CN105138098A - Aluminum-copper explosion cladding CPU cooling fin device - Google Patents
Aluminum-copper explosion cladding CPU cooling fin device Download PDFInfo
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- CN105138098A CN105138098A CN201510516272.1A CN201510516272A CN105138098A CN 105138098 A CN105138098 A CN 105138098A CN 201510516272 A CN201510516272 A CN 201510516272A CN 105138098 A CN105138098 A CN 105138098A
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- fin
- radiating fin
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- cpu
- heat
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention belongs to the technical field of CPU cooling, and discloses an aluminum-copper explosion cladding CPU cooling fin device. The aluminum-copper explosion cladding CPU cooling fin device comprises a fan, a cooling fin, a cooling copper plate, an explosion cladding layer, heat conduction silica gel and a CPU. The cooling copper plate is arranged over the CPU, arc notches are formed in the two sides of the lower end of the cooling copper plate, and the space between the cooling copper plate and the CPU is filled with the heat conduction silica gel. The cooling fin is arranged over the cooling copper plate and comprises a cooling fin base and cooling fin bodies, the cooling fin bodies are evenly and perpendicularly arranged on the cooling fin base, and the cooling fin base is an aluminum plate. The cooling fin bodies comprise the straight fin bodies and the forked fin bodies, and the forked fin bodies are arranged among the straight fin bodies. Each forked fin body comprises two upper short fin bodies and a lower long fin body, wherein the short fin bodies are symmetrically arranged above the long fin body. The explosion cladding layer is arranged between the cooling copper plate and the cooling fin base. The fan is arranged above the cooling fin and blows air towards the cooling fin. The aluminum-copper explosion cladding CPU cooling fin device is high in bonding strength and good in cooling effect.
Description
Technical field
The invention belongs to CPU technical field of heat dissipation, particularly relate to a kind of copper al blasting compound CPU radiating fin device.
Background technology
The increase of CPU number of transistors improves the execution efficiency of processor, but the straight line that result also in its power consumption and thermal value rises.If effectively can not solve heat dissipation problem, the stability of system will be subject to serious impact, thus become the large bottleneck hindering CPU development.At present, main heat dissipation technology has 3 kinds of modes: wind-cooling heat dissipating, heat pipe heat radiation and water-cooling, wherein wind-cooling heat dissipating because of its simple installation, the main flow of feature the becomes current heat dissipation technology such as cost is lower, radiating effect is obvious, strong adaptability, model change are flexible.Air-cooled radiator is formed primarily of radiator fan, heat radiator, fastener, heat-conducting medium 4 part.Because heat radiator directly contacts with the surface of CPU, the size of its heat-sinking capability directly has influence on overall radiating effect.Therefore, heat radiator is the key component of whole cooling system.Status requirement residing for heat radiator its must meet two basic demands: one be absorb as much as possible at short notice CPU release heat, namely moment heat absorption capacity; Two is to possess enough heat storage capacity, namely larger thermal capacity.Therefore, heat radiator should select the material that thermal conductivity is high.The thermal conductivity of copper is nearly 2 times of aluminium, but little compared with aluminium of thermal capacity, and full copper radiating rib cost is high, and sole mass is large, not corrosion-resistant.In view of full aluminium radiator and full copper radiator self are difficult to the shortcoming that overcomes, along with the raising of radiating requirements, the Copper-Aluminum compound heat radiator taking into account Performance and Cost Modeling arises at the historic moment.Fine copper is adopted bottom heat radiator, and fin portion adopts aluminum alloy sheet, integral by soldering, screw closure, the process combining such as combination, mechanical type pressing that expands with heat and contract with cold, utilize the feature of the high heat conductance of copper, at the bottom of copper, heat is transmitted to aluminium fin fast, then by aluminium fin, heat is distributed.Both ensure that heat radiator sole mass portion exceeded standard, and can production cost have been controlled again, also achieve very large enhancing efficiency.But this Copper-Aluminum compound heat radiator cost is high, bond strength is low.
Summary of the invention
The invention provides a kind of copper al blasting compound CPU radiating fin device, bond strength is high, and radiating effect is good.
Technical matters solved by the invention realizes by the following technical solutions: the invention provides a kind of copper al blasting compound CPU radiating fin device, it is characterized in that: it comprises fan, heat radiating fin, heat radiation copper coin, Explosion composite layer, heat conductive silica gel, CPU, described heat radiation copper coin is arranged at directly over CPU, the both sides of described heat radiation copper coin lower end are provided with arc gap groove, heat conductive silica gel is filled with between described heat radiation copper coin and CPU, heat radiating fin is provided with directly over described heat radiation copper coin, described heat radiating fin comprises heat radiating fin seat, radiating fin, described radiating fin uniform vertical is arranged on heat radiating fin seat, described heat radiating fin seat is aluminium sheet, described radiating fin comprises straight fin and bifurcated fin, described bifurcated fin is arranged between straight fin, described bifurcated fin comprises the two panels short fin of top and the long fin of below, described short fin is symmetricly set on the top of long fin, Explosion composite layer is provided with between described heat radiation copper coin and heat radiating fin seat, fan is provided with above described heat radiating fin, described fan air-out direction is towards heat radiating fin.
The thickness of described heat radiation copper coin is 8 ~ 10mm.
The thickness of described heat radiating fin seat is 3 ~ 5mm.
Described bifurcated fin is provided with thermal hole.
Beneficial effect of the present invention is:
1 this patent is adopted between heat radiation copper coin and heat radiating fin seat and is formed by Explosion composite, and combined strength bination is high, and not easily layering and cracking phenomena occur, low cost of manufacture, heat dispersion is good.
The fan arranged above 2 heat radiating fins blows heat radiating fin, can realize the cooling of heat radiating fin fast, accelerates CPU heat radiation.
Heat conductive silica gel is filled with between 3 heat radiation copper coins and CPU, heat conductive silica gel is high-end guides thermalize compound, and can not solidification, the characteristic that can not conduct electricity can avoid such as short circuit equivalent risk, has high thermal conductivity, splendid thermal conductivity, the exhausted property of good electricity, good stability in use, can be delivered in radiating copper sheet fast by the heat that CPU produces, radiating copper sheet transfers heat to heat radiating fin, and heat radiating fin is quick heat radiating under the effect of fan.
4 straight fins and bifurcated fin arranged in a crossed manner, be conducive to quick heat radiating.
5 bifurcated fins considerably increase cooling surface area, are conducive to realizing heat radiating fin quick heat radiating, to meet the cooling requirements of CPU.
The thickness of 6 heat radiation copper coins is 8 ~ 10mm, the thickness of heat radiating fin seat is 3 ~ 5mm, because the thickness of heat radiation copper coin and heat radiating fin seat has larger impact to heat-sinking capability, too thick or too thin all can cause heat radiation bad, such thickness is selected not only to save cost, and ensure that good radiating effect.
7 bifurcated fins are provided with thermal hole, considerably increase the cooling surface area of bifurcated fin, improve heat dispersion.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described further:
In figure: 1-fan, 2-heat radiating fin, 3-dispels the heat copper coin, 4-Explosion composite layer, 5-heat conductive silica gel, 6-CPU, 7-arc gap groove, 8-heat radiating fin seat, 9-radiating fin, the straight fin of 10-, 11-bifurcated fin, 12-short fin, the long fin of 13-, 14-thermal hole.
Embodiment:
The present embodiment comprises fan 1, heat radiating fin 2, heat radiation copper coin 3, Explosion composite layer 4, heat conductive silica gel 5, CPU6, and heat radiation copper coin 3 is arranged at directly over CPU6, and the thickness of heat radiation copper coin 3 is 8 ~ 10mm.The both sides of heat radiation copper coin 3 lower end are provided with arc gap groove 7, heat conductive silica gel 5 is filled with between heat radiation copper coin 3 and CPU6, heat radiating fin 2 is provided with directly over heat radiation copper coin 3, heat radiating fin 2 comprises heat radiating fin seat 8, radiating fin 9, radiating fin 9 uniform vertical is arranged on heat radiating fin seat 8, heat radiating fin seat 8 is aluminium sheet, and the thickness of heat radiating fin seat 8 is 3 ~ 5mm.Radiating fin 9 comprises straight fin 10 and bifurcated fin 11, bifurcated fin 11 is arranged between straight fin 10, bifurcated fin 11 comprises the two panels short fin 12 of top and the long fin 13 of below, and short fin 12 is symmetricly set on the top of long fin 13, bifurcated fin 11 is provided with thermal hole 14.Be provided with Explosion composite layer 4 between heat radiation copper coin 3 and heat radiating fin seat 8, be provided with fan 1 above heat radiating fin 2, fan 1 air-out direction is towards heat radiating fin 2.
Utilize technical solutions according to the invention, or those skilled in the art being under the inspiration of technical solution of the present invention, designing similar technical scheme, and reach above-mentioned technique effect, is all fall into protection scope of the present invention.
Claims (4)
1. a copper al blasting compound CPU radiating fin device, it is characterized in that: it comprises fan, heat radiating fin, heat radiation copper coin, Explosion composite layer, heat conductive silica gel, CPU, described heat radiation copper coin is arranged at directly over CPU, the both sides of described heat radiation copper coin lower end are provided with arc gap groove, heat conductive silica gel is filled with between described heat radiation copper coin and CPU, heat radiating fin is provided with directly over described heat radiation copper coin, described heat radiating fin comprises heat radiating fin seat, radiating fin, described radiating fin uniform vertical is arranged on heat radiating fin seat, described heat radiating fin seat is aluminium sheet, described radiating fin comprises straight fin and bifurcated fin, described bifurcated fin is arranged between straight fin, described bifurcated fin comprises the two panels short fin of top and the long fin of below, described short fin is symmetricly set on the top of long fin, Explosion composite layer is provided with between described heat radiation copper coin and heat radiating fin seat, fan is provided with above described heat radiating fin, described fan air-out direction is towards heat radiating fin.
2. a kind of copper al blasting compound CPU radiating fin device according to claim 1, is characterized in that: the thickness of described heat radiation copper coin is 8 ~ 10mm.
3. a kind of copper al blasting compound CPU radiating fin device according to claim 1, is characterized in that: the thickness of described heat radiating fin seat is 3 ~ 5mm.
4. a kind of copper al blasting compound CPU radiating fin device according to claim 1, is characterized in that: described bifurcated fin is provided with thermal hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510516272.1A CN105138098A (en) | 2015-08-21 | 2015-08-21 | Aluminum-copper explosion cladding CPU cooling fin device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510516272.1A CN105138098A (en) | 2015-08-21 | 2015-08-21 | Aluminum-copper explosion cladding CPU cooling fin device |
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| Publication Number | Publication Date |
|---|---|
| CN105138098A true CN105138098A (en) | 2015-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510516272.1A Pending CN105138098A (en) | 2015-08-21 | 2015-08-21 | Aluminum-copper explosion cladding CPU cooling fin device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108089680A (en) * | 2018-01-03 | 2018-05-29 | 联想(北京)有限公司 | A kind of heat dissipating method and device |
| CN111641126A (en) * | 2020-06-16 | 2020-09-08 | 遵义长征电器设备有限责任公司 | Power distribution cabinet for power supply |
| US11222830B2 (en) | 2018-01-03 | 2022-01-11 | Lenovo (Beijing) Co., Ltd. | Heat dissipation structure and electronic device |
-
2015
- 2015-08-21 CN CN201510516272.1A patent/CN105138098A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108089680A (en) * | 2018-01-03 | 2018-05-29 | 联想(北京)有限公司 | A kind of heat dissipating method and device |
| US11222830B2 (en) | 2018-01-03 | 2022-01-11 | Lenovo (Beijing) Co., Ltd. | Heat dissipation structure and electronic device |
| CN111641126A (en) * | 2020-06-16 | 2020-09-08 | 遵义长征电器设备有限责任公司 | Power distribution cabinet for power supply |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151209 |
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| WD01 | Invention patent application deemed withdrawn after publication |