CN204014396U - Composite heat dissipation device - Google Patents
Composite heat dissipation device Download PDFInfo
- Publication number
- CN204014396U CN204014396U CN201420465735.7U CN201420465735U CN204014396U CN 204014396 U CN204014396 U CN 204014396U CN 201420465735 U CN201420465735 U CN 201420465735U CN 204014396 U CN204014396 U CN 204014396U
- Authority
- CN
- China
- Prior art keywords
- heat
- sink unit
- heat dissipation
- dissipation device
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Abstract
The utility model provides a kind of composite heat dissipation device, be included at least one first heat-sink unit forming with the pipeline of capillary structure being carved with in flat board, be positioned at the below of the first heat-sink unit, the second heat-sink unit and the cover plate that is covered in composite heat dissipation device upper end and lower end and base plate that the second heat dissipation pipeline being formed by the arrangement of a plurality of microchannels forms, because the first heat-sink unit is pulsating heat pipe, the vibration phase transition process that it is lasting, the heat that a plurality of chips can be distributed is diffused on the first heat-sink unit rapidly, reach the effect of samming, the first heat-sink unit and the second heat-sink unit organically combine the second heat-sink unit that heat is passed to lower floor simultaneously, then by the refrigeration working medium of the second heat-sink unit, heat is taken away, two heat-sink units organically combine, the composite heat dissipation device that the present embodiment is provided, not only simple in structure but also improved the heat radiation uniformity of existing composite heat dissipation device.
Description
Technical field
The utility model belongs to dissipation from electronic devices field, is specifically related to a kind of composite heat dissipation device.
Background technology
Since starting development from integrated circuit, heat dissipation design becomes one of key technology of Structural Design of Electronic System.Along with the integrated level of electronic device and system equipment is more and more higher, integrated circuit, towards high density, high-power future development, reduces quantity increase, density of heat flow rate raising, the heat-dissipating space of chip.When being a plurality of electronic element radiating, cooling system cannot spread heat uniformly simultaneously, and corresponding heat also cannot promptly be diffused into monoblock microchannel cold plates or Oscillating Flat heat pipe, causes the heat radiation of a plurality of electronic components inhomogeneous.So single heat abstractor can not meet the radiating requirements of the integrated electronics that heat flow increases day by day, bad heat radiation will cause the reliability decrease of electronic equipment.Therefore, the composite radiating system that design soaking ability is strong, efficiency is higher, can adapt to a plurality of electronic components, is not only the key of electronic apparatus system design, and cooling system theoretical research and application to engineering practice is had to higher value.
Existing heat abstractor or complex structure, or the problem that mostly can not solve efficiently radiates heat and heat is evenly distributed to monoblock heat abstractor.If application number is 201010230852.1, utility model name is called: for the combined planar heat pipe radiator of cooling LED.This utility model comprise aluminium sheet, die casting heat pipe heat conduit fin cover plate, oscillating heat pipe, in enclose silk screen heat pipe, peripheral silk screen heat pipe and inner peripheral gravity assisted heat pipe.Although its heat transfer effect is greater than the heat transfer effect of single heat pipe, its structure is very complicated, and procedure is loaded down with trivial details, and economic use value is lower.
Application number is 201220439512.4, the utility model that name is called a kind of LED radiator comprises flat-plate heat pipe and fin, its fin is many lobes dentation buckle-type finned heatsink, between fin and flat-plate heat pipe, for fastening, dry type contacts, the inner heat producing of UV-LED is transported to fin fin by flat board, is discharged in air.The weak point of this utility model is between flat-plate heat pipe gapped, causes the plurality of LEDs chip cooling that is placed on it inhomogeneous.
Utility model content
The utility model carries out for addressing the above problem, and object is, by a kind of composite heat dissipation device is provided, further to improve heat radiation uniformity and the radiating efficiency of existing heat radiator of electronic element.
For addressing the above problem the utility model, adopted following technical scheme:
The utility model provides a kind of composite heat dissipation device, it is characterized in that, comprising: the first heat-sink unit, is included in the first heat dissipation pipeline that at least one pipeline with capillary structure of being carved with in flat board forms; And below the second heat-sink unit that is positioned at the first heat-sink unit, comprise by a plurality of microchannels arrange the second heat dissipation pipeline of forming, be positioned at the second heat dissipation pipeline one side for working medium enter the second heat dissipation pipeline enter matter mouth and be positioned at the second heat dissipation pipeline opposite side for working medium, leave the pledge mouth of the second heat dissipation pipeline, the first heat-sink unit absorbs the heat of electronic device, and heat is passed to the second heat-sink unit.
The composite heat dissipation device that the utility model provides can also have such feature: the first heat dissipation pipeline is pulsating heat pipe.
The composite heat dissipation device that the utility model provides can also have such feature, also comprises: the cover plate and the base plate that are covered in respectively composite heat dissipation device upper end and lower end.
The composite heat dissipation device that the utility model provides can also have such feature, also comprises: respectively and enter matter mouth and pledge mouth is connected, for working medium enter and flow out the second heat-sink unit enter matter unit and pledge unit.
The composite heat dissipation device that the utility model provides can also have such feature: the second heat-sink unit is connected with condenser, for the temperature of controlled medium.
The composite heat dissipation device that the utility model provides can also have such feature: between the first heat-sink unit and the second heat-sink unit, adopt diffusion to merge welding manner and connect.
The composite heat dissipation device that the utility model provides can also have such feature: the spread geometry of microchannel is any one in straight type, S type and waveform.
Utility model effect and effect
The composite heat dissipation device providing according to the utility model, be included at least one first heat-sink unit forming with the pipeline of capillary structure being carved with in flat board, be positioned at the below of the first heat-sink unit, the second heat-sink unit that the second heat dissipation pipeline being formed by the arrangement of a plurality of microchannels forms and the cover plate that is covered in composite heat dissipation device upper end and lower end and base plate form, because the first heat-sink unit is pulsating heat pipe, the vibration phase transition process that it is lasting, the heat that a plurality of chips can be distributed is diffused on the first heat-sink unit rapidly, reach the effect of samming, the first heat-sink unit and the second heat-sink unit organically combine simultaneously, heat is passed to the second heat-sink unit of lower floor, then by the refrigeration working medium of the second heat-sink unit, heat is taken away, the first heat-sink unit has fabulous temperature uniforming heat radiation effect, the second heat-sink unit has remarkable heat-transfer capability, two heat-sink units organically combine, and the composite heat dissipation device that the utility model is provided is not only simple in structure but also improved the heat radiation uniformity of existing composite heat dissipation device.
Accompanying drawing explanation
Fig. 1 is the surface structure schematic diagram of composite heat dissipation device in embodiment of the present utility model;
Fig. 2 is the blast structure chart of composite heat dissipation device in embodiment of the present utility model;
Fig. 3 is the structural representation of the first heat-sink unit in embodiment of the present utility model;
Fig. 4 is the structural representation of the second heat-sink unit in embodiment of the present utility model;
Fig. 5 is the structural representation of the second heat-sink unit in variation one of the present utility model; And
Fig. 6 is the structural representation of the second heat-sink unit in variation two of the present utility model.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described.
Fig. 1 is the surface structure schematic diagram of composite heat dissipation device in embodiment.
Fig. 2 is the blast structural representation of composite heat dissipation device in embodiment.
As depicted in figs. 1 and 2, what composite heat dissipation device 100 comprised cover plate 1, the first heat-sink unit 2, the second heat-sink unit 3, base plate 4 and was positioned at the second heat-sink unit 3 both sides enters matter unit 5 and pledge unit 6, cover plate 1 and base plate 4 are covered in respectively the upper end of the first heat-sink unit 2 and the lower end of the second heat-sink unit, enter being all connected with the condenser outside composite heat dissipation device of matter unit 5 and pledge unit 6, for controlling the temperature of the second heat-sink unit 3 refrigeration working mediums.
Fig. 3 is the structural representation of the first heat-sink unit in embodiment.
As shown in Figure 3, the first heat-sink unit 2 is comprised of the first heat dissipation pipeline 21, and the first heat dissipation pipeline 21 is the dull and stereotyped pulsating heat pipe of enclosed, and the pipeline 211 by least one with capillary structure forms.
Before use, in the joint of capillary structure pipeline, draw a pipeline as topping up pipe, the first heat dissipation pipeline 21 is vacuumized and topping up, and rear enclosed topping up pipe, make the first heat-sink unit 2 of use state.
Fig. 4 is the structural representation of the second heat-sink unit in embodiment.
As shown in Figure 4, the second heat-sink unit 3 comprises the second heat dissipation pipeline 31, be positioned at the second heat dissipation pipeline 31 both sides for refrigeration working medium, flow into and flow out heat dissipation pipeline 31 enter matter mouth 32 and pledge mouth 33, enter matter mouth 32 and pledge mouth 33 respectively with Fig. 1 in enter matter unit 5 and pledge unit 6 is connected, the second heat dissipation pipeline 31 is arranged and is formed by a plurality of microchannels 311, refrigeration working medium flows into into matter mouth 32 by entering matter unit 5, through entering matter mouth 32, enter in microchannel 311 mobile, through pledge mouth 33 and pledge unit 6, pass back in condenser afterwards, after condenser heat exchange, by entering matter unit 5, enter in the second heat dissipation pipeline 31 again.
While using set composite 100, cover plate 1, the first heat-sink unit 2, the second heat-sink unit 3 and base plate 4 are connected, the chip of a plurality of electronic equipments is placed on the first heat-sink unit, the first heat-sink unit 2 pulsating heat pipes ceaselessly oscillating phase become in flow process, the heat that multiple chips is given out is promptly diffused on the first heat-sink unit 2, and be delivered in the second heat-sink unit 3 of lower floor, and then the refrigeration working medium in the second heat-sink unit 3 is taken away heat.
During use, can increase according to actual conditions the quantity of the second heat-sink unit 2, to reach the object of timely heat radiation, meanwhile, the first heat dissipation pipeline 21 in the utility model can also be open type pulsating heat pipe.
Cover plate 1 in the utility model, the first heat-sink unit 2, the second heat-sink unit 3 and base plate 4 adopt the mode that welding is merged in diffusion to connect, diffusion merge welding be rely on storeroom surface to produce atom diffusion and mutually combine into the similar integral body of the fine structure of material own, this kind of interconnection technique makes cooling system there is no contact heat resistance, good pressure-resistant performance, sound construction is reliable, not only normal pressure refrigeration working medium can be used, the refrigeration working medium that carbon dioxide equal pressure is higher can also be used.
Embodiment effect and effect
The composite heat dissipation device providing according to the present embodiment, be included at least one first heat-sink unit forming with the pipeline of capillary structure being carved with in flat board, be positioned at the below of the first heat-sink unit, the second heat-sink unit and the cover plate that is covered in composite heat dissipation device upper end and lower end and base plate that the second heat dissipation pipeline being formed by the arrangement of a plurality of microchannels forms, because the first heat-sink unit is pulsating heat pipe, the vibration phase transition process that it is lasting, the heat that a plurality of chips can be distributed is diffused on the first heat-sink unit rapidly, reach the effect of samming, the first heat-sink unit and the second heat-sink unit organically combine the second heat-sink unit that heat is passed to lower floor simultaneously, then by the refrigeration working medium of the second heat-sink unit, heat is taken away, the first heat-sink unit has fabulous temperature uniforming heat radiation effect, the second heat-sink unit has remarkable heat-transfer capability, two heat-sink units organically combine, and the composite heat dissipation device that the present embodiment is provided is not only simple in structure but also improved the heat radiation uniformity of existing composite heat dissipation device.
Variation one
In this variation one, and in embodiment mono-, identical structure adopts identical symbol, and omits identical explanation.
Fig. 5 is the structural representation of the second heat-sink unit in variation one.
As shown in Figure 5, in the second heat-sink unit 7, the spread pattern of microchannel 711 is undaform.
Variation two
In this variation two, and in embodiment mono-, identical structure adopts identical symbol, and omits identical explanation.
Fig. 6 is the structural representation of the second heat-sink unit in variation two.
As shown in Figure 6, in the second heat-sink unit 8, the spread pattern of microchannel 811 is S-type.
The effect of variation one and variation two and effect
In variation one and variation two, the spread pattern of microchannel is undaform and S type, has increased the length of flow of refrigeration working medium in microchannel, is conducive to the increase of heat exchange efficiency.
The utility model is not limited to the scope of embodiment; to those skilled in the art; as long as various variations described claim limit and the spirit and scope of the present utility model determined in; these variations are apparent, and all utilize the utility model of the utility model design to create all the row in protection.
Claims (7)
1. a composite heat dissipation device, for dissipation from electronic devices, is characterized in that, comprising:
The first heat-sink unit, is included in the first heat dissipation pipeline that at least one pipeline with capillary structure of being carved with in flat board forms; And
At least one second heat-sink unit, is positioned at the below of described the first heat-sink unit, comprises by a plurality of microchannels and arranges the second heat dissipation pipeline forming;
Be positioned at described the second heat dissipation pipeline one side for working medium, enter described the second heat dissipation pipeline enter matter mouth;
What be positioned at described the second heat dissipation pipeline opposite side leaves the pledge mouth of described the second heat dissipation pipeline for working medium,
Described the first heat-sink unit absorbs the heat of electronic device, and heat is passed to described the second heat-sink unit.
2. composite heat dissipation device according to claim 1, is characterized in that:
Wherein, described the first heat dissipation pipeline is pulsating heat pipe.
3. composite heat dissipation device according to claim 1, is characterized in that, also comprises:
Be covered in respectively cover plate and the base plate of described composite heat dissipation device upper end and lower end.
4. composite heat dissipation device according to claim 1, is characterized in that, also comprises:
Respectively and described in enter matter mouth and described pledge mouth is connected, for described working medium enter and flow out described the second heat-sink unit enter matter unit and pledge unit.
5. composite heat dissipation device according to claim 1, is characterized in that:
Wherein, described the second heat-sink unit is connected with condenser, for controlling the temperature of described working medium.
6. composite heat dissipation device according to claim 1, is characterized in that:
Wherein, between described the first heat-sink unit and described the second heat-sink unit, adopting diffusion to merge welding manner connects.
7. composite heat dissipation device according to claim 1, is characterized in that:
Wherein, the spread geometry of described microchannel is any one in straight type, S type and waveform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420465735.7U CN204014396U (en) | 2014-08-18 | 2014-08-18 | Composite heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420465735.7U CN204014396U (en) | 2014-08-18 | 2014-08-18 | Composite heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204014396U true CN204014396U (en) | 2014-12-10 |
Family
ID=52054328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420465735.7U Expired - Fee Related CN204014396U (en) | 2014-08-18 | 2014-08-18 | Composite heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204014396U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104159437A (en) * | 2014-08-18 | 2014-11-19 | 上海理工大学 | Composite heat radiating device |
| US11016546B2 (en) | 2016-12-29 | 2021-05-25 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus and terminal device having same |
-
2014
- 2014-08-18 CN CN201420465735.7U patent/CN204014396U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104159437A (en) * | 2014-08-18 | 2014-11-19 | 上海理工大学 | Composite heat radiating device |
| US11016546B2 (en) | 2016-12-29 | 2021-05-25 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus and terminal device having same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104159437A (en) | Composite heat radiating device | |
| TW201223382A (en) | A cabinet of server | |
| CN203964739U (en) | Thermal siphon loop heat abstractor | |
| CN108153401A (en) | A kind of computer server radiator | |
| CN204014396U (en) | Composite heat dissipation device | |
| CN204014395U (en) | Heat radiation module | |
| CN203423164U (en) | Temperature equalization superconductive heat radiator | |
| CN203520294U (en) | Efficient computer radiator | |
| CN103292285B (en) | Radiator | |
| CN109152310A (en) | A kind of more circular arc microchannel heat sinks | |
| CN205665634U (en) | Liquid cooling's rack -mounted server | |
| CN204305546U (en) | A kind of high-power heater members group cooling device | |
| CN209497788U (en) | A kind of more circular arc microchannel heat sinks | |
| CN202443406U (en) | Computer heat radiating plate | |
| CN210168376U (en) | Data center water-cooling heat dissipation rack | |
| CN105050371A (en) | High-heat-flux electronic equipment hot spot removing device | |
| CN203521890U (en) | Double-circulation-waterway semiconductor laser refrigerating system | |
| CN203416554U (en) | Light-emitting diode screen water-cooling heat dissipation device | |
| CN105676976A (en) | High-performance radiator | |
| CN204272578U (en) | A kind of novel immersion heat abstractor | |
| CN203814114U (en) | Heat dissipator for large-capacity reactive compensation device | |
| CN203773456U (en) | Mainboard radiator for sealed computer case | |
| CN204119706U (en) | Radiating module | |
| CN203720769U (en) | Heat source separated cooling fin for computer | |
| CN220340668U (en) | Dual-cycle liquid cooling device and dual-cycle liquid cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 200093 Shanghai military road, Yangpu District, No. 516 Patentee after: University of Shanghai for Science and Technology Patentee after: SHANGHAI SUNGLOW PACKAGING TECHNOLOGY CO., LTD. Address before: 200093 Shanghai military road, Yangpu District, No. 516 Patentee before: University of Shanghai for Science and Technology Patentee before: Shanghai Sunglow Printing Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20190818 |