CN112594964A - Flat-plate sleeve type nitrogen cooling device - Google Patents
Flat-plate sleeve type nitrogen cooling device Download PDFInfo
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- CN112594964A CN112594964A CN202011286123.8A CN202011286123A CN112594964A CN 112594964 A CN112594964 A CN 112594964A CN 202011286123 A CN202011286123 A CN 202011286123A CN 112594964 A CN112594964 A CN 112594964A
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- plate
- refrigeration
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- copper pipe
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
Abstract
The invention discloses a flat-plate sleeve type nitrogen cooling device which comprises a refrigeration module, wherein a copper pipe is arranged in the refrigeration module, a heat transfer control module is arranged on the periphery of the refrigeration module, and a heat dissipation module is arranged on the periphery of the heat transfer control module. According to the technical scheme, the refrigeration module, the heat dissipation module and the heat transfer control module are organically combined, so that the device can be used for sufficiently refrigerating nitrogen, the heat dissipation means of the device to the surrounding environment is provided to the maximum extent, the refrigeration characteristic of the semiconductor is sufficiently exerted, the requirement on the production condition of an airtight production space which is oxygen-insulated and constant in temperature is effectively met, a practical device and a technical means are provided for the production field with the requirement on the production condition of a specific product, and the service performance and the service life of the produced product are guaranteed.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration, in particular to a flat-plate sleeve type nitrogen cooling device.
Background
Data show that in the production process of certain specific products, a closed production space must be filled with nitrogen to maintain an oxygen-insulated condition, but in the conventional production process, a certain amount of heat is generated, so that the temperature of the closed production space is continuously increased, and the final use performance of the products is seriously influenced. Therefore, how to maintain the conditions of oxygen insulation and constant temperature of the closed production space is a difficult problem to be solved urgently in many fields with high requirements on production environment.
The peltier effect means that when a current passes through a loop formed by different conductors, in addition to irreversible joule heat generation, heat absorption and heat release phenomena occur at joints of the different conductors respectively along with the difference of current directions.
Chinese patent document CN105518407B discloses a "gas cooler". Methods, systems, and apparatus are provided that are configured to reduce temperature variation of a cooling fluid where CO2 may have a relatively high specific heat capacity in a gas cooler. Additional cooling fluid may be introduced where the CO2 may have a relatively high specific heat capacity to reduce temperature variations of the cooling fluid. By slowing the temperature change of the cooling fluid where the CO2 may have a relatively high specific heat capacity, a temperature differential between the CO2 and the cooling fluid in the gas cooler may be maintained and/or generated, which facilitates heat exchange between the CO2 and the cooling fluid. Above-mentioned technical scheme adopts cooling fluid to cool off, and the effect is unsatisfactory, if needs to reach better effect, requires highly to equipment volume, has increased the cost.
Disclosure of Invention
The invention mainly solves the technical problems of large volume and high cost of the original cooling device, and provides a flat-plate sleeve type nitrogen cooling device.
The technical problem of the invention is mainly solved by the following technical scheme: the refrigerator comprises a refrigeration module, wherein a copper pipe is arranged in the refrigeration module, a heat transfer control module is arranged on the periphery of the refrigeration module, and a heat dissipation module is arranged on the periphery of the heat transfer control module. The copper pipe is arranged in the refrigeration module to realize effective refrigeration of nitrogen flowing through the copper pipe, the heat transfer control module arranged on the periphery of the refrigeration module is used for preventing cold energy from dissipating to the surrounding environment, and the heat dissipation module is used for accelerating heat dissipation of the nitrogen.
Preferably, the refrigeration module comprises an upper clamping block aluminum plate and a lower clamping block aluminum plate which are respectively arranged on the upper side and the lower side of the copper pipe and tightly attached to the copper pipe, and a plurality of semiconductor refrigeration pieces are arranged on one side, far away from the copper pipe, of the upper clamping block aluminum plate and the lower clamping block aluminum plate. The semiconductor refrigeration piece refrigerates, carries out heat transfer through last clamp splice aluminum plate and clamp splice aluminum plate down, realizes effectively refrigerating to the interior flow through nitrogen gas of copper pipe.
Preferably, the heat transfer control module comprises heat insulation strips arranged on the left side and the right side of the copper pipe and tightly attached to the copper pipe, and heat insulation sheets arranged on one sides, far away from the copper pipe, of the upper clamping block aluminum plate and the lower clamping block aluminum plate. The heat insulating strips and the heat insulating sheets made of polyethylene effectively limit the dissipation of cold energy in the upper clamping block aluminum plate and the lower clamping block aluminum plate to the surrounding environment, and simultaneously ensure that the cold energy produced by the semiconductor refrigerating sheets can be transmitted to nitrogen in the sleeve to the maximum extent.
Preferably, the heat dissipation module comprises a radiator arranged on the other side of the heat insulation sheet, the radiator is fixedly connected with the heat insulation sheet, the upper clamping block aluminum plate and the lower clamping block aluminum plate through screws to form a refrigeration main body, a plurality of fans are arranged on the back of the refrigeration main body side by side, and a fan mesh enclosure is arranged on the back of each fan. The fan that distributes in refrigeration main part one side has fully played the square structure advantage of self, combines the effect of the thermal-insulated material of aluminum plate side, and the fan can significantly reduce blows away aluminum plate's cold volume, can furthest again blow away a large amount of heats that produce between the radiator fin. The fan mesh enclosure is different from a common installation method of directly installing the fan, but passes through the screw through hole of the fan bracket in the middle, then passes through the screw through hole of the fan, and finally is in a special connection structure fixed by a nut. The fan mesh enclosure is arranged on the fan bracket, so that the problem of damage to the semiconductor refrigerating device through the air inlet side of the fan caused by injury due to human error contact or peripheral external interference objects is effectively avoided. The fan mesh enclosure is arranged on the fan bracket, so that the problem of damage to the semiconductor refrigerating device through the air inlet side of the fan caused by injury due to human error contact or peripheral external interference objects is effectively avoided.
Preferably, a groove corresponding to the contour of the copper pipe is arranged on one side, close to the copper pipe, of the upper clamping block aluminum plate and the lower clamping block aluminum plate. The copper pipe filled with nitrogen gas can just penetrate through the circular channel formed by the two grooves. The copper pipe is in contact with the aluminum plate groove, so that the thermal contact resistance between the copper pipe and the aluminum plate is effectively reduced, and the refrigerating efficiency of the semiconductor refrigerating sheet module on the cooling of nitrogen in the copper pipe is better enhanced.
Preferably, the upper side and the lower side of the plurality of semiconductor refrigeration pieces are provided with heat conduction materials. Go up effective seamless connection with the heat conduction material between the contact surface of clamp splice aluminum plate, lower clamp splice aluminum plate and semiconductor refrigeration piece, can effectively reduce the thermal resistance between refrigeration piece and the aluminum plate, strengthen the refrigeration piece greatly to the direct cooling effect of aluminum plate to and the indirect refrigeration effect of refrigeration piece to nitrogen gas. One side of the hot surface of the semiconductor refrigerating sheet, which is in contact with the radiator, is in seamless connection with the heat conducting material, so that the thermal resistance between the refrigerating sheet and the radiator can be effectively reduced, and the efficiency of the radiator for taking away the heat generated by the refrigerating sheet is greatly enhanced.
Preferably, the thickness of the heat insulation sheet is smaller than or equal to that of the semiconductor refrigeration sheet, and a plurality of through holes corresponding to the size of the semiconductor refrigeration sheet are formed in the heat insulation sheet. The heat insulation plates made of special materials are used for isolating the upper clamping block aluminum plate, the lower clamping block aluminum plate and the radiator around the semiconductor refrigeration piece, so that the temperature difference formed between the cold and hot surfaces of the refrigeration piece and the refrigeration energy efficiency ratio of the semiconductor refrigeration piece can be effectively guaranteed, and the cooling effect of nitrogen in a copper pipe is also guaranteed.
Preferably, a support shell is arranged on the outer side of the refrigeration main body, the front side of the support shell is free of a shell, a plurality of through holes corresponding to the size of the fan mesh enclosure are formed in the back side of the support shell, and grooves corresponding to the diameter and the position of the copper pipe are formed in the two sides of the support shell.
Preferably, one surface of the radiator, which is in contact with the heat insulation sheet, is a metal plate, and a plurality of metal sheets perpendicular to the metal plate are arranged on the other surface of the metal plate, are perpendicular to the fan, and are spaced from each other. The metal sheets are perpendicular to the fan and are spaced from each other to facilitate air flow to remove heat.
The invention has the beneficial effects that: through the organic combination among the refrigeration module, the heat dissipation module and the heat transfer control module, the device is guaranteed to fully refrigerate nitrogen, and the heat dissipation means of the device to the surrounding environment is provided to the maximum extent, so that the characteristic of semiconductor refrigeration is fully exerted, the requirement on airtight production space oxygen-free and constant-temperature product production conditions is effectively met, a very practical device and technical means are provided for the production field with the requirement on the production conditions of specific products, and the service performance and service life of the produced products can be greatly guaranteed.
Drawings
Fig. 1 is an exploded view of the present invention.
Fig. 2 is a perspective view of a venting end of the present invention.
Fig. 3 is a perspective view of an air intake end of the present invention.
In the figure, a copper pipe is 1, an aluminum plate is arranged on an upper clamping block 2, an aluminum plate is arranged on a lower clamping block 3, a heat insulation strip is 4, a semiconductor refrigeration sheet is 5, a heat insulation sheet is 6, a radiator is 7, a screw is 8, a fan is 9, a bracket shell is 10, and a fan mesh enclosure is 11.
Detailed Description
The technical scheme of the invention is further specifically described by the following embodiments and the accompanying drawings.
Example (b): the flat-plate sleeve type nitrogen cooling device of the embodiment comprises an upper-end aluminum flat plate 2, wherein two sides of the butt joint surface of a lower-end aluminum flat plate 3 are respectively provided with a semicircular groove, and a copper pipe 1 which is introduced with nitrogen can just penetrate through a circular channel formed by the two grooves, as shown in fig. 1, 2 and 3. Wherein the copper pipe and the upper and lower two aluminum plate's recess surface to reach and use the effective seamless joint of heat conducting material between two upper and lower aluminum plate's the contact surface, reach and effectively reduce copper pipe 1 and aluminum plate, and the thermal contact resistance between aluminum plate and the aluminum plate, better reinforcing semiconductor refrigeration piece 5 to the copper intraductal nitrogen refrigerated refrigeration efficiency.
The heat insulation strips 4 made of polyethylene are respectively adhered to the two sides of the aluminum plate, so that the dissipation of cold in the flat plate to the surrounding environment is effectively limited, and meanwhile, the cold produced by the semiconductor refrigerating sheet 5 can be transmitted to nitrogen in the sleeve to the maximum extent. Aluminum plate and refrigeration piece are with heat conducting material seamless joint, can effectively reduce the thermal resistance between refrigeration piece and the aluminum plate, strengthen the refrigeration piece greatly to the direct cooling effect of aluminum plate to and the indirect refrigeration effect of refrigeration piece to nitrogen gas. One side of the hot surface of the refrigeration sheet, which is in contact with the radiator 7, is in seamless connection with the heat conducting material, so that the thermal resistance between the refrigeration sheet and the radiator can be effectively reduced, and the efficiency of the radiator for taking away the heat generated by the refrigeration sheet is greatly enhanced.
The heat insulation plates 6 made of special materials are used for isolating the peripheries of the refrigerating fins, namely the aluminum plates and the radiators 7, so that the temperature difference formed between the cold and hot surfaces of the refrigerating fins and the refrigerating energy efficiency ratio of the semiconductor refrigerating fins 5 can be effectively guaranteed, and the cooling effect on nitrogen in the sleeve is also guaranteed. The fan 13 distributed on one side of the aluminum plate and the radiator fully exerts the advantage of a square structure of the fan, and the fan can greatly reduce the cooling capacity of the aluminum plate and blow away a large amount of heat generated between fins of the radiator to the maximum extent by combining the action of the heat insulation strips 4 on the side surfaces of the aluminum plate.
The fan support is arranged inside the support shell 10, the fan support solves the problem of fixing the fan, and due to the fact that the fan support is extended to be of a special design structure, the top of the fins of the radiator can be covered, wind blown out by the fan can pass through all the fins of the radiator 7 to the maximum extent, and the heat of the radiator is fully discharged to the environment.
The fan mesh enclosure 11 is different from the installation method of the common direct installation on the fan, but the middle part of the fan mesh enclosure 11 passes through a screw through hole of the fan support, then passes through a screw 8 through hole of the fan, and finally is fixed by a nut, the structure can effectively ensure the heat sink 7 and the sucked air, is not influenced by the gap between the fan and the heat sink 7, and leads the air sucked by the fan 9 to be changed into hot air to be dissipated to the surrounding environment through the fins of the heat sink 7 to achieve the purpose of heat dissipation, obviously, if the fan 9 and the fan mesh enclosure 11 are both installed on one side of a sheet metal part of the fan support, the good heat dissipation effect can not be achieved.
The fan mesh enclosure 11 is arranged on the fan bracket, so that the problem that the air inlet side of the fan is damaged by injury due to human error contact or peripheral external interference objects are damaged to the semiconductor refrigerating device is effectively avoided.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Although the terms copper tube, clip aluminum plate, semiconductor chilling plate, etc. are used more herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Claims (9)
1. The flat-plate sleeve type nitrogen cooling device is characterized by comprising a refrigeration module, wherein a copper pipe (1) is arranged inside the refrigeration module, a heat transfer control module is arranged on the periphery of the refrigeration module, and a heat dissipation module is arranged on the periphery of the heat transfer control module.
2. The flat-plate sleeve type nitrogen cooling device according to claim 1, wherein the refrigeration module comprises an upper clamping block aluminum plate (2) and a lower clamping block aluminum plate (3) which are respectively arranged on the upper side and the lower side of the copper pipe (1) and tightly attached to the copper pipe (1), and a plurality of semiconductor refrigeration pieces (5) are arranged on one sides, far away from the copper pipe (1), of the upper clamping block aluminum plate (2) and the lower clamping block aluminum plate (3).
3. The flat sleeve type nitrogen cooling device as claimed in claim 2, wherein the heat transfer control module comprises heat insulating strips (4) disposed on the left and right sides of the copper pipe (1) and closely attached to the copper pipe (1), and heat insulating sheets (6) disposed on the sides of the upper and lower clamping block aluminum plates (2, 3) away from the copper pipe (1).
4. The flat-plate sleeve type nitrogen cooling device as claimed in claim 3, wherein the heat dissipation module comprises a heat sink (7) arranged on the other side of the heat shield (6), the heat sink (7) is fixedly connected with the heat shield (6), the upper clamping block aluminum plate (2) and the lower clamping block aluminum plate (3) through screws (8) to form a refrigeration main body, a plurality of fans (9) are arranged on the back of the refrigeration main body side by side, and a fan guard (11) is arranged on the back of each fan (9).
5. The flat-plate sleeve type nitrogen cooling device as claimed in claim 2, wherein the side of the upper clamping block aluminum plate (2) and the lower clamping block aluminum plate (3) close to the copper pipe (1) is provided with a groove corresponding to the contour of the copper pipe (1).
6. The flat-plate sleeve type nitrogen cooling device as claimed in claim 2, wherein the upper and lower sides of the plurality of semiconductor chilling plates (5) are provided with heat conductive materials.
7. The flat-plate sleeve type nitrogen cooling device as claimed in claim 3, wherein the thickness of the heat shield (6) is less than or equal to that of the semiconductor refrigeration piece (5), and a plurality of through holes corresponding to the size of the semiconductor refrigeration piece (5) are formed in the heat shield (6).
8. The flat-plate sleeve type nitrogen cooling device as claimed in claim 4, wherein a support shell (10) is arranged outside the refrigeration main body, the front surface of the support shell (10) is free of shells, a plurality of through holes corresponding to the size of the fan mesh enclosure (11) are arranged on the back surface of the support shell (10), and grooves corresponding to the diameter and the position of the copper pipe (1) are arranged on two sides of the support shell (10).
9. The flat plate pipe sleeve type nitrogen cooling device according to claim 4, wherein one side of the heat radiator (7) contacting the heat insulating plate (6) is a metal plate, and the other side of the metal plate is provided with a plurality of metal sheets perpendicular to the metal plate, and the metal sheets are perpendicular to the fan (9) and spaced from each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011286123.8A CN112594964A (en) | 2020-11-17 | 2020-11-17 | Flat-plate sleeve type nitrogen cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011286123.8A CN112594964A (en) | 2020-11-17 | 2020-11-17 | Flat-plate sleeve type nitrogen cooling device |
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| Publication Number | Publication Date |
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| CN112594964A true CN112594964A (en) | 2021-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011286123.8A Pending CN112594964A (en) | 2020-11-17 | 2020-11-17 | Flat-plate sleeve type nitrogen cooling device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113623924A (en) * | 2021-06-24 | 2021-11-09 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration cold water machine with standby control system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103727702A (en) * | 2014-01-16 | 2014-04-16 | 湖南大学 | Semiconductor heat pump energy-saving instant-hot faucet |
| CN203595313U (en) * | 2013-11-29 | 2014-05-14 | 浙江迈特电子有限公司 | Semiconductor freezing device |
| CN211012103U (en) * | 2019-12-10 | 2020-07-14 | 阿法贝德自动化科技(苏州)有限公司 | Miniature cold and hot water generator |
-
2020
- 2020-11-17 CN CN202011286123.8A patent/CN112594964A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203595313U (en) * | 2013-11-29 | 2014-05-14 | 浙江迈特电子有限公司 | Semiconductor freezing device |
| CN103727702A (en) * | 2014-01-16 | 2014-04-16 | 湖南大学 | Semiconductor heat pump energy-saving instant-hot faucet |
| CN211012103U (en) * | 2019-12-10 | 2020-07-14 | 阿法贝德自动化科技(苏州)有限公司 | Miniature cold and hot water generator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113623924A (en) * | 2021-06-24 | 2021-11-09 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration cold water machine with standby control system |
| CN113623924B (en) * | 2021-06-24 | 2023-01-10 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration cold water machine with standby control system |
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Application publication date: 20210402 |
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