CN202109600U - Semiconductor air conditioner with high refrigeration efficiency - Google Patents
Semiconductor air conditioner with high refrigeration efficiency Download PDFInfo
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- CN202109600U CN202109600U CN2011201867491U CN201120186749U CN202109600U CN 202109600 U CN202109600 U CN 202109600U CN 2011201867491 U CN2011201867491 U CN 2011201867491U CN 201120186749 U CN201120186749 U CN 201120186749U CN 202109600 U CN202109600 U CN 202109600U
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Abstract
A semiconductor air conditioner with high refrigeration efficiency comprises an indoor heat exchanger, a semiconductor refrigeration assembly, a cooling tower and a circulating water pump. A water inlet of the circulating water pump is connected with a water outlet of the cooling tower, the semiconductor refrigeration assembly is composed of a casing and a semiconductor refrigeration slice, and a cold channel and a hot channel for circulating water is respectively defined by a refrigeration face and a radiating face of the semiconductor refrigeration slice and the casing. An inlet of the cold channel is connected with a water outlet of the circulating water pump, an outlet is connected with a backwater port of the cooling tower through the indoor heat exchanger, and an inlet of the hot channel is connected with a water outlet of the circulating water pump, and the outlet is connected with the backwater port of the cooling tower. The connection mode of parts can be that the water outlet of the cooling tower is connected with the backwater port of the cooling tower through the circulating water pump, the cold channel, the hot channel and the indoor heat exchanger sequentially. The outlet of the hot channel is connected with the backwater port of the cooling tower. The semiconductor air conditioner can ensure that the hot face and the cold face of the semiconductor refrigeration slice have small temperature difference, and the refrigeration efficiency of the semiconductor air conditioner is greatly improved.
Description
Technical field
The utility model relates to a kind of high efficiency air conditioner that adopts the semiconductor chilling plate refrigeration, belongs to the air-conditioning technique field.
Background technology
At present, the air-conditioner overwhelming majority on the market is the compressor formula, and there is certain defective in this air-conditioning at aspects such as energy consumption, environmental protection, and this is to be determined by its refrigeration principle.Semiconductor refrigerating is the middle of last century new developing technology, semiconductor refrigerating equipment environmentally safe, but the refrigerating capacity and the Energy Efficiency Ratio of existing semiconductor air-conditioner all are inferior to compressor formula air-conditioner, have greatly limited its promotion and application.Theoretically, want to improve the refrigerating capacity and the Energy Efficiency Ratio of semiconductor air conditioner, can only take following two kinds of methods:
1, improves the high-quality coefficient E of semi-conducting material.The quality of cooling semi-conducting material is to weigh with the size of high-quality coefficient E, and the E value is big more, and the thermoelectricity capability of semi-conducting material is just good more, and when E → ∞, semi-conductive coefficient of refrigerating performance also tends to the coefficient of refrigerating performance of Ideal Cycle.
2, dwindle the temperature difference T of semiconductor chilling plate cold and hot surface.When the temperature difference T of the cold and hot surface of semiconductor chilling plate is very little (Δ T<10 ° C), semi-conductive refrigerating efficiency COP can sharply rise, and this moment, the refrigerating efficiency of semiconductor air conditioner might meet and exceed conventional air conditioner fully.
Because it is little significantly to improve the possibility of semi-conducting material high-quality coefficient E in a short time; Therefore; How effectively to control the cold and hot surface temperature difference T of semiconductor chilling plate, just become the present main direction of studying of relevant technologies personnel with the refrigerating efficiency that improves semiconductor air conditioner.
The utility model content
The utility model be used to overcome prior art deficiency, a kind of semiconductor air-conditioner with high refrigerating efficiency that has a narrow range of temperature of semiconductor chilling plate cold and hot surface is provided.
The alleged problem of the utility model realizes with following technical proposals:
A kind of semiconductor air-conditioner with high refrigerating efficiency; Comprise indoor heat exchanger, semiconductor refrigerating assembly, cooling tower and water circulating pump in the formation; The water inlet of said water circulating pump connects the delivery port of cooling tower, and said semiconductor refrigerating assembly is made up of shell and semiconductor chilling plate, and the chill surface of said semiconductor chilling plate and radiating surface surround the cold passage and the passage of heat of recirculated water respectively with shell; The inlet of said cold passage connects the delivery port of water circulating pump; Outlet connects the water return outlet of cooling tower through indoor heat exchanger, and the inlet of the said passage of heat connects the delivery port of water circulating pump through flow control valve, and outlet connects the water return outlet of cooling tower.
A kind of semiconductor air-conditioner with high refrigerating efficiency; Comprise indoor heat exchanger, semiconductor refrigerating assembly, cooling tower and water circulating pump in the formation; Said semiconductor refrigerating assembly is made up of shell and semiconductor chilling plate; The chill surface of said semiconductor chilling plate and radiating surface surround the cold passage and the passage of heat of recirculated water respectively with shell; The delivery port of said cooling tower connects the water return outlet of cooling tower successively through cold passage, the passage of heat and the indoor heat exchanger of water circulating pump, semiconductor refrigerating assembly, the outlet of the passage of heat of semiconductor refrigerating assembly also connects the water return outlet of cooling tower through flow control valve.
Above-mentioned semiconductor air-conditioner with high refrigerating efficiency; Semiconductor chilling plate in the said semiconductor refrigerating assembly is provided with two; Their chill surface surrounds the cold passage of recirculated water relatively and with shell; The radiating surface of two semiconductor cooling pieces surrounds the passage of heat of two recirculated waters respectively with shell, two recirculated water passage of heat internal communication or be communicated with through exterior line.
Above-mentioned semiconductor air-conditioner with high refrigerating efficiency; Also comprise air circulation device in the formation; Said air circulation device is made up of gas-gas heat exchanger and air blast; The cold wind import of said gas-gas heat exchanger is docked with the cooling tower upper opening, and cold wind outlet and fresh air inlet connect atmosphere, and the fresh air outlet connects indoor; The air inlet of said air blast is connected with indoor, and the air inlet that is positioned at the inner-tower filling material below on air outlet and the cooling tower sidewall is connected.
Above-mentioned semiconductor air-conditioner with high refrigerating efficiency; Said gas-gas heat exchanger can also be substituted by cooling tower shunting lid; The sidepiece of said cooling tower shunting lid is provided with two exhaust outlets; Exhaust outlet connects indoor and itself and indoor connecting line are provided with new air-valve, and another exhaust outlet connects atmosphere and is provided with gate.
Above-mentioned semiconductor air-conditioner with high refrigerating efficiency, said gas-gas heat exchanger are shell and tube, board-like or heat pipe-type.
The utility model adopts the cold passage and the passage of heat of semiconductor refrigerating assembly and connects or the end to end back method that inserts liquid circulation line; Make inlet isothermal or the inlet of cold passage and the outlet isothermal of the passage of heat of the cold passage and the passage of heat; Guarantee the temperature difference T<10 ° C of the cold and hot surface of semiconductor chilling plate, thereby improved the refrigerating efficiency of semiconductor air conditioner greatly.Cooling tower utilizes evaporation of water to make the recirculated water cooling, has improved the Energy Efficiency Ratio of aircondition.Cold passage is arranged between two passage of heats, can effectively reduces the loss of refrigeration capacity of cold passage, improve refrigeration.
Description of drawings
Below in conjunction with accompanying drawing the utility model is done further to detail.
Fig. 1 is the structural representation of indoor circulation semiconductor air-conditioner of cold passage and the passage of heat inlet isothermal of cooling assembly;
Fig. 2 is the passage of heat outlet of cooling assembly and the structural representation of the indoor circulation semiconductor air-conditioner of cold feeder connection isothermal;
Fig. 3 is the structural representation of fresh air semiconductor air-conditioner of cold passage and the passage of heat inlet isothermal of cooling assembly;
Fig. 4 is the passage of heat outlet of cooling assembly and the structural representation of the fresh air semiconductor air-conditioner of cold feeder connection isothermal;
Fig. 5 is the structural representation of part fresh air semiconductor air-conditioner of cold passage and the passage of heat inlet isothermal of cooling assembly;
Fig. 6 is the passage of heat outlet of cooling assembly and the structural representation of the part fresh air semiconductor air-conditioner of cold feeder connection isothermal;
Fig. 7 is the structural representation of the semiconductor refrigerating assembly of built-in individual layer semiconductor chilling plate;
Fig. 8 is the structural representation of the semiconductor refrigerating assembly of built-in double-deck semiconductor chilling plate;
Fig. 9 is the graph of a relation between semiconductor refrigerating coefficient ε and the temperature difference t;
Figure 10 is that the fresh air of on the air psychrometric chart, representing gets in the semiconductor air-conditioner in process of refrigerastion air state variation situation;
Each label is among the figure:
1, indoor heat exchanger, 2, the semiconductor refrigerating assembly, 3, cooling tower, 4, flow control valve, 5, water circulating pump; 6, air blast, 7, filler, 8, pressure fan, 9, gas-gas heat exchanger; 10, cooling tower shunting lid, 11, gate, 12, new air-valve; 13, the passage of heat, 14, semiconductor chilling plate, 15, cold passage, 16, shell.
The specific embodiment
The utility model can have following several kinds of mode of operations:
One, the room air circulatory system.
1, the inlet isothermal of the inlet of cold passage and the passage of heat.
Referring to Fig. 1, the cold water by cooling tower 2 gets off is divided into two-way through water circulating pump 5, flows through the cold passage and the passage of heat of semiconductor refrigerating assembly 2 respectively.The water that flows through the passage of heat is taken away the caloric value of semiconductor chilling plate and is got into the water return outlet of cooling tower 3.The water that flows through cold passage through the hot-air in indoor heat exchanger 1 cooling chamber, is also got back to cooling tower 2 by heat exchanger 1 in the inlet chamber of semiconductor chilling plate cooling back then.Flow control valve 4 is used to regulate the flow-rate ratio of water in the cold passage and the passage of heat.Pressure fan 8 is used to promote the circulation of indoor cold wind.
2, the inlet isothermal of the outlet of the passage of heat and cold passage.
Referring to Fig. 2; The cold water that gets off by cooling tower 2; Behind water circulating pump 5, all flow through the passage of heat of semiconductor refrigerating assembly 2, water is divided into two-way after coming out from the passage of heat again, and one the road flows to cooling tower 2; Get into the hot-air in indoor heat exchanger 1 cooling chamber again after the cold passage cooling of another Lu Xianjing, get back to cooling tower 2 at last.Flow control valve 4 is used to regulate the flow of cold in-channel water.
Two, 100% fresh air gets into indoor heating system.
1, the inlet isothermal of the inlet of cold passage and the passage of heat.
Referring to Fig. 3, water circulation system and Fig. 1 of this air-conditioner are just the same, and different is air circulation system, and the air circulation path is: room air → cooling tower 2 → lead to outdoor; Outdoor air → gas-gas heat exchanger 9 → indoor heat exchanger 1 → indoor.
Gas-gas heat exchanger 9 has various ways, like shell and tube, board-like, heat pipe-type etc.Be characterized in: gas and gas transmit heat through metal wall superheater tube working medium, and not directly contact.The cooling tower here both can provide cold water, again cold air can be provided.Process of refrigerastion air state variation situation is shown in figure 10: room air state A, in cooling tower, cool to state C along isenthalp, and carry out heat exchange with outdoor air conditions B, press etc. that wet line heats up or cooling; Outdoor air is by state B → state E, and in the inlet chamber, the cold air of cooling tower drains into outdoor by state C → state D.
During practical implementation, gas-gas heat exchanger 9 is provided with air forced circulation device with indoor connecting line planted agent.
2, the inlet isothermal of the outlet of the passage of heat and cold passage.
Referring to Fig. 4, water circulation system and Fig. 2 of this air-conditioner are just the same, and air circulation system and Fig. 3 are just the same.
Three, partly (0~50%) fresh air gets into indoor heating system.
1, the inlet isothermal of the inlet of cold passage and the passage of heat.
Referring to Fig. 5; Water circulation system and Fig. 1 of this air-conditioner are just the same; Different is air circulation system, and the air circulation path is:
Through the percentage (0~50%) in gate 11 and the new air-valve 12 control fresh air inlet chambers.Be characterized in: the cold air of cooling tower mixes heat exchanger in the inlet chamber of back with outdoor air.
2, the inlet isothermal of the outlet of the passage of heat and cold passage.
Referring to Fig. 6, water circulation system and Fig. 2 of this air-conditioner are just the same, and air circulation system and Fig. 5 are just the same.
Claims (10)
1. semiconductor air-conditioner with high refrigerating efficiency; It is characterized in that; It comprises indoor heat exchanger (1), semiconductor refrigerating assembly (2), cooling tower (3) and water circulating pump (5); The water inlet of said water circulating pump (5) connects the delivery port of cooling tower (3), and said semiconductor refrigerating assembly (2) is made up of shell (16) and semiconductor chilling plate (14), and the chill surface of said semiconductor chilling plate (14) and radiating surface surround the cold passage (15) and the passage of heat (13) of recirculated water respectively with shell (16); The inlet of said cold passage (15) connects the delivery port of water circulating pump (5); Outlet connects the water return outlet of cooling tower (3) through indoor heat exchanger (1), and the inlet of the said passage of heat (13) connects the delivery port of water circulating pump (5) through flow control valve (4), and outlet connects the water return outlet of cooling tower (3).
2. according to the said semiconductor air-conditioner of claim 1 with high refrigerating efficiency; It is characterized in that; Semiconductor chilling plate (14) in the said semiconductor refrigerating assembly (2) is provided with two; Their chill surface surrounds the cold passage (15) of recirculated water relatively and with shell (16), and the radiating surface of two semiconductor cooling pieces (14) surrounds the passage of heat (13) of two recirculated waters respectively with shell (16), two the recirculated water passage of heat (13) internal communication or be communicated with through exterior line.
3. according to claim 1 or 2 said semiconductor air-conditioners with high refrigerating efficiency; It is characterized in that; Also comprise air circulation device in the formation, said air circulation device is made up of gas-gas heat exchanger (9) and air blast (6), and the cold wind import of said gas-gas heat exchanger (9) is docked with cooling tower (3) upper opening; Cold wind outlet and fresh air inlet connect atmosphere, and the fresh air outlet connects indoor; The air inlet of said air blast (6) is connected with indoor, and the air inlet that is positioned at inner-tower filling material (7) below on air outlet and cooling tower (3) sidewall is connected.
4. according to the said semiconductor air-conditioner of claim 3 with high refrigerating efficiency; It is characterized in that; Said gas-gas heat exchanger (9) can also be substituted by cooling tower shunting lid (10); The sidepiece of said cooling tower shunting lid (10) is provided with two exhaust outlets, and exhaust outlet connects indoor and itself and indoor connecting line are provided with new air-valve (12), and another exhaust outlet connects atmosphere and is provided with gate (11).
5. according to the said semiconductor air-conditioner of claim 4, it is characterized in that said gas-gas heat exchanger (9) is shell and tube, board-like or heat pipe-type with high refrigerating efficiency.
6. semiconductor air-conditioner with high refrigerating efficiency; It is characterized in that; It comprises indoor heat exchanger (1), semiconductor refrigerating assembly (2), cooling tower (3) and water circulating pump (5); The water inlet of said water circulating pump (5) connects the delivery port of cooling tower (3), and said semiconductor refrigerating assembly (2) is made up of shell (16) and semiconductor chilling plate (14), and the chill surface of said semiconductor chilling plate (14) and radiating surface surround the cold passage (15) and the passage of heat (13) of recirculated water respectively with shell (16); The inlet of said cold passage (15) connects the delivery port of water circulating pump (5); Outlet connects the water return outlet of cooling tower (3) through indoor heat exchanger (1), and the inlet of the said passage of heat (13) connects the delivery port of water circulating pump (5) through flow control valve (4), and outlet connects the water return outlet of cooling tower (3).
7. according to the said semiconductor air-conditioner of claim 6 with high refrigerating efficiency; It is characterized in that; Semiconductor chilling plate (14) in the said semiconductor refrigerating assembly (2) is provided with two; Their chill surface surrounds the cold passage (15) of recirculated water relatively and with shell (16), and the radiating surface of two semiconductor cooling pieces (14) surrounds the passage of heat (13) of two recirculated waters respectively with shell (16), two the recirculated water passage of heat (13) internal communication or be communicated with through exterior line.
8. according to claim 6 or 7 said semiconductor air-conditioners with high refrigerating efficiency; It is characterized in that; Also comprise air circulation device in the formation, said air circulation device is made up of gas-gas heat exchanger (9) and air blast (6), and the cold wind import of said gas-gas heat exchanger (9) is docked with cooling tower (3) upper opening; Cold wind outlet and fresh air inlet connect atmosphere, and the fresh air outlet connects indoor; The air inlet of said air blast (6) is connected with indoor, and the air inlet that is positioned at inner-tower filling material (7) below on air outlet and cooling tower (3) sidewall is connected.
9. said according to Claim 8 semiconductor air-conditioner with high refrigerating efficiency; It is characterized in that; Said gas-gas heat exchanger (9) can also be substituted by cooling tower shunting lid (10); The sidepiece of said cooling tower shunting lid (10) is provided with two exhaust outlets, and exhaust outlet connects indoor and itself and indoor connecting line are provided with new air-valve (12), and another exhaust outlet connects atmosphere and is provided with gate (11).
10. according to the said semiconductor air-conditioner of claim 9, it is characterized in that said gas-gas heat exchanger (9) is shell and tube, board-like or heat pipe-type with high refrigerating efficiency.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011201867491U CN202109600U (en) | 2011-06-03 | 2011-06-03 | Semiconductor air conditioner with high refrigeration efficiency |
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CN2011201867491U CN202109600U (en) | 2011-06-03 | 2011-06-03 | Semiconductor air conditioner with high refrigeration efficiency |
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CN2011201867491U Expired - Lifetime CN202109600U (en) | 2011-06-03 | 2011-06-03 | Semiconductor air conditioner with high refrigeration efficiency |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102162659A (en) * | 2011-06-03 | 2011-08-24 | 王恒月 | Semiconductor air conditioner with high refrigeration efficiency |
CN106766346A (en) * | 2016-12-26 | 2017-05-31 | 华南理工大学 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
-
2011
- 2011-06-03 CN CN2011201867491U patent/CN202109600U/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102162659A (en) * | 2011-06-03 | 2011-08-24 | 王恒月 | Semiconductor air conditioner with high refrigeration efficiency |
CN102162659B (en) * | 2011-06-03 | 2013-08-07 | 王恒月 | Semiconductor air conditioner with high refrigeration efficiency |
CN106766346A (en) * | 2016-12-26 | 2017-05-31 | 华南理工大学 | A kind of circulated water-cooled heat-radiating semiconductor refrigeration system |
CN106766346B (en) * | 2016-12-26 | 2022-09-20 | 华南理工大学 | Circulating water-cooled heat dissipation semiconductor refrigerating system |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20120111 Effective date of abandoning: 20130807 |
|
RGAV | Abandon patent right to avoid regrant |