CN113465046A - Heat dissipation device, air conditioner and control method of heat dissipation device - Google Patents
Heat dissipation device, air conditioner and control method of heat dissipation device Download PDFInfo
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- CN113465046A CN113465046A CN202110846749.8A CN202110846749A CN113465046A CN 113465046 A CN113465046 A CN 113465046A CN 202110846749 A CN202110846749 A CN 202110846749A CN 113465046 A CN113465046 A CN 113465046A
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- Prior art keywords
- refrigerant
- heat dissipation
- pipeline
- heat sink
- heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/20—Electric components for separate outdoor units
- F24F1/24—Cooling of electric components
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/64—Electronic processing using pre-stored data
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/65—Electronic processing for selecting an operating mode
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
Abstract
The invention provides a heat dissipation device, an air conditioner and a control method of the heat dissipation device, wherein the heat dissipation device comprises a heat radiator body, an air cooling heat dissipation part, a refrigerant input pipeline, a refrigerant output pipeline and a refrigerant bypass pipeline. The air cooling radiating component and the refrigerant radiating component are arranged on the radiator body, the refrigerant input pipeline and the refrigerant output pipeline are respectively connected with the refrigerant radiating component, and the refrigerant bypass pipeline is connected between the refrigerant input pipeline and the refrigerant output pipeline. By applying the technical scheme of the invention, the radiator body radiates the heat of the part to be radiated, when the load of the part to be radiated is lower, the heat productivity is lower, at the moment, the refrigerant bypass pipeline can be operated, the refrigerant does not radiate the radiator body through the refrigerant radiating part, and the radiator body is radiated only through the air cooling radiating part, so that the condensation phenomenon caused by the over-low temperature of the refrigerant radiating part is avoided, and the electrical safety is ensured.
Description
Technical Field
The invention relates to the technical field of air conditioners, in particular to a heat dissipation device, an air conditioner and a control method of the heat dissipation device.
Background
The cooling method is a common cooling method for a main board module in an electric appliance box of an air conditioner by utilizing a refrigerant for cooling, and aims to prevent the main board from being damaged due to overhigh temperature of components in the main board. As shown in fig. 1, the existing refrigerant heat dissipation structure includes a heat sink 1, a pressure plate 2 and a refrigerant heat dissipation tube 3, the refrigerant heat dissipation tube 3 is fixed on the heat sink 1 through the heat sink 1 and the pressure plate 2, the heat sink 1 is attached to the motherboard, and the refrigerant heat dissipation tube 3 is continuous and provides cooling capacity for the heat sink, so as to achieve the effect of heat dissipation of the motherboard.
In foretell prior art, the coolant is continuous to the radiating effect of mainboard, and under the low-load operating mode, mainboard surface temperature is lower, and the coolant radiator still continuously provides cold volume, leads to mainboard surface temperature to hang down excessively easily, and under the off-premises station heating operating mode, the mainboard surface has the condensation risk.
Disclosure of Invention
The embodiment of the invention provides a heat dissipation device, an air conditioner and a control method of the heat dissipation device, and aims to solve the technical problem that in the prior art, a refrigerant heat radiator applied to an electric appliance box of the air conditioner is prone to causing condensation to harm electrical safety.
An embodiment of the present invention provides a heat dissipation apparatus, including: a heat sink body; the air cooling radiating part is arranged on the radiator body; the refrigerant heat dissipation part is arranged on the heat radiator body; the refrigerant input pipeline and the refrigerant output pipeline are respectively connected with the refrigerant heat dissipation part; the refrigerant bypass pipeline is connected between the refrigerant input pipeline and the refrigerant output pipeline; when the refrigerant bypass pipeline is closed, the refrigerant in the refrigerant input pipeline flows into the refrigerant heat dissipation part and then flows out of the refrigerant output pipeline; when the refrigerant bypass pipeline runs, the refrigerant in the refrigerant input pipeline flows into the refrigerant bypass pipeline and then flows out of the refrigerant output pipeline.
In one embodiment, a refrigerant heat dissipating member includes: the liquid inlet part is connected with a refrigerant input pipeline, and the liquid outlet part is connected with a refrigerant output pipeline; and the cold quantity transmission part is connected between the liquid inlet part and the liquid outlet part and is used for transmitting cold quantity to the radiator body.
In one embodiment, the refrigerant heat radiating member further includes a plurality of liquid returning portions, and some of the plurality of refrigeration transmitting portions are connected between the liquid inlet portion and the liquid returning portion, and the remaining of the plurality of refrigeration transmitting portions are connected between the liquid outlet portion and the liquid returning portion.
In one embodiment, the cooling energy transmission unit is inserted and connected to the air-cooled heat dissipation member.
In one embodiment, the air-cooled heat dissipation member is a heat dissipation fin provided on the heat sink body.
In one embodiment, the cooling fin is provided with a through slot, and the cooling capacity transmission part is connected with the cooling fin through the through slot.
In one embodiment, the cold energy transfer part is of flat tube construction.
In one embodiment, the liquid inlet portion, the liquid outlet portion, and the liquid return portion are tubular structures.
The invention also provides an air conditioner which comprises the heat dissipation device.
The invention also provides a control method of the heat dissipation device, which is used for the heat dissipation device and comprises the following steps: the refrigerant bypass pipeline is controlled to be closed under the high-load working condition heat dissipation mode, so that the refrigerant flows into the refrigerant heat dissipation part from the refrigerant input pipeline and then flows out from the refrigerant output pipeline; and in the low-load working condition heat dissipation mode, the refrigerant bypass pipeline is controlled to operate, so that the refrigerant flows into the refrigerant bypass pipeline from the refrigerant input pipeline and then flows out from the refrigerant output pipeline.
In one embodiment, a control method includes: detecting the temperature of a part to be radiated; if the temperature of the part to be cooled is lower than a first preset value, starting a low-load working condition cooling mode; and if the temperature of the part to be cooled is higher than a second preset value, starting a high-load working condition cooling mode.
In the above embodiment, the radiator body radiates the heat to be radiated, and when the load of the part to be radiated is low, the heat productivity is low, at this time, the refrigerant bypass pipeline can be operated, the refrigerant is not radiated to the radiator body through the refrigerant radiating part, and the radiator body is radiated only through the air cooling radiating part, so that the condensation phenomenon caused by the low temperature at the refrigerant radiating part is avoided, and the electrical safety is ensured; when the load of the part to be cooled is higher, the heat productivity is higher, the refrigerant bypass pipeline can be closed at the moment, the refrigerant enters the refrigerant cooling part to cool the radiator body, the heat generated by the part to be cooled is taken away in time, and in the process, the air cooling part can also continue to play a role in cooling, so that the higher cooling requirement is met.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic front view and a schematic side view of a heat dissipation device in the prior art;
fig. 2 is a schematic perspective view of an embodiment of a heat dissipation device according to the present invention;
FIG. 3 is a schematic view of a low load condition heat dissipation mode of the heat dissipation device of FIG. 2;
FIG. 4 is a schematic view of a high load condition heat dissipation mode of the heat dissipation device of FIG. 2;
fig. 5 is a schematic diagram of the heat sink body and the air-cooled heat sink of the heat sink device of fig. 2 from three perspectives.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.
Aiming at the defects in the prior art, the invention mainly aims at reducing the heat dissipation capacity under the low-load working condition and improving the heat dissipation capacity under the high-load working condition, thereby not only effectively controlling the surface temperature of the mainboard, but also preventing the generation of condensation. In the technical scheme of the invention, a technical scheme combining air cooling and refrigerant heat dissipation is provided, and the heat dissipation can be targeted under the condition of different loads. Under the low-load working condition, the mainboard is only cooled in an air cooling mode, so that the heat dissipation capacity is less, and the surface temperature of the mainboard is not too low; under the high load operating mode, can dispel the heat to the mainboard through air cooling heat dissipation and refrigerant heat dissipation combination, the radiating effect promotes, prevents that the too high problem that leads to the mainboard to damage of mainboard temperature under the high load operating mode.
Specifically, as shown in fig. 2, the present invention provides an embodiment of a heat dissipation device, which includes a heat dissipation device body 10, an air cooling heat dissipation component 20, a refrigerant heat dissipation component 30, a refrigerant input pipeline 40, a refrigerant output pipeline 50, and a refrigerant bypass pipeline 60. The air-cooling heat dissipation part 20 and the refrigerant heat dissipation part 30 are disposed on the heat sink body 10, the refrigerant input pipeline 40 and the refrigerant output pipeline 50 are respectively connected to the refrigerant heat dissipation part 30, and the refrigerant bypass pipeline 60 is connected between the refrigerant input pipeline 40 and the refrigerant output pipeline 50. When the refrigerant bypass line 60 is closed, the refrigerant in the refrigerant input line 40 flows into the refrigerant heat dissipation part 30 and then flows out from the refrigerant output line 50; when the refrigerant bypass line 60 is operated, the refrigerant in the refrigerant input line 40 flows into the refrigerant bypass line 60 and then flows out of the refrigerant output line 50.
By applying the technical scheme of the invention, the radiator body 10 radiates the heat of the part to be radiated, when the load of the part to be radiated is lower, the heat productivity is lower, at the moment, the refrigerant bypass pipeline 60 can be operated, the refrigerant does not radiate the radiator body 10 through the refrigerant radiating part 30, and the radiator body 10 is radiated only through the air cooling radiating part 20, so that the condensation phenomenon caused by the over-low temperature of the refrigerant radiating part 30 is avoided, and the electrical safety is ensured; when the load of the part to be cooled is high, the heat productivity is high, the refrigerant bypass pipeline 60 can be closed at the moment, the refrigerant enters the refrigerant cooling part 30 to cool the radiator body 10, the heat generated by the part to be cooled is taken away in time, and in the process, the air cooling part 20 can also continue to play a role in cooling, so that the high cooling requirement is met.
It should be noted that in the technical solution of the present invention, the term "cold" actually means that the cold output from a to B actually outputs heat from B to a, compared with the heat, and therefore the description of the term "cold" is adopted to make the technical solution easier to understand. It should be noted that the cold is a unit concept of energy or energy. With the development of social progress and science and technology, people increasingly and widely prepare and use refrigeration equipment facilities, and gradually use the vocabulary of refrigeration capacity. The cooling capacity is a total energy value of heat consumed by the refrigerating device or the heat conducting facility by refrigerating or a total energy value of heat conducted from the target space per unit time or a period of time.
As shown in fig. 2, in the present embodiment, the refrigerant heat dissipating member 30 includes a liquid inlet portion 31, a liquid outlet portion 32, and a cooling energy transmitting portion 33, the liquid inlet portion 31 is connected to the refrigerant input pipeline 40, the liquid outlet portion 32 is connected to the refrigerant output pipeline 50, and the cooling energy transmitting portion 33 is connected between the liquid inlet portion 31 and the liquid outlet portion 32. In the process of using the refrigerant heat dissipation component 30, the refrigerant enters the liquid inlet portion 31 from the refrigerant input pipeline 40, enters the cold quantity transmission portion 33 from the liquid inlet portion 31 to transmit cold quantity to the heat sink body 10, and then enters the liquid outlet portion 32 with heat quantity, and flows out along the refrigerant output pipeline 50.
More preferably, in the present embodiment, the refrigerant heat radiating member 30 further includes a liquid returning portion 34, a plurality of refrigeration transmitting portions 33 are provided, a part of the plurality of refrigeration transmitting portions 33 is connected between the liquid inlet portion 31 and the liquid returning portion 34, and the remaining part of the plurality of refrigeration transmitting portions 33 is connected between the liquid outlet portion 32 and the liquid returning portion 34. In this embodiment, the refrigerant enters the liquid inlet portion 31, then reaches the liquid return portion 34 along a part of the refrigeration capacity transmission portion 33, then returns to the other part of the refrigeration capacity transmission portion 33 from the liquid return portion 34, and finally enters the liquid outlet portion 32. Preferably, in the embodiment, half of the refrigeration energy transmission parts 33 are connected to the liquid inlet part 31, and the other half of the refrigeration energy transmission parts 33 are connected to the liquid return part 34.
More preferably, in the solution of the present embodiment, the liquid inlet portion 31, the liquid outlet portion 32, and the liquid return portion 34 are tubular structures. The liquid inlet part 31 and the liquid outlet part 32 are equal in height, and the liquid return part 34 is equal to the sum of the heights of the liquid inlet part 31 and the liquid outlet part 32.
As another alternative embodiment, the liquid returning section 34 may be omitted, and only the liquid inlet section 31 and the liquid outlet section 32 may be left. In this embodiment, the liquid inlet portion 31 and the liquid outlet portion 32 are located on both sides of the coldness transmission portion 33.
As shown in fig. 2, in the present embodiment, the cooling energy transmission unit 33 is inserted and connected to the air-cooled heat radiating member 20. In this embodiment, the cold is transmitted to the air-cooled heat radiating member 20 through the cold transmission unit 33, and the cold is transmitted to the radiator main body 10 through the air-cooled heat radiating member 20.
As shown in fig. 5, in the present embodiment, the air-cooled heat dissipation members 20 are heat dissipation fins provided on the heat sink body 10, and the air-cooled heat dissipation members 20 of the heat dissipation fin structure facilitate heat exchange with air, thereby facilitating heat dissipation. More preferably, in the solution of the present embodiment, the insertion slot 21 is provided on the heat dissipation fin, and the coldness transmission part 33 is connected to the heat dissipation fin through the insertion slot 21. In the solution of the present embodiment, the coldness transmission portion 33 is fixed to the heat dissipating fin by the insertion slot 21.
More preferably, in the solution of the present embodiment, the cooling energy transmission part 33 has a flat tube structure. The cooling capacity transmission part 33 of the flat tube structure can increase the contact area with the air-cooled heat dissipation part 20, thereby being beneficial to improving the heat dissipation effect of the heat sink body 10. In particular, the contact area between the coldness transmission portion 33 of the flat tube structure and the air-cooled heat dissipating member 20 of the heat dissipating fin is increased, and the heat transfer effect is further improved.
In the technical scheme of this embodiment, liquid inlet portion 31, go out liquid portion 32 and return liquid portion 34 and play the effect of pressure manifold, liquid inlet portion 31, it can all adopt aluminium as the material to go out liquid portion 32 and return liquid portion 34 and radiating fin, weld radiating fin evenly distributed at radiator body 10, there is the fluting to be used for installing the slot 21 that wears of flat tube structure in the radiating fin, flat tube structure is fixed through the welding with radiating fin, pressure manifold and flat tube structure junction welding, pressure manifold and flat tube have formed refrigerant circulation return circuit, it dispels the heat to wait that the radiating piece carries out the heat exchange through radiator body 10 and the refrigerant in the flat tube.
The air-cooling heat dissipation method using the air-cooling heat dissipation member 20 may be such that the air-cooling heat dissipation member 20 directly contacts air to dissipate heat, or may be combined with a wind member to improve the heat dissipation effect of the air-cooling heat dissipation member 20 by flowing air.
The invention also provides an air conditioner which comprises the heat dissipation device, and different heat dissipation modes can be adopted for the electric elements needing heat dissipation on the air conditioner aiming at different working conditions of the air conditioner by adopting the heat dissipation device, so that the conditions of condensation or insufficient heat dissipation are avoided.
As shown in fig. 3 and 4, the present invention further provides a control method of a heat dissipation device, the control method is used for dissipating heat of the heat dissipation device, and the control method includes a low-load operating condition heat dissipation mode and a high-load operating condition heat dissipation mode;
as shown in fig. 3, in the high-load operating condition heat dissipation mode, the refrigerant bypass line 60 is controlled to be closed, so that the refrigerant flows into the refrigerant heat dissipation part 30 from the refrigerant input line 40 and then flows out from the refrigerant output line 50;
as shown in fig. 4, in the heat dissipation mode under the low load condition, the refrigerant bypass line 60 is controlled to operate, so that the refrigerant flows into the refrigerant bypass line 60 from the refrigerant input line 40 and then flows out from the refrigerant output line 50.
When the load of the part to be cooled is low, the heat productivity is low, the low-load working condition heat dissipation mode is started, the refrigerant is not allowed to dissipate heat of the radiator body 10 through the refrigerant heat dissipation part 30, and the heat of the radiator body 10 is dissipated only through the air cooling heat dissipation part 20, so that the condensation phenomenon caused by the fact that the temperature of the refrigerant heat dissipation part 30 is too low is avoided, and the electrical safety is guaranteed; when the load of the part to be cooled is high, the heat productivity is high, and the high-load working condition heat dissipation mode is started, so that the refrigerant enters the refrigerant heat dissipation part 30 to dissipate heat of the radiator body 10, the heat generated by the part to be cooled is taken away in time, and in the process, the air cooling heat dissipation part 20 can also continue to play a role in heat dissipation, and therefore the high heat dissipation requirement is met.
It should be noted that, in the refrigerant flow direction control, the on/off of the pipeline node can be realized by means of an electromagnetic valve or other control valves, so as to realize the control of the refrigerant flow direction. Specifically, as shown in fig. 3, in the solution of the present embodiment, an electromagnetic valve 70a is disposed on the refrigerant input pipeline 40, a check valve 70b is disposed on the refrigerant output pipeline 50, after the refrigerant bypass pipeline 60 is activated, the electromagnetic valve 70a is closed, the refrigerant cannot flow to the refrigerant heat dissipation component 30 through the refrigerant input pipeline 40, and the check valve 70b does not allow the refrigerant to flow to the refrigerant heat dissipation component 30 through the refrigerant output pipeline 50.
In order to implement more intelligent control, in the technical solution of this embodiment, the control method further includes:
detecting the temperature of a part to be radiated;
if the temperature of the part to be cooled is lower than a first preset value, starting a low-load working condition cooling mode;
and if the temperature of the part to be cooled is higher than a second preset value, starting a high-load working condition cooling mode.
The first predetermined value and the second predetermined value may be different temperature values or the same temperature value. The first predetermined value is less than the second predetermined value when the first predetermined value and the second predetermined value may be different temperature values.
Specifically, in the technical scheme of this embodiment, as shown in fig. 3, under the low-load operation condition of the outdoor unit of the air conditioner, the temperature of the main board module is less than 80 ℃, the heat dissipation capacity required by the main board is small, refrigerant heat dissipation is not suitable for being adopted, the heat dissipation requirement of the main board can be met through air cooling heat dissipation, air cooling heat exchange is performed through an air field inside the outdoor unit, and at this time, the low-load working condition heat dissipation mode is started, so that condensation of the main board due to too low temperature under the low-load working condition is prevented;
as shown in fig. 4, under the high load operation condition of the outdoor unit of the air conditioner, the temperature of the main board module is greater than 80 ℃, the heat dissipation capacity required by the main board is large, and at this time, the heat dissipation mode under the high load operation condition is started, and air cooling and refrigerant heat dissipation are simultaneously performed, so that the heat dissipation effect is improved, the surface temperature of the main board is effectively reduced, and the damage of the main board due to overhigh temperature is prevented.
As can be seen from the above, the technical solution of the present invention achieves the following technical effects:
1. the problem that the surface of the main board is condensed due to low temperature under the heating working condition of the outdoor unit, so that the main board is short-circuited and damaged is solved;
2. the radiating effect is improved, and the problem that under the high load working condition, the mainboard heat dissipation is not enough, and the module temperature exceeds the standard, resulting in the mainboard damage is solved.
3. Let mainboard surface temperature distribution more even to can carry out effective control to the temperature of mainboard, reduce the risk of condensation.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes may be made to the embodiment of the present invention by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. A heat dissipating device, comprising:
a radiator body (10);
an air-cooled heat dissipation member (20) provided on the heat sink body (10);
a refrigerant heat dissipation member (30) provided on the heat sink body (10);
the refrigerant input pipeline (40) and the refrigerant output pipeline (50) are respectively connected with the refrigerant heat dissipation part (30);
a refrigerant bypass line (60) connected between the refrigerant input line (40) and the refrigerant output line (50);
when the refrigerant bypass pipeline (60) is closed, the refrigerant in the refrigerant input pipeline (40) flows into the refrigerant heat dissipation part (30) and then flows out of the refrigerant output pipeline (50); when the refrigerant bypass pipeline (60) operates, the refrigerant in the refrigerant input pipeline (40) flows into the refrigerant bypass pipeline (60) and then flows out of the refrigerant output pipeline (50).
2. The heat sink as claimed in claim 1, wherein the coolant heat sink member (30) comprises:
the refrigerant inlet and outlet device comprises a liquid inlet part (31) and a liquid outlet part (32), wherein the liquid inlet part (31) is connected with the refrigerant input pipeline (40), and the liquid outlet part (32) is connected with the refrigerant output pipeline (50);
and a cold energy transfer part (33) connected between the liquid inlet part (31) and the liquid outlet part (32) and used for transferring cold energy to the radiator body (10).
3. The heat sink according to claim 2, wherein the refrigerant heat sink member (30) further includes a plurality of liquid returning portions (34), wherein a part of the plurality of cold energy transmitting portions (33) is connected between the liquid inlet portion (31) and the liquid returning portion (34), and the remaining part of the plurality of cold energy transmitting portions (33) is connected between the liquid outlet portion (32) and the liquid returning portion (34).
4. The heat sink according to claim 3, wherein the cold mass transfer part (33) is connected to the air-cooled heat sink (20) in an interposed manner.
5. The heat sink according to claim 4, wherein the air-cooled heat sink member (20) is a heat sink fin provided on the heat sink body (10).
6. The heat sink according to claim 5, wherein the heat sink fins are provided with insertion grooves (21), and the coldness transmission portions (33) are connected to the heat sink fins through the insertion grooves (21).
7. The heat sink according to claim 3, characterised in that the cold mass transfer (33) is of flat tube construction.
8. The heat sink according to claim 3, wherein the liquid inlet portion (31), the liquid outlet portion (32) and the liquid return portion (34) are tubular structures.
9. An air conditioner comprising a heat dissipating device, wherein the heat dissipating device is the heat dissipating device of any one of claims 1 to 8.
10. A control method for a heat sink according to any one of claims 1 to 8, the control method comprising:
the high-load working condition heat dissipation mode is characterized in that a refrigerant bypass pipeline (60) is controlled to be closed, and refrigerant flows into a refrigerant heat dissipation part (30) from a refrigerant input pipeline (40) and then flows out from a refrigerant output pipeline (50);
and in the low-load working condition heat dissipation mode, the refrigerant bypass pipeline (60) is controlled to operate, so that the refrigerant flows into the refrigerant bypass pipeline (60) from the refrigerant input pipeline (40) and then flows out from the refrigerant output pipeline (50).
11. The control method according to claim 10, characterized by comprising:
detecting the temperature of a part to be radiated;
if the temperature of the part to be cooled is lower than a first preset value, starting the low-load working condition cooling mode;
and if the temperature of the part to be cooled is higher than a second preset value, starting the high-load working condition cooling mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110846749.8A CN113465046A (en) | 2021-07-26 | 2021-07-26 | Heat dissipation device, air conditioner and control method of heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110846749.8A CN113465046A (en) | 2021-07-26 | 2021-07-26 | Heat dissipation device, air conditioner and control method of heat dissipation device |
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| CN113465046A true CN113465046A (en) | 2021-10-01 |
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| CN202110846749.8A Pending CN113465046A (en) | 2021-07-26 | 2021-07-26 | Heat dissipation device, air conditioner and control method of heat dissipation device |
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| CN (1) | CN113465046A (en) |
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2021
- 2021-07-26 CN CN202110846749.8A patent/CN113465046A/en active Pending
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