CN105676976A - High-performance radiator - Google Patents
High-performance radiator Download PDFInfo
- Publication number
- CN105676976A CN105676976A CN201410667004.5A CN201410667004A CN105676976A CN 105676976 A CN105676976 A CN 105676976A CN 201410667004 A CN201410667004 A CN 201410667004A CN 105676976 A CN105676976 A CN 105676976A
- Authority
- CN
- China
- Prior art keywords
- heat
- pedestal
- radiator
- aluminium
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 24
- 230000005855 radiation Effects 0.000 claims abstract description 20
- 239000004411 aluminium Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012913 prioritisation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Provided is a high-performance radiator. The bottom of an aluminum pedestal is provided with a copper base. Multiple parallel radiating aluminum sheets integrated with the aluminum pedestal are arranged above the aluminum pedestal. A heat-conducting copper strip is arranged above the aluminum pedestal and vertical with the radiating aluminum sheets. The radiation base made by copper material is capable of rapidly absorbing heat of a CPU. The heat-conducting copper strip is utilized for transferring heat to each piece of radiating aluminum sheet so that the pace of overall radiation performance of the radiator is quickened.
Description
Technical field
The present invention relates to a kind of cpu heat, particularly adopt the scatterer of Cu and Al combination heat radiation.
Background technology
Machine element uses unicircuit in a large number. It is well known that high temperature is the formidable enemy of unicircuit; High temperature not only can cause system cloud gray model unstable, it may also be useful to the life-span shortens, it could even be possible to make some parts burn; The heat of high temperature is caused not to be from outside computer, but computer-internal, or perhaps IC interior; The effect of scatterer is exactly by these heat absorption, then diffuses in cabinet or outside cabinet, ensures that the temperature of machine element is normal. Most scatterer passes through and heat generating components surface contact, absorbs heat, then is delivered at a distance by heat by various method, and in the air in such as cabinet, then these warm airs are passed to outside cabinet by cabinet, complete the heat radiation of computer. The kind of scatterer is very many, CPU, video card, board chip set, hard disk, cabinet, power supply even CD-ROM drive and internal memory all can need scatterer, these different scatterers can not be used with, and wherein what the most often contact is exactly the scatterer of CPU. According to the mode taking away heat from scatterer, it is possible to scatterer to be divided into active heat removal and passive heat radiation. The former is air-cooled radiator commonly, and the latter common be exactly radiator element. Further finely divided hot mode, it is possible to be divided into air-cooled, heat pipe, liquid cooling, semi-conductor freezes, compressor cooling etc.
When computer CPU dispels the heat, CPU radiating fin directly contacts with CPU surface, and the heat on CPU surface passes to CPU radiating fin by thermal conduction; Heat radiation fan is produced air-flow and is taken away by the heat of thermal convection by CPU radiating fin surface; And in cabinet, the flowing of air is also taken away by the heat of thermal convection by CPU radiating fin ambient air, until outside cabinet; The part that all temperature are high simultaneously can be low to surrounding temperature part generation thermal radiation.
Existing cpu heat is generally aluminium or aluminium alloy is made, aluminum has extraordinary heat conductivility, but compared with copper product, copper has better heat conductivility, the thermal conductivity of copper is close to the twice of aluminium thermal conductivity, but when copper exposes in atmosphere, copper product is easily oxidized, thus reduce the thermal conductivity of copper; And for the higher occasion of cooling requirements, the scatterer of aluminum often can not meet cooling requirements.
Summary of the invention
In order to improve the heat dispersion of existing cpu heat, the present invention provides a kind of radiator with high performance, and it adopts the technique of Cu and Al combination, it is to increase the heat dispersion of scatterer.
The technical scheme of the present invention is: the bottom of the aluminium matter pedestal of radiator with high performance arranges one piece of copper pedestal, it is provided with above aluminium matter pedestal and many parallel heat radiation aluminium sheets of aluminium matter pedestal one, a heat conduction copper bar it is provided with, and this heat conduction copper bar is vertical with heat radiation aluminium sheet above aluminium matter pedestal.
A kind of prioritization scheme of this scheme for arranging fan above heat radiation aluminium sheet.
Owing to copper has heat conductivility more better than aluminium, copper pedestal the heat of fast absorption CPU can pass to aluminium matter pedestal, aluminium matter pedestal is extremely extraneous by the heat radiation aluminium sheet heat conduction above it, owing to heat conduction copper bar is through every sheet heat radiation aluminium sheet, heat conduction copper bar improves the transmission speed of heat to heat radiation aluminium sheet, accelerates the integral heat sink performance of scatterer.
The invention has the beneficial effects as follows, do heat dissipation base with copper product and absorb heat fast CPU heat, transmit, with heat conduction copper bar, the integral heat sink performance that heat accelerates scatterer to every sheet heat radiation aluminium sheet.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
1. aluminium matter pedestal in figure, 2. copper pedestal, 3. dispel the heat aluminium sheet, 4. heat conduction copper bar, 5. fan.
Embodiment
In FIG, the bottom of the aluminium matter pedestal 1 of radiator with high performance arranges one piece of copper pedestal 2, it is provided with above aluminium matter pedestal 1 and many parallel heat radiation aluminium sheets 3 of aluminium matter pedestal 1 one, above aluminium matter pedestal 1, it is provided with a heat conduction copper bar 4, and this heat conduction copper bar 4 is vertical with heat radiation aluminium sheet 3; Above heat radiation aluminium sheet 3, fan 5 is set.
Claims (2)
1. a radiator with high performance, it is characterized in that: the bottom of its aluminium matter pedestal arranges one piece of copper pedestal, it is provided with above aluminium matter pedestal and many parallel heat radiation aluminium sheets of aluminium matter pedestal one, above aluminium matter pedestal, it is provided with a heat conduction copper bar, and this heat conduction copper bar is vertical with heat radiation aluminium sheet.
2. radiator with high performance according to claim 1, it is characterised in that: the top of described heat radiation aluminium sheet is provided with fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410667004.5A CN105676976A (en) | 2014-11-20 | 2014-11-20 | High-performance radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410667004.5A CN105676976A (en) | 2014-11-20 | 2014-11-20 | High-performance radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105676976A true CN105676976A (en) | 2016-06-15 |
Family
ID=56957998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410667004.5A Pending CN105676976A (en) | 2014-11-20 | 2014-11-20 | High-performance radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105676976A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114235711A (en) * | 2022-02-24 | 2022-03-25 | 朗思传感科技(深圳)有限公司 | Miniaturized portable high-sensitivity gas measurement system |
| CN114527856A (en) * | 2022-03-09 | 2022-05-24 | 大连大学 | Heat radiation structure |
-
2014
- 2014-11-20 CN CN201410667004.5A patent/CN105676976A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114235711A (en) * | 2022-02-24 | 2022-03-25 | 朗思传感科技(深圳)有限公司 | Miniaturized portable high-sensitivity gas measurement system |
| CN114527856A (en) * | 2022-03-09 | 2022-05-24 | 大连大学 | Heat radiation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160615 |
|
| WD01 | Invention patent application deemed withdrawn after publication |