CN107293633B - High heat flux density cooling device for high-power LED - Google Patents
High heat flux density cooling device for high-power LED Download PDFInfo
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- CN107293633B CN107293633B CN201710654431.3A CN201710654431A CN107293633B CN 107293633 B CN107293633 B CN 107293633B CN 201710654431 A CN201710654431 A CN 201710654431A CN 107293633 B CN107293633 B CN 107293633B
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
A high heat flux density cooling device for a high-power LED comprises at least one high-power LED device, wherein the high-power LED device at least comprises a metal-based circuit board, a heat dissipation substrate and a heat dissipation structure; the heat dissipation substrate comprises an LED mounting surface, a heat dissipation surface and a step mounting portion, wherein the LED mounting surface is provided with a first heat conduction structure; the first heat conduction structure is filled with heat conduction silicone grease, and the metal-based circuit board is embedded into the heat conduction silicone grease and fixed with the LED mounting surface; a second heat conducting structure is arranged on the heat radiating surface; the heat dissipation structure comprises a condensation shell, an evaporation cavity, a heat dissipation manifold and a reflux capillary core. The high heat flux density cooling device for the high-power LED supplements the heat dissipation of the radiant heat by increasing the heat dissipation area and using the transmission path of the conduction heat dissipation and the phase change heat dissipation, the heat is quickly dissipated, and the high heat flux density cooling device is suitable for being more than 60w/cm 2 Efficient heat dissipation at high heat flux density.
Description
Technical Field
The invention relates to the technical field of high-power LEDs, in particular to a high heat flux density cooling device for a high-power LED.
Background
As an active self-luminous device, the LED is used as solid illumination of a non-combustible filament or gas, has the characteristics of low power consumption, low working voltage, high luminous brightness, long working life and stable performance, can work in an extreme environment and has small performance attenuation, but only 15 percent of electric energy is converted into light energy in the working process, and the rest 85 percent of electric energy is almost completely converted into heat energy, so that the temperature of the LED is increased. As the temperature increases, the failure rate of the LED is greatly increased, the light decay of the LED is increased, and the service life of the LED is shortened, so that a thermal design with high heat flux density is the most required core design of the LED. For example, if the photoelectric conversion efficiency of a 10W white LED is 15%, 8.5W of electric energy is converted into heat energy, and if no heat dissipation measure is taken, the core temperature of the high-power LED will rise rapidly, and when the junction temperature Tj rises above the maximum allowable temperature, the LED will be damaged by overheating.
The heat flow density of the current partial high-power LED product needing heat dissipation reaches 50-90w/cm 2 Higher already over 150 w/cm 2 . In addition to the smaller and smaller size of the product, the constraints encountered by the arrangement and design of the heat dissipation device itself are also becoming more and more severe. The traditional convection heat exchange and forced air cooling method relying on single-phase fluid can only be used for the heat flow density not more than 10w/cm 2 The product of (1). The experimental experience shows that the heat flow density is more than 60w/cm 2 May be referred to as high heat flux densityAnd (4) degree.
The prior art typically removes heat from the tightly packed LEDs by mounting a manifold, forced draft fans, and special aluminum heat sinks on the back of the substrate. For example, a heat sink layer is mounted under the front LED mounting pads of the substrate, but heat is transferred through the LED mounting pads to the heat sink layer of the substrate, and then conducted by the heat sink layer to the back of the substrate where it is carried away by the fan airflow, thus attempting to dissipate the heat by forced airflow from the back of the substrate. Since the heat generated from the front side can only be taken away from the back side, the heat dissipation efficiency is poor, which affects the service life of the LED array device to some extent. A plurality of copper pipes penetrating through the spacing space of the LED array on the substrate are also adopted for heat dissipation, but the cooling and heat dissipation requirements can be met only by arranging a forced flow type ventilation fan on the back of the substrate. This results in a large increase in the amount of electricity used by the forced draft fan, and also increases the manufacturing cost.
At the same time, the cost of manufacturing and using LEDs is increased in order to cool the LEDs on a tightly packed substrate. For example, the power usage cost of an LED array device is more than 70% of the cost of cooling with a forced-air fan. The addition of a heat sink layer during the manufacturing process also increases the cost of the LED array device.
Therefore, how to transfer heat of the tightly-gathered LED array device with low cost and high efficiency becomes a common problem to be solved urgently for the popularization of the LED array device in the industry.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a high heat flux density cooling apparatus for high power LED, which can efficiently dissipate heat of an LED substrate at a very low cost without consuming electric energy.
The object of the invention is achieved by a high heat flux cooling arrangement for high power LEDs, comprising at least one high power LED device, the high power LED device comprising at least a metal based circuit board,
the high-power device and the heat dissipation structure are respectively installed and fixed on two sides of the heat dissipation substrate;
the heat dissipation substrate comprises an LED mounting surface, a heat dissipation surface and a step mounting part, wherein the LED mounting surface is provided with a first heat conduction structure; the first heat conduction structure is filled with heat conduction silicone grease, and the metal-based circuit board is embedded into the heat conduction silicone grease and fixed with the LED mounting surface;
the heat dissipation surface comprises a left heat dissipation surface and a right heat dissipation surface, the left heat dissipation surface and the right heat dissipation surface are abutted, symmetrically and obliquely arranged on two sides of the abutting edge to form concave ridges, and a second heat conduction structure is arranged on the heat dissipation surface;
the heat dissipation structure comprises a condensation shell, an evaporation cavity, a heat dissipation manifold and a reflux capillary core, wherein the condensation shell is adiabatically fixed on the step mounting part; an internal cavity formed by the condensation shell and the heat dissipation substrate is formed into an evaporation cavity, and a phase-changeable working medium is filled in the evaporation cavity; a plurality of radiating manifold sheets are arranged on the inner wall and the outer wall of the condensing shell at intervals in a one-to-one correspondence manner;
the inner wall of the condensation shell is provided with a reflux capillary core, and the reflux capillary core can reflux the liquid working medium on the inner wall of the condensation shell to the radiating surface.
Further, the first heat conducting structure comprises a plurality of heat absorption pits arranged on the LED mounting surface at intervals in an array mode, and the second heat conducting structure comprises a plurality of heat dissipation pits arranged on the heat dissipation surface at intervals in an array mode.
Furthermore, the heat dissipation structure further comprises an axial flow fan and an air guide shell, and the condensation shell is provided with a top outer manifold and a peripheral outer manifold; the air guide shell is internally and fixedly provided with an axial flow fan, and can guide outlet airflow of the axial flow fan to enter the peripheral outer manifold along the top outer manifold of the condensation shell.
Further, the condensation casing includes integrated into one piece's condensation top shell, perisporium and flange installation department, the condensation top shell includes left top and right top, left side top and right top are connected and are formed the ridge shape, the ridge line of ridge shape is parallel relative with the interior ridge.
Further, the heat dissipation manifold comprises an outer manifold and an inner manifold which are arranged inside and outside the wall of the condensation shell in a one-to-one correspondence mode, the outer manifold comprises a top outer manifold and a periphery outer manifold which are not connected, and the inner manifold comprises a top inner manifold and a periphery inner manifold which are connected with each other and integrally formed.
Further, the backward flow wick is restrainted including backward flow wick to one side, the perpendicular backward flow wick is restrainted and is flowed back the capillary chip, and the backward flow wick to one side is restrainted and is fixed between the interior piece of qi of condensation casing, and makes the backward flow wick to one side tighten and paste the inner wall of condensation top shell is fixed with perpendicular backward flow wick and restraints at the corresponding ridge line position interval that the backward flow wick was restrainted to one side, is equipped with the backward flow capillary chip on the cooling surface of radiating basal plate, the lower extreme that the capillary wick was restrainted to one side and the lower extreme of perpendicular backward flow wick were restrainted butt respectively the backward flow capillary chip.
Furthermore, the air guide shell is provided with a fan fixing part and an air guide part, when an outlet flange of the air guide shell is fixed on a flange mounting part of the condensation shell, the peripheral wall of the air guide part is arranged in a manner of being tightly attached to the peripheral outer manifold pieces, a plurality of grid holes are arranged on the peripheral wall of the air guide part at intervals corresponding to the positions of the peripheral outer manifold pieces, and the air guide shell guides outlet airflow of the axial flow fan to flow along the space between the top outer manifold pieces to the outer side along the space between the peripheral outer manifold pieces and then flows out of the grid holes.
Further, the fan fixing portion comprises a supporting rib and an inverted T-shaped hub fixing body which are integrally connected with the air guide shell, the hub fixing body comprises an integrally formed T-shaped cap and a motor shaft fixing pipe, the axial flow fan comprises a hub and a plurality of rotating blades integrally connected with the hub, and the hub combined with a driving shaft of the motor is rotatably arranged in the motor shaft fixing pipe through a tapered roller bearing.
Further, the T-shaped cap is provided with a wind guide edge, an included angle between the wind guide edge and the axis of the motor shaft fixing pipe forms a wind guide angle, and the wind guide angle is 30-60 degrees.
Further, the heat dissipation structure further comprises a tubular evaporator hermetically mounted in the mounting hole of the heat dissipation substrate; the tubular evaporator comprises an evaporation part and a condensation part, wherein the condensation part is provided with an opening end, and the opening end extends to be higher than the liquid level of the working medium in the evaporation cavity; the tubular evaporator is filled with the phase-changeable working medium.
Compared with the prior art, the high heat flux density cooling device for the high-power LED enables the heat of the base of the high-power LED device and the heat of the high heat flux density in the LED aggregation group to be rapidly dissipated, greatly increases the heat dissipation area, supplements the heat dissipation of radiation heat by using the transmission paths of conduction heat dissipation and phase change heat dissipation, and is suitable for the heat dissipation of more than 60w/cm 2 Efficient heat dissipation at high heat flux density.
Drawings
Fig. 1 is a front sectional view of the present invention for a high power LED.
Fig. 2 is a front sectional view of a high heat flux density cooling apparatus for high power LEDs of the present invention.
Fig. 3 is a bottom view of a high heat flux density cooling apparatus for high power LEDs of the present invention.
Fig. 4 is a front sectional view of a condensing housing of a high heat flux density cooling apparatus for high power LEDs of the present invention.
Fig. 5 is a front sectional view of a wind guide housing of a high heat flux density cooling apparatus for a high power LED according to the present invention.
Reference numbers in the above figures:
100. a high-power LED device, 101 LED chips, 102 internal heat sinks, 103 metal-based circuit boards, 104 packaging lenses, 105Z-shaped electrodes, 106 insulating layers, 200 heat dissipation structures,
1. the heat dissipation substrate comprises a heat dissipation substrate, 2 first heat conduction structures, 2.1 heat absorption pits, 3 annular convex ribs, 4 heat conduction silicone grease, 6 left heat dissipation surfaces, 7 right heat dissipation surfaces, 8 second heat conduction structures and 8.1 heat dissipation pits
1.1 LED mounting surface, 1.2 heat dissipation surface, 1.3 step mounting portion, 1.4 concave ridge and 1.5 side wall surface
20. Condensing shell, 21 condensing top shell, 21.1 left top, 21.2 right top, 22 peripheral wall, 23 flange mounting part
30. Evaporation chamber, 31 working medium
40. Heat dissipation manifold, 41 outer manifold, 41.1 top outer manifold, 41.2 circumference outer manifold, 42 inner manifold, 42.1 top inner manifold, 42.2 circumference inner manifold
50. A return capillary core, a 51 oblique return capillary core, a 52 vertical return capillary core and a 53 return capillary core
60. Axial fan, 61 air guide shell, 62 support ribs, 63 hub fixing body and 64 air guide edge
60.1 Hub, 60.2 rotating blade, 60.3 tapered roller bearing
61.1 Blower fixed part, 61.2 wind guide part, 61.3 grid hole
63.1 T-shaped cap, 63.2 motor shaft fixing tube, alpha wind guiding angle
70. Tubular evaporator, 70.1 evaporator section, 70.2 condenser section
Detailed Description
The following detailed description of the embodiments of the present invention is provided in connection with the accompanying drawings, but is not intended to limit the scope of the invention.
As shown in the figure, a high-power LED device 100 includes an LED chip 101, an internal heat sink 102, a metal-based circuit board 103 and a package lens 104, where the internal heat sink 102 is fixed on the metal-based circuit board 103 through a high thermal conductive silver paste, the internal heat sink 102 includes a top surface portion and a step portion, the LED chip 101 is fixed on the top surface portion of the internal heat sink 102 through a high thermal conductive silver paste, an insulating layer 106 is fixed on the step portion of the internal heat sink 102, and a Z-shaped electrode 105 is fixed outside the insulating layer 103; the lap joint end of the Z-shaped electrode is fixed on the insulating layer 106, the sealing end of the Z-shaped electrode is fixed on the metal-based circuit board 103 through high-thermal-conductivity silver adhesive, and the Z-shaped electrode is connected with the LED chip 101 through a gold thread; the package lens 104 seals and fixes the LED chip 101, the gold wire, and the overlapping end of the Z-shaped electrode 104 on the step portion of the inner heat sink 102. The LED chip 101, the internal heat sink 102 and the metal-based circuit board 103 form a heat conduction path.
A high-power LED array device 300 comprises a plurality of high-power LED devices 100 and a heat dissipation substrate 1, wherein the high-power LED devices 100 are fixed on the heat dissipation substrate 1 in an array with a row spacing Y and a column spacing X;
a high heat flux density cooling device for a high-power LED array device comprises a heat dissipation substrate 1 and a heat dissipation structure 200 arranged on the heat dissipation substrate 1, wherein the heat dissipation substrate 1 comprises an LED mounting surface 1.1, a heat dissipation surface 1.2 and a step mounting part 1.3, the LED mounting surface 1.1 is provided with a first heat conduction structure 2 and an annular convex rib 3, and the annular convex rib 3 is arranged around the first heat conduction structure 2; the first heat conducting structure 2 comprises heat absorption pits 2.1 which are arranged on the LED mounting surface 1.1 at intervals in a certain array, and heat conducting silicone grease 4 with a certain thickness is filled in the annular convex rib 4, so that the heat absorption pits 2.1 are filled with the heat conducting silicone grease 5 and are higher than the LED mounting surface 1.1 by a certain embedding thickness, and the embedding thickness is at least 1.5 times larger than the thickness of the metal-based circuit board 103. The metal-based circuit board 103 is embedded in the heat conductive silicone grease 4 and fixed to the heat dissipation substrate 1. Preferably, the heat absorption pits 2.1 are cubes, and the array interval is the side length of the cubes;
the radiating surface 1.2 is V-shaped and comprises a left radiating surface 6 and a right radiating surface 7, and the left radiating surface 6 and the right radiating surface 7 respectively form an included angle of 2-5 degrees with the horizontal plane. The heat dissipation surface 1.2 is provided with a second heat conduction structure 8, and the second heat conduction structure 8 comprises heat dissipation pits 8.1 which are arranged on the heat dissipation surface 1.2 at intervals of a certain array interval. Preferably, the heat dissipation pits 8.1 are cubes, and the array pitch is the side length of the cubes.
The side wall surface 1.4 of the heat radiating surface 1.2 and the edge surface outside the heat radiating surface of the substrate 1 form a step mounting part 1.3.
The heat dissipation structure 200 comprises a condensation shell 20, wherein the condensation shell 20 comprises a condensation top shell 21, a peripheral wall 22 and a flange mounting part 23 which are integrally formed, the flange mounting part 23 is fixed on the step mounting part 1.3, and a heat insulation pad 24 is arranged between the flange mounting part 23 and the step mounting part 1.3; and the peripheral wall 22 is closely attached to the side wall surface 1.5 of the heat radiating surface 1.2. The top condensing shell 21 comprises a left top 21.1 and a right top 21.2, the left top 21.1 and the right top 21.2 are connected to form a horseshoe shape, and the top condensing shell 21 is made of a rapid heat conduction material, such as copper, aluminum alloy or graphene or other materials with high thermal conductivity coefficient.
The heat dissipation structure 2 further comprises an evaporation cavity 30, an internal cavity formed by the condensation shell 20 and the heat dissipation substrate 1 is formed into the evaporation cavity 30, and the evaporation cavity 30 is vacuumized and filled with a phase-changeable working medium 31. The filling amount of the working medium is optimally 15-25% of the total volume of the evaporation cavity 13.
The heat dissipation structure 2 further comprises heat dissipation manifold 40, the heat dissipation manifold 40 comprises an outer manifold 41 and an inner manifold 42 which are arranged inside and outside the wall and correspond to each other, the outer manifold 41 comprises a top outer manifold 41.1 and a periphery outer manifold 41.2, the inner manifold 42 comprises a top inner manifold 42.1 and a periphery inner manifold 42.2, the outer manifold 41 and the inner manifold 42 are correspondingly arranged in a straight line shape along the outer surface and the inner surface of the condensation top shell 21, the top outer manifold 41.1 and the periphery outer manifold 41.2 are aligned one by one, and the top inner manifold 42.1 and the periphery inner manifold 42.2 are aligned one by one. The peripheral outer manifold 41.2 is not connected to the top outer manifold 41.1. The inner peripheral manifold 42.2 and the inner top manifold 42.1 are connected and integrally formed;
the heat dissipation structure 2 further comprises a return capillary wick 50, and the return capillary wick 50 brings the liquid working medium from the top inner wall of the condensation housing 20 back to the heat dissipation surface 1.2 of the heat dissipation substrate 1. Specifically, an inclined return capillary wick 51 is fixedly arranged between the adjacent inner manifold sheets 42, the inclined return capillary wick bundle 51 is fixed on the adjacent inner manifold sheets 42 in a spot welding manner, and the inclined return capillary wick is tightly adhered to the inner wall of the condensing top shell 21; and a vertical return capillary wick bundle 52 is fixed in the middle of the inclined return capillary wick bundle 51 at intervals. A return capillary chip 53 is arranged on the heat dissipation surface 1.2 of the heat dissipation substrate 1, and the lower end of the inclined return capillary core bundle 51 and the lower end of the vertical return capillary core bundle 52 are respectively abutted against the return capillary chip 53.
The heat dissipation structure 200 further comprises an axial flow fan 60 and an air guide casing 61, the air guide casing 61 is provided with a fan fixing portion 61.1 and an air guide portion 61.2, the axial flow fan 60 is fixed on the fan fixing portion 61.1, specifically, the fan fixing portion 61.1 comprises a support rib 62 and an inverted T-shaped hub fixing body 63 which are integrally connected with the air guide casing, and the hub fixing body 63 comprises an integrally formed T-shaped cap 63.1 and a motor shaft fixing tube 63.2. The axial flow fan 60 includes a hub 60.1 and a plurality of rotary blades 60.2 integrally connected to the hub, and the hub 60.1 combined with the driving shaft of the motor is rotatably disposed in a motor shaft fixing tube 63.2 of the fan fixing portion 61.1 through a tapered roller bearing 60.3. Preferably, the T-shaped cap 63.1 has a wind guiding edge 64, and an included angle between the wind guiding edge 64 and an axis of the motor shaft fixing tube is 30-60 degrees of a wind guiding angle α.
When the outlet flange of the air guide casing 61 is fixed to the flange mounting portion 23 of the condensation casing 20, the peripheral wall of the air guide portion 61.2 is closely attached to the peripheral outer manifold 41.2. The peripheral wall of the air guiding part 61.2 is provided with a plurality of grid holes 61.3 at intervals corresponding to the positions of the peripheral outer manifolds 41.2, and the air guiding shell 61 guides the outlet airflow of the axial flow fan 60 to flow along the space between the top outer manifolds 41.1 to the outer side along the space between the peripheral outer manifolds 41.2 and then flows out of the grid holes 61.3. The air guide shell is provided with an inlet flange and an outlet flange, and bolts penetrate through the inlet flange and the outlet flange simultaneously to be fixed with the flange mounting portion 12.
The heat dissipation structure 200 further includes a tube-shaped evaporator 70. The tube-shaped evaporator 70 is hermetically mounted on the mounting hole of the heat-dissipating substrate 1; the tubular evaporator 70 comprises an evaporation part 70.1 and a condensation part 70.2, the condensation part 70.2 is provided with an open end, and the open end extends 5-10mm higher than the liquid level of the working medium in the evaporation cavity 30; the evaporation part 70.1 is provided with a closed end, and the closed end is preferably shaped like a semi-sphere or a plane or other three-dimensional decorative modeling; the evaporation part 70.1 of the tube-shaped evaporator passes through the mounting hole 1.3 of the heat dissipation substrate and is arranged between the LED arrays.
The tubular evaporator 70 is filled with a phase-changeable working medium; the filling amount of the phase-changeable working medium in the tubular evaporator 70 is 12-25% of the total volume of the tubular evaporator 70; the amount of the working medium to be filled is preferably 15% of the total volume of the tubular evaporator 70.
The evaporation part 70.1 and the evaporation cavity 30 of the tubular evaporator 70 are respectively provided with a rectangular observation window 71, and the lower edge of the observation window 71 is positioned at 1/5 of the height of the tubular evaporator 70; the level of the phase-changeable liquid is observed through the viewing window 71, and if the internal level is below the lower edge of the viewing window, the surface working medium is less and needs to be replenished.
When the LED array device 300 or the high-power LED device 100 operates, as the collected LED light-emitting elements continuously release heat, the internal heat sink 102 directly transfers the heat to the heat-dissipating substrate 1, the radiation heat of the package lens 104 is transferred to the evaporation part 70.1 of the tubular evaporator 70, the phase-changeable working medium in the evaporation cavity 30 and the evaporation part 70.1 is converted from liquid to gas in the evaporation section, the gas evaporates upwards until the working medium is condensed on the top condensation shell 21 and the internal manifold 42, the working medium is converted from gas to liquid, and as the liquid is gradually collected, part of the liquid flows back to the lowest position in the center of the heat-dissipating substrate 1 through the vertical return capillary bundle. The heat released on the condensation top case 21 and the inner manifold 42 is rapidly dissipated in the air by the outer manifold 41.
The cooling device of the LED array device radiates heat through two ways, wherein one way is to conduct heat, the conducted heat is conducted to the radiating plate through the internal heat sink, and the radiating plate radiates the part of heat to the air through the radiating manifold 40 through the evaporation cavity 30; second, the heat radiation, which is the heat generated by the radiation of the package lens 104, is converted from liquid to gas by the working medium in the tubular evaporator 70, and absorbs the heat of the tubular evaporator 70. The evaporation chamber 30 and the tubular evaporator 70 cooperate to carry away the heat transfer and radiation respectively, and together maintain the low temperature working environment of the LED array device 300.
For a single high power LED, the tube shaped evaporator 70 may be omitted and only the heat dissipation structure 200 including the evaporation cavity 30 may be used.
The cooling device with high heat flow density for the high-power LED substantially solves the technical problem of how to transfer the heat with high heat flow density of the high-power LED device with low cost and high efficiency through the following technologies:
1) The heat conducting structure increases the heat transfer area and forms a heat conducting path without micro-gap
Heat conduction structures are arranged on two sides of the heat dissipation substrate 1, a plurality of heat absorption pits are arranged on the LED mounting surface in an interval array mode, a plurality of heat dissipation pits are arranged on the heat dissipation surface in an interval array mode, heat from heat sinks in the high-power LEDs is conducted to the metal-based circuit board, heat of the metal-based circuit board is transmitted to the heat conduction silicone grease, the heat conduction silicone grease is in contact with the heat dissipation substrate 1 through the longitudinal heat absorption pits, the heat transfer area of the heat dissipation substrate 1 for absorbing heat from the heat conduction silicone grease is greatly increased, and the pits are assumed to be cubes with side length a and are a 2 The heat absorption area is changed after the cube pits are pressedIs 5a 2 The heat absorption area is increased by 4 times. The heat dissipation pits also increase the heat transfer area for heat conduction from the heat dissipation substrate to the working medium by a factor of 4.
The LED mounting surface of the heat dissipation substrate is in contact with the heat conduction silicone grease, the heat dissipation surface is in contact with the liquid working medium, the contact surface does not have any micro gap, and a heat conduction path in seamless connection with the heat transfer area is constructed.
2) The combination of the condensing shell and the inner manifold piece forms a first heat dissipation path, the combination of the air guide shell and the outer manifold piece forms a second heat dissipation path,
the condensation shell 20 and the heat dissipation substrate form an evaporation cavity, the phase-changeable working medium in the evaporation cavity is changed from a liquid state to a gas state to absorb heat, the gas-state working medium rises to the inner wall of the condensation shell, the gas state is changed from the gas state to the liquid state on the inner wall and the inner manifold, heat is released, the heat is transferred to the inner wall of the condensation shell and the inner manifold, and a phase-change heat dissipation path is formed as a first heat dissipation path; the heat conduction of the inner wall and the inner manifold is transferred to the outer manifold and the outer wall, the air heat dissipation path constructed by the matching of the outer manifold of the condensation shell and the air guide shell is a second heat dissipation path, and the second heat dissipation path is closely connected with the first heat dissipation path and transfers the heat to the ambient air.
3) The tubular evaporator absorbs radiation and dissipates heat, and supplements conduction and dissipation heat
Although the heat dissipation substrate 1 can satisfy the operating temperature requirement of the LED chip 101 by absorbing heat generated by long-time radiation from the LED package lens 104, after long-time use, the radiation heat irradiated from the package lens 104 for a long time may in turn heat the temperature in the package lens 104, resulting in an increase in the temperature in the package space of the LED chip 101, which is not allowed. The tubular evaporator takes away the radiation heat of the package lens 104, so that the temperature of the gap of the LED array is reduced, and indirectly the temperature of the package lens 104 itself is not increased, thereby ensuring a low operating temperature in the package space of the LED chip 101. This is a powerful addition to the conductive heat dissipation from the internal heat sink 102 to the metal-based wiring board 101.
The improved synergistic effect of the three aspects enables the heat of the base of the high-power LED device and the heat with high heat flux density in the LED cluster to be quickly dissipated, greatly increases the heat dissipation area, supplements the heat dissipation of radiant heat by using a transfer path of conduction heat dissipation and phase-change heat dissipation, and greatly improves the heat transfer efficiency.
Claims (5)
1. A high heat flux density cooling arrangement for high power LEDs comprising at least one high power LED device (100) comprising at least a metal based circuit board (103), characterized in that,
the LED high-power heat dissipation structure comprises a heat dissipation substrate (1) and a heat dissipation structure (200), wherein the high-power LED device and the heat dissipation structure are respectively fixedly arranged on two sides of the heat dissipation substrate (1);
the heat dissipation substrate (1) comprises an LED mounting surface (1.1), a heat dissipation surface (1.2) and a step mounting portion (1.3), wherein the LED mounting surface (1.1) is provided with a first heat conduction structure (2); the first heat conduction structure (2) is filled with heat conduction silicone grease (4), and the metal-based circuit board (103) is embedded into the heat conduction silicone grease (4) and fixed with the LED mounting surface (1.1);
the heat dissipation surface (1.2) comprises a left heat dissipation surface (6) and a right heat dissipation surface (7), the left heat dissipation surface (6) and the right heat dissipation surface (7) are abutted, symmetrically and obliquely arranged on two sides of an abutting edge to form concave ridges (1.4), and a second heat conduction structure (8) is arranged on the heat dissipation surface (1.2);
the heat dissipation structure (200) comprises a condensation shell (20), an evaporation cavity (30), a heat dissipation manifold (40) and a reflux capillary core (50), wherein the condensation shell (20) is fixed on the step mounting part (1.3) in a heat insulation manner; an internal cavity formed by the condensation shell (20) and the heat dissipation substrate (1) is formed into an evaporation cavity (30), and a phase-changeable working medium (31) is filled in the evaporation cavity (30); a plurality of radiating manifold pieces (40) are arranged on the inner wall and the outer wall of the condensing shell (20) at intervals in a one-to-one correspondence manner;
the inner wall of the condensation shell is provided with a reflux capillary core (50), and the reflux capillary core (50) can reflux the liquid working medium on the inner wall of the condensation shell to the heat dissipation surface (1.2);
the first heat conducting structure (2) comprises a plurality of heat absorption pits (2.1) which are arranged on the LED mounting surface (1.1) at intervals in an array mode, and the second heat conducting structure (8) comprises a plurality of heat dissipation pits (8.1) which are arranged on the heat dissipation surface (1.2) at intervals in an array mode;
the heat dissipation structure (200) further comprises an axial flow fan (60) and an air guide shell (61), and the condensation shell (20) is provided with a top outer manifold (41.1) and a peripheral outer manifold (41.2); an axial flow fan (60) is fixedly installed in the air guide shell (61), and the air guide shell (61) can guide outlet airflow of the axial flow fan to enter a peripheral outer manifold along a top outer manifold of the condensation shell;
the condensation shell (20) comprises a condensation top shell (21), a peripheral wall (22) and a flange mounting part (23) which are integrally formed, the condensation top shell (21) comprises a left top part (21.1) and a right top part (21.2), the left top part (21.1) and the right top part (21.2) are connected to form a horseridge shape, and a horseridge line of the horseridge shape is opposite to the inner concave ridge (1.4) in parallel;
the heat dissipation manifold (40) comprises an outer manifold (41) and an inner manifold (42) which are arranged inside and outside the wall of the condensation shell in a one-to-one correspondence mode, the outer manifold (41) comprises a top outer manifold (41.1) and a periphery outer manifold (41.2) which are not connected, and the inner manifold (42) comprises a top inner manifold (42.1) and a periphery inner manifold (42.2) which are connected with each other and integrally formed;
reflux capillary core (50) are restrainted (51), are restrainted (52) and are restrainted to the perpendicular reflux capillary core and reflux capillary chip (53) including the reflux capillary core to one side, and to flow back capillary core to one side and restraint (51) and fix between interior manifold piece (42) of condensation casing (20), and make the reflux capillary core to one side tie the inner wall of condensation top shell (21), the corresponding ridge line position interval of restrainting (51) is fixed with perpendicular reflux capillary core and restraints (52) to one side, is equipped with reflux capillary chip (53) on radiating surface (1.2) of radiating basal plate, the lower extreme that the reflux capillary core restrainted (51) and the lower extreme of perpendicular reflux capillary core and restrainting (52) butt respectively reflux capillary chip (53).
2. The high heat flux density cooling device for high power LED as claimed in claim 1, wherein the air guiding casing (61) is provided with a fan fixing portion (61.1) and an air guiding portion (61.2), when the outlet flange of the air guiding casing (61) is fixed on the flange mounting portion (23) of the condensation casing (20), the peripheral wall of the air guiding portion (61.2) is disposed in close contact with the peripheral outer manifold (41.2), the peripheral wall of the air guiding portion (61.2) is provided with a plurality of grid holes (61.3) at intervals corresponding to the positions of the peripheral outer manifold (41.2), and the air guiding casing (61) guides the outlet air flow of the axial flow fan (60) to flow along the space between the top outer manifold (41.1) to the outside along the space between the peripheral outer manifolds (41.2) and then flow out from the grid holes (61.3).
3. The high heat flux density cooling device for high power LED according to claim 2, wherein the fan fixing part (61.1) comprises a support rib (62) integrally connected with the air guide casing and an inverted T-shaped hub fixing body (63), the hub fixing body (63) comprises a T-shaped cap (63.1) and a motor shaft fixing tube (63.2) which are integrally formed, the axial flow fan (60) comprises a hub (60.1) and a plurality of rotating blades (60.2) integrally connected with the hub, and the hub (60.1) combined with the driving shaft of the motor is rotatably disposed in the motor shaft fixing tube (63.2) through a tapered roller bearing (60.3).
4. The high heat flux density cooling device for high power LED according to claim 3, wherein the T-shaped cap (63.1) has a wind guiding edge (64), the wind guiding edge (64) forms a wind guiding angle (α) with the axis of the motor shaft fixing tube, and the wind guiding angle (α) is 30 ° to 60 °.
5. The high heat flux density cooling device for high power LED according to claim 1, wherein the heat dissipating structure (200) further comprises a tube shaped evaporator (70), the tube shaped evaporator (70) being hermetically mounted in the mounting hole of the heat dissipating substrate (1); the tubular evaporator (70) comprises an evaporation part (70.1) and a condensation part (70.2), the condensation part (70.2) is provided with an open end, and the open end extends to be higher than the working medium liquid level of the evaporation cavity (30); the tubular evaporator (70) contains the phase-changeable working medium (31).
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| CN108123025A (en) * | 2018-01-23 | 2018-06-05 | 福建工程学院 | A kind of high heat flux density cooling unit of high-power LED array module |
| CN108105732A (en) * | 2018-01-23 | 2018-06-01 | 福建工程学院 | A kind of radiator structure of LED array module |
| CN108278581B (en) * | 2018-01-28 | 2019-11-29 | 陈攀攀 | A kind of cooling structure of LED array module |
| CN110475457B (en) * | 2018-05-11 | 2021-06-29 | 深圳富泰宏精密工业有限公司 | Heat radiation structure and electronic device with same |
| CN112055502B (en) * | 2019-06-05 | 2022-12-20 | 英业达科技有限公司 | Cooling system |
| CN112201737A (en) * | 2020-10-13 | 2021-01-08 | 安徽芯瑞达科技股份有限公司 | Mini LED device packaging method and structure |
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