CN203520294U - A high-efficiency computer cooling device - Google Patents
A high-efficiency computer cooling device Download PDFInfo
- Publication number
- CN203520294U CN203520294U CN201320694848.XU CN201320694848U CN203520294U CN 203520294 U CN203520294 U CN 203520294U CN 201320694848 U CN201320694848 U CN 201320694848U CN 203520294 U CN203520294 U CN 203520294U
- Authority
- CN
- China
- Prior art keywords
- computer
- cooling
- water
- tank
- computer body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
技术领域 technical field
本实用新型涉及计算机装置技术领域,具体涉及一种高效的计算机散热装置。 The utility model relates to the technical field of computer devices, in particular to an efficient computer cooling device.
背景技术 Background technique
CPU散热其实就是一个热传递的过程,目的是将CPU产生的热量带到其它介质上,将CPU温度控制在一个稳定范围之内。根据我们生活的环境,CPU的热量最终是要发散到空气当中。而在这之间的热传递过程,就是散热器所要扮演的角色了。 CPU heat dissipation is actually a process of heat transfer, the purpose is to transfer the heat generated by the CPU to other media, and control the CPU temperature within a stable range. According to the environment we live in, the heat of the CPU will eventually be dissipated into the air. And the heat transfer process between them is the role of the radiator.
所有的散热器都以热传导、热对流为主要方式进行散热,还没有听说能以热辐射为主要方式对芯片进行降温的产品。根据热传导、热对流手段的不同,可以将散热器产品分为主动与被动两种方式。主动的含义是,有与发热体无关的能源参与进行强制散热,比如风扇、液冷中的水泵,相变制冷中的压缩机,这些散热手段的普遍特点是效率高,但同时也需要其它能源的辅助。与之相反,被动的意思就好理解了,就是仅依靠发热体或散热片的自行发散来进行降温。 All heat sinks use heat conduction and heat convection as the main way to dissipate heat, and there is no product that can cool the chip by heat radiation as the main way. According to the different means of heat conduction and heat convection, radiator products can be divided into two types: active and passive. Active means that there are energy sources that have nothing to do with the heating body to participate in forced heat dissipation, such as fans, water pumps in liquid cooling, and compressors in phase-change refrigeration. The general characteristics of these heat dissipation methods are high efficiency, but they also require other energy sources auxiliary. On the contrary, the meaning of passive is easy to understand, that is, to cool down only by the self-radiation of the heating element or heat sink.
现在的电脑散热一般采用风扇和散热片,但是现有的电脑散热都是减低配件的温度,机箱内部温度还是很高,导致散热效果较差。 Today's computer cooling generally uses fans and heat sinks, but the existing computer cooling is to reduce the temperature of accessories, and the internal temperature of the chassis is still very high, resulting in poor cooling effect.
发明内容 Contents of the invention
本实用新型的目的是提供一种高效的计算机散热装置,它结构简单,通过散热片将计算机配件的温度传导到机箱外部,然后再通过水对散热片进行了冷却,这样降低计算机内部的整体温度,散热效果显著。 The purpose of this utility model is to provide a high-efficiency computer cooling device, which has a simple structure. The temperature of the computer accessories is transmitted to the outside of the chassis through the cooling fins, and then the cooling fins are cooled by water, thus reducing the overall temperature inside the computer. , the heat dissipation effect is remarkable.
为了解决背景技术所存在的问题,本实用新型是采用以下技术方案:它包含计算机本体1、计算机主板2、驱动电源3、散热风扇4、水冷箱槽5、铜管散热片6、冷却水箱7、输水管8,所述的计算机本体1的内部设置有计算机主板2,计算机本体1的底部设置有驱动电源3,计算机本体1的顶端设置有散热风扇4,计算机本体1的右侧设置有水冷箱槽5,水冷箱槽5的内部设置有数个铜管散热片6,铜管散热片6分别与计算机主板2、驱动电源3连接,水冷箱槽5的右侧设置有冷却水箱7,冷却水箱7通过输水管8与水冷箱槽5上端连接。
In order to solve the existing problems of the background technology, the utility model adopts the following technical solutions: it includes a
本实用新型具有以下有益效果:它结构简单,通过散热片将计算机配件的温度传导到机箱外部,然后再通过水对散热片进行了冷却,这样降低计算机内部的整体温度,散热效果显著。 The utility model has the following beneficial effects: the structure is simple, the temperature of the computer accessories is transmitted to the outside of the chassis through the heat sink, and then the heat sink is cooled by water, so that the overall temperature inside the computer is reduced, and the heat dissipation effect is remarkable.
附图说明: Description of drawings:
图1是本实用新型结构示意图。 Fig. 1 is the structural representation of the utility model.
具体实施方式: Detailed ways:
参看图1,本具体实施方式采用以下技术方案:它包含计算机本体1、计算机主板2、驱动电源3、散热风扇4、水冷箱槽5、铜管散热片6、冷却水箱7、输水管8,所述的计算机本体1的内部设置有计算机主板2,计算机本体1的底部设置有驱动电源3,计算机本体1的顶端设置有散热风扇4,计算机本体1的右侧设置有水冷箱槽5,水冷箱槽5的内部设置有数个铜管散热片6,铜管散热片6分别与计算机主板2、驱动电源3连接,水冷箱槽5的右侧设置有冷却水箱7,冷却水箱7通过输水管8与水冷箱槽5上端连接。
Referring to Fig. 1, the present embodiment adopts the following technical solutions: it comprises a
本具体实施方式具有以下有益效果:它结构简单,通过散热片将计算机配件的温度传导到机箱外部,然后再通过水对散热片进行了冷却,这样降低计算机内部的整体温度,散热效果显著。 This specific embodiment has the following beneficial effects: it has a simple structure, and the temperature of the computer accessories is transmitted to the outside of the chassis through the heat sink, and then the heat sink is cooled by water, so that the overall temperature inside the computer is reduced, and the heat dissipation effect is remarkable.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320694848.XU CN203520294U (en) | 2013-11-06 | 2013-11-06 | A high-efficiency computer cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320694848.XU CN203520294U (en) | 2013-11-06 | 2013-11-06 | A high-efficiency computer cooling device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203520294U true CN203520294U (en) | 2014-04-02 |
Family
ID=50379197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201320694848.XU Expired - Fee Related CN203520294U (en) | 2013-11-06 | 2013-11-06 | A high-efficiency computer cooling device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203520294U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017070875A1 (en) * | 2015-10-29 | 2017-05-04 | 北京市鑫全盛商贸有限公司 | Computer liquid cooling system and liquid cooling apparatus container |
CN107092321A (en) * | 2017-06-02 | 2017-08-25 | 山东建筑大学 | A kind of phase-change heat cabinet of computer |
CN107562146A (en) * | 2017-07-28 | 2018-01-09 | 安徽工程大学 | It is a kind of have can buffer action computer augmented cooling device |
-
2013
- 2013-11-06 CN CN201320694848.XU patent/CN203520294U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017070875A1 (en) * | 2015-10-29 | 2017-05-04 | 北京市鑫全盛商贸有限公司 | Computer liquid cooling system and liquid cooling apparatus container |
US10386896B2 (en) | 2015-10-29 | 2019-08-20 | Beijing Deepcool Industries Co., Ltd. | Water cooling system for a computer and water cooling case having the same |
CN107092321A (en) * | 2017-06-02 | 2017-08-25 | 山东建筑大学 | A kind of phase-change heat cabinet of computer |
CN107562146A (en) * | 2017-07-28 | 2018-01-09 | 安徽工程大学 | It is a kind of have can buffer action computer augmented cooling device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN205581772U (en) | Computer liquid cooling ware | |
CN202887087U (en) | Semiconductor central processing unit (CPU) radiator having heat insulation protection | |
CN204360312U (en) | A kind of CPU heat abstractor with Graphene heat dissipating layer | |
CN203520294U (en) | A high-efficiency computer cooling device | |
CN203376678U (en) | A built-in water cooling heat sink for a notebook computer | |
CN207488929U (en) | A contact type cold energy radiator | |
CN106817884A (en) | A kind of electronic-device radiator | |
CN203673428U (en) | Notebook computer heat dissipation base | |
CN210605614U (en) | Heat abstractor for computer machine case | |
CN204705976U (en) | A kind of heat abstractor | |
CN206249216U (en) | An electronic radiator | |
CN205656568U (en) | Ultrafast computer with high -efficient chip water -cooling heat -radiating devices | |
CN107426950A (en) | A kind of electronic device natural heat dissipation device | |
CN206363244U (en) | A kind of many heat-generating system water cooling plants | |
CN204390151U (en) | A kind of air-cooled heat-pipe radiator | |
CN204390153U (en) | A kind of liquid cooling system and liquid nitrogen of utilizing carries out the computer radiator dispelled the heat | |
CN205665634U (en) | Liquid cooling's rack -mounted server | |
CN105676976A (en) | High-performance radiator | |
CN203773456U (en) | Mainboard radiator for sealed computer case | |
CN202443406U (en) | Computer heat radiating plate | |
CN203521890U (en) | A dual-circulation water circuit semiconductor laser refrigeration system | |
CN204288103U (en) | For the external air-cooled radiator of notebook computer | |
CN209231847U (en) | Circular arrangement type heat pipe type CPU water cooling structure | |
CN202267909U (en) | Computer radiating system improved through thermoelectric cooler | |
CN206058092U (en) | A kind of composite efficient cpu heat |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20141106 |
|
EXPY | Termination of patent right or utility model |