CN108278581B - A kind of cooling structure of LED array module - Google Patents
A kind of cooling structure of LED array module Download PDFInfo
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- CN108278581B CN108278581B CN201810081508.7A CN201810081508A CN108278581B CN 108278581 B CN108278581 B CN 108278581B CN 201810081508 A CN201810081508 A CN 201810081508A CN 108278581 B CN108278581 B CN 108278581B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of cooling structure of LED array module, LED array module is fixed on the lower surface of the cooling structure by thermal interfacial material, including solid-liquid phase change heat accumulation box, solid-liquid phase change heat accumulation box includes heat-radiating substrate, cover board and heat accumulation chamber, cover board, which is fitted on heat-radiating substrate, forms closed heat accumulation chamber, and heat accumulation is intracavitary to be equipped with the first porous media and heat-storage medium；It further include dual-purpose cooling structure, the dual-purpose cooling structure includes the spire being integrally disposed upon outside cover board, condensation shell and cooling duct, is equipped with the second porous media in cooling duct.The cooling structure of the LED array module, cooperate dual-purpose heat-absorbing structure using solid-liquid phase change heat accumulation box, thermal conductive network, intersect cooling tube, it is directly transferred to the heat of LED array in heat-storage medium rapidly, but also provides effective heat dissipation for the recycling of solid-liquid phase change heat accumulation box.
Description
Technical field
The present invention relates to the technical fields of LED, and in particular to a kind of cooling structure of LED array module.
Background technique
LED is as a kind of active selfluminous element, and the solid-state light as do not burn filament or gas is shone, and the course of work is only
There is 15% electric energy to be converted into luminous energy, remaining 85% electric energy almost all is converted into thermal energy, increases the temperature of LED.With
The crash rate for increasing not only LED of temperature greatly increases but also LED light declines aggravation, the lost of life, therefore, the performance of LED product
And its reliability, it is heavily dependent on good heat dissipation design, and whether the cooling measure taken is effective.
Current LED product has the tendency that high-power, and the heat flow density that need to be radiated has reached 50-90w/cm2, higher
Already exceed 150w/cm2.However small product size size is smaller and smaller, what the arrangement and design of radiator itself encountered
It constrains also increasingly severe.Traditional is only used for heat flow density not by the heat convection and air blast cooling method of monophasic fluid
Greater than 10w/cm2Product.Now test experience have shown that, heat flow density be greater than 60w/cm2It just can be described as high heat flux density.
Prior art heat exchange has the cooling implementation such as air-cooled, liquid cooling, heat pipe, but the natural cooling of qi piece heat dissipation is still
It is the major way of business application.
Air-cooled, conventional fan is because of the rotating excitation field around driving because leakage field or electric spark interfere the normal of ambient electron element
Work, thus the less use in LED heat dissipation.Someone has studied piezoelectric fan, and piezoelectric patches forms air chamber, by piezoelectric patches
Logical high voltage direct current electric forming 15-23KV voltage, so that ionic discharge generation ion wind is formed to the LED substrate back side in air chamber
Heat sink forced convertion, the coefficient of heat transfer are 7 times of free convection, are 1.4 times of conventional fan.But this is high-voltage electricity, is unsuitable for
Large-scale commercial applications application.
The back side that liquid cooling, usually liquid flow through LED installation base plate is taken away by heat.There are water cooling, microchannel cooling, Micropump
It is cooling etc., but liquid is cooling, once reaching thermal balance, then attempts to increase heat exchange amount by increasing flow velocity to be extremely limited
, while the side effect for increasing electricity consumption is also brought, therefore, exclusive use is defective.
Heat pipe, heat pipe has the advantages that obtain the biggish coefficient of overall heat transmission with the smaller temperature difference, but conventional heat pipe is same due to gas-liquid
Road, as long as heat pipe one is bent, efficiency just reduces suddenly.
That is, air-cooled, liquid cooling and heat pipe rest on the experimental stage, the defect for thering is it to be accordingly difficult to overcome, no
It is able to achieve commercial applications.
Since the heat that front generates can only be taken away from the back side, so radiating efficiency is poor, this is affected to a certain extent
The service life of LED array device.Also had in addition to pacifying dissipated heat from substrate back from substrate front side according to thermal diffusion path
Dissipated heat.For example heat dissipating layer is installed below in the positive LED mounting base of substrate, but heat is transferred to base by LED seat
The heat dissipating layer of piece, then conducted to the back side of substrate by heat dissipating layer and heat is taken away by fan airstream so attempts by from base
The pressure air-flow at the piece back side radiates.Also have and be threaded through the copper pipe on substrate in the clearance space of LED array using multiple and dissipate
Heat, but need substrate back setting that streaming draught fan is forced just to be able to satisfy cooling cooling requirements.Which results in strong
The electricity consumption of streaming draught fan processed greatly increases, and also increases manufacturing cost.
Then, how business application, be effectively constructed tight clusters LED array radiator structure, become industry
Promote the problem of LED array device general character urgently to be resolved.
Summary of the invention
For above-mentioned defect existing in the prior art, the purpose of the present invention is to provide a kind of the cold of LED array module
But structure with the heat of inexpensive, expeditiously transfer tight clusters LED array devices, and keeps cooling measure effective.
The object of the present invention is achieved like this, and a kind of cooling structure of LED array module, LED array module passes through heat
Boundary material is fixed on the lower surface of the cooling structure, including solid-liquid phase change heat accumulation box, and solid-liquid phase change heat accumulation box includes heat dissipation
Substrate, cover board and heat accumulation chamber, cover board, which is fitted on heat-radiating substrate, forms closed heat accumulation chamber, and heat accumulation is intracavitary to be equipped with first porous Jie
Matter and heat-storage medium；
It further include dual-purpose cooling structure, the dual-purpose cooling structure includes the spire being integrally disposed upon outside cover board, condensation
Shell and cooling duct, the second porous media is equipped in cooling duct, and the top of the second porous media abuts the interior of condensation shell
The two sides on surface, the integrally molded outer surface in cover board in the bottom of the second porous media, the second porous media abut spire；
The dual-purpose cooling structure has use pattern one and use pattern two, and use pattern one is to disassemble condensation shell,
So that spire and the second porous media are exposed in air；Use pattern two is condensation shell setting in spire and outer and close
Feud is fitted on heat-radiating substrate, so that condensation shell, cover board and spire form closing and continuous cooling duct.
It further, further include thermal conductive network, the thermal conductive network includes the warp and weft being cross-woven anyhow, thermal conductive network one
Body is solidificated in heat-radiating substrate, and heat-radiating substrate side and upwards bending formation radiating segment, institute are stretched out in the free end of warp and weft
Radiating segment is stated to be located in cooling duct.
Further, the first porous media middle position, which intersects, wears intersection cooling tube, and the intersection cooling tube is condensing
Shell outer hose joins end to end, and intersecting cooling tube one end is cooling tube inlet, and the other end is that cooling tube exports, intersect cooling tube and
Cooling duct series/parallel connection.
Further, the spire includes end to end all spires and top spire, is spaced and sets in cooling duct
There are multiple second porous medias.
Further, the center for condensing the corresponding top spire in top of shell is equipped with cooling duct entrance, condenses shell
The peripheral wall of body equipped with cooling duct export, coolant liquid from cooling duct entrance enter, from top spire center cooling duct by
Enclose around box body portion outside week spire cooling duct, then from cooling duct export flow out, by solid-liquid phase change heat accumulation box
Interior heat accumulation is taken away.
Further, heat-storage medium includes the paraffin that fusion temperature is 40-50 DEG C, and heat-storage medium is filled under vacuumized conditions
Note is only filled into the 90% of heat accumulation chamber height in heat accumulation chamber.
Further, the heat-radiating substrate includes mounting surface, radiating surface and step flange, and cover board includes box body portion peaceful method
Blue portion, box body portion cooperate on the vertical step surface of step flange, and plane face flange portion is hermetically fitted in the flange of step flange portion
It is upper to form the heat accumulation chamber.
Further, the first porous media at least fills the 95% of the volume of heat accumulation chamber.
Further, the fusing point of first porous media is at least 300 DEG C higher than the fusing point of heat-radiating substrate, first porous Jie
The thermal coefficient of the thermal conductivity ratio heat-radiating substrate of matter is big by 50% or more.
A kind of hot property control method of the cooling structure of LED array module further includes that control system and liquid cooling follow
Loop system, the control system include being mounted on the first ultrasonic level meter of cover board outside top center and being mounted on cover board
Second ultrasonic level meter of side heat accumulation chamber mid-height position, measures the length and width of short transverse atoleine respectively
Thus the length of direction atoleine, control system calculate the volume V of atoleineLiquid, the heat accumulation chamber is with heat accumulation chamber height
H0With heat accumulation chamber diameter D, solid-liquid phase change heat accumulation box has mean temperature T, the mean temperature TIn minimum temperature TIt is lowAnd highest
Temperature TIt is highBetween, meet condition:And T≥TIt is high, then start liquid cooling recirculation system is rapidly by heat accumulation chamber
In liquid paraffin be transformed into solid paraffin, until meeting condition:And T≤TIt is low, then stop liquid is cooling follows
Loop system.
The cooling structure of the LED array module, solve by following technical spirit " how business application, have
The technical issues of radiator structure of the LED array of effect ground building tight clusters ":
1) heat of heat-radiating substrate is transferred quickly in heat-storage medium by solid-liquid phase change heat accumulation box
Heat accumulation height H0, heat accumulation diameter D heat accumulation chamber in fill the first porous media and heat-storage medium, the first porous media
Play the role of temperature-averaging and transfer heat to heat-storage medium from thermal interfacial material rapidly, heat-radiating substrate is in this predominantly solid
Liquid phase-change thermal storage box plate seals heat-storage medium and as the fixed LED of LED array mounting plate, is secondary function to heat-storage medium heat transfer
Can, through detecting, the 90% of heat flow density is conducted by the first porous media into heat-storage medium.
2) heat of dual-purpose heat-absorbing structure and thermal conductive network, heat-storage medium is transferred in coolant liquid, so that solid-liquid phase change heat accumulation
Box can be recycled
To be recycled, the heat in heat-storage medium must lose solid-liquid phase change heat accumulation box.Dual-purpose heat-absorbing structure
There are integrally formed spire and the second porous media outside box body portion in cooling duct, constitutes the upper surface heat dissipation of heat accumulation box, lead
Heat supply network constitutes the lower surface heat dissipation of heat accumulation box, upper and lower surfaces heat dissipation, so that liquid heat-storage medium is changed into rapidly solid-state cooling
Medium, so that solid-liquid phase change heat dissipation technology can be recycled.
3) intersect cooling tube
Solid-liquid phase change heat accumulation box is to reducing energy consumption, the umklapp transformation and time for being cooled to the minimum temperature stage has to fit
When otherwise institute's consuming electric power is excessive may not apply to business, as design conditions w/mm2When height arrives certain value, want by increasing unit
Time maintains cooling rate unrealistic by the flow of cooling duct cross section, then increases inside solid-liquid phase change heat accumulation box
Add intersection cooling tube, the intersection cooling tube and cooling duct are connected in series or in parallel in coolant circulation system, if right
Cooling rate requires, then directlys adopt the mode being connected in parallel, in this way to solid-liquid phase change heat accumulation box from upper surface, lower surface and
Inside cools down respectively, can accelerate umklapp transformation and be cooled to the speed in minimum temperature stage.
Exactly by the improved synergistic effect of above-mentioned three aspect, so that the spoke in the heat of LED component pedestal and LED gathering groups
It penetrates heat and runs through solid-liquid phase change heat accumulation box to shift and distribute, radiating efficiency is fast and heat dissipation is effective.
Why such technology is able to achieve business application, and being is intermittently to use because of LED array major part service condition,
Intermittent time has with short, and solid-liquid phase change heat accumulation box cooperates the technology of dual-purpose heat-absorbing structure just to become very useful, does not have to any
Energy consumption, amount of heat are mentioned from the heat-storage medium that thermal interfacial material is directly transferred to solid-liquid phase change heat accumulation box for LED array cooling
Buffer time is supplied.And if detecting that heat-storage medium has changed into liquid and temperature is higher than maximum temperature TIt is high, then start liquid cooling
The circulatory system solidifies rapidly heat-storage medium, so as to recycling.
Compared with prior art, the present invention the cooling structure of LED array module, is cooperated dual-purpose using solid-liquid phase change heat accumulation box
Heat-absorbing structure, thermal conductive network intersect cooling tube, are directly transferred to the heat of LED array in heat-storage medium rapidly, but also be solid
Liquid phase-change thermal storage box, which is recycled, provides effective heat dissipation.
Detailed description of the invention
Fig. 1 is a kind of main sectional view of the cooling structure embodiment one of LED array module of the present invention.
Fig. 2 is a kind of top view of the cooling structure embodiment one of LED array module of the present invention (disassembly condensation shell).
Fig. 3 is a kind of main sectional view of the cover board of the cooling structure embodiment one of LED array module of the present invention.
Fig. 4 is a kind of main sectional view of the cooling structure embodiment two of LED array module of the present invention.
Fig. 5 is a kind of top view of the cooling structure embodiment two of LED array module of the present invention (disassembly condensation shell).
Fig. 6 is a kind of heat-radiating substrate of cooling structure embodiment two of LED array module of the present invention and the vertical view of thermal conductive network
Figure.
Fig. 7 is a kind of main sectional view of the cooling structure embodiment three of LED array module of the present invention.
Fig. 8 is a kind of thermal performance test curve of the cooling structure embodiment two of LED array module of the present invention.
Appended drawing reference in above-mentioned figure:
20 solid-liquid phase change heat accumulation boxes, 21 heat-radiating substrates, 22 cover boards, 23 box body portions, 24 plane face flange portions, 25 heat accumulation chambers, 26
One porous media, 27 heat-storage mediums
30 dual-purpose cooling structures, 31 spires, 32 condensation shells, 33 cooling ducts, 34 second porous medias, 35 is cooling logical
Road entrance, the outlet of 36 cooling ducts, 37 gaskets
40 thermal conductive networks, 41 warps, 42 wefts, 43 radiating segments
50 intersect cooling tube, 51 cooling tube inlets, the outlet of 52 cooling tubes
21.1 mounting surfaces, 21.2 radiating surfaces, 21.3 step flanges
31.1 weeks spires, 31.2 top spires
32.1 condensation top shells, 32.2 condensation peripheral walls, 32.3 flange mounting portions
Specific embodiment
It elaborates, but is not intended to limit the scope of the invention to the embodiment of the present invention below in conjunction with attached drawing.
Embodiment one
A kind of cooling structure of LED array module, LED array module are fixed on the cooling structure by heat-conducting silicone grease
Lower surface, including solid-liquid phase change heat accumulation box 20, solid-liquid phase change heat accumulation box 20 include heat-radiating substrate 21, cover board 22 and heat accumulation chamber 25,
The heat-radiating substrate 21 includes mounting surface 21.1, radiating surface 21.2 and step flange 21.3, and cover board 22 includes 23 peace of box body portion
Flange portion 24, box body portion 23 cooperate on the vertical step surface of step flange 21.2, and plane face flange portion 24 is hermetically fitted in step
Closed heat accumulation chamber 25 is formed on the flange of flange portion 21.2, heat accumulation chamber 25 has heat accumulation chamber height H0With heat accumulation chamber diameter D, storage
The first porous media 26 and heat-storage medium 27 are equipped in hot chamber 25.
First porous media 26 at least fills the 95% of the volume of heat accumulation chamber 25, and 26 bottom of the first porous media is through up and down
Outwardly integrally it is compounded in heat-radiating substrate 21.The fusing point of first porous media 26 than heat-radiating substrate 21 fusing point up to
300 DEG C few, the thermal coefficient of the thermal conductivity ratio heat-radiating substrate 21 of the first porous media 26 is big by 50% or more, in this way convenient for one
Composite casting is molded in heat-radiating substrate 21, and through upper and lower surface a bluk recombination is in order to reduce interface resistance, so that LED gusts
The heat of column module is directly conducted through the first porous media 26 to heat accumulation chamber 25 through heat-conducting silicone grease.Heat-radiating substrate 21 is aluminum substrate
When, corresponding porous media 24 is through-hole type foam copper.The porosity of first porous media 26 is in 95-98%, and aperture is in 2-3mm.
Heat-storage medium 27 includes paraffin, and specially fusion temperature is 40.6 DEG C, positive 21 alkane of purity 98%.Heat-storage medium 27
It is to be poured under vacuumized conditions in heat accumulation chamber 25, to prevent the stereomutation of paraffin volume phase transition process from generating excessive expansion
Stress is only filled into heat accumulation chamber height H090%.
It further include dual-purpose cooling structure 30, the dual-purpose cooling structure 30 includes the box body portion 23 for being integrally disposed upon cover board 22
Outer spire 31, condensation shell 32 and cooling duct 33, the condensation shell 32 including integrally formed condensation top shell 32.1,
Peripheral wall 32.2 and flange mounting portion 32.3 are condensed, the spire 31 includes all spires 31.1 and top spire 31.2.Condensation
The flange mounting portion 32.3 of shell 32 is sealingly fixed in the step flange portion 21.2 of heat-radiating substrate 21, the flange mounting portion
Gasket 37 is equipped between 32.3 and the step flange portion 21.2, so that condensation shell 32, cover board 22 and the formation of spire 31
Continuous cooling duct 33, the cooling duct 33 also include top cooling duct and all cooling ducts.The top spire 31.2
For Archimedian screw, multiple second porous medias 34 are equipped at intervals in cooling duct 33, or be continuously equipped with second porous Jie
Matter 34.The top of second porous media 34 abuts the inner surface of condensation shell 32, and the bottom of the second porous media 34 passes through scolding tin
It is welded on the outer surface of cover board 22；Second porous media 34 is through-hole type foam metal.Condense the corresponding top spiral shell in top of shell 32
The center in rotation portion 31.2 is equipped with cooling duct entrance 35, and the peripheral wall 32.2 of condensation shell 32 is equipped with cooling duct outlet 36.
Coolant liquid enters from cooling duct entrance 35, from outside week spiral shell of the cooling duct from coil to coil around box body portion 23 for pushing up spire center
Then the accumulation of heat in solid-liquid phase change heat accumulation box 20 is taken away from 36 outflow of cooling duct outlet in rotation portion 31.1.
First porous media 26 is through-hole type foam copper or through-hole type foamed aluminium, and the second porous media 34 is through-hole type foam
Silver or through-hole type foamy graphite, heat-radiating substrate 21,22 material of cover board are aluminium, copper or silver.The cross-sectional area of cooling duct 33 is at least
For
It further include control system, the control system includes the first ultrasonic liquid level for being mounted on 22 outer side center position of cover board
The second ultrasonic level meter of heat accumulation chamber mid-height position is counted and is mounted on, the ultrasonic level meter is stored up using ultrasonic wave in solid-state
The different principle of spread speed in thermal medium, metallic walls and liquid heat-storage medium, measures the length of short transverse atoleine
The length of degree and width direction atoleine, and it is sent to control system, thus control system calculates the volume V of atoleineLiquid,
The heat accumulation chamber 25 has heat accumulation chamber height H0With heat accumulation chamber diameter D, solid-liquid phase change heat accumulation box 20 has mean temperature T, meet
Condition:And T>=50 DEG C, meet condition then start liquid cooling recirculation system,
The liquid paraffin in heat accumulation chamber 25 is transformed into solid paraffin rapidly, until meeting condition:And T≤ 30 DEG C, then stop liquid cooling recirculation system.
The benefit of the dual-purpose cooling structure 30 is, when without using condensation shell 32, spire 31 and second porous Jie
Matter 34 just plays the role of the qi piece that radiates, and wherein radiate based on spire 31 qi piece, and the second porous media 34 is to be grown in cover board
The secondary heat dissipation qi piece of 22 box body portion 23, by heat loss in ambient air, in the 23 outside shape of box body portion of cover board 22
It is use pattern one at air cooling structure.When that will condense shell 32 and be sealingly fixed on heat-radiating substrate 21, cooling duct
33 form, and are passed through coolant liquid from coolant inlet 35, flow out coolant liquid from cooling liquid outlet 36, then in the box body portion 23 of cover board 22
Outside forms liquid cooling structure, is use pattern two.
Above-mentioned cooling structure, the heat dissipation that solid-liquid phase change heat accumulation box 20 has dual-purpose cooling structure 30 to be used as heat dissipation qi piece simultaneously are mended
The case where filling, using LED array for intermittence is suitable.It is dual-purpose cold when use environment is for a long time using LED array
But structure 30 is used as liquid cooling structure, is passed through coolant liquid in the cooling channel, so that liquid heat-storage medium transforms back into solid-state again in turn
Heat-storage medium completes the requirement of the circulation cooling of solid-liquid phase change heat accumulation box 20, so that LED array temperature rise has been at 30 DEG C -50
Between DEG C.
Embodiment two
In order to which liquid heat-storage medium is preferably re-converted into solid-state heat-storage medium, the only liquid in 23 outside of box body portion
Cooling is inadequate.
Cooling structure further includes thermal conductive network 40, and the thermal conductive network 40 includes warp 41 and weft 42, thermally conductive 40 one of sieve
It is solidificated in heat-radiating substrate 21, the step side of step flange is stretched out in the free end of warp and weft and upward bending formation is located at
Radiating segment 43 in cooling duct.The length L of radiating segment 43 meets: 10mm < L, the longer the better, can also be bent with spiral in cooling
In channel.The coolant liquid takes away the heat of radiating segment 43, and thermally conductive sieve 40 continuously conducts heat from heat-radiating substrate 21
To radiating segment 43, coolant liquid constantly takes away the heat of radiating segment 43, so that solid-liquid phase change heat accumulation box 20 is by cover board above
It radiates simultaneously with following heat-radiating substrate, more uniformly both direction solidifies heat-storage medium up and down.Warp 41 and weft 42
It is preferred that the copper wire or filamentary silver material of 1-5mm.
Other structures are the same as example 1.
Embodiment three
For heat accumulation chamber height H0In 10-30mm, dual-purpose cooling structure 30 and thermal conductive network 40 are from the upper surface of heat accumulation chamber 25
Cover board and following heat-radiating substrate radiate simultaneously, start liquid cooling cycle makes liquid paraffin become the reverse phase of solid paraffin
Becoming duration cannot be too long, too long that LED is easy to cause to be rapidly heated.
As heat accumulation chamber height H0When > 30mm, in order to shorten the umklapp transformation time, in addition to dual-purpose cooling structure 30 and thermal conductive network
40, we also use such as flowering structure:
First porous media, 26 middle position, which intersects to wear, intersects cooling tube 50, and the intersection cooling tube 50 is in condensation shell
32 outer hoses head and the tail connect, and intersecting 50 one end of cooling tube is cooling tube inlet 51, and the other end is cooling tube outlet 52.
Intersecting cooling tube 50 can be connected in series in coolant circulation system with cooling duct 33, can also be with cooling duct 33
It is connected in parallel in coolant circulation system；
Other structures are the same as example 1.
It is heat sink in LED directly to be passed heat by heat-conducting silicone grease when positive phase transformation when the high power LED device 100 works
It is directed at heat-radiating substrate 21, heat-radiating substrate 21 conducts heat into heat-storage medium 25 by the first porous media 26.When umklapp transformation,
The radiator structure, thermal conductive network of box body portion 23 and intersection cooling tube conduct heat in coolant liquid respectively in cooling duct, guarantee
Umklapp transformation is completed in 3min, to quickly complete energy circulation, the present embodiment can be reduced umklapp transformation and cool to 30 DEG C of time.
The thermal performance test of the cooling structure of the LED array module:
Test predominantly detect positive phase transformation, one complete cycle of umklapp transformation heat-radiating substrate 21 mean temperature variation and temperature
Uniformity.5 patch type pt100 temperature sensors are mounted in the mounting surface different parts of heat-radiating substrate 21, sensor is connected
Be connected on data collecting instrument and observe and record in real time each point temperature data, side warm spot be distributed in corresponding box body portion center,
The radius midpoint of four direction.Heat accumulation chamber height H030mm, heat accumulation chamber diameter 120mm, filled stone wax body product are about
2000mm3, the use of general power is 60W, practical heat flow density is in w/m2LED array module, dual-purpose cooling structure be use pattern
Two are tested.A temperature is acquired every half an hour, arranges and draw mean temperature-time graph of each temperature measuring point, such as
Shown in Fig. 8.
As can be seen from Figure 8, solid-liquid phase change heat accumulation box 20 has delayed the temperature-rise period of LED array module, the 60W the case where
Under have about 3 hours temperature rise buffer time, about 14 hours solid-liquid phase changes between 30 DEG C of minimum temperature and 50 DEG C of maximum temperature
Time, about 2 hours liquid consolidate umklapp transformation and temperature drop time, cyclically-varying, ensure that LED array module keeps lower for a long time
The needs that 30 DEG C -50 DEG C of operating temperature.
Claims (10)
1. a kind of cooling structure of LED array module, LED array module are fixed on the cooling structure by thermal interfacial material
Lower surface, which is characterized in that
Including solid-liquid phase change heat accumulation box (20), solid-liquid phase change heat accumulation box (20) includes heat-radiating substrate (21), cover board (22), cover board
(22) it is fitted on heat-radiating substrate (21) and forms closed heat accumulation chamber (25), bottom is integrally compounded in heat dissipation through upper and lower surface
The first porous media (26) in substrate (21) is closed in that heat accumulation is intracavitary, and liquid heat-storage medium (27) is poured into heat accumulation chamber
(25) in；The thermal coefficient of the thermal conductivity ratio heat-radiating substrate (21) of first porous media (26) is big by 50% or more, LED array mould
Block is fixed on the lower surface of heat-radiating substrate (21) by thermal interfacial material；
It further include dual-purpose cooling structure (30), the dual-purpose cooling structure (30) includes being integrally disposed upon the spiral of cover board (22) outside
Portion (31), the dual-purpose cooling structure are fixed on the condensation on heat-radiating substrate with being still alternatively included in 22 outer side seal of cover board
Shell (32), so that condensation shell (32), cover board (22) and spire (31) form continuous cooling duct (33), cooling duct
(33) the second porous media (34) are equipped in, the top of the second porous media (34) abuts the inner surface of condensation shell (32), the
The two sides of the integrally molded outer surface in cover board (22) in the bottom of two porous medias (34), the second porous media (34) abut spiral
Portion；
The dual-purpose cooling structure (30) has use pattern one and use pattern two, and use pattern one is to disassemble condensation shell
(32), so that spire (31) and the second porous media (34) are exposed in air；Use pattern two is that condensation shell setting exists
Spire (31) is fitted in outside and hermetically on heat-radiating substrate (21), so that condensation shell (32), cover board (22) and spire
(31) closing and continuous cooling duct (33) are formed.
2. the cooling structure of LED array module as described in claim 1, which is characterized in that it further include thermal conductive network (40), it is described to lead
Heat supply network (40) includes the warp (41) and weft (42) being cross-woven anyhow, and thermal conductive network (40) is integrally solidificated in heat-radiating substrate (21)
In, heat-radiating substrate side and upwards bending formation radiating segment (43), the radiating segment (43) are stretched out in the free end of warp and weft
In cooling duct (33).
3. the cooling structure of LED array module as described in claim 1, which is characterized in that the first porous media (26) interposition
It sets intersection and wears and intersect cooling tube (50), the intersection cooling tube (50) joins end to end in condensation shell (32) outer hose, intersects
Cooling tube (50) one end is cooling tube inlet (51), and the other end is that cooling tube exports (52), is intersected cooling tube (50) and cooling logical
Road (33) series/parallel connection.
4. the cooling structure of LED array module as described in claim 1, which is characterized in that the spire (31) includes head and the tail
The all spires (31.1) to connect and top spire (31.2), are equipped at intervals with multiple second porous medias in cooling duct (33)
(34)。
5. the cooling structure of LED array module as claimed in claim 4, which is characterized in that the top of condensation shell (32) is corresponding
The center for pushing up spire (31.2) is equipped with cooling duct entrance (35), and the peripheral wall (32.2) of condensation shell (32) is equipped with cooling
Channel outlet (36), coolant liquid enter from cooling duct entrance (35), from the cooling duct from coil to coil at spire center is pushed up around box
The cooling duct of the outside week spire (31.1) in body portion (23) is then flowed out from cooling duct outlet (36), by solid-liquid phase change
Heat accumulation in heat accumulation box (20) is taken away.
6. the cooling structure of LED array module as described in claim 1, which is characterized in that heat-storage medium (27) includes fusing temperature
The paraffin that degree is 40-50 DEG C, heat-storage medium (27) is poured in heat accumulation chamber (25) under vacuumized conditions, and heat accumulation chamber is only filled into
Highly (H0) 90%.
7. the cooling structure of LED array module as claimed in claim 6, which is characterized in that the heat-radiating substrate (21) includes peace
Dress face (21.1), radiating surface (21.2) and step flange (21.3), cover board (22) include the peaceful flange portion (24) of box body portion (23),
Box body portion (23) cooperates on the vertical step surface of step flange (21.2), and plane face flange portion (24) are hermetically fitted in step flange
The heat accumulation chamber (25) is formed on the flange in portion (21.2).
8. the cooling structure of LED array module as claimed in claim 7, which is characterized in that the first porous media (26) is at least filled out
Fill the 95% of the volume of heat accumulation chamber (25).
9. the cooling structure of LED array module as described in claim 1, which is characterized in that first porous media (26)
At least 300 DEG C of fusing point height of fusing point than heat-radiating substrate (21), the thermal conductivity ratio heat-radiating substrate (21) of the first porous media (26)
Thermal coefficient it is big by 50% or more.
10. the hot property control method of the cooling structure of LED array module, feature as described in any with claim 1-9
It is, further includes control system and liquid cooling recirculation system, the control system includes being mounted on cover board (22) outside top
First ultrasonic level meter of center and the second ultrasonic liquid level for being mounted on cover board (22) side heat accumulation chamber mid-height position
Meter, measures the length of the length and width direction atoleine of short transverse atoleine, thus control system calculates respectively
The volume V of atoleineLiquid, the liquid storage chamber (25) is with liquid storage chamber height H0With liquid storage chamber diameter D, solid-liquid phase change heat accumulation box
(20) there is mean temperature T, the mean temperature TIn minimum temperature TIt is lowWith maximum temperature TIt is highBetween, meet condition:And T≥TIt is high, then start liquid cooling recirculation system rapidly changes the liquid paraffin in heat accumulation chamber (25)
At solid paraffin, until meeting condition:And T≤TIt is low, then stop liquid cooling recirculation system.
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| CN112628687B (en) * | 2020-12-14 | 2022-03-01 | 电子科技大学 | Vehicle LED lamp based on 3D printing and liquid cooling system thereof |
| CN112882027A (en) * | 2021-01-11 | 2021-06-01 | 北京无线电测量研究所 | Heat dissipation method and system for satellite-borne SAR antenna |
| CN113131037B (en) * | 2021-03-27 | 2022-09-02 | 陈攀攀 | Fixed-width indefinite-length continuous extrusion flexible cold plate, preparation method and application thereof |
| CN114449871B (en) * | 2022-03-03 | 2024-08-06 | 合肥工业大学 | Micro double-channel spiral boiling heat exchange type uniform temperature cooling plate |
| CN117193424B (en) * | 2023-10-18 | 2024-04-12 | 中诚华隆计算机技术有限公司 | 3D (three-dimensional) on-chip hybrid cooling control method and system |
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| DE3771405D1 (en) * | 1986-05-30 | 1991-08-22 | Digital Equipment Corp | COMPLETE HEAT PIPE MODULE. |
| US7161802B2 (en) * | 2002-08-02 | 2007-01-09 | Raytheon Company | Thermal management system having porous fluid transfer element |
| CN100481413C (en) * | 2006-02-24 | 2009-04-22 | 日月光半导体制造股份有限公司 | Radiator and package structure |
| CN204360230U (en) * | 2015-01-26 | 2015-05-27 | 中国科学院宁波材料技术与工程研究所 | Temperature control system |
| CN107293633B (en) * | 2017-08-03 | 2023-02-17 | 福建工程学院 | High heat flux density cooling device for high-power LED |
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