CN206906973U - A kind of semiconductor refrigerating heat dissipation pad for notebook computer - Google Patents
A kind of semiconductor refrigerating heat dissipation pad for notebook computer Download PDFInfo
- Publication number
- CN206906973U CN206906973U CN201720457742.6U CN201720457742U CN206906973U CN 206906973 U CN206906973 U CN 206906973U CN 201720457742 U CN201720457742 U CN 201720457742U CN 206906973 U CN206906973 U CN 206906973U
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- Prior art keywords
- radiator
- cold
- notebook computer
- chamber
- main fan
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Abstract
The utility model discloses a kind of semiconductor refrigerating heat dissipation pad for notebook computer, including shell, radiator and main fan with cold end and hot junction；The open top of shell, inside are separated into two chambers by dividing plate；Respectively cold chamber and main fan chamber；The cold chamber air inlet of cold chamber and main fan chamber is communicated with dividing plate；Main fan is installed in main fan chamber；The side wall of cold chamber is provided with a radiator installing port, and the radiator in cold end and hot junction is provided with radiator installing port；The cold end face radiator installing port of radiator with cold end and hot junction.The utility model overcomes the drawbacks of normal temperature air cooling effect is bad, while also solves the problems, such as if using water cooling to need the teardown of engine and causing guarantee from carrying out；The utility model is applied to most notebook computer moulds on the market, while enables cold to supply the position for needing most cooling so that efficiency is improved.
Description
Technical field
The utility model belongs to laptop heat-dissipation technical field, more particularly to a kind of heat dissipation pad for notebook computer.
Background technology
A few days ago, laptop heat-dissipation has turned into the major influence factors in terms of most of notebook computer performance restriction, however,
Heat dissipation problem can not solve upstream manufacturer at, and notebook manufacturer does not have pair because of cost performance problem and capacity issue
Notebook computer does excessive heat transfer and strengthened.
The generation of notebook heat：The generation of notebook heat and desktop computer heat is slightly different, the heat master of desktop computer
It is cpu, video card and internal memory to want source.And heat dissipation capacity is larger.Notebook computer heat production source is CPU, and general computer for students is more
For integrated graphics card or low and middle-end display card, power is relatively low, therefore main heating source is CPU, also just because of this reason, notebook
Flat copper pipe heat conduction is relied primarily on inside computer, without other radiating modes.Heat transfer and convection heat transfer' heat-transfer by convection thus are relied primarily on, allows sky
Gas takes away heat caused by cpu.
Radiating, is exactly a heat transfer process in fact --- the several ways such as conduction, convection current, radiation.Generally desk-top
It is mainly air-cooled technology in machine, this includes radiator fan of CPU, video card, power supply and cabinet etc., air-cooled in notebook computer
Main radiating mode still, absolutely radiating modes several greatly are：The combination of fan+heat pipe+heat sink.Many notes on the market
This computer uses the shell of almag, and certain effect is also played to radiating.It is equally known that in laptop bottom
It is general to have heat dissipation ventilation mouth, or suck or blow out, the radiating to notebook computer is all extremely important.Notebook computer is designing
When also allow for heat dissipation problem, often fuselage is raised with feet, but when temperature is too high, just seems and compare
Reluctantly.
Notebook computer because volume is smaller, concentrate by heater element, and heat dissipation design has sizable difficulty, normal use
When common CP U surface temperature more than 50 degrees Celsius, and it is internal be more up to 80 degree of even upper Baidu, it is but common
Fan-cooled radiator, often do not reach cooling requirements, thus need to be directed to such a situation Design assistant radiator.
The radiating principle of common cooling pad of notebook computer mainly has two kinds on the market at present：
1) heat sinking function is realized by heat conduction principle physically merely.By heat dissipation base made of plastics or metal
The bottom of notebook is placed on, notebook is raised to promote air circulation and radiating to radiate, radiating effect can be reached.
2) several radiator fans are installed again on heat dissipation base to improve heat dispersion.This wind-cooling heat dissipating mode bag
Include two kinds of air draught and blowing.The difference of two kinds of wind pushing forms is the difference of airflow pattern, is turbulent flow caused by blowing, belongs to
Active heat removal, blast is big but easily by drag losses, such as the electric fan in our daily summers；It is layer caused by air draught
Stream, belongs to passive radiating, and blast is small but steady air current, such as case fan.In theory, in open environment, turbulent heat exchange
Efficiency is bigger than laminar flow, but notebook bottom and heat dissipation base is actual constitutes a closing space, so general air draught radiating
Mode more meets distinguished and admirable design specification.The heat dissipation base majority of in the market has built-in induced draught fan.
Prior art defect：Common cooling pad of notebook computer is simple in construction, usually by metal or plastic casing
Formed plus 2~4 built-in fans.
Problems with generally be present in common cooling pad of notebook computer：
1) position of fan and computer heat radiation mouth position are not met.The position of fan of cooling pad of notebook computer on the market is all
It is fixed, this causes consumer to need first to determine oneself laptop radiating mouth when choosing cooling pad of notebook computer
Position, suitable cooling pad is chosen accordingly；If it have purchased position of fan and the cooling pad that thermovent position does not conform to, radiating effect
It will have a greatly reduced quality.
2) fan effective wind deficiency.Fan mainly has blowing and two kinds of wind pushing forms of air draught on current market.For blowing
For wind formula fan, notebook bottom and heat dissipation base is actual constitutes a closing space, effective air-supply of bleed type fan
Ability does not have conceptive so high；And for induced draught fan, the space between notebook bottom and heat dissipation base can not neglect
Depending on so that fan is less than theoretical air output to the actual air output inside notebook computer., can if increasing fan power
To ensure air output, but easily make noise excessive.
3) energy utilization rate is low, the actual increased heat exchange amount of electric energy contrast of consumption, and efficiency is relatively low.
4) water-cooling heat radiating system installation then has to dismount notebook computer, can not be operated for domestic consumer, simultaneously meeting
Bring the problem of can not guaranteeing to keep in good repair.
Semiconductor chilling plate principle：
A kind of cooling device that cooler is made up of semiconductor, with modern age semiconductor development just have it is actual
Using, that is, the invention of refrigerator.Its operation principle is as the energy needed for dc source provides electron stream, is electrified
Afterwards, electronics negative pole (-) is set out, and first passes around P-type semiconductor, in this caloric receptivity, has arrived N-type semiconductor, and heat is released,
Often pass through a np module, just have heat outer while causing the temperature difference and forming hot and cold side by being sent to order.Hot and cold side is distinguished
It is made up of two panels potsherd, cold end will connect thermal source, that is, be intended to cool down it.
Existing related semiconductor refrigeration radiating patent and its defect：
1. the U of Authorization Notice No. CN 201716651, mentioned in authorized announcement date 2011.01.19 utility model patent
Semiconductor refrigerating heat-dissipation base for notebook computer, it, which is substantially made a summary, is：Semiconductor refrigerating heat-dissipation base for notebook computer, including
Criss-cross metal decking, the bottom of perforate and notebook computer in the shape and metal decking of metal decking are adapted, gold
Category lower panels both sides are fixed with 2 support plates, in metal decking lower middle part, are pasted with one or more semiconductor chilling plates,
The chill surface of semiconductor chilling plate is close to metal decking.There is a square frame on the periphery of each semiconductor chilling plate, square frame is fixed
Below metal decking, below semiconductor chilling plate, i.e., on radiating surface, stickup is fixed with heat radiating metal module, radiating gold
Category module is fixed with fan below by screw.Notebook computer is placed on metal decking, the refrigeration of semiconductor chilling plate
Face will reduce the temperature for the metal decking being in close contact with notebook computer, so as to reduce the temperature of notebook computer.This reality
There is strong refrigeration and radiating effect with new.It disclosure satisfy that the cooling requirements of high-performance notebook.
Its technological deficiency is that notebook computer uses abs engineering plastics in itself, and its maximum feature is heat conductivility
Bad, the patent cools the metallic plate contacted in notebook computer, but the notebook computer casing that abs engineering plastics make
Cold can not be passed to the chip for needing to radiate very well.
2. the U of Authorization Notice No. CN 205665646, one is referred in authorized announcement date 2016.10.26 utility model patent
The notebook computer of kind good heat dissipation, is related to computer realm, including computer bottom plate, screen, and the computer base plate interior includes electricity
Source slot, power supply, CPU, integrated circuit, in addition to micro semiconductor cooling piece, temperature controller, CPU conductive structures, it is described miniature
Semiconductor chilling plate is fixed in power slot, and the chill surface of micro semiconductor cooling piece contacts with computer power, micro semiconductor
The heating face of cooling piece connects with the bottom shell of computer bottom plate；Two to be connected with power supply, CPU are connected with the temperature controller
Individual temperature sensor, when temperature is too high temperature controller by polygon control survey micro semiconductor cooling piece, fan work, can and
When cool down power supply, avoid power supply from being burned, improve power supply service life.
Its technological deficiency is that versatility is poor, while needs user to dismount computer.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor refrigerating heat dissipation pad for notebook computer, asked with solving above-mentioned technology
Topic.
To achieve these goals, the utility model adopts the following technical scheme that：
A kind of semiconductor refrigerating heat dissipation pad for notebook computer, including shell, radiator and main fan with cold end and hot junction；Shell
Open top, inside by dividing plate is separated into two chambers；Respectively cold chamber and main fan chamber；Cold chamber is communicated with dividing plate
With the cold chamber air inlet of main fan chamber；Main fan is installed in main fan chamber；The side wall of cold chamber is provided with a radiator
Installing port, the radiator in cold end and hot junction is provided with radiator installing port；The cold end of radiator with cold end and hot junction is just
To radiator installing port.
Further, cold chamber is provided with panel installation neck, and panel installs neck by panel and is installed on cold chamber top；Face
There are some openings on plate, opening is provided with dismountable plug.
Further, main fan chamber is provided with wire side installation neck, and wire side installs neck by wire side and is arranged on main wind
Fan chamber top.
Further, the hot junction of the radiator with cold end and hot junction deviates from radiator installing port；Hot junction carries radiator fan.
Further, it is also equipped with refrigeration circuit plate in main fan chamber, refrigeration circuit plate connect band cold end and hot junction
Radiator.
Further, refrigeration circuit plate is connected with external power supply by ship type switch.
Further, main fan is connected with USB plug.
Further, notebook is positioned over the upper surface of shell, the inlet scoop of the region face notebook bottom of panel.
Relative to prior art, the utility model has the advantages that：
1) radiator with hot junction and with cold end fan, built-in cooling piece are used so that the fan of cold end is by cold intracavitary
Air be cooled to room temperature once so that its refrigeration is better than normal temperature air cooling effect on the market.
2) the utility model designs a panel and its subsidiary plug, by the installation of plug with removing cold wind
The position of outlet can be adjusted so that it can be common to different notebook moulds, while be that cold is supplied to and needed most
Position causes efficiency to be improved.
3) refrigerating part is incorporated on heat dissipation pad for notebook computer by the utility model, while more preferable cooling effect, is used
It is convenient to dismount computer so that user easy can use while ensure that will not be so that notebook computer can not be guaranteed to keep in good repair.
The utility model overcomes the drawbacks of normal temperature air cooling effect is bad, if while also solved using water cooling need
Want the teardown of engine and cause the problem of guarantee is from carrying out, while the utility model devises panel and plug causes its versatility
Greatly improve, suitable for most notebook computer moulds on the market, while cold is supplied and needs most cooling
Position causes efficiency to be improved.
Brief description of the drawings
Fig. 1 is a kind of explosive view of semiconductor refrigerating heat dissipation pad for notebook computer of the utility model；
Fig. 2 is a kind of assembling figure of semiconductor refrigerating heat dissipation pad for notebook computer of the utility model；
Wherein：1st, plug；2nd, panel；3rd, the radiator with cold end and hot junction；4th, shell；5th, wire side；6th, refrigeration circuit plate；
7th, cold chamber air inlet；8th, radiator installing port；9th, panel installation neck；10th, wire side installation neck；11st, ship type switchs；12nd, it is main
Fan.
Embodiment
Refer to shown in Fig. 1 and Fig. 2, a kind of semiconductor refrigerating heat dissipation pad for notebook computer of the utility model, including shell 4, band
The radiator 3 in cold end and hot junction, panel 2 and wire side 5.
The open top of shell 4, inside are separated into two chambers by dividing plate 41；Respectively cold chamber and main fan chamber；Every
Plate 41 is provided with cold chamber air inlet 7, for connecting cold chamber and main fan chamber.
Main fan 12 is installed in main fan chamber；Main fan chamber is provided with wire side installation neck 10, and wire side 5 passes through net
Face installation neck 10 is arranged on main fan chamber top.
Cold chamber is provided with panel installation neck 9, and panel 2 installs neck 9 by panel and is installed on cold chamber top.On panel 2
There are some openings, opening is provided with dismountable plug 1.
The side wall of cold chamber is provided with a radiator installing port 8, and cold end and hot junction are provided with radiator installing port 8
Radiator 3；The cold end face radiator installing port 8 of radiator 3 with cold end and hot junction.Radiator 3 with cold end and hot junction
Hot junction deviates from radiator installing port 8, and carries radiator fan.
Refrigeration circuit plate 6 is also equipped with main fan chamber；The connect band cold end of refrigeration circuit plate 6 and the radiator 3 in hot junction,
For controlling the radiator 3 with cold end and hot junction to work；Refrigeration circuit plate 6 is connected with external power supply, ship by ship type switch 11
Type switch 11 is used for the connection or closing for controlling power supply.Main fan 12 is connected with the USB that USB plug may be inserted into notebook computer
Interface power taking.
Main fan 12 and refrigeration circuit plate 6 are adhesive on shell 4 by PUR, and ship type switch 11 is adhesive in outer by PUR
On shell 4, from when being required without refrigeration, wind enters wind from the lower section of main fan 12, is different from prior art, what the utility model used
The type of cooling is：When being required without refrigeration, notebook is blowed to by wire side 5；When having the refrigeration to require, wind is from the lower section air inlet of main fan 12
Into, by cold chamber air inlet 7 enter cold chamber, refrigeration cooling is carried out by the radiator 3 with cold end and hot junction, is different from prior art
The utility model is in order to solve general sex chromosome mosaicism：Panel 2 is provided with multiple openings, and opening is provided with dismountable plug 1, cold chamber
In cold air as some plug 1 of dismantling unplugged opening spray into laptop bottom corresponding to inlet scoop, plug quantity
Most 8 all cover opening, and folding is carried out according to different notebook moulds.
Claims (8)
1. a kind of semiconductor refrigerating heat dissipation pad for notebook computer, it is characterised in that including shell (4), the radiator with cold end and hot junction
And main fan (12) (3)；
The open top of shell (4), inside are separated into two chambers by dividing plate (41)；Respectively cold chamber and main fan chamber；Every
The cold chamber air inlet (7) of cold chamber and main fan chamber is communicated with plate (41)；
Main fan (12) is installed in main fan chamber；
The side wall of cold chamber is provided with a radiator installing port (8), and cold end and hot junction are provided with radiator installing port (8)
Radiator (3)；The cold end face radiator installing port (8) of radiator (3) with cold end and hot junction.
2. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that cold chamber is provided with panel
Neck (9) is installed, panel (2) installs neck (9) by panel and is installed on cold chamber top；There are some openings on panel (2), be open
It is provided with dismountable plug (1).
3. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that set on main fan chamber
There is wire side that neck (10) is installed, wire side (5) installs neck (10) by wire side and is arranged on main fan chamber top.
A kind of 4. semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that with cold end and hot junction
The hot junction of radiator (3) deviates from radiator installing port (8)；Hot junction carries radiator fan.
5. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that in main fan chamber also
The radiator (3) of refrigeration circuit plate (6), refrigeration circuit plate (6) connect band cold end and hot junction is installed.
A kind of 6. semiconductor refrigerating heat dissipation pad for notebook computer according to claim 5, it is characterised in that refrigeration circuit plate (6)
External power supply is connected with by ship type switch (11).
7. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that main fan (12) connects
There is USB plug.
8. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that notebook is positioned over outer
The upper surface of shell (4), the inlet scoop of the region face notebook bottom of panel (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720457742.6U CN206906973U (en) | 2017-04-27 | 2017-04-27 | A kind of semiconductor refrigerating heat dissipation pad for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720457742.6U CN206906973U (en) | 2017-04-27 | 2017-04-27 | A kind of semiconductor refrigerating heat dissipation pad for notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206906973U true CN206906973U (en) | 2018-01-19 |
Family
ID=61291239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720457742.6U Expired - Fee Related CN206906973U (en) | 2017-04-27 | 2017-04-27 | A kind of semiconductor refrigerating heat dissipation pad for notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206906973U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108664096A (en) * | 2018-05-18 | 2018-10-16 | 郑州赫恩电子信息技术有限公司 | A kind of computer host box being easily installed |
| CN109375734A (en) * | 2018-10-11 | 2019-02-22 | 郑州森之林电子科技有限公司 | A kind of notebook auxiliary radiating device |
| CN110513907A (en) * | 2018-05-22 | 2019-11-29 | 讯凯国际股份有限公司 | Formula radiator and register are taken outside |
| CN113923938A (en) * | 2021-09-06 | 2022-01-11 | 联想(北京)有限公司 | Electronic device |
-
2017
- 2017-04-27 CN CN201720457742.6U patent/CN206906973U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108664096A (en) * | 2018-05-18 | 2018-10-16 | 郑州赫恩电子信息技术有限公司 | A kind of computer host box being easily installed |
| CN110513907A (en) * | 2018-05-22 | 2019-11-29 | 讯凯国际股份有限公司 | Formula radiator and register are taken outside |
| CN110513907B (en) * | 2018-05-22 | 2022-01-25 | 讯凯国际股份有限公司 | External-lap type heat dissipation device and temperature adjusting device |
| CN109375734A (en) * | 2018-10-11 | 2019-02-22 | 郑州森之林电子科技有限公司 | A kind of notebook auxiliary radiating device |
| CN113923938A (en) * | 2021-09-06 | 2022-01-11 | 联想(北京)有限公司 | Electronic device |
| CN113923938B (en) * | 2021-09-06 | 2023-03-24 | 联想(北京)有限公司 | Electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180119 Termination date: 20190427 |