CN209087758U - Hall ion source magnetic pole cooling device - Google Patents
Hall ion source magnetic pole cooling device Download PDFInfo
- Publication number
- CN209087758U CN209087758U CN201822157454.6U CN201822157454U CN209087758U CN 209087758 U CN209087758 U CN 209087758U CN 201822157454 U CN201822157454 U CN 201822157454U CN 209087758 U CN209087758 U CN 209087758U
- Authority
- CN
- China
- Prior art keywords
- magnetic pole
- ion source
- hall ion
- cold air
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of hall ion source magnetic pole cooling devices, are related to hall ion source technical field.The utility model includes hall ion source ontology, the plate upper surface of hall ion source ontology is fixed with magnetic pole, hall ion source ontology plate upper surface is fixed with cooling chamber, pole tip is sealed through cooling chamber and magnetic pole perimeter surface and cooling chamber, magnetic pole surfaces are arranged with radiator for semiconductor, and hall ion source ontology bottom base plate, which runs through, the cold air inlet pipe extended in cooling chamber and cold air outlet pipe.The utility model is by being arranged the quick forced heat-exchanging of radiator for semiconductor progress using in magnetic pole surfaces, the heat of radiator is taken away by cold air heat exchange again, due to improving the cooling velocity of magnetic pole, the heat exchange area with cold air is increased further through radiating fin, with superelevation cooling efficiency, the heat radiation that magnetic pole is born in hall ion source work is reduced, to solve magnetic pole demagnetization phenomenon, magnetic pole service life is extended, spoilage is reduced.
Description
Technical field
The utility model belongs to hall ion source technical field, fills more particularly to a kind of hall ion source magnetic pole is cooling
It sets.
Background technique
Currently, usually non-heating/cooling device, hall ion source generate field pole in ion to the magnetic pole of hall ion source
It can generate nearly 500 DEG C of heat under the bombardment of beam, work long hours, high temperature, which can generate demagnetization phenomenon to magnetic pole, enables ion source
Amount reduces, and also has hall ion source to cool down by increasing around cooling structures such as the cooling water pipes of magnetic pole setting, still,
The effect of fast cooling is not achieved, work necessary requirement is not achieved.
Utility model content
The purpose of this utility model is to provide a kind of hall ion source magnetic pole cooling devices, solve existing Hall ion
The magnetic pole in source, which lacks, cools protection or existing cooling structure is difficult to reach the problem of cooling of work requires.
In order to solve the above technical problems, the utility model is achieved through the following technical solutions:
The utility model is a kind of hall ion source magnetic pole cooling device, including hall ion source ontology, the Hall from
The plate upper surface of component ontology is fixed with magnetic pole, and the hall ion source ontology plate upper surface is fixed with cooling chamber, described
Pole tip is sealed through cooling chamber and magnetic pole perimeter surface and cooling chamber, and the magnetic pole surfaces are arranged with radiator for semiconductor, institute
Hall ion source ontology bottom base plate is stated through having the cold air inlet pipe extended in cooling chamber and cold air outlet pipe, the cold air inlet pipe
The overlay film chamber for running through laminating machine with cold air outlet pipe one end, by being sealed with overlay film chamber flanged joint, and it is cold with external world's circulation
But equipment connects to form cooling air circuit, and circulation cooling device can be factory's air conditioner cooling system or compressor and evaporator
Unit etc..
Further, the radiator for semiconductor is tubular structure and cylinder perimeter surface is equipped with radiating fin, the cooling
The lead collar of settable radiator for semiconductor, the power supply line of the radiator for semiconductor on the bottom plate of chamber and hall ion source ontology
It is pierced by connection DC power supply by lead collar sealing, supply voltage may not exceed radiator for semiconductor voltage rating.
Further, the cold air inlet pipe and cold air outlet pipe are located at radiator for semiconductor two sides.
The utility model has the following beneficial effects:
The utility model is by carrying out quick forced heat-exchanging using being arranged radiator for semiconductor in magnetic pole surfaces, then by cold
The heat that radiator is taken away in gas heat exchange increases and cold air due to improving the cooling velocity of magnetic pole further through radiating fin
Heat exchange area has superelevation cooling efficiency, reduces the heat radiation that magnetic pole is born in hall ion source work, moves back to solve magnetic pole
Magnetic phenomenon extends magnetic pole service life, reduces spoilage.
Certainly, any product for implementing the utility model does not necessarily require achieving all the advantages described above at the same time.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the utility model embodiment, make required for being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are merely some embodiments of the present invention,
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Other attached drawings.
Fig. 1 is the structural schematic diagram of the utility model hall ion source magnetic pole cooling device.
In attached drawing, parts list represented by the reference numerals are as follows:
1- hall ion source ontology, 2- magnetic pole, 3- cooling chamber, 4- radiator for semiconductor, 5- cold air inlet pipe, 6- cold air go out
Pipe.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
All other embodiment obtained, fall within the protection scope of the utility model.
Refering to Figure 1, the utility model is a kind of hall ion source magnetic pole cooling device, including hall ion source sheet
Body 1, the plate upper surface of hall ion source ontology 1 are fixed with magnetic pole 2, and 1 plate upper surface of hall ion source ontology is fixed with cold
But chamber 3,2 top of magnetic pole are sealed through cooling chamber 3 and 2 perimeter surface of magnetic pole and cooling chamber 3, and 2 surface of magnetic pole is arranged with semiconductor and dissipates
Hot device 4,1 bottom base plate of hall ion source ontology, which runs through, the cold air inlet pipe 5 extended in cooling chamber 3 and cold air outlet pipe 6, cold air
The overlay film chamber of laminating machine is run through in inlet pipe 5 and 6 one end of cold air outlet pipe, by being sealed with overlay film chamber flanged joint, and with the external world
Circulation cooling device connects to form cooling air circuit, circulation cooling device can be factory's air conditioner cooling system or compressor with
Evaporator unit etc..
Wherein, radiator for semiconductor 4 be tubular structure and cylinder perimeter surface be equipped with radiating fin, cooling chamber 3 and Hall from
The lead collar of settable radiator for semiconductor 4, the power supply line of radiator for semiconductor 4 pass through lead collar on the bottom plate of component ontology 1
Sealing is pierced by connection DC power supply；Radiator for semiconductor 4, which is powered, to be imported outside to 2 surface forced heat-exchanging of magnetic pole for heat and dissipate
On hot fin, magnetic pole 2 is made to cool down rapidly, heat exchange cold air is entered in cooling chamber 3 by cold air inlet pipe 5, by the heat on radiating fin
It takes away, then is come back in cooling system and freezed by cold air outlet pipe 6, complete circulating cooling cooling as a result,.
Wherein, cold air inlet pipe 5 and cold air outlet pipe 6 are located at 4 two sides of radiator for semiconductor.
In the description of this specification, the description of reference term " one embodiment ", " example ", " specific example " etc. means
Particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one of the utility model
In embodiment or example.In the present specification, schematic expression of the above terms be not necessarily referring to identical embodiment or
Example.Moreover, particular features, structures, materials, or characteristics described can be in any one or more embodiment or examples
In can be combined in any suitable manner.
The preferred embodiment in the utility model disclosed above is only intended to help to illustrate the utility model.Preferred embodiment is simultaneously
There is no the details that detailed descriptionthe is all, also not limiting the utility model is only the specific embodiment.Obviously, according to this theory
The content of bright book can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to preferably
The principles of the present invention and practical application are explained, so that skilled artisan be enable to better understand and utilize this
Utility model.The utility model is limited only by the claims and their full scope and equivalents.
Claims (3)
1. a kind of hall ion source magnetic pole cooling device, including hall ion source ontology (1), the hall ion source ontology (1)
Plate upper surface be fixed with magnetic pole (2), it is characterised in that:
Hall ion source ontology (1) plate upper surface is fixed with cooling chamber (3), and cooling chamber is run through on magnetic pole (2) top
(3) and magnetic pole (2) perimeter surface and cooling chamber (3) seal, and magnetic pole (2) surface is arranged with radiator for semiconductor (4), it is described suddenly
Your ion source ontology (1) bottom base plate, which runs through, the cold air inlet pipe (5) extended in cooling chamber (3) and cold air outlet pipe (6).
2. a kind of hall ion source magnetic pole cooling device according to claim 1, which is characterized in that the semiconductor heat-dissipating
Device (4) is tubular structure and cylinder perimeter surface is equipped with radiating fin.
3. a kind of hall ion source magnetic pole cooling device according to claim 1, which is characterized in that the cold air inlet pipe
(5) and cold air outlet pipe (6) is located at radiator for semiconductor (4) two sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822157454.6U CN209087758U (en) | 2018-12-21 | 2018-12-21 | Hall ion source magnetic pole cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822157454.6U CN209087758U (en) | 2018-12-21 | 2018-12-21 | Hall ion source magnetic pole cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209087758U true CN209087758U (en) | 2019-07-09 |
Family
ID=67127167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822157454.6U Active CN209087758U (en) | 2018-12-21 | 2018-12-21 | Hall ion source magnetic pole cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209087758U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113346800A (en) * | 2021-06-26 | 2021-09-03 | 陕西航空电气有限责任公司 | Rotor position detection method suitable for brushless direct current motor |
-
2018
- 2018-12-21 CN CN201822157454.6U patent/CN209087758U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113346800A (en) * | 2021-06-26 | 2021-09-03 | 陕西航空电气有限责任公司 | Rotor position detection method suitable for brushless direct current motor |
| CN113346800B (en) * | 2021-06-26 | 2022-09-23 | 陕西航空电气有限责任公司 | Rotor position detection method suitable for brushless direct current motor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10371396B2 (en) | Air conditioner heat-radiating circulation system | |
| KR20180000291U (en) | Semiconductor-based air conditioning device | |
| CN108807313B (en) | Microelectronic device heat dissipation device | |
| CN205491635U (en) | Power circuit board geomantic omen mixed cooling machine case | |
| CN105539123B (en) | A kind of electric automobile cooling system | |
| US20180368289A1 (en) | Natural cold-source heat-dissipation system for various data centers | |
| CN202231001U (en) | Chip cooling device for control module of variable frequency air conditioner | |
| CN105737439A (en) | Air conditioner system utilizing solar energy and thermoelectricity supercooling device | |
| CN101922778A (en) | Semiconductor refrigerating air conditioning device | |
| CN208888754U (en) | A kind of server chips liquid cooling heat radiation system | |
| CN206207598U (en) | Air-conditioner | |
| CN105932525B (en) | Portable laser cooling and power supply device | |
| CN209087758U (en) | Hall ion source magnetic pole cooling device | |
| CN203633039U (en) | air conditioning unit | |
| CN105392326A (en) | Heat radiation method of closed rectification power supply device | |
| CN204739708U (en) | Semiconductor refrigeration air conditioner structure | |
| CN203445772U (en) | Cooling system for converter | |
| CN203537218U (en) | Device for cooling current transformer | |
| CN108489303A (en) | A kind of heat sink arrangement with thermal insulation layer | |
| CN104851855A (en) | Semiconductor liquid-cooling radiator | |
| CN104359155B (en) | Converter valve and valve hall combine heat-exchange system | |
| CN203633038U (en) | air conditioning unit | |
| CN106766346B (en) | Circulating water-cooled heat dissipation semiconductor refrigerating system | |
| WO2018141187A1 (en) | Bundled and combined semiconductor refrigeration and heating device | |
| CN205657965U (en) | Liquid-cooled heat dissipation system and pump thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |