CN201844486U - Semiconductor refrigerating air-conditioning device - Google Patents

Semiconductor refrigerating air-conditioning device Download PDF

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Publication number
CN201844486U
CN201844486U CN2010205412804U CN201020541280U CN201844486U CN 201844486 U CN201844486 U CN 201844486U CN 2010205412804 U CN2010205412804 U CN 2010205412804U CN 201020541280 U CN201020541280 U CN 201020541280U CN 201844486 U CN201844486 U CN 201844486U
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China
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heat
cold scattering
cold
housing
cavity
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Expired - Lifetime
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CN2010205412804U
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Chinese (zh)
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陈创新
向建化
李勇
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Guangdong Newidea & Patent Development Co Ltd
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Guangdong Newidea & Patent Development Co Ltd
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Abstract

The utility model relates to a semiconductor refrigerating air-conditioning device, which comprises a semiconductor refrigerating chip, wherein the semiconductor refrigerating chip comprises a heat end and a cold end, and is provided with a first shell and a second shell, the first shell is provided with a cold radiating cavity, the second shell is provided with a heat radiating cavity, the adjacent wall surfaces of the first shell and the second shell are connected, the positions at which the adjacent wall surfaces of the first shell and the second shell are connected are respectively provided with a through hole, the dimension of the through hole is matched with the dimension of the semiconductor refrigerating chip, the semiconductor refrigerating chip is fixed in the through hole, the cold end of the semiconductor refrigerating chip is arranged at the cold radiating cavity, the heat end of the semiconductor refrigerating chip is arranged at the heat radiating cavity, the cold radiating device is arranged in the cold radiating cavity, a heat radiating device is arranged in the heat radiating cavity, the upper part of the first shell is provided with an air inlet, the air inlet is communicated with the cold radiating cavity, the cold radiating cavity is internally provided with an air inlet device, and the lower part of the first shell is provided with an air inlet channel. The semiconductor refrigerating air-conditioning device has the characteristics that the refrigerating speed is quick, the refrigerating effect is good, the structure is simple, saving and environmental-protection can be obtained, no noise is caused, and popularization and application are convenient.

Description

A kind of semiconductor refrigerating air conditioning device
Technical field
The utility model relates to a kind of refrigeration plant, particularly relates to a kind of semiconductor refrigerating air conditioning device.
Background technology
The refrigeration of tradition aircondition is based on mechanical technique and chemical technology, and the dependence refrigerant (for example: liquid state freon)---the heat exchange of gaseous state phase transition process realizes.Because the freon that it adopted or the leakage of other compound can cause certain pollution to surrounding environment, and atmospheric ozone layer is had strong destruction, so these airconditions will be eliminated by market gradually.Therefore, develop a kind of superior performance, the Refrigeration Technique of environmental sound has become an important topic in global Refrigeration Technique scientific research field.
The high-tech semiconductor refrigerating technology of modernization without any need for cold-producing medium, but utilizes semi-conductive Peltier effect just can realize refrigeration, and this is a kind of environmentally friendly refrigeration modes.The principle of this semiconductor refrigerating technology is: when a N-type semiconductor material and P-type semiconductor material be coupled to galvanic couple to the time, in circuit, connect DC current after, just can energy-producing transfer.As: flow to the joint release heat of N type element by electric current by P type element, form the hot junction, can be used for heating; Absorb heat by electric current by the joint that N type element flows to P type element, form cold junction, can be used for refrigeration.Because semiconductor refrigerating technology, need not any cold-producing medium, movement-less part, also have noiseless simultaneously, do not have wearing and tearing, the life-span is long, reliability is high, conversion efficiency is high, easy to control, size is little and advantage such as in light weight, so, be widely used in fields such as industry, agricultural, medical treatment, scientific research, national defence.
In the prior art, semiconductor refrigerating air conditioning device includes semiconductor refrigeration chip, and an end of semiconductor refrigeration chip is called the hot junction, and the other end is called cold junction, its operation principle is exactly to rely on the electronics of semiconductor refrigeration chip to carry energy transfer, realizes the refrigeration of aircondition, the usefulness that heats.The semiconductor air conditioner technology can not only save the user expense, can reduce the exploitation of fuel source; simultaneously owing to do not use any cold-producing medium; can suppress the aggravation of greenhouse effects, help the protection of environment, will become one of Chinese air conditioner industry development in future direction.
Yet, because semiconductor refrigeration chip distributed if the heat in hot junction is untimely in when refrigeration, will influence the refrigerating efficiency of semiconductor refrigeration chip, when serious even cause burning of semiconductor refrigeration chip; And, because heat is delivered to cold junction by heat bridge from the hot junction of semiconductor refrigeration chip easily, thereby reduced the refrigeration of semiconductor cooling device, therefore, the heat dissipation problem that solves semiconductor refrigeration chip becomes the important prerequisite that improves refrigeration.
In the prior art, semiconductor refrigerating air conditioning device generally adopts the type of cooling of direct cooling of blower fan or free convection, this class type of cooling makes dust, moisture, mist of oil etc. enter easily, to the functional reliability of electronic devices and components and service life etc. causing adverse effect, even can influence the operate as normal of electronic devices and components.Also having some in the prior art is that the principle that adopts semiconductor refrigeration chip to add radiator is freezed, and the Energy Efficiency Ratio of this structure is lower, and refrigerating capacity is no more than 300W, and is difficult to realize refrigeration when environment temperature is higher.
Therefore, at the deficiencies in the prior art, needing badly provides a kind of not only refrigerating speed fast, and good refrigeration effect, and simple in structure, energy-conserving and environment-protective are convenient to the semiconductor refrigerating air conditioning device of promoting and using.
The utility model content
The purpose of this utility model is to avoid weak point of the prior art and provides a kind of not only refrigerating speed fast, and good refrigeration effect, and simple in structure, energy-conserving and environment-protective are convenient to the semiconductor refrigerating air conditioning device of promoting and using.
The purpose of this utility model is achieved through the following technical solutions:
A kind of semiconductor refrigerating air conditioning device is provided, include at least one semiconductor refrigeration chip, described semiconductor refrigeration chip has hot junction and cold junction, wherein, be provided with first housing and second housing, described first housing has the cold scattering cavity, described second housing has heat-dissipating cavity, described first housing is connected setting with the adjacent wall of described second housing, the adjacent wall with described second housing of described first housing connects the equal corresponding through hole that matches with the Outside Dimensions of described semiconductor refrigeration chip that offers in position that is provided with, described semiconductor refrigeration chip is fixed in the described through hole, the cold junction of described semiconductor refrigeration chip is arranged at described cold scattering cavity, and the hot junction of described semiconductor refrigeration chip is arranged at described heat-dissipating cavity; Be provided with the cold scattering device in the described cold scattering cavity, described cold scattering device is provided with Cryo Heat Tube, cold scattering pedestal and cold scattering fins set, one side of described cold scattering pedestal and the cold junction of described semiconductor refrigeration chip closely touch, the opposite side of described cold scattering pedestal is connected with first pipeline section of described Cryo Heat Tube, and second pipeline section of described Cryo Heat Tube is connected with described cold scattering fins set; Be provided with heat abstractor in the described heat-dissipating cavity, described heat abstractor is provided with heat pipe, cooling base and radiating fin group, one side of described cooling base and the hot junction of described semiconductor refrigeration chip closely touch, the opposite side of described cooling base is connected with first pipeline section of described heat pipe, and second pipeline section of described heat pipe is connected with described radiating fin group; The top of described first housing is provided with air admission hole, and described air admission hole is communicated with described cold scattering cavity, is provided with inlet duct in the described cold scattering cavity, and described first lower part of frame is provided with the conduit of giving vent to anger.
Described semiconductor refrigeration chip, described cold scattering device and described heat abstractor join and are the integral type modular construction.
Described heat-dissipating cavity is provided with air cooling equipment, and described air cooling equipment is arranged at a side of the air outlet of contiguous described second housing of described radiating fin group.
Described air cooling equipment and vertical setting of described radiating fin group, i.e. gap towards between the radiating fin of described radiating fin group.
Described air cooling equipment is provided with aerofoil fan or footpath flow fan.
Described heat-dissipating cavity is provided with water cooling plant, and described water cooling plant is provided with water pump and is communicated with the cooling medium circulation pipe of setting with described water pump.
Be provided with first briquetting and second briquetting, the opposite side of described cold scattering pedestal is provided with first groove, and first pipeline section of described Cryo Heat Tube is embedded in described first groove, and compresses by the seamless unoccupied place of described first briquetting and to be fixed in described cold scattering pedestal; The opposite side of described cooling base is provided with second groove, and first pipeline section of described heat pipe is embedded in described second groove, and compresses by the seamless unoccupied place of described second briquetting and to be fixed in described cooling base.
The equal correspondence of each sheet radiating fin in the described radiating fin group is provided with louvre, and the equal correspondence of each sheet cold scattering fin in the described cold scattering fins set is provided with cold scattering hole.
Described heat pipe is broken line type heat pipe or straight pipe type heat pipe or U type heat pipe, and the shape of cross section of described heat pipe is circle or rectangle; Described Cryo Heat Tube is broken line type Cryo Heat Tube or straight pipe type Cryo Heat Tube or U type Cryo Heat Tube, and the shape of cross section of described Cryo Heat Tube is circle or rectangle.
Described inlet duct is the cylinder cross flow fan, and described cylinder cross flow fan is arranged at the below of described air admission hole.
The beneficial effects of the utility model: because semiconductor refrigerating air conditioning device of the present utility model includes at least one semiconductor refrigeration chip, semiconductor refrigeration chip has hot junction and cold junction, wherein, be provided with first housing and second housing, first housing has the cold scattering cavity, second housing has heat-dissipating cavity, the adjacent wall with second housing of first housing is connected setting, the adjacent wall with second housing of first housing connects the equal corresponding through hole that matches with the Outside Dimensions of semiconductor refrigeration chip that offers in position that is provided with, semiconductor refrigeration chip is fixed in the through hole, the cold junction of semiconductor refrigeration chip is arranged at the cold scattering cavity, and the hot junction of semiconductor refrigeration chip is arranged at heat-dissipating cavity; Be provided with the cold scattering device in the cold scattering cavity, the cold scattering device is provided with Cryo Heat Tube, cold scattering pedestal and cold scattering fins set, one side of cold scattering pedestal and the cold junction of semiconductor refrigeration chip closely touch, the opposite side of cold scattering pedestal is connected with first pipeline section of Cryo Heat Tube, and second pipeline section of Cryo Heat Tube is connected with the cold scattering fins set; Be provided with heat abstractor in the heat-dissipating cavity, heat abstractor is provided with heat pipe, cooling base and radiating fin group, one side of cooling base and the hot junction of semiconductor refrigeration chip closely touch, the opposite side of cooling base is connected with first pipeline section of heat pipe, and second pipeline section of heat pipe is connected with the radiating fin group; The top of first housing is provided with air admission hole, air admission hole is communicated with the cold scattering cavity, be provided with inlet duct in the cold scattering cavity, air admission hole blows into room air in the cold scattering cavity by inlet duct, and freeze through the cold scattering device, first lower part of frame is provided with the conduit of giving vent to anger, and the air after cold scattering device refrigeration flows out by the conduit of giving vent to anger.Compared with prior art, this semiconductor refrigerating air conditioning device, its heat abstractor utilizes heat pipe as heat conducting element, the heat in the hot junction of semiconductor refrigeration chip can be led away rapidly, and can utilize air-cooled or water-cooled is cooled off the radiating fin group, and be dispersed in the external environment, improved heat-sinking capability greatly; The cold junction of its cold scattering device and semiconductor refrigeration chip closely touches, strengthened refrigeration, be somebody's turn to do the cold scattering device of forming by Cryo Heat Tube, can be effectively the cold of semiconductor refrigeration chip be delivered to the cold scattering fins set rapidly, simultaneously, the top of first housing is provided with air admission hole, air admission hole is communicated with the cold scattering cavity, be provided with inlet duct in the cold scattering cavity, in air admission hole was delivered to the cold scattering cavity, and through cold scattering device refrigeration, first lower part of frame was provided with the conduit of giving vent to anger to room air by inlet duct, air after cold scattering device refrigeration is by the conduit output of giving vent to anger, so that the interior space is lowered the temperature.Have thus that refrigerating speed is fast, good refrigeration effect, simple in structure, economical environment-protective, noiseless, be convenient to the characteristics promoting and use.
Description of drawings
The utility model is described in further detail to utilize accompanying drawing, but the embodiment in the accompanying drawing does not constitute any restriction of the present utility model, for those of ordinary skill in the art, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to the following drawings.
Fig. 1 is the structural representation of a kind of semiconductor refrigerating air conditioning device of the present utility model.
Fig. 2 is the side direction structural representation of a kind of semiconductor refrigerating air conditioning device of the present utility model.
Fig. 3 is the structural representation of the integral type modular construction of a kind of semiconductor refrigerating air conditioning device of the present utility model.
Fig. 4 is the structural representation of the cold scattering device of a kind of semiconductor refrigerating air conditioning device of the present utility model.
Fig. 5 is the structural representation of the heat abstractor of a kind of semiconductor refrigerating air conditioning device of the present utility model.
Fig. 6 is the circulation of air path schematic diagram of the cold scattering cavity of a kind of semiconductor refrigerating air conditioning device of the present utility model.
Fig. 7 is the air or the cooling medium circulation path schematic diagram of the heat-dissipating cavity of a kind of semiconductor refrigerating air conditioning device of the present utility model.
In Fig. 1 to Fig. 7, comprise: 1---semiconductor refrigeration chip, 11---the hot junction, 12---cold junction, 2---heat abstractor, 20---second housing, 201---heat-dissipating cavity, 21---heat pipe, 22---cooling base, 221---second groove, 23---the radiating fin group, 231---louvre, 24---second briquetting, 3---the cold scattering device, 30---first housing, 301---the cold scattering cavity, 31---Cryo Heat Tube, 32---the cold scattering pedestal, 321---first groove, 33---the cold scattering fins set, 331---cold scattering hole, 34---first briquetting, 35---the conduit of giving vent to anger, 36---air admission hole, 4---inlet duct.
The specific embodiment
With the following Examples the utility model is further described.
Embodiment 1
One of specific embodiment of a kind of semiconductor refrigerating air conditioning device of the present utility model as Fig. 1, Fig. 2 and shown in Figure 3, includes at least one semiconductor refrigeration chip 1, and this semiconductor refrigeration chip 1 has hot junction 11 and cold junction 12.The quantity of semiconductor refrigeration chip 1 can be one or more according in the practical application demand of refrigerating plant cold being set.The positive pole of the semiconductor refrigeration chip 1 in the present embodiment and the positive pole of complete machine power supply join, the negative pole of the negative pole of semiconductor refrigeration chip 1 and complete machine power supply joins, simultaneously can be by changing the size of operating current, control cryogenic temperature and refrigerating speed have the flexible characteristics of the control regulated.
And, semiconductor refrigeration chip 1 has invertibity with being connected of power supply, if the positive pole of semiconductor refrigeration chip 1 and the negative pole of complete machine power supply are joined, the positive pole of the negative pole of semiconductor refrigeration chip 1 and complete machine power supply joins, the polarity of this change electric current just can realize the exchange of freezing, heating, the semiconductor refrigerating air conditioning device in this enforcement becomes heating mode, so can be realized the demand that heats.
A kind of semiconductor refrigerating air conditioning device of the present utility model as depicted in figs. 1 and 2, be provided with first housing 30 and second housing 20, first housing 30 has cold scattering cavity 301, second housing 20 has heat-dissipating cavity 201, first housing 30 is connected setting with second housing, 20 adjacent walls, first housing 30 connects the equal corresponding through hole that matches with the Outside Dimensions of semiconductor refrigeration chip 1 that offers in position that is provided with second housing, 20 adjacent walls, semiconductor refrigeration chip 1 is fixed in the through hole, the cold junction 12 of semiconductor refrigeration chip 1 is arranged at cold scattering cavity 301, and the hot junction 11 of semiconductor refrigeration chip 1 is arranged at heat-dissipating cavity 201; Heat radiation is finished respectively in heat-dissipating cavity 201 and 301 two cavitys of cold scattering cavity with cold scattering, thereby makes the transmission of cold and the transmission of heat not finish in the same space, has avoided having only the situation of local refrigeration to produce.Wherein, first housing 30 and second housing 20 are the shell of insulation, and this first housing 30 also has adiabatic function.Semiconductor refrigeration chip 1 is gapless closely cooperating with cooperating of through hole.
As Fig. 2 and shown in Figure 4, be provided with cold scattering device 3 in the cold scattering cavity 301, cold scattering device 3 is provided with Cryo Heat Tube 31, cold scattering pedestal 32 and cold scattering fins set 33, one side of cold scattering pedestal 32 and the cold junction 12 of semiconductor refrigeration chip 1 closely touch, the opposite side of cold scattering pedestal 32 is connected with first pipeline section of Cryo Heat Tube 31, and second pipeline section of Cryo Heat Tube 31 is connected with cold scattering fins set 33; Be provided with heat abstractor 2 in the heat-dissipating cavity 201, heat abstractor 2 is provided with heat pipe 21, cooling base 22 and radiating fin group 23, one side of cooling base 22 and the hot junction 11 of semiconductor refrigeration chip 1 closely touch, the opposite side of cooling base 22 is connected with first pipeline section of heat pipe 21, and second pipeline section of heat pipe 21 is connected with radiating fin group 23.The external diameter of second pipeline section of heat pipe 21 is more bigger than the internal diameter of heat pipe pilot hole, second pipeline section of heat pipe 21 passes the heat pipe pilot hole of the radiating fin of each sheet in the radiating fin group 23 successively, during assembling, the outer wall swelling of second pipeline section of heat pipe 21 is in heat pipe pilot hole place, distance between each sheet radiating fin is provided with evenly, and vertical setting of second pipeline section of each sheet radiating fin and heat pipe 21; The assembling of Cryo Heat Tube 31 and cold scattering fins set 33 is with the assembling of heat pipe 21 with radiating fin group 23.
Wherein, heat pipe 21 is broken line type heat pipe or straight pipe type heat pipe or U type heat pipe, and the shape of cross section of heat pipe 21 is circle or rectangle; Cryo Heat Tube 31 is broken line type Cryo Heat Tube or straight pipe type Cryo Heat Tube or U type Cryo Heat Tube, and the shape of cross section of Cryo Heat Tube 31 is circle or rectangle.In the present embodiment, heat pipe 21 adopts U type heat pipe, and Cryo Heat Tube 31 adopts U type Cryo Heat Tube, and first pipeline section of this heat pipe 21 is the bottom of U type, and second pipeline section of this heat pipe 21 is the both ends of U type, i.e. two legs; First pipeline section of this Cryo Heat Tube 31 is the bottom of U type, and second pipeline section of this Cryo Heat Tube 31 is the both ends of U type, i.e. two legs.
As Fig. 1, Fig. 2 and shown in Figure 6, the top of first housing 30 is provided with air admission hole 36, air admission hole 36 is communicated with cold scattering cavity 301, be provided with inlet duct 4 in the cold scattering cavity 301, room air by inlet duct 4 in air admission hole 36 is delivered to cold scattering cavity 301, and through cold scattering device 3 refrigeration, the bottom of first housing 30 is provided with the conduit 35 of giving vent to anger, and the air after cold scattering device 3 refrigeration is by conduit 35 outputs of giving vent to anger.The circulation path of the air in the cold scattering cavity is shown in the direction of arrow among Fig. 6, the conduit 35 of giving vent to anger that the bottom of air admission hole 36 to first housings 30 that are provided with from the top of first housing 30 is provided with, formed the cold convection channel in the cold scattering cavity 301, by this cold convection channel, realized that inlet duct 4 blows into indoor air in the cold scattering cavity 301, cool off by cold scattering fins set 33, come out to form cold air from the conduit 35 of giving vent to anger then, so that the interior space is lowered the temperature.
As shown in Figure 7, heat abstractor 2 is for being provided with the heat abstractor 2 of air cooling equipment, heat abstractor 2 cools off radiating fin group 23 by air cooling equipment, concrete, heat-dissipating cavity 201 is provided with air cooling equipment, and this air cooling equipment is arranged at the side that radiating fin group 23 is closed on the air outlet of second housing 20 (shown in Fig. 1 arrow).The circulation of air path of heat-dissipating cavity 201 is shown in the direction of arrow among Fig. 7, outdoor air enters from the air inlet of second housing 20, the radiating fin group 23 of flowing through, by air cooling equipment radiating fin group 23 is dried then, accelerate the radiating rate of radiating fin group 23, so that absorb the heat that passes over by heat pipe 21 quickly, thus the temperature of reduction heat pipe 21, the heat that the hot junction 11 that makes heat pipe 21 can more, more effectively absorb semiconductor refrigeration chip 1 discharges.Wherein, this air cooling equipment and the 23 vertical settings of radiating fin group, promptly towards the gap of the radiating fin of radiating fin group 23, be provided with like this and can guarantee that air cooling equipment can carry out forced heat radiation to each sheet radiating fin, promptly can further strengthen radiating effect by wind-cooling heat dissipating is carried out in the gap between each radiating fin.Wherein, air cooling equipment can be selected aerofoil fan or footpath flow fan for use.
As shown in Figure 3, semiconductor refrigeration chip 1, cold scattering device 3 and heat abstractor 2 join and are the integral type modular construction.In advance semiconductor refrigeration chip 1, cold scattering device 3 and heat abstractor 2 are assembled, had characteristic of simple structure, and this integral type modular construction is convenient to the overall package of aircondition.
The operation principle of heat pipe: the heating end of heat pipe is evaporator section (heat absorption), radiating end is condensation segment (heat release), when the evaporator section of heat pipe is heated, the evaporation of liquid working substance in the capillary wick, the pressure differential driving steam between " heat " evaporator section and " cold " condensation segment flow in the condensation segment and in the condensation segment condensation.The working medium that becomes liquid again flows back to evaporator section along capillary structure from condensation segment under the driving of capillary force.So circulation, heat reaches another pipeline section by first pipeline section of heat pipe.Inside heat pipe mainly is exactly " vapour-liquid " phase-change heat transfer by heat transfer medium, and thermal resistance is very little, has the very high capacity of heat transmission, and its heat-transfer capability is higher two more than the order of magnitude than metals such as copper, aluminium.Heat pipe can adopt the mixing liquid sucting core structure of plough groove type and sintered type.
Above-mentioned heat pipe 21 and Cryo Heat Tube 31 all are heat pipes, and only the start-up temperature of the heat pipe 21 in the heat abstractor 2 is 20 ℃, and the start-up temperature of the Cryo Heat Tube 31 in the cold scattering device 3 is at-10 ℃~10 ℃.
The cold of the cold junction 12 of semiconductor refrigeration chip 1 passes to first pipeline section of Cryo Heat Tube 31 by cold scattering pedestal 32, first pipeline section by Cryo Heat Tube 31 is passed to the cold scattering fins set 33 on second pipeline section of Cryo Heat Tube 31 again, room air is sucked in the cold scattering cavity 301 by inlet duct 4 by air admission hole 36, and freeze by cold scattering fins set 33, the conduit 35 of giving vent to anger that is provided with by the bottom of first housing 30 blows out the heat exchange of carrying out with room air to indoor again; The heat in the hot junction 11 of semiconductor refrigeration chip 1 passes to first pipeline section of heat pipe 21 by cooling base 22, first pipeline section by heat pipe 21 is passed to the radiating fin group 23 on second pipeline section of heat pipe 21 again, can select for use air-cooled mode to strengthen heat radiation, thereby distribute the heat that is produced in semiconductor refrigeration chip 1 work effectively.
A kind of semiconductor refrigerating air conditioning device of the present utility model such as Fig. 1 are to shown in Figure 5, be provided with first briquetting 34 and second briquetting 24, the opposite side of cold scattering pedestal 32 is provided with first groove 321, first pipeline section of Cryo Heat Tube 31 is embedded in first groove 321, and compresses by described first briquetting 34 seamless unoccupied places and to be fixed in cold scattering pedestal 32; The opposite side of cooling base 22 is provided with second groove 221, and first pipeline section of heat pipe 21 is embedded in described second groove 221, and compresses by second briquetting, 24 seamless unoccupied places and to be fixed in cooling base 22.Adopt groove to cooperate the fixed form of crimping with briquetting, help heat pipe 21 and the tight of cooling base 22 to fix, thereby make heat pipe 21 can all absorb heat from cooling base 22, help Cryo Heat Tube 31 and the tight of cooling base 32 to fix, thereby make Cryo Heat Tube 31 can all absorb cold from cold scattering pedestal 32.
And, be fixed in cold scattering pedestal 32 and second briquetting 24 and heat pipe 21 seamless unoccupied places can be compressed and be fixed in cooling base 22 in order to guarantee that first briquetting 34 can compress Cryo Heat Tube 31 seamless unoccupied places, between them, can fill heat-conducting silicone grease, and then avoid the generation in slit.
As shown in Figure 4 and Figure 5, the equal correspondence of each sheet radiating fin in the radiating fin group 23 is provided with louvre 231, and the equal correspondence of each sheet cold scattering fin in the cold scattering fins set 33 is provided with cold scattering hole 331.Each louvre 231 alignment are vertically arranged, and each cold scattering hole 331 alignment are vertically arranged.Louvre 231 is set on radiating fin helps cross-ventilation, accelerate heat radiation; Cold scattering hole 331 is set on the cold scattering fin helps cross-ventilation, accelerate cold scattering, and make refrigerating capacity even, avoid local phenomenon cold, localized heat to produce.
As depicted in figs. 1 and 2, inlet duct 4 is the cylinder cross flow fan, and this cylinder cross flow fan is arranged at the below of air admission hole 36.This cylinder cross flow fan uses aluminum alloy material, have in light weight, air quantity is big, noise is low, high strength, low vibrations, heatproof is good, the life-span is long advantage.By this cylinder cross flow fan, with the processing of freezing in the room air inspiration cold scattering cavity 301.
Embodiment 2
Two of the specific embodiment of a kind of semiconductor refrigerating air conditioning device of the present utility model, as shown in Figure 7, the main technical schemes of present embodiment is identical with embodiment 1, in the present embodiment unaccounted feature, adopt the explanation among the embodiment 1, no longer give unnecessary details at this.The difference of present embodiment and embodiment 1 is, heat abstractor 2 is for being provided with the heat abstractor 2 of water cooling plant, concrete, be provided with water cooling plant at heat-dissipating cavity 201, water cooling plant includes water pump and is communicated with the cooling medium circulation pipe that is provided with water pump, and heat abstractor 2 cools off radiating fin group 23 by water-cooling pattern.The circulation of air path of heat-dissipating cavity 201 is shown in the direction of arrow among Fig. 7, cooling medium flows into from the water inlet of second housing 20, by the cooling medium circulation pipe radiating fin group 23 of flowing through, make heat abstractor 2 when work, cooling medium can fully contact with radiating fin group 23, thereby the raising radiating efficiency, the delivery port from second housing 20 flows out at last.Water pump constantly makes cooling medium carry out flow circuit.Wherein, cooling medium can adopt the water with environmental protection characteristics.
Should be noted that at last; above embodiment is only in order to the explanation the technical solution of the utility model; but not to the restriction of the utility model protection domain; although the utility model has been done to explain with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement the technical solution of the utility model, and not break away from the essence and the scope of technical solutions of the utility model.

Claims (10)

1. semiconductor refrigerating air conditioning device, include at least one semiconductor refrigeration chip, described semiconductor refrigeration chip has hot junction and cold junction, it is characterized in that: be provided with first housing and second housing, described first housing has the cold scattering cavity, described second housing has heat-dissipating cavity, described first housing is connected setting with the adjacent wall of described second housing, the adjacent wall with described second housing of described first housing connects the equal corresponding through hole that matches with the Outside Dimensions of described semiconductor refrigeration chip that offers in position that is provided with, described semiconductor refrigeration chip is fixed in the described through hole, the cold junction of described semiconductor refrigeration chip is arranged at described cold scattering cavity, and the hot junction of described semiconductor refrigeration chip is arranged at described heat-dissipating cavity; Be provided with the cold scattering device in the described cold scattering cavity, described cold scattering device is provided with Cryo Heat Tube, cold scattering pedestal and cold scattering fins set, one side of described cold scattering pedestal and the cold junction of described semiconductor refrigeration chip closely touch, the opposite side of described cold scattering pedestal is connected with first pipeline section of described Cryo Heat Tube, and second pipeline section of described Cryo Heat Tube is connected with described cold scattering fins set; Be provided with heat abstractor in the described heat-dissipating cavity, described heat abstractor is provided with heat pipe, cooling base and radiating fin group, one side of described cooling base and the hot junction of described semiconductor refrigeration chip closely touch, the opposite side of described cooling base is connected with first pipeline section of described heat pipe, and second pipeline section of described heat pipe is connected with described radiating fin group; The top of described first housing is provided with air admission hole, and described air admission hole is communicated with described cold scattering cavity, is provided with inlet duct in the described cold scattering cavity, and described first lower part of frame is provided with the conduit of giving vent to anger.
2. semiconductor refrigerating air conditioning device according to claim 1 is characterized in that: described semiconductor refrigeration chip, described cold scattering device and described heat abstractor join and are the integral type modular construction.
3. semiconductor refrigerating air conditioning device according to claim 1 and 2 is characterized in that: described heat-dissipating cavity is provided with air cooling equipment, and described air cooling equipment is arranged at a side of the air outlet of contiguous described second housing of described radiating fin group.
4. semiconductor refrigerating air conditioning device according to claim 3 is characterized in that: described air cooling equipment and vertical setting of described radiating fin group, i.e. gap towards between the radiating fin of described radiating fin group.
5. semiconductor refrigerating air conditioning device according to claim 4 is characterized in that: described air cooling equipment is provided with aerofoil fan or footpath flow fan.
6. semiconductor refrigerating air conditioning device according to claim 1 and 2 is characterized in that: described heat-dissipating cavity is provided with water cooling plant, and described water cooling plant is provided with water pump and is communicated with the cooling medium circulation pipe of setting with described water pump.
7. semiconductor refrigerating air conditioning device according to claim 1 and 2, it is characterized in that: be provided with first briquetting and second briquetting, the opposite side of described cold scattering pedestal is provided with first groove, first pipeline section of described Cryo Heat Tube is embedded in described first groove, and compresses by the seamless unoccupied place of described first briquetting and to be fixed in described cold scattering pedestal; The opposite side of described cooling base is provided with second groove, and first pipeline section of described heat pipe is embedded in described second groove, and compresses by the seamless unoccupied place of described second briquetting and to be fixed in described cooling base.
8. semiconductor refrigerating air conditioning device according to claim 1 and 2 is characterized in that: the equal correspondence of each sheet radiating fin in the described radiating fin group is provided with louvre, and the equal correspondence of each sheet cold scattering fin in the described cold scattering fins set is provided with cold scattering hole.
9. semiconductor refrigerating air conditioning device according to claim 1 and 2 is characterized in that: described heat pipe is broken line type heat pipe or straight pipe type heat pipe or U type heat pipe, and the shape of cross section of described heat pipe is circle or rectangle; Described Cryo Heat Tube is broken line type Cryo Heat Tube or straight pipe type Cryo Heat Tube or U type Cryo Heat Tube, and the shape of cross section of described Cryo Heat Tube is circle or rectangle.
10. semiconductor refrigerating air conditioning device according to claim 1 and 2 is characterized in that: described inlet duct is the cylinder cross flow fan, and described cylinder cross flow fan is arranged at the below of described air admission hole.
CN2010205412804U 2010-09-26 2010-09-26 Semiconductor refrigerating air-conditioning device Expired - Lifetime CN201844486U (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101922778A (en) * 2010-09-26 2010-12-22 广东新创意专利发展有限公司 Semiconductor refrigerating air conditioning device
CN103557571A (en) * 2013-11-18 2014-02-05 北京德能恒信科技有限公司 Inner heat pipe heat-exchange type semiconductor refrigeration device
CN104833024A (en) * 2015-04-30 2015-08-12 苏州海特温控技术有限公司 Heat pipe semiconductor air conditioner and preparation method thereof
CN106949580A (en) * 2016-12-02 2017-07-14 王彦宸 Air-conditioning
CN106989538A (en) * 2016-12-16 2017-07-28 王彦宸 Air-conditioning
CN107062460A (en) * 2016-12-16 2017-08-18 王彦宸 Air-conditioning
CN111322787A (en) * 2020-03-11 2020-06-23 中车青岛四方车辆研究所有限公司 Refrigeration air-inlet grille

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101922778A (en) * 2010-09-26 2010-12-22 广东新创意专利发展有限公司 Semiconductor refrigerating air conditioning device
CN103557571A (en) * 2013-11-18 2014-02-05 北京德能恒信科技有限公司 Inner heat pipe heat-exchange type semiconductor refrigeration device
CN103557571B (en) * 2013-11-18 2017-02-01 北京丰联奥睿科技有限公司 Inner heat pipe heat-exchange type semiconductor refrigeration device
CN104833024A (en) * 2015-04-30 2015-08-12 苏州海特温控技术有限公司 Heat pipe semiconductor air conditioner and preparation method thereof
CN106949580A (en) * 2016-12-02 2017-07-14 王彦宸 Air-conditioning
CN106989538A (en) * 2016-12-16 2017-07-28 王彦宸 Air-conditioning
CN107062460A (en) * 2016-12-16 2017-08-18 王彦宸 Air-conditioning
CN111322787A (en) * 2020-03-11 2020-06-23 中车青岛四方车辆研究所有限公司 Refrigeration air-inlet grille
CN111322787B (en) * 2020-03-11 2022-03-11 中车青岛四方车辆研究所有限公司 Refrigeration air-inlet grille

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