CN210470095U - Frequency conversion control cabinet - Google Patents
Frequency conversion control cabinet Download PDFInfo
- Publication number
- CN210470095U CN210470095U CN201921031764.1U CN201921031764U CN210470095U CN 210470095 U CN210470095 U CN 210470095U CN 201921031764 U CN201921031764 U CN 201921031764U CN 210470095 U CN210470095 U CN 210470095U
- Authority
- CN
- China
- Prior art keywords
- cabinet body
- variable frequency
- frequency control
- control cabinet
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a variable frequency control cabinet, which comprises a cabinet body and a cabinet door arranged at the front side of the cabinet body, wherein the top of the cabinet body is provided with an air inlet, one side of the lower part of the cabinet body is provided with an air outlet and a temperature controller, the air outlet is provided with an exhaust fan, and the upper part of the cabinet body is provided with a semiconductor cooling component; the air inlet is provided with an axial flow fan for blowing air to the inside of the cabinet body, and the air suction side of the axial flow fan is provided with a filter assembly capable of completely covering the air suction channel of the axial flow fan; the filtering component is arranged on an air inlet air path of the displacement of the cabinet body, so that dust is prevented from entering the cabinet body; the variable frequency control cabinet cooling system combines multiple refrigeration methods, can meet the requirement of long-term operation heat dissipation of the variable frequency control cabinet, can realize efficient cooling of the variable frequency control cabinet, guarantees stable operation of components in the variable frequency control cabinet, and has the advantages of dust prevention, low energy consumption, low noise and the like.
Description
Technical Field
The utility model belongs to the variable frequency control cabinet field, concretely relates to variable frequency control cabinet.
Background
The variable frequency control cabinet is mainly used for adjusting the working frequency of equipment, reducing energy loss, stably starting the equipment and reducing the damage of large current generated when the equipment is directly started to a motor. Meanwhile, the device is provided with analog quantity input (for speed control or feedback signals), PID control, pump switching control (for constant pressure), a communication function, a macro function (different parameter settings aiming at different occasions), multi-speed and the like. The automatic control system can be widely applied to the automatic control of various occasions such as water supply, drainage, fire fighting, spraying pipe network pressurization, heating, ventilation, air conditioning, cold and hot water circulation and the like in industrial and agricultural production and various buildings.
A large number of high-power components and parts are usually installed in the variable frequency control cabinet and are installed tightly, so that the heating value is large, and therefore effective heat dissipation is needed to guarantee normal work of internal elements of the variable frequency control cabinet. The simplest heat dissipation mode among the prior art is adopting the fan heat dissipation, installs the fan and goes out to carry out convulsions in order to reach the purpose of taking a breath cooling at the air outlet, but this kind of heat transfer mode's cooling effect very big degree relies on external temperature, therefore the radiating effect is unstable.
The semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump. Its advantages are no slide part, limited space, high reliability and no pollution of refrigerant. By using the Peltier effect (Peltier effect) of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the aim of refrigeration can be fulfilled. The refrigerating technology which generates negative thermal resistance is characterized by no moving parts and higher reliability.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of prior art and providing a can effectively reduce the variable frequency control cabinet of the inside temperature of variable frequency control cabinet.
The technical scheme of the utility model as follows:
a variable frequency control cabinet comprises a cabinet body and a cabinet door arranged on the front side of the cabinet body, wherein an air inlet is formed in the top of the cabinet body, an air outlet and a temperature controller are arranged on one side of the lower part of the cabinet body, an exhaust fan is installed on the air outlet, and a semiconductor cooling assembly is erected on the upper part of the cabinet body; the air inlet is provided with an axial flow fan for blowing air to the inside of the cabinet body, and the air suction side of the axial flow fan is provided with a filter assembly capable of completely covering the air suction channel of the axial flow fan;
the semiconductor cooling assembly comprises cooling guide fins erected at the upper part of the interior of the cabinet body through fin supports, and semiconductor refrigerators are installed on at least two sides of the cooling guide fins; the semiconductor refrigerator comprises a semiconductor refrigerating piece, a cold guide head and a heat conduction head, wherein the cold guide head is attached to the cold end side of the semiconductor refrigerating piece, the heat conduction head is attached to the hot end side of the semiconductor refrigerating piece, the cold guide head is connected with the cold guide fins, and the heat conduction head is arranged outside the cabinet body;
the temperature controller is provided with a temperature sensor, and the axial flow fan, the semiconductor refrigeration piece and the cooling fan are all electrically connected with the temperature controller.
Furthermore, a heat radiation fan is arranged at the outer end of the heat conducting head.
Further, the semiconductor refrigerator is hermetically connected with the cabinet body.
Furthermore, the semiconductor refrigerator also comprises a heat insulation gasket arranged between the cold conducting head and the heat conducting head.
Furthermore, refrigeration piece holes for containing semiconductor refrigeration pieces are formed in the heat insulation gaskets.
Furthermore, the cold guide fins comprise a cold guide outer frame and a latticed heat dissipation structure which is arranged in the cold guide outer frame and formed by first heat dissipation fins and second heat dissipation fins in a staggered mode.
Further, the surfaces of the first radiating fin and the second radiating fin are provided with radiating fins.
Furthermore, a damping washer is arranged between the axial flow fan and the cabinet body.
Furthermore, a water cooling plate is arranged on one side of the cabinet body close to the side wall of the cabinet body.
Further, an outer bracket for supporting the semiconductor refrigerator is arranged at the upper part of the cabinet body.
Furthermore, the outer end of the exhaust fan is provided with a one-way air outlet mechanism only for air outlet of the cabinet body.
Compared with the prior art, the beneficial effects of the utility model are that:
the filtering component of the utility model is arranged on the air inlet path of the displacement of the cabinet body, and the arrangement of the filtering component can filter the air entering the cabinet body from the outside for one time, thereby preventing the dust from entering the cabinet body; the adoption of the axial flow fan is beneficial to reducing the overall height of the utility model in the vertical direction; the semiconductor cooling assembly is arranged at the downstream of the axial flow fan, can refrigerate and conduct cold quantity to the cold guide fins, and under the pushing action of the axial flow fan, hot air entering the cabinet body from the outside is cooled by the semiconductor cooling assembly and then enters the cabinet body to realize the cooling of the interior of the cabinet body; the temperature controller can sense the temperature in the cabinet body, the semiconductor refrigerating sheet operates to refrigerate during normal operation so as to maintain the temperature in the cabinet body to be stable, when the temperature in the cabinet body exceeds a set value of the temperature controller, the temperature controller starts the axial flow fan and the exhaust fan to ventilate hot air in the cabinet body, and when the air flow passes through the cooling guide fins, the air flow and the cooling guide fins exchange heat to cool so as to greatly reduce the temperature in the cabinet body; the utility model discloses combined multiple refrigeration method, can satisfy the radiating demand of frequency conversion control cabinet long-term operation, can realize guaranteeing the steady operation of components and parts in the frequency conversion control cabinet to the cooling of frequency conversion control cabinet efficient, have simultaneously dustproof, low energy consumption, advantages such as low noise.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic top view of the semiconductor cooling assembly according to the embodiment of the present invention.
Fig. 3 is a schematic structural view of a heat insulating gasket according to an embodiment of the present invention.
Fig. 4 is a schematic side view of the embodiment of the present invention.
In the figure, the cooling guide head 11, the semiconductor refrigeration sheet 12, the heat conduction head 13, the cooling fan 14, the cooling guide fin 15, the cooling guide outer frame 151, the first cooling fin 152, the second cooling fin 153, the heat insulation gasket 16, the gasket fixing hole 161, the refrigeration sheet hole 161, the cabinet 2, the air inlet 21, the fin support 22, the outer support 23, the heat insulation layer 31, the axial flow fan 32, the vibration reduction gasket 33, the filter component 41, the filter fastener 42, the exhaust fan 5, the water cooling plate 6, the sealing heat insulation belt 7 and the temperature controller 8 are shown.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 to 4, a variable frequency control cabinet comprises a cabinet body 2 and a cabinet door arranged on the front side of the cabinet body 2, wherein an air inlet 21 is arranged at the top of the cabinet body 2, an air outlet and a temperature controller 8 are arranged on one side of the lower part of the cabinet body 2, an exhaust fan 5 is arranged on the air outlet, and a semiconductor cooling assembly is arranged on the upper part of the cabinet body 2; the air inlet 21 is provided with an axial flow fan 32 for blowing air to the inside of the cabinet body 2, and the air suction side of the axial flow fan 32 is provided with a filter assembly capable of completely covering the air suction channel of the axial flow fan 32;
the semiconductor cooling assembly comprises cooling guide fins 15 which are erected on the upper part inside the cabinet body 2 through fin supports 22, and semiconductor refrigerators are arranged on at least two sides of the cooling guide fins 15; the semiconductor refrigerator comprises a semiconductor refrigerating piece 12, a cold guide head 11 attached to the cold end side of the semiconductor refrigerating piece 12 and a heat conduction head 13 attached to the hot end side of the semiconductor refrigerating piece 12, the cold guide head 11 is connected with cold guide fins 15, and the heat conduction head 13 is arranged outside the cabinet body 2; specifically, heat-conducting silica gel is coated on two sides of the semiconductor refrigeration sheet 12 to form a heat-conducting silica gel layer, so that heat conduction between the semiconductor refrigeration sheet 12 and the heat-conducting head 13 or the cold-conducting head 11 is facilitated;
a temperature sensor is arranged on the temperature controller 8, and the axial flow fan 32, the semiconductor refrigeration sheet 12 and the cooling fan 14 are all electrically connected with the temperature controller 8; the temperature controller 8 is used for controlling the running states of the axial flow fan 23, the semiconductor refrigeration sheet 12 and the heat radiation fan 14 according to the temperature in the cabinet body 2.
The temperature controller 8 is commonly found in various temperature control devices such as an oven, a refrigerator, a water bath, and the like, and is a conventional technology known to those skilled in the art, and will not be described herein again.
Preferably, as shown in fig. 2, the cooling guide fins 15 are each provided with a semiconductor cooler on 4 sides.
Preferably, as shown in fig. 1, a heat insulating layer 31 is disposed on a surface of a casing of the axial flow fan 32 to reduce heat exchange efficiency between the casing of the axial flow fan 32 and outside air, so as to facilitate heat insulation inside the cabinet 2; specifically, the heat insulating layer 31 is an aluminum foil applied to the surface of the housing.
Preferably, a gasket shallow groove is arranged on the end face of the cold conducting head 11 or the heat conducting head 13 close to the semiconductor refrigeration plate 12, and the gasket shallow groove is arranged to facilitate the positioning of the heat insulation gasket 16.
Specifically, the cold conducting head 11 is a heat conducting metal solid block or a hollow block, and the heat conducting head 13 is an insert radiator, such as an aluminum alloy insert radiator.
Preferably, as shown in fig. 1, a heat dissipation fan 14 is disposed at an outer end of the heat conducting head 13 to facilitate heat dissipation and cooling of the heat conducting head 13, and the heat dissipation fan 14 is controlled by the temperature controller 8.
Preferably, the semiconductor refrigerator is hermetically connected with the cabinet body 2; specifically, as shown in fig. 1 and 4, a sealing heat insulation belt 7 is disposed at the installation position of the semiconductor refrigerator and the cabinet 2, or foam rubber is filled at the installation joint of the cabinet 2 after the semiconductor refrigerator is installed, so as to prevent outside air from entering the cabinet 2 from the installation joint of the semiconductor refrigerator.
Preferably, as shown in fig. 2 and 3, the semiconductor refrigerator further includes a heat insulation gasket 16 disposed between the cold conducting head 11 and the heat conducting head 13, wherein the heat insulation gasket 16 is used for protecting the semiconductor chilling plates 12 from being mounted too tightly to crush the semiconductor chilling plates 12 when the cold conducting head 11 and the heat conducting head 13 are mounted; preferably, the heat insulation gasket 16 is provided with a refrigerating sheet hole 161 for accommodating the semiconductor refrigerating sheet 12, and the semiconductor refrigerating sheet 12 is accommodated in the refrigerating sheet hole 161; the heat insulation gasket is made of ceramic fiber heat insulation gaskets and high-strength polyurethane heat insulation gaskets in the prior art.
Preferably, as shown in fig. 2, the cooling guide fins 15 include a cooling guide outer frame 151 and a grid-shaped heat dissipation structure formed by first and second heat dissipation fins 152 and 153 arranged in the cooling guide outer frame 151 in a staggered manner, and the air drawn into the cabinet 2 by the axial flow fan 32 can pass through the cooling guide fins 15 and exchange heat with the cooling guide fins 15.
Preferably, as shown in fig. 2, the cold lead 11 and the heat conductive head 13 are fixed to the cold lead frame 151 by screws.
Preferably, the surfaces of the first and second heat dissipation fins 152 and 153 are provided with heat dissipation fins to improve heat exchange efficiency.
Preferably, as shown in fig. 1, a damping washer 33 is padded between the axial flow fan 32 and the cabinet 2, and the damping washer 33 is made of a damping material in the prior art according to the shape and size of the air inlet 21 and the axial flow fan 32.
Optionally, as shown in fig. 1, a water cooling plate 6 is disposed on one side of the cabinet 2 and clings to the side wall of the cabinet 2, and the water cooling plate 6 of the present invention may be a water cooling plate in the prior art, such as a water cooling plate in chinese patent 112520165372. X or a water cooling plate in chinese patent 201120421078.2.
Optionally, as shown in fig. 1 and 4, an outer bracket 23 for supporting the semiconductor refrigerator is disposed at the upper portion of the cabinet 2.
Preferably, as shown in fig. 4, a unidirectional air outlet mechanism for only supplying air out of the cabinet 2 is disposed at an outer end of the exhaust fan 14, the unidirectional air outlet mechanism adopts a louver commonly used in an exhaust fan or a negative pressure air blower in the prior art, wherein the louver is horizontally disposed, and when the exhaust fan 14 is not operated, the louver is in a natural closing state to achieve the closing of the air outlet.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (9)
1. The utility model provides a variable frequency control cabinet which characterized in that: the semiconductor cooling cabinet comprises a cabinet body (2) and a cabinet door arranged on the front side of the cabinet body (2), wherein an air inlet (21) is formed in the top of the cabinet body (2), an air outlet and a temperature controller (8) are formed in one side of the lower part of the cabinet body (2), an exhaust fan (5) is installed on the air outlet, and a semiconductor cooling assembly is erected on the upper part of the cabinet body (2); an axial flow fan (32) used for blowing air to the inside of the cabinet body (2) is arranged on the air inlet (21), and a filtering assembly capable of completely covering an air suction channel of the axial flow fan (32) is installed on the air suction side of the axial flow fan (32);
the semiconductor cooling assembly comprises cooling guide fins (15) erected at the upper part inside the cabinet body (2) through fin supports (22), and semiconductor refrigerators are installed on at least two sides of the cooling guide fins (15); the semiconductor refrigerator comprises a semiconductor refrigerating piece (12), a cold guide head (11) attached to the cold end side of the semiconductor refrigerating piece (12) and a heat guide head (13) attached to the hot end side of the semiconductor refrigerating piece (12), wherein the cold guide head (11) is connected with cold guide fins (15), and the heat guide head (13) is arranged outside the cabinet body (2).
2. The variable frequency control cabinet according to claim 1, characterized in that: and a heat radiation fan (14) is arranged at the outer end of the heat conduction head (13).
3. The variable frequency control cabinet according to claim 1, characterized in that: the semiconductor refrigerator is hermetically connected with the cabinet body (2).
4. The variable frequency control cabinet according to claim 1, characterized in that: the semiconductor refrigerator also comprises a heat insulation gasket (16) arranged between the cold conducting head (11) and the heat conducting head (13).
5. The variable frequency control cabinet according to claim 4, wherein: the heat insulation gasket (16) is provided with a refrigerating sheet hole (161) for accommodating the semiconductor refrigerating sheet (12).
6. The variable frequency control cabinet according to claim 1, characterized in that: the cold guide fins (15) comprise a cold guide outer frame (151) and a latticed heat dissipation structure which is arranged in the cold guide outer frame (151) and formed by staggering first heat dissipation fins (152) and second heat dissipation fins (153).
7. The variable frequency control cabinet according to claim 6, characterized in that: the surfaces of the first radiating fin (152) and the second radiating fin (153) are provided with radiating fins.
8. The variable frequency control cabinet according to claim 1, characterized in that: a damping gasket (33) is padded between the axial flow fan (32) and the cabinet body (2).
9. The variable frequency control cabinet according to claim 1, characterized in that: and a water cooling plate (6) is arranged on one side of the cabinet body (2) and clings to the side wall of the cabinet body (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921031764.1U CN210470095U (en) | 2019-07-03 | 2019-07-03 | Frequency conversion control cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921031764.1U CN210470095U (en) | 2019-07-03 | 2019-07-03 | Frequency conversion control cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210470095U true CN210470095U (en) | 2020-05-05 |
Family
ID=70443678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921031764.1U Active CN210470095U (en) | 2019-07-03 | 2019-07-03 | Frequency conversion control cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210470095U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447809A (en) * | 2020-05-13 | 2020-07-24 | 珠海格力电器股份有限公司 | Photovoltaic air conditioner, cooling assembly and control method of cooling assembly |
-
2019
- 2019-07-03 CN CN201921031764.1U patent/CN210470095U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447809A (en) * | 2020-05-13 | 2020-07-24 | 珠海格力电器股份有限公司 | Photovoltaic air conditioner, cooling assembly and control method of cooling assembly |
| CN111447809B (en) * | 2020-05-13 | 2023-10-24 | 珠海格力电器股份有限公司 | Photovoltaic air conditioner, cooling assembly and control method of cooling assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10386085B2 (en) | Semiconductor-based air conditioning device | |
| JP2000055411A (en) | Air conditioner | |
| CN105578842A (en) | Cabinet door air-cooling type constant temperature cabinet system and control method | |
| CN110912009A (en) | Electric control cabinet capable of keeping constant temperature | |
| CN108376928A (en) | A kind of electrical cabinet heat-sink unit and control method | |
| CN201571292U (en) | Active heat radiation type cabinet | |
| CN210470095U (en) | Frequency conversion control cabinet | |
| CN210980123U (en) | Outdoor unit of air conditioner | |
| CN114245679A (en) | Air conditioner and control method thereof | |
| KR100801677B1 (en) | Cooling Unit Of Telecom Repeater | |
| CN213578196U (en) | System for cooling circulating water based on semiconductor refrigeration technology | |
| CN115750290A (en) | Anti-condensation structure, integrated compressor and refrigeration equipment | |
| CN112489947B (en) | A multifunctional automatic transformer | |
| CN209484775U (en) | A temperature regulation system for enclosed spaces | |
| CN110553455B (en) | Refrigeration equipment of air-cooled refrigeration workbench and control method thereof | |
| CN116171029B (en) | Energy-saving heat dissipation type variable frequency control cabinet | |
| CN208480197U (en) | An electrical control cabinet that facilitates heat dissipation | |
| CN206176620U (en) | Air-conditioning fan control device and air-conditioning fan | |
| CN222835925U (en) | Self-cooling screw compressor | |
| CN222925649U (en) | Internal environment temperature control device for air conditioning unit | |
| CN219834782U (en) | Energy-saving adjusting type integrated cabinet | |
| CN112229090A (en) | System for cooling circulating water based on semiconductor refrigeration technology | |
| CN111306013A (en) | Unit heat abstractor with high heat dispersion | |
| CN222123651U (en) | Efficient quick-freezing warehouse unit | |
| CN217876238U (en) | Evaporative cooling power-saving air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |