CN108123025A - A kind of high heat flux density cooling unit of high-power LED array module - Google Patents
A kind of high heat flux density cooling unit of high-power LED array module Download PDFInfo
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- CN108123025A CN108123025A CN201810061896.2A CN201810061896A CN108123025A CN 108123025 A CN108123025 A CN 108123025A CN 201810061896 A CN201810061896 A CN 201810061896A CN 108123025 A CN108123025 A CN 108123025A
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- radiation rack
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- Microelectronics & Electronic Packaging (AREA)
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- Manufacturing & Machinery (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
A kind of high heat flux density cooling unit of high-power LED array module, including heat-radiating substrate, heat-radiating substrate is equipped with radiator structure；Radiator structure includes condensation housing, evaporation cavity, through-hole foamed metal heat radiation rack；The internal cavities that the condensation housing and heat-radiating substrate are formed are configured to evaporation cavity, in the evaporation cavity filled with can phase transformation working media；The inner and outer wall of the condensation housing is equipped with through-hole foamed metal heat radiation rack；The radiator structure further includes hot interface composite structure, and the hot interface composite structure, which includes integrally casting shaping in aluminium base, through-hole foam copper coin, and through-hole foam copper coin upper surface and/or lower surface are integrally compounded with the through-hole foamed metal heat radiation rack；The condensation housing and heat-radiating substrate use the hot interface composite structure.The bang path of the high heat flux density cooling unit of the high-power LED array module, dual-purpose heat loss through conduction and phase-change heat, suitable for being more than 60w/cm2High heat flux density effective heat dissipation.
Description
A kind of high heat flux density cooling unit of high-power LED array module.
Technical field
The present invention relates to the technical fields of great power LED, and in particular to a kind of high hot-fluid of high-power LED array module is close
Spend cooling unit.
Background technology
LED is as a kind of active selfluminous element, and the solid-state light as do not burn filament or gas is shone, small power consumption, work
Voltage is low, luminosity is high, long working life, performance are stablized, can work in extreme circumstances and the characteristics of performance degradation very little
And be widely applied, but the electric energy that its course of work only has 15% is converted into luminous energy, and remaining 85% electric energy almost all turns
It changes thermal energy into, raises the temperature of LED.Not only the crash rate of LED greatly increases as the temperature increases but also LED light declines and adds
The acute, lost of life, therefore, the performance and its reliability of LED product, be heavily dependent on good heat dissipation design and
Whether the cooling measure taken is effective.
Current part heavy-power LED product, the heat flow density that need to be radiated have reached 50-90w/cm2, it is higher
More than 150 w/cm2.In addition small product size size is less and less, the constraint that radiator arrangement in itself and design are run into also is got over
Come more serious.Traditional heat convection and air blast cooling method by monophasic fluid is only used for heat flow density no more than 10w/
cm2Product.Now experiment experience have shown that, heat flow density be more than 60w/cm2It just can be described as high heat flux density.
Heat dissipation qi piece, pressure streaming draught fan and special aluminium are installed generally by substrate back in the prior art
Heat sink processed is come the heat that sheds from the LED of tight clusters.For example heat dissipating layer is installed below in the positive LED mounting bases of substrate,
But heat is transferred to the heat dissipating layer of substrate by LED seat, then conducted by heat dissipating layer to the back side of substrate and by fan airstream handle
Heat is taken away, and so attempts by radiating from the pressure air-flow of substrate back.Since the heat that front generates can only be from the back side
It takes away, so radiating efficiency is poor, this affects the service life of LED array device to a certain extent.Also have and worn using multiple
It is located at the copper pipe on substrate in the clearance space of LED array to radiate, but substrate back is needed to set and forces streaming ventilation
Fan could meet cooling cooling requirements.Which results in the power consumption of streaming draught fan is forced to greatly increase, also increase
Manufacture cost.
Meanwhile in order to cool down the LED on the substrate of tight clusters, causing to manufacture LED and be increased using the expense of LED.Than
Such as, the cooled pressure streaming draught fan of the electricity cost more than 70% of LED array device expends.It is added in manufacturing process
Heat dissipating layer also increases the cost of LED array device.
Then, the heat of LED array device that is how inexpensive, expeditiously shifting tight clusters, and make cooling measure
Effectively, the problem that industry promotes LED array device general character urgently to be resolved hurrily is become.
The content of the invention
Defect present in for the above-mentioned prior art, it is an object of the invention to provide a kind of high-power LED array moulds
The high heat flux density cooling unit of block, the heat of what low cost, the expeditiously LED array device of transfer tight clusters, and make
Cooling measure is effective.
The object of the present invention is achieved like this, a kind of high heat flux density cooling unit of high-power LED array module, bag
High-power LED array module and heat-radiating substrate are included, the high-power LED array module includes at least four high power LED device,
Heat-radiating substrate is equipped with radiator structure；
The heat-radiating substrate includes LED mounting surfaces, radiating surface and step mounting portion, and the high power LED device is with a line spacing
It is fixed on row matrix row on the LED mounting surfaces of heat-radiating substrate；
Radiator structure includes condensation housing, evaporation cavity, through-hole foamed metal heat radiation rack, and the condensation housing is adiabatically fixed on institute
It states on step mounting portion；The internal cavities that the condensation housing and heat-radiating substrate are formed are configured to evaporation cavity, in the evaporation cavity
Filled with can phase transformation working media；The inner and outer wall of the condensation housing is equipped with through-hole foamed metal heat radiation rack；
The radiator structure further includes hot interface composite structure, the hot interface composite structure include in aluminium base integrally casting into
Type has through-hole foam copper coin, through-hole foamed metal heat radiation rack described in through-hole foam copper coin upper surface and/or lower surface integrally connected；
The condensation housing and heat-radiating substrate use the hot interface composite structure.
Further, the through-hole foamed metal heat radiation rack include be arranged on condensation housing wall inside and outside outer heat radiation rack and
Interior heat absorption frame, the outer heat radiation rack include heat radiation rack and week outer heat radiation rack outside integrally formed top, and the interior heat absorption frame includes one
Absorb heat frame and heat absorption frame in week in body formed top.
Further, condensing integrally casting shaping in the aluminium base of housing has the second through-hole foam copper coin, condenses outside housing
Surface is integrally compounded with outer heat radiation rack, and condensation shell inner surface is integrally compounded with interior heat absorption frame, one in the aluminium base of heat-radiating substrate
Body casting has first through hole foam copper coin, and radiating surface is integrally compounded with through-hole foamed metal heat radiation rack.
Further, it is described to be integrally complex as：Casting molten aluminum exceeds the compound depth of upper and lower interface of the through-hole foam copper coin
Spend for 3-5mm, when molten aluminum does not solidify, by through-hole foamed metal heat radiation rack insert in molten aluminum and make its on through-hole foam copper coin
Lower interfacial contact obtains the hot interface composite structure after solidification.
Further, the radiator structure further includes reflux frame, and heat radiation rack in the top of the trellis abutting that flows back, bottom abuts the 3rd
Through-hole foam copper coin, and spot welding links into an integrated entity.
Further, the radiator structure further includes the heat conduction for being threaded through in great power LED and being inlaid on LED mounting surfaces
Item, the heat conduction item extend to radiating surface and are welded on outer heat radiation rack around the side of heat-radiating substrate.
Further, the heat conduction item is more than 500 w/mk along the thermal conductivity factor of heat conduction extending direction.
Further, the heat conduction item is high heat conduction celion band or flexible high heat conduction graphite tape.
Further, the radiator structure further includes coolant housing, states coolant housing and is fixed on the condensation top shell
Outside forms the cold chamber of liquid between coolant housing and condensation top shell, and the outer heat radiation rack and heat conduction end are located at the cold chamber of liquid
In.
Further, high heat conduction celion band is 2205 celion bands or 1205 celion items
Band.
Compared with prior art, the present invention the high heat flux density cooling unit of high-power LED array module so that high-power
The heat of LED component pedestal and the heat of the high heat flux density in LED gathering groups distribute rapidly, greatly increase heat dissipation area, simultaneous
With heat loss through conduction and the bang path of phase-change heat, the heat dissipation of radiant heat is supplemented, suitable for being more than 60w/cm2High heat flux density
Effectively heat dissipation.
Description of the drawings
Fig. 1 is the main sectional view that the present invention is used for great power LED.
Fig. 2 cuts open for a kind of master of the embodiment one of the high heat flux density cooling unit of high-power LED array module of the present invention
View.
Fig. 3 is a kind of looking up for embodiment one of the high heat flux density cooling unit of high-power LED array module of the invention
Figure.
Fig. 4 is a kind of condensation of the embodiment one of the high heat flux density cooling unit of high-power LED array module of the present invention
Housing main sectional view.
Fig. 5 cuts open for a kind of master of the embodiment two of the high heat flux density cooling unit of high-power LED array module of the present invention
View.
Fig. 6 is a kind of hot interface composite structure of the high heat flux density cooling unit of high-power LED array module of the present invention
Schematic diagram.
Reference numeral in above-mentioned figure：
100 high power LED devices, 101 LED chips, heat sink, 103 metal base circuit boards in 102,104 package lens, 105 Z
Shape electrode, 106 insulating layers, 200 radiator structures, 300 high-power LED array modules
1 heat-radiating substrate, 2 first through hole foam copper coins, 3 annular convex ribs, 4 heat-conducting silicone greases, 5 second through-hole foam copper coins, 6
Three through-hole foam copper plates
1.1 LED mounting surfaces, 1.2 radiating surfaces, 1.3 step mounting portions, 1.4 side wall surfaces
20 condensation housings, 21 condensation top shells, 21.1 left tops, 21.2 right tops, 22 peripheral walls, 23 flange mounting portions, 24
Adiabatic gasket
30 evaporation cavities, 31 working medias
40 through-hole foamed metal heat radiation racks, 41 outer heat radiation racks, the 41.1 outer heat radiation racks in top, 41.2 weeks outer heat radiation racks, in 42
Absorb heat frame, 43 reflux framves, 44 coolant housings, the cold chamber of 45 liquid, 45.1 liquid inlets, 45.2 liquid outlets
50 heat conduction items
60 hot interface composite structures, 61 aluminium bases, 62 through-hole foam copper coins, L composite depths.
Specific embodiment
It elaborates below in conjunction with attached drawing to the embodiment of the present invention, but is not limited to the scope of the present invention.
Embodiment one
As shown in the figure, a kind of high power LED device 100 includes LED chip 101, interior heat sink 102, metal base circuit board 103 and envelope
Lens 104 are filled, described interior heat sink 102 are fixed on by high heat conduction elargol on metal base circuit board 103, interior heat sink 102 bag
Top part and stage portion are included, the LED chip 101 is fixed on interior heat sink 102 top part, interior heat by high heat conduction elargol
Heavy 102 stage portion is fixed with insulating layer 106, and Z-shaped electrode 105 is fixed with outside insulating layer 103；The bond end of the Z-shaped electrode
It is fixed on the insulating layer 106, the sealed end of Z-shaped electrode is fixed on by high heat conduction elargol on metal base circuit board 103, institute
Z-shaped electrode is stated to be connected with LED chip 101 by gold thread；The package lens 104 are by the LED chip 101, gold thread and Z-shaped electricity
The bond end sealing of pole 104 is fixed on interior heat sink 102 stage portion.The LED chip 101, interior heat sink 102 and Metal Substrate
Wiring board 103 forms heat conduction via.
A kind of high-power LED array module 300 includes at least four high power LED device 100, the high power LED device
100 are fixed on away from X array on the heat-radiating substrate 1 with a line spacing Y and row；
A kind of high heat flux density cooling unit of high-power LED array module, including aluminum cooling substrates 1, the heat-radiating substrate 1 wraps
LED mounting surfaces 1.1, radiating surface 1.2 and step mounting portion 1.3 are included, the LED mounting surfaces 1.1 are equipped with annular convex rib 3, in annular
The certain thickness heat-conducting silicone grease 4 of filling in convex ribs 3 so that the heat-conducting silicone grease 4 fills step mounting portion and is higher by LED mounting surfaces
1.1 are centainly embedded in thickness, and the embedded thickness is at least above 1.5 times of the thickness of metal base circuit board 103.The metal base
Road plate 103 is embedded in heat-conducting silicone grease 4 and is fixed with the heat-radiating substrate 1.Integrally molded on the radiating surface 1.2 of heat-radiating substrate 1
Three through-hole foam copper plates 6.
The side wall surface 1.4 of radiating surface 1.2 is configured to step mounting portion 1.3 with the edge surface on the outside of 1 radiating surface of substrate.
Radiator structure 200 includes condensation housing 20, and the condensation housing 20 includes integrally formed condensation top shell 21, peripheral wall
22 and flange mounting portion 23, the flange mounting portion 23 be fixed on the step mounting portion 1.3, the flange mounting portion 23 with
Adiabatic gasket 24 is equipped between the step mounting portion 1.3.The condensation top shell 21 includes left top 21.1 and right top
21.2, the left top 21.1 and the connection of right top 21.2 form horse ridged.
Radiator structure 200 further includes evaporation cavity 30, and the internal cavities that the condensation housing 20 and heat-radiating substrate 1 are formed are formed
For evaporation cavity 30, the evaporation cavity 30 vacuumize and be filled with can phase transformation working media 31.The groundwater increment of working media is most preferably
The 25-50% of 13 total volume of evaporation cavity.
The radiator structure 200 further includes through-hole foamed metal heat radiation rack 40, and the through-hole foamed metal heat radiation rack 40 wraps
Include installation position corresponding outer heat radiation rack 41 and interior heat absorption frame 42, the hole of the outer heat radiation rack 41 inside and outside condensation top shell 21 respectively
Footpath is in 3-10mm, porosity 90-98%.The aperture of interior heat absorption frame 42 is in 0.5-2mm, porosity 90-98%.The outer heat radiation rack 41
Including heat radiation rack 41.1 outside integrally formed top and week outer heat radiation rack 41.2, the interior heat absorption frame 42 is included in integrally formed top
Absorb heat frame 42.1 and heat absorption frame 42.2 in week.The through-hole foamed metal heat radiation rack 40 selects foam copper or foamed aluminium.
The radiator structure 200 further includes reflux frame 43, and heat radiation rack 42 in the 43 top abutting of frame that flows back, bottom abuts through hole
Foam copper heat sink 6, and spot welding links into an integrated entity.The reflux frame 43 is by liquid working media by the top inner wall of condensation housing 20
Bring back to the radiating surface 1.2 of heat-radiating substrate 1.
The radiator structure 200 further includes hot interface composite structure 60, and the condensation housing 20 and heat-radiating substrate 1 use institute
State hot interface composite structure 60.Specifically, the hot interface composite structure 60 has logical including integrally casting shaping in aluminium base 61
Hole foam copper coin 62,62 upper surface of through-hole foam copper coin or lower surface are connected with through-hole foam heat radiation rack 40.Casting molten aluminum
Exceed the upper and lower interface composite depth L of the through-hole foam copper coin 62 for 3-5mm, when molten aluminum does not solidify, by through-hole foam gold
Belong to heat radiation rack 40 to insert in molten aluminum and it is made to contact with 62 upper and lower interface of through-hole foam copper coin, the hot interface is obtained after solidification and is answered
Close structure 60.
The condensation housing 20 and heat-radiating substrate 1 use the hot interface composite structure 60.One in the condensation housing 20
Body casting has the second through-hole foam copper coin 5, and integrally casting shaping has a first through hole foam copper coin 2 in heat-radiating substrate 1, and first
The hole density of through-hole foam copper coin 2 is more than the hole density of the second through-hole foam copper coin 5, the porosity of first through hole foam copper coin 2
More than the porosity of the second through-hole foam copper coin 5.The aluminium base upper surface of heat-radiating substrate 1 is connected with third through-hole foam copper
Plate 6.
The radiator structure 200, which further includes, is threaded through line-spacing Y and row away from the heat conduction item 50 in X.In LED array, installation is complete
Afterwards, the heat conduction item 50 is arranged between LED array；The heat conduction item 50 extends to radiating surface around the side of heat-radiating substrate 1
It 1.2 and is welded on outer heat radiation rack 41.The heat conduction item 50 is high heat conduction celion band or flexible high heat conduction graphite
Band, high heat conduction celion band are more than 500w/mk along machine direction thermal conductivity factor.High heat conduction graphite tape is along band heat conduction
Coefficient is more than 500 w/mk.High heat conduction celion band is preferably 2205 or 1205 celion bands, and the height is led
Hot celion band can take central temperature to radiating surface 1.2 along heat conduction item 70 rapidly and be conducted to outer heat radiation rack 41.
It is interior heat sink as the LED light-emitting component of aggregation constantly discharges heat when the high power LED device 100 works
102 directly conduct heat to heat-radiating substrate 1 by heat-conducting silicone grease 4, and the radiations heat energy of package lens 104 passes to thermal conductive belt
50, thermal conductive belt directly conducts heat to outer heat radiation rack along thermal conductive belt, compared with by heat-radiating substrate to evaporation cavity to condensation top plate
The first heat dissipation path to outer heat radiation rack will fast directly much.
The cooling device of the LED array device is radiated by two approach, first, conduction heat, conduction heat is by interior
Heat sink heat transfer to heat sink, heat sink by evaporation cavity 30 by the partial heat by through-hole foamed metal heat radiation rack 40 by heat
Amount is dispersed into air；Second, radiations heat energy, radiations heat energy is the heat that the radiation of package lens 104 generates, the partial heat
Heat is transported to outer heat radiation rack 41 along heat conduction item 70 by heat conduction item 70.Cooperation will conduction heat jointly for evaporation cavity 30 and heat conduction item 70
Amount and radiations heat energy are taken away respectively, maintain the low-temperature working environment of the LED array device 300 jointly.
For the high-power LED array of less than 4, heat conduction item 70 can be omitted, using only dissipating including evaporation cavity 30
Heat structure 200.
Embodiment two
Outer heat radiation rack 41 is arranged in coolant housing 44, and the coolant housing 44 is fixed on 21 outside of condensation top shell,
The cold chamber 45 of liquid is formed between coolant housing 44 and condensation top shell 21, the liquid in the cold chamber 45 of liquid is by outer heat radiation rack 41 and heat conduction
The heat of item is taken away.The cold chamber 45 of liquid has liquid inlet 45.1 and liquid outlet 45.2.
Coolant flows through the cold chamber 45 of liquid, takes away the heat of outer heat radiation rack 41 and heat conduction item 50, ensure that the phase of evaporation cavity 30
Becoming the heat of heat transfer can be released effectively.
Other structures are identical with embodiment one.
The high heat flux density cooling unit of the high-power LED array module, solve by following technical spirit " how
The technical issues of low cost, high heat flux density heat for expeditiously shifting high power LED device "：
1）Hot interface composite structure maintains the lightweight of aluminium and the efficient heat transfer of copper
The thermal conductivity factor of copper is 401w/mk, and the thermal conductivity factor of aluminium is 237w/mk, but the density of copper is 8.9 × 103kg/m3,
The density of aluminium is 2.7 × 103kg/m3, the heat-radiating substrate of same volume, copper coin is 3 times of weights of aluminium sheet, and cost is also expensive, so limitation
Use of the copper coin as LED heat radiation substrate.And integrally casting has through-hole foam copper coin in aluminium base, then the height for having had copper concurrently is led
Hot coefficient, and have the lightweight of aluminium.The fusing point of copper is 1083 DEG C, and the fusing point of aluminium is 660 DEG C, is first put into casting aluminium sheet cavity logical
Hole foam copper coin, then casting aluminium sheet.In order to remove gas hole defect, through-hole foam copper is first put into the mold of aluminum substrate
Stent, then suction pouring filling molten aluminum, is cooled and shaped to embed the clad aluminium of foam copper.
Through-hole foam copper coin upper surface and/or lower surface are integrally compounded with through-hole foamed metal heat radiation rack, heat radiation rack simultaneously
The upper surface or lower surface of through-hole foam copper coin are contacted directly, heat directly passes to heat radiation rack from through-hole foam copper coin, scatters and disappears
Into air or coolant, the interface resistance between housing and heat radiation rack is greatly reduced.
The hot interface composite structure has advantage of both the high thermal conductivity of copper and the lightweight of aluminium, while interface resistance concurrently
It is low, it breaches encirclement shell body and outwards conducts the poorly efficient of heat, be the hot interface composite structure for being suitble to LED efficient heat transfers.
2）The cooperation for condensing housing, interior heat absorption frame builds the first radiating segment, and outer heat radiation rack builds the second radiating segment, and cold
First radiating segment is then effectively connected to the second radiating segment by solidifying top shell, becomes the first path effectively to radiate.
Condense housing and heat-radiating substrate and form evaporation cavity, in evaporation cavity can phase transformation working media gaseous state be changed by liquid inhale
Heat is received, gaseous working medium rises to condensation inner walls, becomes liquid from gaseous state on inner wall and interior heat absorption frame, heat release,
Condensation inner walls and interior heat absorption frame are transferred heat to, is configured to the first radiating segment of phase-change heat；Inner wall and interior heat absorption frame
Heat conducted by condensation top shell 21 to outer heat radiation rack and outer wall, the heat dissipation for condensing the outer heat radiation rack of housing to surrounding air is second
To the second radiating segment, heat is sent into surrounding air or in coolant for radiating segment, the effectively heat dissipation of the first radiating segment.Three sections dissipate
Heat exists without thermojunction, is that the through-hole foam copper of high thermal conductivity is playing a crucial role.If aluminum condenses top shell, then interior suction
The heat transfer of hot frame to outer heat radiation rack can be subject to the aluminum condensation restriction that top shell thermal conductivity factor is low, heat transfer efficiency is low.
3）Thermal conductive belt conducts heat, and by the radiation thermal conduction of heat-radiating substrate mounting surface to outer heat radiation rack below, becomes and effectively dissipates
Second path of heat
Thermal conductive belt absorbs the heat for radiating generation for a long time from LED package lens 104, although heat-radiating substrate 1 disclosure satisfy that LED
Operating temperature requirements of chip 101, but after much time using, from 104 long-irradiated radiations heat energy of package lens,
Heat-radiating substrate mounting surface temperature drastically raises, and can bake the temperature in heat-seal lens 104 in turn, causes the envelope of LED chip 101
The temperature rise in space is filled, this does not allow.Thermal conductive belt 70 has taken away the radiations heat energy of package lens 104 so that LED gusts
The gap temperature of row reduces, indirectly so that 104 self-temperature of package lens will not raise, so as to ensure that the envelope of LED chip 101
Fill the low operating temperature in space.This is to from interior heat sink 102 to the second path of the heat loss through conduction of metal base circuit board 101.
Exactly by the above-mentioned three improved synergistic effects of aspect so that the heat of high power LED device pedestal and LED gathering groups
In the heat of high heat flux density distribute rapidly, greatly increase the transmission road of heat dissipation area, dual-purpose heat loss through conduction and phase-change heat
Footpath supplements the heat dissipation of radiant heat, substantially increases heat transfer efficiency.
Claims (10)
1. a kind of high heat flux density cooling unit of high-power LED array module, including high-power LED array module（300）With
Heat-radiating substrate（1）, the high-power LED array module（300）Including at least four high power LED device（100）, feature exists
In,
Heat-radiating substrate（1）It is equipped with radiator structure（200）；
The heat-radiating substrate（1）Including LED mounting surfaces（1.1）, radiating surface（1.2）With step mounting portion（1.3）, it is described high-power
LED component（100）With a line spacing（Y）With row away from（X）Array is fixed on heat-radiating substrate（1）LED mounting surfaces（1.1）On；
Radiator structure（200）Including condensing housing（20）, evaporation cavity（30）, through-hole foamed metal heat radiation rack（40）, the condensation
Housing（20）Adiabatically it is fixed on the step mounting portion（1.3）On；The condensation housing（20）And heat-radiating substrate（1）It forms
Internal cavities are configured to evaporation cavity（30）, the evaporation cavity（30）It is interior filled with can phase transformation working media（31）；The condensation
Housing（20）Inner and outer wall be equipped with through-hole foamed metal heat radiation rack（40）；
The radiator structure（200）Further include hot interface composite structure（60）, the hot interface composite structure（60）Including aluminium base
Material（61）Middle integrally casting shaping has through-hole foam copper coin（62）, through-hole foam copper coin（62）Upper surface and/or lower surface one
It is compounded with the through-hole foamed metal heat radiation rack（40）；
The condensation housing（20）And heat-radiating substrate（1）Using the hot interface composite structure（60）.
2. the high heat flux density cooling unit of high-power LED array module as described in claim 1, which is characterized in that described logical
Hole foam metal heat radiation rack（40）Including the outer heat radiation rack being arranged on inside and outside the wall of condensation housing（41）With interior heat absorption frame（42）, institute
State outer heat radiation rack（41）Including heat radiation rack outside integrally formed top（41.1）With heat radiation rack outside week（41.2）, the interior heat absorption frame
（42）Including the frame that absorbs heat in integrally formed top（42.1）With the frame that absorbs heat in week（42.2）.
3. the high heat flux density cooling unit of high-power LED array module as described in claim 1, which is characterized in that condensation shell
Body（20）Aluminium base in integrally casting shaping have the second through-hole foam copper coin（5）, condensation housing outer surface is integrally compounded with outer
Heat radiation rack（41）, condense shell inner surface and be integrally compounded with interior heat absorption frame（42）, in the aluminium base of heat-radiating substrate integrally casting into
Type has first through hole foam copper coin（2）, radiating surface is integrally compounded with third through-hole foam copper coin（6）.
4. the high heat flux density cooling unit of high-power LED array module as described in claim 1, which is characterized in that described one
Bluk recombination is：Casting molten aluminum exceeds the through-hole foam copper coin（62）Upper and lower interface composite depth（L）For 3-5mm, work as molten aluminum
When not solidifying, by through-hole foamed metal heat radiation rack（40）It inserts in molten aluminum and makes itself and through-hole foam copper coin（62）Upper and lower interface connects
It touches, the hot interface composite structure is obtained after solidification（60）.
5. the high heat flux density cooling unit of high-power LED array module as claimed in claim 3, which is characterized in that described to dissipate
Heat structure（200）Further include reflux frame（43）, flow back frame（43）Heat radiation rack in the abutting of top（42）, bottom abuts third through-hole bubble
Foam copper coin（6）, and spot welding links into an integrated entity.
6. the high heat flux density cooling unit of high-power LED array module as described in claim 1, which is characterized in that described to dissipate
Heat structure（200）It further includes and is threaded through in great power LED and is inlaid in LED mounting surfaces（1.1）On heat conduction item（50）, it is described to lead
Hot item（50）Around heat-radiating substrate（1）Side extend to radiating surface（1.2）And it is welded to outer heat radiation rack（41）On.
7. the high heat flux density cooling unit of high-power LED array module as claimed in claim 6, which is characterized in that described to lead
Hot item（50）It is more than 500 w/mk along the thermal conductivity factor of heat conduction extending direction.
8. the high heat flux density cooling unit of high-power LED array module as claimed in claim 7, which is characterized in that described to lead
Hot item（50）For high heat conduction celion band or flexible high heat conduction graphite tape.
9. such as the high heat flux density cooling unit with high-power LED array module as described in claim 8, which is characterized in that institute
State radiator structure（200）Further include coolant housing（44）, state coolant housing（44）It is fixed on the condensation top shell（21）Outside
Side, in coolant housing（44）With condensation top shell（21）Between formed the cold chamber of liquid（45）, the outer heat radiation rack（41）With heat conduction item
End is located at the cold chamber of liquid（45）In.
10. the high heat flux density cooling unit of high-power LED array module as claimed in claim 7, which is characterized in that high heat conduction
Celion band is 2205 celion bands or 1205 celion bands.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810061896.2A CN108123025A (en) | 2018-01-23 | 2018-01-23 | A kind of high heat flux density cooling unit of high-power LED array module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810061896.2A CN108123025A (en) | 2018-01-23 | 2018-01-23 | A kind of high heat flux density cooling unit of high-power LED array module |
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| Publication Number | Publication Date |
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| CN108123025A true CN108123025A (en) | 2018-06-05 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810061896.2A Pending CN108123025A (en) | 2018-01-23 | 2018-01-23 | A kind of high heat flux density cooling unit of high-power LED array module |
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| Country | Link |
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| CN (1) | CN108123025A (en) |
Citations (4)
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| CN102095173A (en) * | 2009-12-10 | 2011-06-15 | 阿兰图姆公司 | Cooling device for light-emitting diode |
| CN103727499A (en) * | 2013-12-13 | 2014-04-16 | 青岛威力电子科技有限公司 | Efficient heat-dissipation device of LED light source carrier |
| CN107202509A (en) * | 2017-06-08 | 2017-09-26 | 无锡来德电子有限公司 | A kind of temperature-uniforming plate composite foam metal radiator |
| CN107293633A (en) * | 2017-08-03 | 2017-10-24 | 福建工程学院 | A kind of high heat flux cooling device for great power LED |
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2018
- 2018-01-23 CN CN201810061896.2A patent/CN108123025A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102095173A (en) * | 2009-12-10 | 2011-06-15 | 阿兰图姆公司 | Cooling device for light-emitting diode |
| CN103727499A (en) * | 2013-12-13 | 2014-04-16 | 青岛威力电子科技有限公司 | Efficient heat-dissipation device of LED light source carrier |
| CN107202509A (en) * | 2017-06-08 | 2017-09-26 | 无锡来德电子有限公司 | A kind of temperature-uniforming plate composite foam metal radiator |
| CN107293633A (en) * | 2017-08-03 | 2017-10-24 | 福建工程学院 | A kind of high heat flux cooling device for great power LED |
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