WO2012062205A1 - Omnidirectional cold-heat-complementary integrated heat exchanger - Google Patents

Omnidirectional cold-heat-complementary integrated heat exchanger Download PDF

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Publication number
WO2012062205A1
WO2012062205A1 PCT/CN2011/081960 CN2011081960W WO2012062205A1 WO 2012062205 A1 WO2012062205 A1 WO 2012062205A1 CN 2011081960 W CN2011081960 W CN 2011081960W WO 2012062205 A1 WO2012062205 A1 WO 2012062205A1
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WIPO (PCT)
Prior art keywords
heat exchanger
condenser
composite condenser
heat
cold
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PCT/CN2011/081960
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French (fr)
Chinese (zh)
Inventor
刘万辉
Original Assignee
沈茂相
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Publication of WO2012062205A1 publication Critical patent/WO2012062205A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/0408—Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids
    • F28D1/0417—Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids with particular circuits for the same heat exchange medium, e.g. with the heat exchange medium flowing through sections having different heat exchange capacities or for heating/cooling the heat exchange medium at different temperatures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B6/00—Compression machines, plants or systems, with several condenser circuits
    • F25B6/04—Compression machines, plants or systems, with several condenser circuits arranged in series
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0068—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for refrigerant cycles
    • F28D2021/007—Condensers

Definitions

  • the invention relates to a comprehensive heat exchanger, in particular to a novel high efficiency cold and heat complementary integrated heat exchanger for use in a semiconductor refrigerated warm storage bin.
  • One is a semiconductor refrigerator that uses a fan and a heat sink for external heat exchange.
  • the box can be both cooled and heated, but the cooling efficiency is low and there is significant noise.
  • It is a semiconductor refrigerated box that uses a heat pipe type heat sink for external heat exchange. The cooling efficiency is slightly higher, but the box can only be cooled and cannot be heated.
  • the object of the present invention is to provide such a high-efficiency all-round standing cold and heat complementary integrated heat exchanger for a multifunctional semiconductor refrigerating and warming dual-use box, which has much longer heat exchange capacity with ambient air than ordinary
  • the heat exchanger also has the ability to neutralize the heat carried by the semiconductor refrigeration heater to the refrigeration compartment and the cooling capacity of the semiconductor refrigeration heater to the heating of the heating compartment, thereby improving the semiconductor refrigeration.
  • the cooling efficiency of the heater and the heating efficiency of the semiconductor refrigeration heater is to provide such a high-efficiency all-round standing cold and heat complementary integrated heat exchanger for a multifunctional semiconductor refrigerating and warming dual-use box, which has much longer heat exchange capacity with ambient air than ordinary
  • the heat exchanger also has the ability to neutralize the heat carried by the semiconductor refrigeration heater to the refrigeration compartment and the cooling capacity of the semiconductor refrigeration heater to the heating of the heating compartment, thereby improving the semiconductor refrigeration.
  • the cooling efficiency of the heater and the heating efficiency of the semiconductor refrigeration heater is to provide such a high-efficiency all-round standing cold and heat
  • the object of the present invention is achieved by the following technical solutions: using a metal material having good thermal conductivity to form a suitable liquid refrigerant, an upper outdoor heat exchanger and a lower outdoor heat exchanger capable of flowing inside, with good thermal conductivity
  • the metal material is made into a composite condenser, and a suitable infusion pump, an upper outdoor heat exchanger, a lower outdoor heat exchanger, a composite condenser and an infusion pump are connected to each other to form a circulating flow path of liquid refrigerant flow, which is characterized in that
  • the composite condenser is composed of a horizontal composite condenser and a vertical composite condenser, and the horizontal composite condenser is composed of one or more horizontal single-layer condensers connected to each other, and the vertical composite type
  • the condenser is constructed by interconnecting one or more vertical single layer condensers.
  • the working principle of the present invention is as follows.
  • the upper compartment heating and the lower compartment cooling of the two-compartment multifunctional semiconductor refrigerating and warming dual-purpose box are exemplified, and the multifunctional semiconductor refrigerating warm-up dual-use box is energized.
  • the lower compartment semiconductor refrigeration heater continuously draws heat from the lower chamber through the lower indoor heat exchanger, transferring the heat to the lower outdoor heat exchanger, and lowering the indoor temperature to achieve the purpose of cooling.
  • the inter-chamber semiconductor refrigeration heater continuously collects heat from the outdoor heat exchanger, and takes heat
  • the source is continuously transmitted to the upper indoor heat exchanger, and then the heat is radiated to the upper chamber.
  • the temperature in the upper chamber rises to achieve the purpose of heating.
  • the liquid refrigerant is placed in such an all-round cold.
  • the circulating flow in the heat-complementary integrated heat exchanger makes the cooling capacity on the upper outdoor heat exchanger and the heat in the lower outdoor heat exchanger neutralize each other, reducing the temperature on the lower outdoor heat exchanger and improving the temperature.
  • the temperature on the outdoor heat exchanger increases the cooling efficiency of the following compartment semiconductor refrigeration heater, the heating efficiency of the upper compartment semiconductor refrigeration heater increases, and the composite condenser is used to dissipate the heat and neutrality.
  • the composite condenser is composed of a horizontal composite condenser and a vertical composite condensation
  • the horizontal composite condenser is composed of one or more horizontal single-layer condensers connected to each other
  • the vertical composite condenser is composed of one More than one vertical single-layer condenser is connected to each other.
  • the vertical composite condenser is usually placed on the outer back of the multifunctional semiconductor refrigerated warm-up box.
  • the horizontal composite condenser is usually placed on the multi-function semiconductor.
  • the outer surface of the refrigerated warm-up dual-use tank, the effective heat exchange area of the composite condenser and the external environment is much larger than the effective heat exchange area of the ordinary composite condenser with a single placement surface and the external environment, so the external The heat exchange efficiency of the environment is very high, and the working efficiency of the multifunctional semiconductor refrigerating and warming dual-use box can be greatly improved.
  • FIG. 1 is a schematic structural diagram of an embodiment of the present invention
  • a high-heat-conducting metal material is used to form a suitable liquid refrigerant.
  • the upper outdoor heat exchanger 1 and the lower outdoor heat exchanger 2, which are internally flowable, are made of a metal material having good thermal conductivity.
  • the condenser 3, the appropriate infusion pump 4, the upper outdoor heat exchanger 1, the lower outdoor heat exchanger 2, the composite condenser 3 and the infusion pump 4 are connected to each other to form a circulating flow path of the liquid refrigerant flow, and its characteristics Yes, the composite condenser 3 is composed of a horizontal composite condenser 6 and a vertical composite condenser 5, and the horizontal composite condenser 6 is composed of one or more horizontal single-layer condensers connected to each other to form a composite condenser 3 , the vertical composite condenser 5 consists of one or more vertical single layer condenser phases The interconnection is composed of a combination.
  • the working principle of the present invention is as follows.
  • the upper compartment heating and the lower compartment cooling of the two-compartment multifunctional semiconductor refrigerating and warming dual-purpose box are exemplified, and the multifunctional semiconductor refrigerating warm-up dual-use box is energized.
  • the lower compartment semiconductor refrigeration heater continuously draws heat from the lower chamber through the lower indoor heat exchanger, and transfers the heat to the lower outdoor heat exchanger 2, and the lower indoor temperature is lowered to achieve the purpose of refrigeration.
  • the upper compartment semiconductor refrigeration heater continuously collects heat from the outdoor heat exchanger 1 to continuously transfer heat to the upper indoor heat exchanger, and then dissipates the heat to the upper chamber, and the upper chamber temperature rises.
  • the liquid refrigerant circulates in such an all-round hot and cold complementary integrated heat exchanger, so that the cooling capacity and the lower space on the upper outdoor heat exchanger 1
  • the heat on the outdoor heat exchanger 2 is neutralized and utilized, the temperature on the lower outdoor heat exchanger 2 is lowered, and the temperature on the outdoor heat exchanger 1 is increased, and the cooling efficiency of the following inter-compartment semiconductor refrigeration heater is improved.
  • the heating efficiency of the upper compartment semiconductor refrigeration heater is improved, and the composite condenser 3 is used for dissipating excess heat of the liquid refrigerant temperature higher than the ambient temperature after the neutralization of the cold heat or for absorbing cold heat neutralization.
  • the composite condenser 3 is composed of a horizontal composite condenser 6 and a vertical composite condenser 5, and the horizontal composite condenser 6 is composed of one or one.
  • the above horizontal single-layer condensers are constructed by interconnecting and combining, and the vertical composite condenser 5 is composed of one or more vertical single-layer condensers connected to each other, and the vertical composite condenser 5 is usually placed at a plurality.
  • the outer surface of the functional semiconductor refrigerated warm-up dual-use tank, the horizontal composite condenser 6 is usually placed on the outer bottom surface of the multifunctional semiconductor refrigerated warm-up dual-use tank, and the effective heat exchange area of the composite condenser 3 and the external environment It is much larger than the normal heat exchange area of the ordinary composite condenser with a single placement surface and the external environment, so it is exchanged with the external environment.
  • the high thermal efficiency can greatly improve the efficiency of the multi-function semiconductor refrigerated warm storage dual-use box.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

An omnidirectional cold-heat-complementary integrated heat exchanger comprising an upper chamber external heat exchanger (1), a lower chamber external heat exchanger (2), a combined condenser (3), and a liquid transfer pump (4). The upper chamber external heat exchanger (1), the lower chamber external heat exchanger (2), the combined condenser (3), and the liquid transfer pump (4) are connected to one another to form a liquid-coolant circulation path. The combined condenser (3) consists of a horizontal combined condenser (6) and a vertical combined condenser (5), each connecting to the other. The horizontal combined condenser (6) consists of one or more than one horizontal single-layer condensers, all connected together. The vertical combined condenser (5) consists of one or more than one vertical single-layer condensers, all connected together. The present integrated heat exchanger can neutralize cold and heat, thereby providing highly efficient heat-exchange.

Description

一种全方位放置冷热互补式综合换热器 技术领域  An all-round placement of cold and heat complementary integrated heat exchangers
本发明涉及到一种综合换热器，特别是一种用于半导体冷藏暖藏两用箱 上的一种新型高效率的冷热互补式综合换热器.  The invention relates to a comprehensive heat exchanger, in particular to a novel high efficiency cold and heat complementary integrated heat exchanger for use in a semiconductor refrigerated warm storage bin.
背景技术 Background technique
目前，市场上有两种半导体冷藏箱.一种是用风扇加散热片进行外部换热 的半导体冷藏箱， 箱内既可制冷又可制热， 但制冷效率低且有明显噪音， 还 有一种是用热管式散热装置进行外部换热的半导体冷藏箱， 制冷效率稍高， 但箱内只可制冷不能制热。  At present, there are two types of semiconductor refrigerators on the market. One is a semiconductor refrigerator that uses a fan and a heat sink for external heat exchange. The box can be both cooled and heated, but the cooling efficiency is low and there is significant noise. It is a semiconductor refrigerated box that uses a heat pipe type heat sink for external heat exchange. The cooling efficiency is slightly higher, but the box can only be cooled and cannot be heated.
发明内容 Summary of the invention
本发明的目的是提供这样一种用于多功能半导体冷藏暖藏两用箱上的一 种高效率的全方位放置冷热互补式综合换热器， 它与周围空气的换热能力远 大于普通的换热器， 还具有可以把半导体制冷制热器对冷藏室制冷所带出的 热量和半导体制冷制热器对暖藏室制热所带出的冷量相互中和利用，从而提 高半导体制冷制热器的制冷效率和半导体制冷制热器的制热效率的特点 .  The object of the present invention is to provide such a high-efficiency all-round standing cold and heat complementary integrated heat exchanger for a multifunctional semiconductor refrigerating and warming dual-use box, which has much longer heat exchange capacity with ambient air than ordinary The heat exchanger also has the ability to neutralize the heat carried by the semiconductor refrigeration heater to the refrigeration compartment and the cooling capacity of the semiconductor refrigeration heater to the heating of the heating compartment, thereby improving the semiconductor refrigeration. The cooling efficiency of the heater and the heating efficiency of the semiconductor refrigeration heater.
本发明的目的是通过下面的技术方案实现的： 用导热性能良好的金属材 料制作成合适的液体冷媒能在内部流动的上间室外换热器和下间室外换热器, 用导热性能良好的金属材料制作成复合式冷凝器， 选用合适的输液泵，上间 室外换热器， 下间室外换热器， 复合式冷凝器和输液泵相互连接构成液体冷 媒流动的循环流动通路， 其特征是：复合式冷凝器由水平复合式冷凝器和竖直 复合式冷凝器相互连通组合而构成， 水平复合式冷凝器由一个或一个以上的 水平单层冷凝器相互连通组合而构成， 竖直复合式冷凝器由一个或一个以上 的竖直单层冷凝器相互连通组合而构成。  The object of the present invention is achieved by the following technical solutions: using a metal material having good thermal conductivity to form a suitable liquid refrigerant, an upper outdoor heat exchanger and a lower outdoor heat exchanger capable of flowing inside, with good thermal conductivity The metal material is made into a composite condenser, and a suitable infusion pump, an upper outdoor heat exchanger, a lower outdoor heat exchanger, a composite condenser and an infusion pump are connected to each other to form a circulating flow path of liquid refrigerant flow, which is characterized in that The composite condenser is composed of a horizontal composite condenser and a vertical composite condenser, and the horizontal composite condenser is composed of one or more horizontal single-layer condensers connected to each other, and the vertical composite type The condenser is constructed by interconnecting one or more vertical single layer condensers.
本发明的工作原理是这样的，这里以两间室的多功能半导体冷藏暖藏两 用箱的上间室制热及下间室制冷来举例说明，多功能半导体冷藏暖藏两用箱 通电后开始工作，下间室半导体制冷制热器通过下间室内换热器不断地从下 间室内吸取热量，把热量传给下间室外换热器，下间室内温度降低，达到制冷 的目的，上间室半导体制冷制热器不断地丛上间室外换热器吸取热量，把热量 源源不断地传给上间室内换热器，再把热量散发到上间室内，上间室内温度升 高，达到制热的目的，由于输液泵的工作，液体冷媒在这样一种全方位放置冷 热互补式综合换热器内循环流动，使得上间室外换热器上的冷量和下间室外 换热器上的热量相互中和利用，降低下间室外换热器上的温度，提高上间室外 换热器上的温度，所以下间室半导体制冷制热器的制冷效率提高，上间室半导 体制冷制热器的制热效率提高，复合式冷凝器则用于散发掉冷热中和后仍使 得液体冷媒温度高于环境温度的多余热量或者用于吸收冷热中和后使得液体 冷媒温度低于环境温度的不足热量，由于复合式冷凝器由水平复合式冷凝器 和竖直复合式冷凝器相互连通组合而构成， 水平复合式冷凝器由一个或一个 以上的水平单层冷凝器相互连通组合而构成， 竖直复合式冷凝器由一个或一 个以上的竖直单层冷凝器相互连通组合而构成， 竖直复合式冷凝器通常被放 置于多功能半导体冷藏暖藏两用箱的外背面， 水平复合式冷凝器通常被放置 于多功能半导体冷藏暖藏两用箱的外底面， 这种复合式冷凝器与外部环境的 有效换热面积远大于通常的只有单一放置面的普通复合式冷凝器与外部环境 的有效换热面积， 所以与外部环境的换热效率很高， 可以大幅度提高多功能 半导体冷藏暖藏两用箱的工作效率。 The working principle of the present invention is as follows. Here, the upper compartment heating and the lower compartment cooling of the two-compartment multifunctional semiconductor refrigerating and warming dual-purpose box are exemplified, and the multifunctional semiconductor refrigerating warm-up dual-use box is energized. At the beginning of work, the lower compartment semiconductor refrigeration heater continuously draws heat from the lower chamber through the lower indoor heat exchanger, transferring the heat to the lower outdoor heat exchanger, and lowering the indoor temperature to achieve the purpose of cooling. The inter-chamber semiconductor refrigeration heater continuously collects heat from the outdoor heat exchanger, and takes heat The source is continuously transmitted to the upper indoor heat exchanger, and then the heat is radiated to the upper chamber. The temperature in the upper chamber rises to achieve the purpose of heating. Due to the operation of the infusion pump, the liquid refrigerant is placed in such an all-round cold. The circulating flow in the heat-complementary integrated heat exchanger makes the cooling capacity on the upper outdoor heat exchanger and the heat in the lower outdoor heat exchanger neutralize each other, reducing the temperature on the lower outdoor heat exchanger and improving the temperature. The temperature on the outdoor heat exchanger increases the cooling efficiency of the following compartment semiconductor refrigeration heater, the heating efficiency of the upper compartment semiconductor refrigeration heater increases, and the composite condenser is used to dissipate the heat and neutrality. Excess heat that still causes the liquid refrigerant temperature to be higher than the ambient temperature or insufficient heat to absorb the liquid refrigerant temperature below the ambient temperature after the neutralization of the hot and cold, because the composite condenser is composed of a horizontal composite condenser and a vertical composite condensation The horizontal composite condenser is composed of one or more horizontal single-layer condensers connected to each other, and the vertical composite condenser is composed of one More than one vertical single-layer condenser is connected to each other. The vertical composite condenser is usually placed on the outer back of the multifunctional semiconductor refrigerated warm-up box. The horizontal composite condenser is usually placed on the multi-function semiconductor. The outer surface of the refrigerated warm-up dual-use tank, the effective heat exchange area of the composite condenser and the external environment is much larger than the effective heat exchange area of the ordinary composite condenser with a single placement surface and the external environment, so the external The heat exchange efficiency of the environment is very high, and the working efficiency of the multifunctional semiconductor refrigerating and warming dual-use box can be greatly improved.
附图说明 DRAWINGS
本发明的附图说明如下：  The drawings of the present invention are described as follows:
图 1是本发明的实施例的原理结构示意图；  1 is a schematic structural diagram of an embodiment of the present invention;
图中： 1. 上间室外换热器； 2.下间室外换热器.； 3. 复合式冷凝器； 4. 输 液泵； 5.竖直复合式冷凝器； 6. 水平复合式冷凝器。  In the figure: 1. Upper outdoor heat exchanger; 2. Lower outdoor heat exchanger; 3. Composite condenser; 4. Infusion pump; 5. Vertical composite condenser; 6. Horizontal composite condenser .
具体实施方式 detailed description
下面结合附图和实施例对本发明做进一步说明：  The present invention will be further described below in conjunction with the accompanying drawings and embodiments:
如图 1所示， 用导热性能良好的金属材料制作成合适的液体冷媒能在内部 流动的上间室外换热器 1和下间室外换热器 2， 用导热性能良好的金属材料制 作成复合式冷凝器 3， 选用合适的输液泵 4，上间室外换热器 1 , 下间室外换热 器 2 , 复合式冷凝器 3和输液泵 4相互连接构成液体冷媒流动的循环流动通路， 其特征是：复合式冷凝器 3由水平复合式冷凝器 6和竖直复合式冷凝器 5相互连 通组合而构成， 水平复合式冷凝器 6由一个或一个以上的水平单层冷凝器相互 连通组合而构成， 竖直复合式冷凝器 5由一个或一个以上的竖直单层冷凝器相 互连通组合而构成。 As shown in Fig. 1, a high-heat-conducting metal material is used to form a suitable liquid refrigerant. The upper outdoor heat exchanger 1 and the lower outdoor heat exchanger 2, which are internally flowable, are made of a metal material having good thermal conductivity. The condenser 3, the appropriate infusion pump 4, the upper outdoor heat exchanger 1, the lower outdoor heat exchanger 2, the composite condenser 3 and the infusion pump 4 are connected to each other to form a circulating flow path of the liquid refrigerant flow, and its characteristics Yes, the composite condenser 3 is composed of a horizontal composite condenser 6 and a vertical composite condenser 5, and the horizontal composite condenser 6 is composed of one or more horizontal single-layer condensers connected to each other to form a composite condenser 3 , the vertical composite condenser 5 consists of one or more vertical single layer condenser phases The interconnection is composed of a combination.
本发明的工作原理是这样的，这里以两间室的多功能半导体冷藏暖藏两 用箱的上间室制热及下间室制冷来举例说明，多功能半导体冷藏暖藏两用箱 通电后开始工作，下间室半导体制冷制热器通过下间室内换热器不断地从下 间室内吸取热量，把热量传给下间室外换热器 2，下间室内温度降低，达到制冷 的目的，上间室半导体制冷制热器不断地丛上间室外换热器 1吸取热量，把热 量源源不断地传给上间室内换热器，再把热量散发到上间室内，上间室内温度 升高，达到制热的目的，由于输液泵 4的工作，液体冷媒在这样一种全方位放置 冷热互补式综合换热器内循环流动，使得上间室外换热器 1上的冷量和下间室 外换热器 2上的热量相互中和利用，降低下间室外换热器 2上的温度，提高上间 室外换热器 1上的温度，所以下间室半导体制冷制热器的制冷效率提高 ,上间 室半导体制冷制热器的制热效率提高，复合式冷凝器 3则用于散发掉冷热中和 后仍使得液体冷媒温度高于环境温度的多余热量或者用于吸收冷热中和后使 得液体冷媒温度低于环境温度的不足热量，由于复合式冷凝器 3由水平复合式 冷凝器 6和竖直复合式冷凝器 5相互连通组合而构成， 水平复合式冷凝器 6由一 个或一个以上的水平单层冷凝器相互连通组合而构成， 竖直复合式冷凝器 5由 一个或一个以上的竖直单层冷凝器相互连通组合而构成， 竖直复合式冷凝器 5 通常被放置于多功能半导体冷藏暖藏两用箱的外背面， 水平复合式冷凝器 6通 常被放置于多功能半导体冷藏暖藏两用箱的外底面， 这种复合式冷凝器 3与外 部环境的有效换热面积远大于通常的只有单一放置面的普通复合式冷凝器与 外部环境的有效换热面积， 所以与外部环境的换热效率艮高， 可以大幅度提 高多功能半导体冷藏暖藏两用箱的工作效率。  The working principle of the present invention is as follows. Here, the upper compartment heating and the lower compartment cooling of the two-compartment multifunctional semiconductor refrigerating and warming dual-purpose box are exemplified, and the multifunctional semiconductor refrigerating warm-up dual-use box is energized. At the beginning of work, the lower compartment semiconductor refrigeration heater continuously draws heat from the lower chamber through the lower indoor heat exchanger, and transfers the heat to the lower outdoor heat exchanger 2, and the lower indoor temperature is lowered to achieve the purpose of refrigeration. The upper compartment semiconductor refrigeration heater continuously collects heat from the outdoor heat exchanger 1 to continuously transfer heat to the upper indoor heat exchanger, and then dissipates the heat to the upper chamber, and the upper chamber temperature rises. To achieve the purpose of heating, due to the operation of the infusion pump 4, the liquid refrigerant circulates in such an all-round hot and cold complementary integrated heat exchanger, so that the cooling capacity and the lower space on the upper outdoor heat exchanger 1 The heat on the outdoor heat exchanger 2 is neutralized and utilized, the temperature on the lower outdoor heat exchanger 2 is lowered, and the temperature on the outdoor heat exchanger 1 is increased, and the cooling efficiency of the following inter-compartment semiconductor refrigeration heater is improved. Increasing, the heating efficiency of the upper compartment semiconductor refrigeration heater is improved, and the composite condenser 3 is used for dissipating excess heat of the liquid refrigerant temperature higher than the ambient temperature after the neutralization of the cold heat or for absorbing cold heat neutralization. After the liquid refrigerant temperature is lower than the ambient temperature, the composite condenser 3 is composed of a horizontal composite condenser 6 and a vertical composite condenser 5, and the horizontal composite condenser 6 is composed of one or one. The above horizontal single-layer condensers are constructed by interconnecting and combining, and the vertical composite condenser 5 is composed of one or more vertical single-layer condensers connected to each other, and the vertical composite condenser 5 is usually placed at a plurality. The outer surface of the functional semiconductor refrigerated warm-up dual-use tank, the horizontal composite condenser 6 is usually placed on the outer bottom surface of the multifunctional semiconductor refrigerated warm-up dual-use tank, and the effective heat exchange area of the composite condenser 3 and the external environment It is much larger than the normal heat exchange area of the ordinary composite condenser with a single placement surface and the external environment, so it is exchanged with the external environment. The high thermal efficiency can greatly improve the efficiency of the multi-function semiconductor refrigerated warm storage dual-use box.

Claims

权利要求 Rights request
1.一种全方位放置冷热互补式综合换热器，包括上间室外换热器（ 1 )、 下 间室外换热器（ 2 )、 复合式冷凝器（ 3 )和输液泵（ 4 ), 上间室外换热器（ 1 )、 下间室外换热器 ( 1 )、 复合式冷凝器 ( 3 )和输液泵 ( 4 )相互连接构成液体 冷媒的循环流动通路，其特征是： 复合式冷凝器（ 3 )由水平复合式冷凝器（ 6 ) 和竖直复合式冷凝器（ 5 )相互连通组合而构成。 1. An all-round cold and heat complementary integrated heat exchanger comprising an upper outdoor heat exchanger (1), a lower outdoor heat exchanger (2), a composite condenser (3) and an infusion pump (4) The upper outdoor heat exchanger (1), the lower outdoor heat exchanger (1), the composite condenser (3) and the infusion pump (4) are connected to each other to form a circulating flow path of the liquid refrigerant, which is characterized by: The condenser (3) is composed of a horizontal composite condenser (6) and a vertical composite condenser (5) connected to each other.
2.如权利要求 1所述一种全方位放置冷热互补式综合换热器，其特征是： 水平复合式冷凝器（6 ) 由一个或一个以上的水平单层冷凝器连通组成。  2. An all-round cold and heat complementary integrated heat exchanger according to claim 1, wherein: the horizontal composite condenser (6) is composed of one or more horizontal single layer condensers.
3.如权利要求 1所述一种全方位放置冷热互补式综合换热器，其特征是： 竖直复合式冷凝器（5 ) 由一个或一个以上的竖直单层冷凝器连通组成。  3. An all-round cold and heat complementary integrated heat exchanger according to claim 1, wherein: the vertical composite condenser (5) is composed of one or more vertical single-layer condensers.
PCT/CN2011/081960 2010-11-11 2011-11-08 Omnidirectional cold-heat-complementary integrated heat exchanger WO2012062205A1 (en)

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CN201852369U (en) * 2010-11-11 2011-06-01 刘万辉 Directionally-placed comprehensive heat exchanger
CN103743165A (en) * 2013-12-09 2014-04-23 合肥美菱股份有限公司 Condenser for household refrigerator

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