CN206906973U - A kind of semiconductor refrigerating heat dissipation pad for notebook computer - Google Patents

Abstract

The utility model discloses a cooling pad for a semiconductor refrigeration notebook, which comprises a shell, a radiator with a cold end and a hot end, and a main fan; the top of the shell is open, and the interior is divided into two chambers by a partition; the cold chamber and the main fan are respectively chamber; the partition plate is provided with a cold chamber air inlet connecting the cold chamber and the main fan chamber; the main fan chamber is equipped with a main fan; the side wall of the cold chamber is provided with a radiator installation port, and the radiator installation port is A radiator with a cold end and a hot end is installed; the cold end of the radiator with a cold end and a hot end faces the radiator installation opening. The utility model overcomes the disadvantage of poor cooling effect of normal temperature air, and also solves the problem that if water cooling is used, the machine needs to be disassembled and the warranty cannot be carried out; Energy efficiency is improved by delivering more energy to the parts that need cooling most.

Description

A semiconductor refrigeration notebook cooling pad

technical field

The utility model belongs to the technical field of notebook cooling, in particular to a cooling pad for notebooks.

Background technique

Recently, notebook heat dissipation has become the main factor affecting the performance of most notebook computers. However, the heat dissipation problem has not been solved by upstream manufacturers. Notebook manufacturers have not done too much transmission to notebook computers because of cost performance and volume issues. Heat enhanced.

Notebook heat generation: Notebook heat generation is slightly different from desktop heat generation. The main sources of desktop heat are cpu, graphics card, and memory. And the heat dissipation is large. The source of heat generation in notebook computers is the CPU. Generally, computers for students use integrated graphics cards or low-end discrete graphics cards with low power, so the main heat source is the CPU. It is for this reason that the inside of the notebook computer mainly relies on flat copper tubes for heat conduction. There is no other way to dissipate heat. Therefore, it mainly relies on heat conduction and convection heat transfer, allowing the air to take away the heat generated by the CPU.

Heat dissipation is actually a process of heat transfer—conduction, convection, radiation, etc. Usually, the air-cooling technology is mainly used in desktop computers, including CPU, graphics card, power supply and cooling fan of the chassis, etc. In notebook computers, air-cooling is still the main heat dissipation method, and the vast majority of heat dissipation methods are: fan + heat pipe + Combination of cooling plates. Many notebook computers on the market use aluminum-magnesium alloy shells, which also play a certain role in heat dissipation. We all know that there are usually cooling vents at the bottom of the laptop, either sucking in or blowing out, which are very important for the cooling of the laptop. Laptops are also designed with heat dissipation in mind, often using feet to raise the body, but when the temperature is too high, it seems relatively reluctant.

Due to the small size of the notebook computer and the concentration of heating elements, the heat dissipation design is quite difficult. The surface temperature of the ordinary CPU is above 50 degrees Celsius during normal use, and the internal temperature is as high as 80 degrees Celsius or even Baidu. However, the ordinary air-cooled The heat sink often fails to meet the heat dissipation requirements, so it is necessary to design an auxiliary heat sink for this situation.

At present, there are two main heat dissipation principles of notebook computer cooling pads on the market:

1) The heat dissipation function is realized simply through the heat conduction principle in physics. Put the heat dissipation base made of plastic or metal on the bottom of the notebook, and raise the notebook to promote air circulation and heat dissipation radiation, which can achieve the heat dissipation effect.

2) Install several cooling fans on the cooling base to improve the cooling performance. This air-cooled heat dissipation method includes two kinds of suction and blowing. The difference between the two forms of air supply lies in the different forms of airflow. When blowing air, turbulent flow is generated, which belongs to active heat dissipation. The wind pressure is high but it is prone to resistance loss, such as the electric fan we use in summer; Airflow, which belongs to passive heat dissipation, has low wind pressure but stable airflow, such as chassis fans. Theoretically, in an open environment, the heat transfer efficiency of turbulent flow is greater than that of laminar flow, but the bottom of the notebook and the heat dissipation base actually form a closed space, so the general air suction and heat dissipation method is more in line with the air flow design specification. Most of the cooling bases on the market have built-in suction fans.

Defects in the prior art: common cooling pads for notebook computers have a simple structure, and generally consist of a metal or plastic shell plus 2 to 4 built-in fans.

Common laptop cooling pads usually have the following problems:

1) The position of the fan does not match the position of the cooling vent of the computer. The position of the fan of the notebook computer cooling pads on the market is fixed, which makes consumers need to determine the position of the cooling outlet of their notebook computer when purchasing a notebook computer cooling pad, and then choose a suitable cooling pad; The heat dissipation pad with the position of the fan and the position of the heat dissipation port is not suitable, and the heat dissipation effect will be greatly reduced.

2) The effective wind power of the fan is insufficient. There are two main types of fans on the market: blowing and suction. For the blower fan, the bottom of the notebook and the heat dissipation base actually form a closed space, and the effective air supply capacity of the blower fan is not as high as imagined; while for the suction fan, the space between the bottom of the notebook and the heat dissipation base The gap cannot be ignored, so that the actual air supply volume of the fan to the inside of the notebook computer is less than the theoretical air supply volume. If the fan power is increased, the air supply volume can be guaranteed, but it is easy to make the noise too loud.

3) The energy utilization rate is low, and the efficiency of the consumed electric energy is relatively low compared with the actual increased heat transfer.

4) The installation of the water cooling system must disassemble the notebook computer, which cannot be operated by ordinary users, and will also cause problems that cannot be guaranteed.

The principle of semiconductor refrigerator:

The refrigeration device is a cooling device composed of semiconductors. It has practical application with the development of modern semiconductors, that is, the invention of refrigerators. Its working principle is that the DC power supply provides the energy required for the flow of electrons. After the power is turned on, the negative electrode (-) of the electrons starts, first passes through the P-type semiconductor, absorbs heat here, and then releases heat when it reaches the N-type semiconductor. After passing through an NP module, heat is sent from one side to the outside and causes a temperature difference to form a hot and cold end. The hot and cold ends are composed of two ceramic pieces respectively, and the cold end should be connected to a heat source, that is, it is to be cooled.

There are related semiconductor cooling and heat dissipation patents and their defects:

1. The authorized announcement number CN 201716651 U, the utility model patent mentioned in the authorized announcement date of 2011.01.19, the general summary of the cooling base for semiconductor cooling notebook computer is: the cooling base for semiconductor cooling notebook computer, including a cross-shaped metal panel, The shape of the metal panel is compatible with the opening on the metal panel and the bottom of the notebook computer. Two support plates are fixed on both sides of the lower part of the metal panel. In the middle of the lower part of the metal panel, one or more semiconductor refrigeration chips are pasted. The refrigerated side of the unit rests against the metal panel. There is a frame around each semiconductor cooling chip, and the frame is fixed under the metal panel. Under the semiconductor cooling chip, that is, on the heat dissipation surface, a heat dissipation metal module is pasted and fixed, and a fan is fixed under the heat dissipation metal module by screws. Put the notebook computer on the metal panel, the cooling surface of the semiconductor cooling chip will reduce the temperature of the metal panel which is in close contact with the notebook computer, thereby reducing the temperature of the notebook computer. The utility model has powerful cooling and cooling effects. It can meet the heat dissipation requirements of high-performance notebooks.

Its technical defect is that the notebook computer itself is made of ABS engineering plastics, and its biggest feature is poor thermal conductivity. This patent will cool down the metal plate in contact with the notebook computer, but the notebook computer shell made of ABS engineering plastics cannot cool the cold well. The amount is transferred to the chip that needs heat dissipation.

2. Authorized announcement number CN 205665646 U, the utility model patent on the authorized announcement date of 2016.10.26 mentions a laptop computer with good heat dissipation, which involves the computer field, including a computer base plate and a screen. The inside of the computer base plate includes a power slot, a power supply , CPU, integrated circuit, and also include a miniature semiconductor cooling chip, a temperature controller, and a heat conduction structure of the CPU. The heating surface is connected with the bottom shell of the computer bottom plate; the temperature controller is connected with two temperature sensors connected with the power supply and the CPU, and when the temperature is too high, the temperature controller controls the operation of the miniature semiconductor cooling chip and the fan , can cool the power supply in time, avoid the power supply from being burned out, and improve the service life of the power supply.

Its technical defect is that versatility is relatively poor, and the user needs to disassemble and assemble the computer at the same time.

Utility model content

The purpose of the utility model is to provide a semiconductor refrigeration notebook cooling pad to solve the above technical problems.

In order to achieve the above object, the utility model adopts the following technical solutions:

A cooling pad for a semiconductor cooling notebook, including a shell, a radiator with a cold end and a hot end, and a main fan; the top of the shell is open, and the inside is divided into two chambers by a partition; respectively, the cold chamber and the main fan chamber; the partition The board is provided with the air inlet of the cold chamber connecting the cold chamber and the main fan chamber; the main fan chamber is installed with the main fan; the side wall of the cold chamber is provided with a radiator installation port, and a cooling A radiator with a cold end and a hot end; a radiator with a cold end and a hot end with the cold end facing the radiator mounting opening.

Further, the cold chamber is provided with a panel installation slot, and the panel is installed on the upper part of the cold chamber through the panel installation slot; there are several openings on the panel, and the openings are provided with detachable plugs.

Further, the main fan chamber is provided with a mesh surface installation card slot, and the mesh surface is installed on the upper part of the main fan chamber through the mesh surface installation card slot.

Further, the hot end of the radiator with the cold end and the hot end is away from the installation opening of the radiator; the hot end is equipped with a cooling fan.

Further, a refrigeration circuit board is installed in the main fan chamber, and the refrigeration circuit board is connected to a radiator with a cold end and a hot end.

Further, the refrigeration circuit board is connected to an external power supply through a rocker switch.

Further, the main fan is connected with a USB plug.

Furthermore, the notebook is placed on the upper surface of the casing, and the area of the panel is facing the air suction port at the bottom of the notebook.

Compared with the prior art, the utility model has the following beneficial effects:

1) Use a radiator with a hot end fan and a cold end fan, with built-in cooling fins, so that the fan at the cold end cools the air in the cold chamber to room temperature, making its cooling effect better than the normal temperature air cooling effect on the market.

2) This utility model designs a panel and its attached plug. Through the installation and removal of the plug, the position of the cold air outlet can be adjusted, so that it can be commonly used in different notebook molds, and at the same time, the cold energy is supplied to the most needed position to make the efficiency be improved.

3) The utility model integrates the cooling part on the cooling pad of the notebook. While having a better cooling effect, it is easy to use and does not need to disassemble the computer, so that users can use it easily and at the same time ensure that the notebook computer will not be out of warranty.

The utility model overcomes the disadvantages of poor air cooling effect at normal temperature, and also solves the problem that if water cooling is used, the machine needs to be disassembled and the warranty cannot be carried out. Most of the notebook computer molds on the market also allow cooling to be supplied to the parts that need cooling the most to improve energy efficiency.

Description of drawings

Fig. 1 is the explosion diagram of a kind of semiconductor refrigeration notebook cooling pad of the present invention;

Fig. 2 is the assembly drawing of a kind of semiconductor refrigeration notebook cooling pad of the present invention;

Among them: 1. Plug; 2. Panel; 3. Radiator with cold end and hot end; 4. Shell; 5. Mesh surface; 6. Refrigeration circuit board; 7. Air inlet of cold chamber; 8. Radiator installation port; 9. Panel installation card slot; 10. Mesh surface installation card slot; 11. Boat type switch; 12. Main fan.

detailed description

Please refer to Fig. 1 and Fig. 2, a kind of cooling pad for semiconductor cooling notebook of the utility model includes a shell 4, a radiator 3 with a cold end and a hot end, a panel 2 and a mesh surface 5.

The top of the casing 4 is open, and the interior is divided into two chambers by a partition 41; respectively, a cold chamber and a main fan chamber; the partition 41 is provided with a cold chamber air inlet 7 for communicating with the cold chamber and the main fan chamber .

A main fan 12 is installed in the main fan chamber; a mesh surface installation slot 10 is arranged on the main fan chamber, and the mesh surface 5 is installed on the upper part of the main fan chamber through the mesh surface installation slot 10 .

The cold chamber is provided with a panel installation slot 9, and the panel 2 is installed on the upper part of the cold chamber through the panel installation slot 9. Several openings are arranged on the panel 2, and detachable plugs 1 are arranged on the openings.

The side wall of the cold cavity is provided with a radiator installation opening 8, and a radiator 3 with a cold end and a hot end is installed on the radiator installation opening 8; the cold end of the radiator 3 with a cold end and a hot end is facing the radiator installation opening 8. The hot end of the radiator 3 with the cold end and the hot end is away from the radiator installation port 8, and has a cooling fan.

Refrigeration circuit board 6 is also installed in the main fan chamber; Refrigeration circuit board 6 is connected with radiator 3 with cold end and hot end, is used for controlling the work of radiator 3 with cold end and hot end; Refrigeration circuit board 6 passes ship type switch 11 Connected with an external power supply, the rocker switch 11 is used to control the connection or closure of the power supply. The main fan 12 is connected with a USB plug and can be inserted into a USB interface of a notebook computer to take power.

The main fan 12 and the refrigeration circuit board 6 are glued on the casing 4 by hot-melt adhesive, and the boat-type switch 11 is glued on the casing 4 by hot-melt glue. In the prior art, the cooling mode adopted by the utility model is as follows: when there is no cooling requirement, it is blown from the mesh surface 5 to the notebook; when there is a cooling requirement, the wind enters from the air inlet below the main fan 12, and enters the cold chamber from the air inlet 7 of the cold chamber , is refrigerated and cooled by a radiator 3 with a cold end and a hot end, which is different from the prior art. In order to solve the problem of versatility, the utility model is provided with a plurality of openings on the panel 2, and a detachable plug 1 is provided on the opening, and the cold chamber The cold air in the plug is sprayed into the corresponding suction port at the bottom of the notebook computer through an unblocked opening where the plug 1 is removed. The number of plugs is at most 8 to cover all the openings, and they are opened and closed according to different notebook molds.

Claims (8)

1. a kind of semiconductor refrigerating heat dissipation pad for notebook computer, it is characterised in that including shell (4), the radiator with cold end and hot junction And main fan (12) (3)；

The open top of shell (4), inside are separated into two chambers by dividing plate (41)；Respectively cold chamber and main fan chamber；Every The cold chamber air inlet (7) of cold chamber and main fan chamber is communicated with plate (41)；

Main fan (12) is installed in main fan chamber；

The side wall of cold chamber is provided with a radiator installing port (8), and cold end and hot junction are provided with radiator installing port (8) Radiator (3)；The cold end face radiator installing port (8) of radiator (3) with cold end and hot junction.

2. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that cold chamber is provided with panel Neck (9) is installed, panel (2) installs neck (9) by panel and is installed on cold chamber top；There are some openings on panel (2), be open It is provided with dismountable plug (1).

3. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that set on main fan chamber There is wire side that neck (10) is installed, wire side (5) installs neck (10) by wire side and is arranged on main fan chamber top.

A kind of 4. semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that with cold end and hot junction The hot junction of radiator (3) deviates from radiator installing port (8)；Hot junction carries radiator fan.

5. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that in main fan chamber also The radiator (3) of refrigeration circuit plate (6), refrigeration circuit plate (6) connect band cold end and hot junction is installed.

A kind of 6. semiconductor refrigerating heat dissipation pad for notebook computer according to claim 5, it is characterised in that refrigeration circuit plate (6) External power supply is connected with by ship type switch (11).

7. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that main fan (12) connects There is USB plug.

8. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that notebook is positioned over outer The upper surface of shell (4), the inlet scoop of the region face notebook bottom of panel (2).