CN207741053U - A kind of radiator structure of LED array module - Google Patents
A kind of radiator structure of LED array module Download PDFInfo
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- CN207741053U CN207741053U CN201820109044.1U CN201820109044U CN207741053U CN 207741053 U CN207741053 U CN 207741053U CN 201820109044 U CN201820109044 U CN 201820109044U CN 207741053 U CN207741053 U CN 207741053U
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- heat
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- radiator structure
- radiation rack
- heat radiation
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Abstract
A kind of radiator structure of LED array module, radiator structure are arranged in heat-radiating substrate（1）On；Radiator structure（200）Including condensing shell（20）, evaporation cavity（30）, through-hole foamed metal heat radiation rack（40）；The condensation shell（20）And heat-radiating substrate（1）The internal cavities of composition are configured to evaporation cavity（30）, the evaporation cavity（30）It is interior filled with can phase transformation working media（31）；The condensation shell（20）Inner and outer wall be equipped with through-hole foamed metal heat radiation rack（40）；The radiator structure（200）It further include hot interface composite structure（60）, the hot interface composite structure（60）Including aluminium base（61）Middle integrally casting shaping has through-hole foam copper coin（62）, through-hole foam copper coin（62）Upper surface and/or lower surface are integrally compounded with the through-hole foamed metal heat radiation rack（40）；The condensation shell（20）And heat-radiating substrate（1）Using the hot interface composite structure（60）.The radiator structure of the LED array module, the transmission path of dual-purpose heat loss through conduction and phase-change heat are suitable for being more than 60w/cm2High heat flux density effective heat dissipation.
Description
A kind of radiator structure of LED array module.
Technical field
The utility model is related to the technical fields of LED, and in particular to a kind of radiator structure of LED array module.
Background technology
LED is as a kind of active selfluminous element, and the solid-state light as do not burn filament or gas is shone, small power consumption, work
Voltage is low, light emission luminance is high, long working life, performance are stablized, can work in extreme circumstances and the characteristics of performance degradation very little
And be widely applied, but its course of work only has 15% electric energy to be converted into luminous energy, and remaining 85% electric energy almost all turns
It changes thermal energy into, the temperature of LED is made to increase.Not only the crash rate of LED greatly increases as the temperature increases but also LED light declines and adds
The acute, lost of life, therefore, the performance and its reliability of LED product are heavily dependent on good heat dissipation design, and
Whether the cooling measure taken is effective.
Current part heavy-power LED product, the heat flow density that need to be radiated have reached 50-90w/cm2, it is higher
More than 150 w/cm2.In addition small product size size is smaller and smaller, the constraint that the arrangement and design of radiator itself encounter also is got over
Come more serious.Traditional heat convection and air blast cooling method by monophasic fluid is only used for heat flow density and is not more than 10w/
cm2Product.Now experiment experience have shown that, heat flow density be more than 60w/cm2It just can be described as high heat flux density.
Heat dissipation qi piece, pressure streaming draught fan and special aluminium are installed generally by substrate back in the prior art
Heat sink processed is come the heat that sheds from the LED of tight clusters.For example heat dissipating layer is installed below in the positive LED mounting bases of substrate,
But heat is transferred to the heat dissipating layer of substrate by LED seat, then conducted to the back side of substrate and by fan airstream handle by heat dissipating layer
Heat is taken away, and so attempts by radiating from the pressure air-flow of substrate back.Since the heat that front generates can only be from the back side
It takes away, so radiating efficiency is poor, this affects the service life of LED array device to a certain extent.Also have and worn using multiple
It is located at the copper pipe on substrate in the clearance space of LED array to radiate, but substrate back setting is needed to force streaming ventilation
Fan could meet cooling cooling requirements.Which results in forcing the electricity consumption of streaming draught fan to greatly increase, also increase
Manufacturing cost.
Meanwhile the LED on the substrate in order to cool down tight clusters, cause to manufacture LED and be increased using the expense of LED.Than
Such as, the cooled pressure streaming draught fan of 70% or more the electricity cost of LED array device expends.It is added in manufacturing process
Heat dissipating layer also increases the cost of LED array device.
Then, the heat of how inexpensive, expeditiously transfer tight clusters LED array devices, and make cooling measure
Effectively, become the problem that industry promotes LED array device general character urgently to be resolved hurrily.
Utility model content
Defect present in for the above-mentioned prior art, the purpose of this utility model is to provide a kind of great power LED battle arrays
The radiator structure of row module, the heat of what low cost, the expeditiously LED array device of transfer tight clusters, and heat dissipation is made to arrange
It applies effectively.
The purpose of this utility model is achieved in that a kind of radiator structure of LED array module, the LED array mould
Block includes at least four high power LED device, and radiator structure is arranged on heat-radiating substrate；
The heat-radiating substrate includes LED mounting surfaces, radiating surface and step mounting portion, and the high power LED device is with certain
Line-spacing and row matrix row are fixed on the LED mounting surfaces of heat-radiating substrate；
Radiator structure includes condensation shell, evaporation cavity, through-hole foamed metal heat radiation rack, and the condensation shell is adiabatically fixed
On the step mounting portion；The internal cavities that the condensation shell and heat-radiating substrate are constituted are configured to evaporation cavity, the evaporation
Intracavitary filled with can phase transformation working media；The inner and outer wall of the condensation shell is equipped with through-hole foamed metal heat radiation rack；
The radiator structure further includes hot interface composite structure, and the hot interface composite structure includes integrally being cast in aluminium base
It makes and forms through-hole foam copper coin, through-hole foamed metal described in through-hole foam copper coin upper surface and/or lower surface integrally connected dissipates
Hot frame；
The condensation shell and heat-radiating substrate use the hot interface composite structure.
Further, the through-hole foamed metal heat radiation rack include be arranged condensation shell wall inside and outside outer heat radiation rack and
Interior heat absorption frame, the outer heat radiation rack include heat radiation rack and week outer heat radiation rack outside integrally formed top, and the interior heat absorption frame includes one
Absorb heat frame and the frame that absorbs heat in week in body formed top.
Further, condensing integrally casting shaping in the aluminium base of shell has the second through-hole foam copper coin, condenses outside shell
Surface is integrally compounded with outer heat radiation rack, and condensation shell inner surface is integrally compounded with interior heat absorption frame, one in the aluminium base of heat-radiating substrate
Body casting and forming has first through hole foam copper coin, radiating surface to be integrally compounded with through-hole foamed metal heat radiation rack.
Further, described to be integrally complex as：Casting molten aluminum exceeds the compound depth of upper and lower interface of the through-hole foam copper coin
Degree be 3-5mm, when molten aluminum does not solidify, by through-hole foamed metal heat radiation rack be placed in molten aluminum in and make its on through-hole foam copper coin
Lower interfacial contact obtains the hot interface composite structure after solidification.
Further, the radiator structure further includes reflux frame, and reflux top of the trellis abuts interior heat radiation rack, and bottom abuts third
Through-hole foam copper coin, and spot welding links into an integrated entity.
Further, the radiator structure further includes the heat conduction for being threaded through in great power LED and being inlaid on LED mounting surfaces
Item, the heat conduction item extend to radiating surface and are welded on outer heat radiation rack around the side of heat-radiating substrate.
Further, the heat conduction item is more than 500 w/mk along the thermal coefficient of heat conduction extending direction.
Further, the heat conduction item is high heat conduction celion band or flexible high heat conduction graphite tape.
Further, the radiator structure further includes coolant liquid shell, states coolant liquid shell and is fixed on the condensation top shell
Outside forms liquid cooling chamber between coolant liquid shell and condensation top shell, and the outer heat radiation rack and heat conduction end are located at liquid cooling chamber
In.
Further, high heat conduction celion band is 2205 celion bands or 1205 celion items
Band.
The utility model compared with prior art, the radiator structure of high-power LED array module so that great power LED device
The heat of part pedestal and the heat of the high heat flux density in LED gathering groups distribute rapidly, greatly increase heat dissipation area, dual-purpose conduction
The transmission path of heat dissipation and phase-change heat, supplements the heat dissipation of radiant heat, is suitable for being more than 60w/cm2High heat flux density it is effective dissipate
Heat.
Description of the drawings
Fig. 1 is the main sectional view that the utility model is used for LED.
Fig. 2 is a kind of main sectional view of the embodiment one of the radiator structure of LED array module of the utility model.
Fig. 3 is a kind of upward view of the embodiment one of the high radiator structure of LED array module of the utility model.
Fig. 4 is a kind of condensation shell main sectional view of the embodiment one of the radiator structure of LED array module of the utility model.
Fig. 5 is a kind of main sectional view of the embodiment two of the radiator structure of LED array module of the utility model.
Fig. 6 is a kind of schematic diagram of the hot interface composite structure of the radiator structure of LED array module of the utility model.
Reference numeral in above-mentioned figure：
100 LED components, 101 LED chips, heat sink in 102,103 metal base circuit boards, 104 package lens, 105 is Z-shaped
Electrode, 106 insulating layers, 200 radiator structures, 300 LED array modules
1 heat-radiating substrate, 2 first through hole foam copper coins, 3 annular convex ribs, 4 heat-conducting silicone greases, 5 second through-hole foam coppers
Plate, 6 third through-hole foam copper coins
1.1 LED mounting surfaces, 1.2 radiating surfaces, 1.3 step mounting portions, 1.4 side wall surfaces
20 condensation shells, 21 condensation top shells, 21.1 left tops, 21.2 right tops, 22 peripheral walls, the installation of 23 flanges
Portion, 24 adiabatic gaskets
30 evaporation cavities, 31 working medias
40 through-hole foamed metal heat radiation racks, 41 outer heat radiation racks, the 41.1 outer heat radiation racks in top, 41.2 weeks outer heat radiation racks, 42
Interior heat absorption frame, 43 reflux framves, 44 coolant liquid shells, 45 liquid cooling chambers, 45.1 liquid inlets, 45.2 liquid outlets
50 heat conduction items
60 hot interface composite structures, 61 aluminium bases, 62 through-hole foam copper coins, L composite depths.
Specific implementation mode
It elaborates to the embodiments of the present invention below in conjunction with attached drawing, but is not limited to the model of the utility model
It encloses.
Embodiment one
As shown, a kind of LED component 100 includes LED chip 101, interior heat sink 102, metal base circuit board 103 and encapsulation
Lens 104, described interior heat sink 102 are fixed on by high heat conduction elargol on metal base circuit board 103, and described interior heat sink 102 include
Top part and stage portion, the LED chip 101 is fixed on interior heat sink 102 top part by high heat conduction elargol, interior heat sink
102 stage portion is fixed with insulating layer 106, and Z-shaped electrode 105 is fixed with outside insulating layer 103；The bond end of the Z-shaped electrode is solid
It is scheduled on the insulating layer 106, the sealed end of Z-shaped electrode is fixed on by high heat conduction elargol on metal base circuit board 103, described
Z-shaped electrode is connect by gold thread with LED chip 101；The package lens 104 are by the LED chip 101, gold thread and Z-shaped electrode
104 bond end sealing is fixed on interior heat sink 102 stage portion.The LED chip 101, interior heat sink 102 and metal base
Road plate 103 constitutes heat conduction via.
A kind of LED array module 300 includes at least four high power LED device 100, the high power LED device 100 with
One line spacing Y and row are fixed on away from X array on the heat-radiating substrate 1；
A kind of radiator structure of LED array module is arranged on aluminum cooling substrates 1, and heat-radiating substrate 1 includes LED mounting surfaces
1.1, radiating surface 1.2 and step mounting portion 1.3, the LED mounting surfaces 1.1 are equipped with annular convex rib 3, the filling in annular convex rib 3
Certain thickness heat-conducting silicone grease 4 so that the heat-conducting silicone grease 4 fills step mounting portion and is higher by LED mounting surfaces 1.1 and is centainly embedded in
Thickness, 1.5 times of thickness of the embedded thickness at least more than metal base circuit board 103.The metal base circuit board 103 is embedded in
It is fixed in heat-conducting silicone grease 4 and with the heat-radiating substrate 1.Integrally molded third through-hole foam copper on the radiating surface 1.2 of heat-radiating substrate 1
Plate 6.
The side wall surface 1.4 of radiating surface 1.2 is configured to step mounting portion 1.3 with the edge surface on the outside of 1 radiating surface of substrate.
Radiator structure 200 includes condensation shell 20, and the condensation shell 20 includes integrally formed condensation top shell 21, peripheral wall
22 and flange mounting portion 23, the flange mounting portion 23 be fixed on the step mounting portion 1.3, the flange mounting portion 23 with
Adiabatic gasket 24 is equipped between the step mounting portion 1.3.The condensation top shell 21 includes left top 21.1 and right top
21.2, the left top 21.1 and the connection of right top 21.2 form horse ridged.
Radiator structure 200 further includes evaporation cavity 30, and the internal cavities that the condensation shell 20 and heat-radiating substrate 1 are constituted are constituted
For evaporation cavity 30, the evaporation cavity 30 vacuumize and be filled with can phase transformation working media 31.The groundwater increment of working media is most preferably
The 25-50% of 13 total volume of evaporation cavity.
The radiator structure 200 further includes through-hole foamed metal heat radiation rack 40, and the through-hole foamed metal heat radiation rack 40 wraps
Include installation position corresponding outer heat radiation rack 41 and interior heat absorption frame 42, the hole of the outer heat radiation rack 41 inside and outside condensation top shell 21 respectively
Diameter is in 3-10mm, porosity 90-98%.The aperture of interior heat absorption frame 42 is in 0.5-2mm, porosity 90-98%.The outer heat radiation rack 41
Including heat radiation rack 41.1 outside integrally formed top and week outer heat radiation rack 41.2, the interior heat absorption frame 42 includes in integrally formed top
Absorb heat frame 42.1 and the frame 42.2 that absorbs heat in week.The through-hole foamed metal heat radiation rack 40 selects foam copper or foamed aluminium.
The radiator structure 200 further includes reflux frame 43, and 43 top of reflux frame abuts interior heat radiation rack 42, and bottom abuts through-hole
Foam copper heat sink 6, and spot welding links into an integrated entity.The reflux frame 43 is by liquid working media by the top inner wall of condensation shell 20
Bring back to the radiating surface 1.2 of heat-radiating substrate 1.
The radiator structure 200 further includes hot interface composite structure 60, and the condensation shell 20 and heat-radiating substrate 1 use institute
State hot interface composite structure 60.Specifically, the hot interface composite structure 60 has logical including integrally casting shaping in aluminium base 61
Hole foam copper coin 62,62 upper surface of through-hole foam copper coin or lower surface are connected with through-hole foam heat radiation rack 40.Casting molten aluminum
The upper and lower interface composite depth L for exceeding the through-hole foam copper coin 62 is 3-5mm, when molten aluminum does not solidify, by through-hole foam gold
Belong to heat radiation rack 40 to be placed in molten aluminum and it is made to contact with 62 upper and lower interface of through-hole foam copper coin, it is multiple that the hot interface is obtained after solidification
Close structure 60.
The condensation shell 20 and heat-radiating substrate 1 are using the hot interface composite structure 60.One in the condensation shell 20
Body casting and forming has the second through-hole foam copper coin 5, and integrally casting shaping has a first through hole foam copper coin 2 in heat-radiating substrate 1, and first
The hole density of through-hole foam copper coin 2 is more than the hole density of the second through-hole foam copper coin 5, the porosity of first through hole foam copper coin 2
More than the porosity of the second through-hole foam copper coin 5.The aluminium base upper surface of heat-radiating substrate 1 is connected with third through-hole foam copper
Plate 6.
The radiator structure 200 further includes being threaded through line-spacing Y and row away from the heat conduction item 50 in X.In LED array, installation is complete
Afterwards, the heat conduction item 50 is arranged between LED array；The heat conduction item 50 extends to radiating surface around the side of heat-radiating substrate 1
It 1.2 and is welded on outer heat radiation rack 41.The heat conduction item 50 is high heat conduction celion band or flexible high heat conduction graphite
Band, high heat conduction celion band are more than 500w/mk along machine direction thermal coefficient.High heat conduction graphite tape is along band heat conduction
Coefficient is more than 500 w/mk.High heat conduction celion band is preferably 2205 or 1205 celion bands, and the height is led
Hot celion band can take central temperature to radiating surface 1.2 along heat conduction item 70 rapidly and be conducted to outer heat radiation rack 41.
When the LED component 100 works, as the LED light-emitting component of aggregation constantly discharges heat, interior heat sink 102 directly
Heat-radiating substrate 1 is conducted heat to by heat-conducting silicone grease 4, the radiations heat energy of package lens 104 passes to thermal conductive belt 50, thermal conductive belt
Directly heat is conducted along thermal conductive belt to outer heat radiation rack, compared with by heat-radiating substrate to evaporation cavity to condensation top plate to outer heat radiation rack
The first heat dissipation path will fast directly much.
The radiator structure of the LED array device is radiated by two approach, first, conduction heat, conduction heat is by interior
For heat sink heat transfer to heat sink, heat sink will be warm by through-hole foamed metal heat radiation rack 40 by the partial heat by evaporation cavity 30
Amount is dispersed into air；Second, radiations heat energy, radiations heat energy is the heat that the radiation of package lens 104 generates, the partial heat
Heat is transported to outer heat radiation rack 41 along heat conduction item 70 by heat conduction item 70.Cooperation will conduction heat jointly for evaporation cavity 30 and heat conduction item 70
Amount and radiations heat energy are taken away respectively, maintain the low-temperature working environment of the LED array device 300 jointly.
For 4 high-power LED arrays below, heat conduction item 70 can be omitted, it includes dissipating for evaporation cavity 30 to be used only
Heat structure 200.
Embodiment two
Outer heat radiation rack 41 is arranged in coolant liquid shell 44, and the coolant liquid shell 44 is fixed on outside the condensation top shell 21
Side forms liquid cooling chamber 45 between coolant liquid shell 44 and condensation top shell 21, and the liquid in liquid cooling chamber 45 is by 41 He of outer heat radiation rack
The heat of heat conduction item is taken away.Liquid cooling chamber 45 has liquid inlet 45.1 and liquid outlet 45.2.
Coolant liquid flows through liquid cooling chamber 45, takes away the heat of outer heat radiation rack 41 and heat conduction item 50, ensure that the phase of evaporation cavity 30
Becoming the heat of heat transfer can be released effectively.
Other structures are identical as embodiment one.
The radiator structure of the LED array module, solve by following technical spirit " how low cost, expeditiously
Shift the high heat flux density heat of high power LED device " the technical issues of：
1）Hot interface composite structure maintains the lightweight of aluminium and the efficient heat transfer of copper
The thermal coefficient of copper is 401w/mk, and the thermal coefficient of aluminium is 237w/mk, but the density of copper is 8.9 × 103kg/
m3, the density of aluminium is 2.7 × 103kg/m3, the heat-radiating substrate of same volume, copper coin is 3 times of weights of aluminium sheet, and cost is also expensive, so
Limit use of the copper coin as LED heat radiation substrate.And integrally casting has through-hole foam copper coin in aluminium base, then has had copper concurrently
High thermal conductivity coefficient, and have the lightweight of aluminium.The fusing point of copper is 1083 DEG C, and the fusing point of aluminium is 660 DEG C, casts in aluminium sheet cavity and first puts
Enter through-hole foam copper coin, then casting and forming aluminium sheet.In order to remove gas hole defect, through-hole bubble is first put into the mold of aluminum substrate
Foam copper stent, then suction pouring filling molten aluminum, is cooled and shaped to embed the clad aluminium of foam copper.
Through-hole foam copper coin upper surface and/or lower surface are integrally compounded with through-hole foamed metal heat radiation rack, heat radiation rack simultaneously
It is in direct contact the upper surface or lower surface of through-hole foam copper coin, heat directly passes to heat radiation rack from through-hole foam copper coin, scatters and disappears
Into air or coolant liquid, the interface resistance between shell and heat radiation rack is greatly reduced.
The hot interface composite structure has advantage of both the high thermal conductivity of copper and the lightweight of aluminium, while interface resistance concurrently
It is low, it breaches encirclement shell body and conducts the inefficient of heat outward, be the hot interface composite structure for being suitble to LED efficient heat transfers.
2）The cooperation for condensing shell, interior heat absorption frame builds the first radiating segment, and outer heat radiation rack builds the second radiating segment, and cold
First radiating segment is then effectively connected to the second radiating segment by solidifying top shell, becomes the first path effectively to radiate.
Condense shell and heat-radiating substrate and constitute evaporation cavity, in evaporation cavity can phase transformation working media gaseous state be changed by liquid inhale
Heat is received, gaseous working medium rises to condensation inner walls, becomes liquid from gaseous state on inner wall and interior heat absorption frame, heat release,
Condensation inner walls and interior heat absorption frame are transferred heat to, the first radiating segment of phase-change heat is configured to；Inner wall and interior heat absorption frame
Heat by the conduction of condensation top shell 21 to outer heat radiation rack and outer wall, the heat dissipation for condensing outer heat radiation rack to the surrounding air of shell is second
Radiating segment, the effectively heat dissipation of the first radiating segment send heat into surrounding air or in coolant liquid to the second radiating segment.Three sections dissipate
Heat exists without hot surplus, is that the through-hole foam copper of high thermal conductivity is playing a crucial role.Top shell is condensed if it is aluminum, then interior suction
The heat transfer of hot frame to outer heat radiation rack can be condensed the restriction that top shell thermal coefficient is low, heat transfer efficiency is low by aluminum.
3）Thermal conductive belt conducts heat, and by the radiation thermal conduction of heat-radiating substrate mounting surface to subsequent outer heat radiation rack, becomes and effectively dissipates
Second path of heat
Thermal conductive belt absorbs the heat for radiating generation for a long time from LED package lens 104, although heat-radiating substrate 1 disclosure satisfy that
The operating temperature requirements of LED chip 101, but after prolonged use, come from 104 long-irradiated radiant heat of package lens
Amount, heat-radiating substrate mounting surface temperature drastically increase, and can bake the temperature in heat-seal lens 104 in turn, lead to LED chip 101
Encapsulated space in temperature increase, this does not allow.Thermal conductive belt 70 has taken away the radiations heat energy of package lens 104 so that
The gap temperature of LED array reduces, indirectly so that 104 self-temperature of package lens will not increase, to ensure that LED chip
Low operating temperature in 101 encapsulated space.This is to from interior heat sink 102 to the of the heat loss through conduction of metal base circuit board 101
Two paths.
Exactly by the improved synergistic effect of above-mentioned three aspect so that the heat and LED gathering groups of high power LED device pedestal
In the heat of high heat flux density distribute rapidly, greatly increase heat dissipation area, the transmission road of dual-purpose heat loss through conduction and phase-change heat
Diameter supplements the heat dissipation of radiant heat, substantially increases heat transfer efficiency.
Claims (6)
1. a kind of radiator structure of LED array module, the LED array module（300）Including at least four LED component（100）,
Radiator structure（200）It is arranged in heat-radiating substrate（1）On, which is characterized in that
The heat-radiating substrate（1）Including LED mounting surfaces（1.1）, radiating surface（1.2）With step mounting portion（1.3）, the LED devices
Part（100）With a line spacing（Y）With row away from（X）Array is fixed on heat-radiating substrate（1）LED mounting surfaces（1.1）On；
Radiator structure（200）Including condensing shell（20）, evaporation cavity（30）, through-hole foamed metal heat radiation rack（40）, the condensation
Shell（20）Adiabatically it is fixed on the step mounting portion（1.3）On；The condensation shell（20）And heat-radiating substrate（1）It constitutes
Internal cavities are configured to evaporation cavity（30）, the evaporation cavity（30）It is interior filled with can phase transformation working media（31）；The condensation
Shell（20）Inner and outer wall be equipped with through-hole foamed metal heat radiation rack（40）；
The condensation shell（20）Including integrally formed condensation top shell（21）, peripheral wall（22）With flange mounting portion（23）, described
Flange mounting portion（23）It is fixed on the step mounting portion (1.3), the flange mounting portion (23) and the step mounting portion
(1.3) adiabatic gasket (24) is equipped between, the condensation top shell (21) includes left top (21.1) and right top (21.2), institute
It states left top (21.1) and right top (21.2) connection forms horse ridged；
The radiator structure（200）It further include hot interface composite structure（60）, the hot interface composite structure（60）Including aluminium base
Material（61）Middle integrally casting shaping has through-hole foam copper coin（62）, through-hole foam copper coin（62）Upper surface and/or lower surface one
It is compounded with the through-hole foamed metal heat radiation rack（40）；
The through-hole foamed metal heat radiation rack（40）Including the outer heat radiation rack inside and outside the wall of condensation shell is arranged（41）And interior suction
Hot frame（42）, the outer heat radiation rack（41）Including heat radiation rack outside integrally formed top（41.1）With heat radiation rack outside week（41.2）, institute
State interior heat absorption frame（42）Including the frame that absorbs heat in integrally formed top（42.1）With the frame that absorbs heat in week（42.2）；
Condense shell（20）Aluminium base in integrally casting shaping have the second through-hole foam copper coin（5）, condense housing outer surface one
Bluk recombination has outer heat radiation rack（41）, condense shell inner surface and be integrally compounded with interior heat absorption frame（42）, in the aluminium base of heat-radiating substrate
Integrally casting shaping has first through hole foam copper coin（2）, radiating surface is integrally compounded with third through-hole foam copper coin（6）；
The radiator structure（200）It further include coolant liquid shell（44）, the coolant liquid shell（44）It is fixed on the condensation top
Shell（21）Outside, in coolant liquid shell（44）With condensation top shell（21）Between formed liquid cooling chamber（45）, the outer heat radiation rack（41）
It is located at liquid cooling chamber with heat conduction end（45）In.
2. the radiator structure of LED array module as described in claim 1, which is characterized in that described to be integrally complex as：Pour cast aluminium
Liquid exceeds the through-hole foam copper coin（62）Upper and lower interface composite depth（L）For 3-5mm, when molten aluminum does not solidify, by through-hole
Foam metal heat radiation rack（40）In merging molten aluminum and make itself and through-hole foam copper coin（62）Upper and lower interface contacts, and institute is obtained after solidification
State hot interface composite structure（60）.
3. the radiator structure of LED array module as described in claim 1, which is characterized in that the radiator structure（200）Also wrap
Include reflux frame（43）, flow back frame（43）Top abuts interior heat radiation rack（42）, bottom abuts third through-hole foam copper coin（6）, and point
Weldering links into an integrated entity.
4. the radiator structure of LED array module as described in claim 1, which is characterized in that the radiator structure（200）Also wrap
It includes and is threaded through in great power LED and is inlaid in LED mounting surfaces（1.1）On heat conduction item（50）, the heat conduction item（50）Around scattered
Hot substrate（1）Side extend to radiating surface（1.2）And it is welded to outer heat radiation rack（41）On.
5. the radiator structure of LED array module as claimed in claim 4, which is characterized in that the heat conduction item（50）Along heat conduction
The thermal coefficient of extending direction is more than 500 w/mk.
6. the radiator structure of LED array module as claimed in claim 5, which is characterized in that the heat conduction item（50）It is led for height
Hot celion band or flexible high heat conduction graphite tape.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820109044.1U CN207741053U (en) | 2018-01-23 | 2018-01-23 | A kind of radiator structure of LED array module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820109044.1U CN207741053U (en) | 2018-01-23 | 2018-01-23 | A kind of radiator structure of LED array module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108105732A (en) * | 2018-01-23 | 2018-06-01 | 福建工程学院 | A kind of radiator structure of LED array module |
| CN114114322A (en) * | 2021-10-19 | 2022-03-01 | 北京遥测技术研究所 | Atmospheric sounding laser radar system suitable for space application |
-
2018
- 2018-01-23 CN CN201820109044.1U patent/CN207741053U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108105732A (en) * | 2018-01-23 | 2018-06-01 | 福建工程学院 | A kind of radiator structure of LED array module |
| CN114114322A (en) * | 2021-10-19 | 2022-03-01 | 北京遥测技术研究所 | Atmospheric sounding laser radar system suitable for space application |
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