CN205231452U - Semiconductor refrigeration cold water power traction is held up for laser instrument - Google Patents
Semiconductor refrigeration cold water power traction is held up for laser instrument Download PDFInfo
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- CN205231452U CN205231452U CN201521012774.2U CN201521012774U CN205231452U CN 205231452 U CN205231452 U CN 205231452U CN 201521012774 U CN201521012774 U CN 201521012774U CN 205231452 U CN205231452 U CN 205231452U
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Abstract
The utility model discloses a semiconductor refrigeration cold water power traction is held up for laser instrument, including fin formula aluminum alloy heat exchanger, fin formula aluminum alloy heat exchanger includes aluminum alloy base plate group, the aluminum alloy base plate group outside all is equipped with heat transfer fin group, the outside of radiating fin group is provided with semiconductor refrigeration piece group, the semiconductor refrigeration piece group outside is provided with inserted sheet formula aluminum alloy radiator, inserted sheet formula aluminum alloy radiator inboard all is equipped with radiating fin group, form heat transfer medium's packing cavity between fin formula aluminum alloy heat exchanger, semiconductor refrigeration piece group and the inserted sheet formula aluminum alloy radiator, radiating fin group through semiconductor refrigeration piece group, heat transfer medium and heat transfer fin group realizes the heat transfer exchange. The utility model discloses a semiconductor refrigeration cold water power traction is held up for laser instrument has that hot exchange capacity is strong, the commonality is wide, expansion nature is strong, the flexibility is high and long service life's characteristics.
Description
Technical field
The utility model relates to cooling device technical field, is specially a kind of laser semiconductor refrigerating cold water power traction and holds up.
Background technology
Along with the reduction of laser technology threshold, the application of laser is more and more general.Because laser can produce a large amount of heat when work, cause laser head temperature to rise, cause laser can not long-term stable operation.Traditional heat sink conception has the following two kinds: air-cooled water circulation heat exchanger; 2) compressor cooling.Two schemes respectively has limitation: air-cooled type heat exchanger can only dispel the heat and can not freeze, and temperature can not be lower than ambient temperature; And compressor needs to use cold-producing medium, the problem of environmental protection aspect can be produced, with mechanical movement, potential safety hazard can be there is in compressed-air actuated process.。
Utility model content
The purpose of this utility model is to provide a kind of laser semiconductor refrigerating cold water power traction and holds up, and has that heat-exchange capacity is strong, versatility is wide, expansion is strong, flexibility is high and the feature of long service life.
The utility model can be achieved through the following technical solutions:
The utility model discloses a kind of laser semiconductor refrigerating cold water power traction to hold up, comprise fin-type aluminum alloy heat exchanger, described fin-type aluminum alloy heat exchanger comprises aluminium alloy base plate group, heat exchange fin group is equipped with outside described aluminium alloy base plate group, the arranged outside of described radiating fin group has semiconductor chilling plate group, described semiconductor chilling plate group arranged outside has blade inserting aluminium alloy heat radiator, radiating fin group is equipped with inside described blade inserting aluminium alloy heat radiator, described fin-type aluminum alloy heat exchanger, the cavity filling of heat transfer medium is formed between semiconductor chilling plate group and blade inserting aluminium alloy heat radiator, described radiating fin group is by semiconductor chilling plate group, heat transfer medium and described heat exchange fin group realize heat transmission and exchange.Heat exchange fin group is equipped with outside the aluminium alloy base plate group of fin-type aluminum alloy heat exchanger, the aluminium alloy that fin-type aluminum alloy heat exchanger adopts heat transfer property outstanding is material, and on aluminium alloy base plate, process fin heat exchange group to increase heat exchange area, can fully efficiently by cold the passing to from laser cooled plate by the heat transfer medium heated of semiconductor chilling plate group generation, add that semiconductor chilling plate group thermal inertia is very little, the cooling and heating type time is fast, be swift in response, also can promote thermal heat transfer capability further; Adopt semiconductor chilling plate group as heat eliminating medium, semiconductor chilling plate group has two kinds of functions, can refrigeration, can heat again, therefore use a device just can replace discrete heating system and refrigerating system, meet temperature range from the 100 DEG C of requirements to negative temperature 130 DEG C of positive temperature; Semiconductor chilling plate group is electric current transducing type device, by the control of input current, can realize high-precision temperature and control, add temperature measurement and control means, very easily realize remote control, program control, computer control, be convenient to form automatic control system; The power that the single cooling element of semiconductor chilling plate group is right is very little, is merged the science combination of connection, can design several watts of refrigeration modules to hundreds of on kilowatt by series connection.Convenient according to caloric value number customize, energy-conservation, convenient, promote it and use flexibility; And whole semiconductor refrigerating cold water power traction is held up without any need for refrigerant, can continuous operation, there is no pollutant sources; There is no rotating parts, can not gyroscopic action be produced; There is no mechanical movement, there is no slide unit, do not shake during work, noise, life-span be long, install easily.
Further, the outer ledge parcel of described aluminium alloy base plate group is fitted with foamed material layer, and foamed material layer has better insulating power, avoids the loss of energy in heat transfer process to affect the good effect of heat trnasfer.
Further, described aluminium alloy base plate group comprises two aluminium alloy base plates of combination parallel to each other, and described two aluminium alloy base plates, by friction welding (FW) welding fabrication, improve the voltage endurance capability of aluminium alloy base plate, can bear the pressure test of 200PSI.
Further, described two aluminium alloy base plate surfaces opposite to each other are provided with nickel plating rete.By arranging nickel plating rete, both preventing aluminium ion to be mixed in heat transfer medium, having avoided aluminium ion to be mixed into when heat transfer medium enters in the heat exchanger on laser head and the heat exchanger generation displacement reaction of laser head, thus the heat exchanger of corrosion laser head; Heat transfer medium circulation line can be blocked after it also avoid the species precipitate of reaction generation.
Further, described fin-type aluminum alloy heat exchanger, semiconductor chilling plate group and blade inserting aluminium alloy heat radiator are shaping, convenient for assembly shaping by screw movable composition,
A kind of laser semiconductor refrigerating of the utility model cold water power traction is held up, and has following beneficial effect:
The first, heat-exchange capacity is strong, heat exchange fin group is equipped with outside the aluminium alloy base plate group of fin-type aluminum alloy heat exchanger, the aluminium alloy that fin-type aluminum alloy heat exchanger adopts heat transfer property outstanding is material, and on aluminium alloy base plate, process fin heat exchange group to increase heat exchange area, can fully efficiently by cold the passing to from laser cooled plate by the heat transfer medium heated of semiconductor chilling plate group generation, add that semiconductor chilling plate group thermal inertia is very little, the cooling and heating type time is fast, be swift in response, also can promote thermal heat transfer capability further;
The second, versatility is wide, adopt semiconductor chilling plate group as heat eliminating medium, semiconductor chilling plate group has two kinds of functions, can refrigeration, can heat again, therefore use a device just can replace discrete heating system and refrigerating system, meet temperature range from the 100 DEG C of requirements to negative temperature 130 DEG C of positive temperature;
Three, expansion is strong, and semiconductor chilling plate group is electric current transducing type device, by the control of input current, high-precision temperature can be realized control, add temperature measurement and control means, very easily realize remote control, program control, computer control, be convenient to form automatic control system;
Four, flexibility is high, and the power that the single cooling element of semiconductor chilling plate group is right is very little, is merged the science combination of connection, can design several watts of refrigeration modules to hundreds of on kilowatt by series connection.Convenient according to caloric value number customize, energy-conservation, convenient, promote it and use flexibility;
Five, long service life, whole semiconductor refrigerating cold water power traction is held up without any need for refrigerant, can continuous operation, does not have pollutant sources; There is no rotating parts, can not gyroscopic action be produced; There is no mechanical movement, there is no slide unit, do not shake during work, noise, life-span be long, install easily.
Accompanying drawing explanation
A kind of laser semiconductor refrigerating of accompanying drawing 1 the utility model cold water power traction holds up decomposition texture schematic diagram;
Accompanying drawing 2 is a kind of laser semiconductor refrigerating of the utility model cold water power traction package assembly schematic diagram;
Accompanying drawing 3 is that a kind of laser semiconductor refrigerating of the utility model cold water power traction holds up fin-type aluminum alloy heat exchanger internal structure schematic diagram;
In accompanying drawing, mark comprises: 1, fin-type aluminum alloy heat exchanger, and 2, semiconductor chilling plate group, 3, blade inserting aluminium alloy heat radiator, 4, aluminium alloy base plate, 5, heat exchange fin group, 6, screw, 7, foamed material layer, 8, radiating fin group.
Embodiment
In order to make those skilled in the art person understand the technical solution of the utility model better, below in conjunction with embodiment and accompanying drawing, the utility model product is described in further detail.
As shown in Figures 1 to 3, the utility model discloses a kind of laser semiconductor refrigerating cold water power traction to hold up, comprise fin-type aluminum alloy heat exchanger 1, described fin-type aluminum alloy heat exchanger 1 comprises aluminium alloy base plate group, heat exchange fin group 5 is equipped with outside described aluminium alloy base plate group, the arranged outside of described radiating fin group 8 has semiconductor chilling plate group 2, described semiconductor chilling plate group 2 arranged outside has blade inserting aluminium alloy heat radiator 3, heat exchange fin group 5 is equipped with inside described blade inserting aluminium alloy heat radiator 3, described fin-type aluminum alloy heat exchanger 1, the cavity filling of heat transfer medium is formed between semiconductor chilling plate group 2 and blade inserting aluminium alloy heat radiator 3, described radiating fin group 8 is by semiconductor chilling plate group 2, heat transfer medium and described heat exchange fin group 5 realize heat transmission and exchange.The outer ledge parcel of described aluminium alloy base plate group is fitted with foamed material layer 7.Described aluminium alloy base plate group comprises two aluminium alloy base plates 4 of combination parallel to each other, and described two aluminium alloy base plates 4 are by friction welding (FW) welding fabrication.Described two aluminium alloy base plate 4 surfaces opposite to each other are provided with nickel plating rete.Described fin-type aluminum alloy heat exchanger 1, semiconductor chilling plate group 2 and blade inserting aluminium alloy heat radiator 3 is shaping by screw 6 movable composition.
The operation principle that laser semiconductor refrigerating cold water power traction described in the utility model is held up is: when semiconductor refrigerating cold water power traction is held up the laser equipment of access client, the fin-type aluminum alloy heat exchanger 1 that semiconductor refrigerating cold water power traction is held up, cooled plate, the water pump of blade inserting aluminium alloy heat radiator 3 and laser, and supporting pipeline forms a closed circulatory system.Add that 24V direct current is started working with rear engine to engine, recirculation after flowing through laser cooled plate and being reduced to the target temperature of setting by the temperature of the cooling fluid heated is entered laser cooled plate.The heat that semiconductor chilling plate group 2 produces in the course of the work, is dispersed in air by blade inserting aluminium alloy heat radiator 3 and supporting blower fan.
The above, be only preferred embodiment of the present utility model, not does any pro forma restriction to the utility model; The those of ordinary skill of all industry all can shown in by specification accompanying drawing and the above and implement the utility model swimmingly; But all those skilled in the art are not departing within the scope of technical solutions of the utility model, disclosed above technology contents can be utilized and make a little change, modify with differentiation equivalent variations, be Equivalent embodiments of the present utility model; Meanwhile, all according to substantial technological of the present utility model to the change of any equivalent variations that above embodiment is done, modify and differentiation etc., within the protection range all still belonging to the technical solution of the utility model.
Claims (5)
1. a laser semiconductor refrigerating cold water power traction is held up, it is characterized in that: comprise fin-type aluminum alloy heat exchanger (1), described fin-type aluminum alloy heat exchanger (1) comprises aluminium alloy base plate group, heat exchange fin group (5) is equipped with outside described aluminium alloy base plate group, the arranged outside of described radiating fin group (8) has semiconductor chilling plate group (2), described semiconductor chilling plate group (2) arranged outside has blade inserting aluminium alloy heat radiator (3), described blade inserting aluminium alloy heat radiator (3) inner side is equipped with radiating fin group (8), described fin-type aluminum alloy heat exchanger (1), the cavity filling of heat transfer medium is formed between semiconductor chilling plate group (2) and blade inserting aluminium alloy heat radiator (3), described radiating fin group (8) is by semiconductor chilling plate group (2), heat transfer medium and described heat exchange fin group (5) realize heat transmission and exchange.
2. laser semiconductor refrigerating cold water power traction according to claim 1 is held up, and it is characterized in that: the outer ledge parcel of described aluminium alloy base plate group is fitted with foamed material layer (7).
3. laser semiconductor refrigerating cold water power traction according to claim 2 is held up, and it is characterized in that: described aluminium alloy base plate group comprises two aluminium alloy base plates (4) of combination parallel to each other, and described two aluminium alloy base plates (4) are by friction welding (FW) welding fabrication.
4. laser semiconductor refrigerating cold water power traction according to claim 3 is held up, and it is characterized in that: described two aluminium alloy base plate (4) surfaces opposite to each other are provided with nickel plating rete.
5. laser semiconductor refrigerating cold water power traction is held up according to claim 4, it is characterized in that: described fin-type aluminum alloy heat exchanger (1), semiconductor chilling plate group (2) and blade inserting aluminium alloy heat radiator (3) are shaping by screw (6) movable composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521012774.2U CN205231452U (en) | 2015-12-09 | 2015-12-09 | Semiconductor refrigeration cold water power traction is held up for laser instrument |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201521012774.2U CN205231452U (en) | 2015-12-09 | 2015-12-09 | Semiconductor refrigeration cold water power traction is held up for laser instrument |
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| CN205231452U true CN205231452U (en) | 2016-05-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896193A (en) * | 2019-11-25 | 2020-03-20 | 杭州海容激光技术有限公司 | High-stability optical fiber laser |
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2015
- 2015-12-09 CN CN201521012774.2U patent/CN205231452U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896193A (en) * | 2019-11-25 | 2020-03-20 | 杭州海容激光技术有限公司 | High-stability optical fiber laser |
| CN110896193B (en) * | 2019-11-25 | 2020-12-15 | 杭州海容激光技术有限公司 | High-stability optical fiber laser |
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