CN206906973U - A kind of semiconductor refrigerating heat dissipation pad for notebook computer - Google Patents

A kind of semiconductor refrigerating heat dissipation pad for notebook computer Download PDF

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CN206906973U
CN206906973U CN201720457742.6U CN201720457742U CN206906973U CN 206906973 U CN206906973 U CN 206906973U CN 201720457742 U CN201720457742 U CN 201720457742U CN 206906973 U CN206906973 U CN 206906973U
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radiator
chamber
cold
heat dissipation
main fan
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郭聿铭
蒲亮
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Xian Jiaotong University
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Abstract

本实用新型公开一种半导体制冷笔记本散热垫,包括外壳、带冷端和热端的散热器和主风扇;外壳的顶部开口,内部由隔板分隔成两个腔室;分别为冷腔和主风扇腔室;隔板上设有连通冷腔和主风扇腔室的冷腔进风口;主风扇腔室中安装有主风扇;冷腔的侧壁上设有一个散热器安装口,散热器安装口上安装有带冷端和热端的散热器;带冷端和热端的散热器的冷端正对散热器安装口。本实用新型克服了常温空气冷却效果不佳的弊端,同时也解决了如果使用水冷需要拆卸机器并使得保修不能进行的问题;本实用新型适用于绝大多数市面上的笔记本电脑模具,同时使得冷量能供给最需要冷却的部位使得能效得以提高。

The utility model discloses a cooling pad for a semiconductor refrigeration notebook, which comprises a shell, a radiator with a cold end and a hot end, and a main fan; the top of the shell is open, and the interior is divided into two chambers by a partition; the cold chamber and the main fan are respectively chamber; the partition plate is provided with a cold chamber air inlet connecting the cold chamber and the main fan chamber; the main fan chamber is equipped with a main fan; the side wall of the cold chamber is provided with a radiator installation port, and the radiator installation port is A radiator with a cold end and a hot end is installed; the cold end of the radiator with a cold end and a hot end faces the radiator installation opening. The utility model overcomes the disadvantage of poor cooling effect of normal temperature air, and also solves the problem that if water cooling is used, the machine needs to be disassembled and the warranty cannot be carried out; Energy efficiency is improved by delivering more energy to the parts that need cooling most.

Description

一种半导体制冷笔记本散热垫A semiconductor refrigeration notebook cooling pad

技术领域technical field

本实用新型属于笔记本散热技术领域,特别涉及一种笔记本散热垫。The utility model belongs to the technical field of notebook cooling, in particular to a cooling pad for notebooks.

背景技术Background technique

日前,笔记本散热已成为大部分笔记本电脑性能制约方面的主要影响因素,然而,散热问题并没有能在上游厂商处解决,笔记本厂商因为性价比问题和体积问题,并没有对笔记本电脑做过多的传热加强。Recently, notebook heat dissipation has become the main factor affecting the performance of most notebook computers. However, the heat dissipation problem has not been solved by upstream manufacturers. Notebook manufacturers have not done too much transmission to notebook computers because of cost performance and volume issues. Heat enhanced.

笔记本热量的产生:笔记本热量与台式机热量的产生略有不同,台式机的热量主要来源为 cpu、显卡与内存。且散热量较大。笔记本电脑产热源头为CPU,一般学生用电脑多为集成显卡或中低端独立显卡,功率较低,故主要热源为CPU,也正是由于这个原因,笔记本电脑内部主要依靠扁铜管导热,没有其它散热方式。因而主要依靠热传导与对流传热,让空气带走 cpu产生的热量。Notebook heat generation: Notebook heat generation is slightly different from desktop heat generation. The main sources of desktop heat are cpu, graphics card, and memory. And the heat dissipation is large. The source of heat generation in notebook computers is the CPU. Generally, computers for students use integrated graphics cards or low-end discrete graphics cards with low power, so the main heat source is the CPU. It is for this reason that the inside of the notebook computer mainly relies on flat copper tubes for heat conduction. There is no other way to dissipate heat. Therefore, it mainly relies on heat conduction and convection heat transfer, allowing the air to take away the heat generated by the CPU.

散热,其实就是一个热量传递过程——传导、对流、辐射等几种方式。通常在台式机中主要是风冷技术,这包括CPU、显卡、电源及机箱的散热风扇等,在笔记本电脑中,风冷依旧的主要的散热方式,绝大数的散热方式是:风扇+热管+散热板的组合。市面上很多笔记本电脑采用铝镁合金的外壳,对散热也起到了一定的作用。大家都知道,在笔记本电脑底部一般都有散热通风口,或吸入或吹出,对笔记本电脑的散热都非常重要。笔记本电脑在设计的时候也考虑到散热问题,往往会用垫脚将机身抬高,但是在温度过高的时候,就显得比较勉强。Heat dissipation is actually a process of heat transfer—conduction, convection, radiation, etc. Usually, the air-cooling technology is mainly used in desktop computers, including CPU, graphics card, power supply and cooling fan of the chassis, etc. In notebook computers, air-cooling is still the main heat dissipation method, and the vast majority of heat dissipation methods are: fan + heat pipe + Combination of cooling plates. Many notebook computers on the market use aluminum-magnesium alloy shells, which also play a certain role in heat dissipation. We all know that there are usually cooling vents at the bottom of the laptop, either sucking in or blowing out, which are very important for the cooling of the laptop. Laptops are also designed with heat dissipation in mind, often using feet to raise the body, but when the temperature is too high, it seems relatively reluctant.

笔记本电脑由于体积比较小,发热元件集中,散热设计有相当大的难度,正常使用时普通 CPU的表面温度在50摄氏度以上,而内部更是高达80度甚至是上百度,然而普通的风冷式散热器,往往达不到散热要求,因而需要针对此种情况设计辅助散热器。Due to the small size of the notebook computer and the concentration of heating elements, the heat dissipation design is quite difficult. The surface temperature of the ordinary CPU is above 50 degrees Celsius during normal use, and the internal temperature is as high as 80 degrees Celsius or even Baidu. However, the ordinary air-cooled The heat sink often fails to meet the heat dissipation requirements, so it is necessary to design an auxiliary heat sink for this situation.

目前市面上常见的笔记本电脑散热垫的散热原理主要有两种:At present, there are two main heat dissipation principles of notebook computer cooling pads on the market:

1)单纯通过物理学上的导热原理实现散热功能。将塑料或者金属制成的散热底座放在笔记本的底部,抬高笔记本以促进空气流通和散热辐射,可以达到散热效果。1) The heat dissipation function is realized simply through the heat conduction principle in physics. Put the heat dissipation base made of plastic or metal on the bottom of the notebook, and raise the notebook to promote air circulation and heat dissipation radiation, which can achieve the heat dissipation effect.

2)在散热底座上面再安装若干个散热风扇来提高散热性能。这种风冷散热方式包括吸风和吹风两种。两种送风形式的差别在于气流形式的不同,吹风时产生的是紊流,属于主动散热,风压大但容易受到阻力损失,例如我们日常夏天用的电风扇;吸风时产生的是层流,属于被动散热,风压小但气流稳定,例如机箱风扇。理论上说,开放环境中,紊流的换热效率比层流大,但是笔记本底部和散热底座实际组成了一个封闭空间,所以一般吸风散热方式更符合风流设计规范。市场上的散热底座多数是有内置吸风式风扇的。2) Install several cooling fans on the cooling base to improve the cooling performance. This air-cooled heat dissipation method includes two kinds of suction and blowing. The difference between the two forms of air supply lies in the different forms of airflow. When blowing air, turbulent flow is generated, which belongs to active heat dissipation. The wind pressure is high but it is prone to resistance loss, such as the electric fan we use in summer; Airflow, which belongs to passive heat dissipation, has low wind pressure but stable airflow, such as chassis fans. Theoretically, in an open environment, the heat transfer efficiency of turbulent flow is greater than that of laminar flow, but the bottom of the notebook and the heat dissipation base actually form a closed space, so the general air suction and heat dissipation method is more in line with the air flow design specification. Most of the cooling bases on the market have built-in suction fans.

现有技术缺陷:常见的笔记本电脑散热垫结构简单,一般是由金属或者塑料外壳加上内置的2~4个风扇构成。Defects in the prior art: common cooling pads for notebook computers have a simple structure, and generally consist of a metal or plastic shell plus 2 to 4 built-in fans.

常见的笔记本电脑散热垫通常存在以下问题:Common laptop cooling pads usually have the following problems:

1)风扇位置和电脑散热口位置不符合。市面上的笔记本电脑散热垫的风扇位置都是固定的,这使得消费者在选购笔记本电脑散热垫时需要先确定自己笔记本电脑散热口的位置,据此选购合适的散热垫;如果购买了风扇位置和散热口位置不合的散热垫,散热效果将大打折扣。1) The position of the fan does not match the position of the cooling vent of the computer. The position of the fan of the notebook computer cooling pads on the market is fixed, which makes consumers need to determine the position of the cooling outlet of their notebook computer when purchasing a notebook computer cooling pad, and then choose a suitable cooling pad; The heat dissipation pad with the position of the fan and the position of the heat dissipation port is not suitable, and the heat dissipation effect will be greatly reduced.

2)风扇有效风力不足。当前市面上风扇主要有吹风和吸风两种送风形式。对于吹风式风扇而言,笔记本底部和散热底座实际组成了一个封闭空间,吹风式风扇的有效送风能力没有想象的那么高;而对吸风式风扇而言,笔记本底部和散热底座之间的空隙无法忽视,使得风扇对笔记本电脑内部的实际送风量小于理论送风量。如果增大风扇功率的话,可以保证送风量,但是容易使噪音过大。2) The effective wind power of the fan is insufficient. There are two main types of fans on the market: blowing and suction. For the blower fan, the bottom of the notebook and the heat dissipation base actually form a closed space, and the effective air supply capacity of the blower fan is not as high as imagined; while for the suction fan, the space between the bottom of the notebook and the heat dissipation base The gap cannot be ignored, so that the actual air supply volume of the fan to the inside of the notebook computer is less than the theoretical air supply volume. If the fan power is increased, the air supply volume can be guaranteed, but it is easy to make the noise too loud.

3)能源利用率低,消耗的电能对比实际增加的换热量,效率偏低。3) The energy utilization rate is low, and the efficiency of the consumed electric energy is relatively low compared with the actual increased heat transfer.

4)水冷散热系统安装则必须要拆装笔记本电脑,对于普通用户无法操作,同时会带来无法保修的问题。4) The installation of the water cooling system must disassemble the notebook computer, which cannot be operated by ordinary users, and will also cause problems that cannot be guaranteed.

半导体制冷片原理:The principle of semiconductor refrigerator:

致冷器件是由半导体所组成的一种冷却装置,随着近代的半导体发展才有实际的应用,也就是致冷器的发明。其工作原理是由直流电源提供电子流所需的能量,通上电源后,电子负极 (-)出发,首先经过P型半导体,于此吸热量,到了N型半导体,又将热量放出,每经过一个 NP模块,就有热量由一边被送到令外一边造成温差而形成冷热端。冷热端分别由两片陶瓷片所构成,冷端要接热源,也就是欲冷却之。The refrigeration device is a cooling device composed of semiconductors. It has practical application with the development of modern semiconductors, that is, the invention of refrigerators. Its working principle is that the DC power supply provides the energy required for the flow of electrons. After the power is turned on, the negative electrode (-) of the electrons starts, first passes through the P-type semiconductor, absorbs heat here, and then releases heat when it reaches the N-type semiconductor. After passing through an NP module, heat is sent from one side to the outside and causes a temperature difference to form a hot and cold end. The hot and cold ends are composed of two ceramic pieces respectively, and the cold end should be connected to a heat source, that is, it is to be cooled.

已有相关半导体制冷散热专利及其缺陷:There are related semiconductor cooling and heat dissipation patents and their defects:

1.授权公告号CN 201716651 U,授权公告日2011.01.19的实用新型专利中所提及的半导体制冷笔记本电脑散热底座,其大致摘要为:半导体制冷笔记本电脑散热底座,包括十字形的金属面板,金属面板的形状与金属面板上的开孔与笔记本电脑的底部相适应,金属面板下部两侧固定有2个支板,在金属面板下面中部,粘贴有一个或多个半导体制冷片,半导体制冷片的制冷面紧贴金属面板。在每一个半导体制冷片的周边有一方框,方框固定在金属面板下面,在半导体制冷片的下面,即散热面上,粘贴固定有散热金属模块,散热金属模块下面通过螺钉固定有风扇。将笔记本电脑放置在金属面板上,半导体制冷片的制冷面将会降低与笔记本电脑紧密接触的金属面板的温度,从而降低笔记本电脑的温度。本实用新型具有强有力的制冷和散热效果。能够满足高性能笔记本的散热要求。1. The authorized announcement number CN 201716651 U, the utility model patent mentioned in the authorized announcement date of 2011.01.19, the general summary of the cooling base for semiconductor cooling notebook computer is: the cooling base for semiconductor cooling notebook computer, including a cross-shaped metal panel, The shape of the metal panel is compatible with the opening on the metal panel and the bottom of the notebook computer. Two support plates are fixed on both sides of the lower part of the metal panel. In the middle of the lower part of the metal panel, one or more semiconductor refrigeration chips are pasted. The refrigerated side of the unit rests against the metal panel. There is a frame around each semiconductor cooling chip, and the frame is fixed under the metal panel. Under the semiconductor cooling chip, that is, on the heat dissipation surface, a heat dissipation metal module is pasted and fixed, and a fan is fixed under the heat dissipation metal module by screws. Put the notebook computer on the metal panel, the cooling surface of the semiconductor cooling chip will reduce the temperature of the metal panel which is in close contact with the notebook computer, thereby reducing the temperature of the notebook computer. The utility model has powerful cooling and cooling effects. It can meet the heat dissipation requirements of high-performance notebooks.

其技术缺陷在于,笔记本电脑本身使用的是abs工程塑料,其最大特点是导热性能不好,该专利将于笔记本电脑接触的金属板降温,然而abs工程塑料制作的笔记本电脑外壳无法很好将冷量传递给需要散热的芯片。Its technical defect is that the notebook computer itself is made of ABS engineering plastics, and its biggest feature is poor thermal conductivity. This patent will cool down the metal plate in contact with the notebook computer, but the notebook computer shell made of ABS engineering plastics cannot cool the cold well. The amount is transferred to the chip that needs heat dissipation.

2.授权公告号CN 205665646 U,授权公告日2016.10.26的实用新型专利中提及一种散热好的笔记本电脑,涉及计算机领域,包括电脑底板、屏幕,所述电脑底板内部包括电源槽、电源、CPU、集成电路,还包括微型半导体制冷片、温度控制器、CPU导热结构,所述微型半导体制冷片固定在电源槽内,微型半导体制冷片的制冷面与电脑电源接触,微型半导体制冷片的制热面与电脑底板的底端外壳相接;所述温度控制器上连有与电源、CPU相连的两个温度传感器,当温度过高时温度控制器通过导线控制微型半导体制冷片、风扇工作,能及时冷却电源,避免电源被烧坏,提高电源使用寿命。2. Authorized announcement number CN 205665646 U, the utility model patent on the authorized announcement date of 2016.10.26 mentions a laptop computer with good heat dissipation, which involves the computer field, including a computer base plate and a screen. The inside of the computer base plate includes a power slot, a power supply , CPU, integrated circuit, and also include a miniature semiconductor cooling chip, a temperature controller, and a heat conduction structure of the CPU. The heating surface is connected with the bottom shell of the computer bottom plate; the temperature controller is connected with two temperature sensors connected with the power supply and the CPU, and when the temperature is too high, the temperature controller controls the operation of the miniature semiconductor cooling chip and the fan , can cool the power supply in time, avoid the power supply from being burned out, and improve the service life of the power supply.

其技术缺陷在于,通用性较差,同时需要用户拆装电脑。Its technical defect is that versatility is relatively poor, and the user needs to disassemble and assemble the computer at the same time.

实用新型内容Utility model content

本实用新型的目的在于提供一种半导体制冷笔记本散热垫,以解决上述技术问题。The purpose of the utility model is to provide a semiconductor refrigeration notebook cooling pad to solve the above technical problems.

为了实现上述目的,本实用新型采用如下技术方案:In order to achieve the above object, the utility model adopts the following technical solutions:

一种半导体制冷笔记本散热垫,包括外壳、带冷端和热端的散热器和主风扇;外壳的顶部开口,内部由隔板分隔成两个腔室;分别为冷腔和主风扇腔室;隔板上设有连通冷腔和主风扇腔室的冷腔进风口;主风扇腔室中安装有主风扇;冷腔的侧壁上设有一个散热器安装口,散热器安装口上安装有带冷端和热端的散热器;带冷端和热端的散热器的冷端正对散热器安装口。A cooling pad for a semiconductor cooling notebook, including a shell, a radiator with a cold end and a hot end, and a main fan; the top of the shell is open, and the inside is divided into two chambers by a partition; respectively, the cold chamber and the main fan chamber; the partition The board is provided with the air inlet of the cold chamber connecting the cold chamber and the main fan chamber; the main fan chamber is installed with the main fan; the side wall of the cold chamber is provided with a radiator installation port, and a cooling A radiator with a cold end and a hot end; a radiator with a cold end and a hot end with the cold end facing the radiator mounting opening.

进一步的,冷腔上设有面板安装卡槽,面板通过面板安装卡槽安装于冷腔上部;面板上有若干开口,开口上设有可拆卸的塞子。Further, the cold chamber is provided with a panel installation slot, and the panel is installed on the upper part of the cold chamber through the panel installation slot; there are several openings on the panel, and the openings are provided with detachable plugs.

进一步的,主风扇腔室上设有网面安装卡槽,网面通过网面安装卡槽安装在主风扇腔室上部。Further, the main fan chamber is provided with a mesh surface installation card slot, and the mesh surface is installed on the upper part of the main fan chamber through the mesh surface installation card slot.

进一步的,带冷端和热端的散热器的热端背离散热器安装口;热端带有散热风扇。Further, the hot end of the radiator with the cold end and the hot end is away from the installation opening of the radiator; the hot end is equipped with a cooling fan.

进一步的,主风扇腔室中还安装有制冷电路板,制冷电路板连接带冷端和热端的散热器。Further, a refrigeration circuit board is installed in the main fan chamber, and the refrigeration circuit board is connected to a radiator with a cold end and a hot end.

进一步的,制冷电路板通过船型开关连接有外接电源。Further, the refrigeration circuit board is connected to an external power supply through a rocker switch.

进一步的,主风扇连接有USB插头。Further, the main fan is connected with a USB plug.

进一步的,笔记本放置于外壳的上表面,面板的区域正对笔记本底部的吸风口。Furthermore, the notebook is placed on the upper surface of the casing, and the area of the panel is facing the air suction port at the bottom of the notebook.

相对于现有技术,本实用新型具有以下有益效果:Compared with the prior art, the utility model has the following beneficial effects:

1)使用带热端和带冷端风扇的散热器,内置制冷片,使得冷端的风扇将冷腔内的空气进行冷却到室温一下,使得其制冷效果优于市面上的常温空气冷却效果。1) Use a radiator with a hot end fan and a cold end fan, with built-in cooling fins, so that the fan at the cold end cools the air in the cold chamber to room temperature, making its cooling effect better than the normal temperature air cooling effect on the market.

2)本实用新型设计一个面板以及其附带的塞子,通过塞子的安装与拆除使得冷风出口的位置可以调节,使得其能够通用于不同的笔记本模具,同时是冷量供给到最需要的位置使得效率得以提高。2) This utility model designs a panel and its attached plug. Through the installation and removal of the plug, the position of the cold air outlet can be adjusted, so that it can be commonly used in different notebook molds, and at the same time, the cold energy is supplied to the most needed position to make the efficiency be improved.

3)本实用新型将制冷部分整合在笔记本散热垫上,在更好冷却效果的同时,使用方便不需要拆装电脑,使得用户可以简便使用同时保证了不会使得笔记本电脑无法保修。3) The utility model integrates the cooling part on the cooling pad of the notebook. While having a better cooling effect, it is easy to use and does not need to disassemble the computer, so that users can use it easily and at the same time ensure that the notebook computer will not be out of warranty.

本实用新型克服了常温空气冷却效果不佳的弊端,同时也解决了如果使用水冷需要拆卸机器并使得保修不能进行的问题,同时本实用新型设计了面板和塞子使得其通用性大大提高,适用于绝大多数市面上的笔记本电脑模具,同时使得冷量能供给最需要冷却的部位使得能效得以提高。The utility model overcomes the disadvantages of poor air cooling effect at normal temperature, and also solves the problem that if water cooling is used, the machine needs to be disassembled and the warranty cannot be carried out. Most of the notebook computer molds on the market also allow cooling to be supplied to the parts that need cooling the most to improve energy efficiency.

附图说明Description of drawings

图1为本实用新型一种半导体制冷笔记本散热垫的爆炸图;Fig. 1 is the explosion diagram of a kind of semiconductor refrigeration notebook cooling pad of the present invention;

图2为本实用新型一种半导体制冷笔记本散热垫的组装图;Fig. 2 is the assembly drawing of a kind of semiconductor refrigeration notebook cooling pad of the present invention;

其中:1、塞子;2、面板;3、带冷端和热端的散热器;4、外壳;5、网面;6、制冷电路板;7、冷腔进风口;8、散热器安装口;9、面板安装卡槽;10、网面安装卡槽;11、船型开关;12、主风扇。Among them: 1. Plug; 2. Panel; 3. Radiator with cold end and hot end; 4. Shell; 5. Mesh surface; 6. Refrigeration circuit board; 7. Air inlet of cold chamber; 8. Radiator installation port; 9. Panel installation card slot; 10. Mesh surface installation card slot; 11. Boat type switch; 12. Main fan.

具体实施方式detailed description

请参阅图1和图2所示,本实用新型一种半导体制冷笔记本散热垫,包括外壳4、带冷端和热端的散热器3、面板2和网面5。Please refer to Fig. 1 and Fig. 2, a kind of cooling pad for semiconductor cooling notebook of the utility model includes a shell 4, a radiator 3 with a cold end and a hot end, a panel 2 and a mesh surface 5.

外壳4的顶部开口,内部由隔板41分隔成两个腔室;分别为冷腔和主风扇腔室;隔板41 上设有冷腔进风口7,用于连通冷腔和主风扇腔室。The top of the casing 4 is open, and the interior is divided into two chambers by a partition 41; respectively, a cold chamber and a main fan chamber; the partition 41 is provided with a cold chamber air inlet 7 for communicating with the cold chamber and the main fan chamber .

主风扇腔室中安装有主风扇12;主风扇腔室上设有网面安装卡槽10,网面5通过网面安装卡槽10安装在主风扇腔室上部。A main fan 12 is installed in the main fan chamber; a mesh surface installation slot 10 is arranged on the main fan chamber, and the mesh surface 5 is installed on the upper part of the main fan chamber through the mesh surface installation slot 10 .

冷腔上设有面板安装卡槽9,面板2通过面板安装卡槽9安装于冷腔上部。面板2上有若干开口,开口上设有可拆卸的塞子1。The cold chamber is provided with a panel installation slot 9, and the panel 2 is installed on the upper part of the cold chamber through the panel installation slot 9. Several openings are arranged on the panel 2, and detachable plugs 1 are arranged on the openings.

冷腔的侧壁上设有一个散热器安装口8,散热器安装口8上安装有带冷端和热端的散热器 3;带冷端和热端的散热器3的冷端正对散热器安装口8。带冷端和热端的散热器3的热端背离散热器安装口8,并带有散热风扇。The side wall of the cold cavity is provided with a radiator installation opening 8, and a radiator 3 with a cold end and a hot end is installed on the radiator installation opening 8; the cold end of the radiator 3 with a cold end and a hot end is facing the radiator installation opening 8. The hot end of the radiator 3 with the cold end and the hot end is away from the radiator installation port 8, and has a cooling fan.

主风扇腔室中还安装有制冷电路板6;制冷电路板6连接带冷端和热端的散热器3,用于控制带冷端和热端的散热器3工作;制冷电路板6通过船型开关11连接有外接电源,船型开关11用于控制电源的连通或关闭。主风扇12连接有USB插头可以插入笔记本电脑的USB接口取电。Refrigeration circuit board 6 is also installed in the main fan chamber; Refrigeration circuit board 6 is connected with radiator 3 with cold end and hot end, is used for controlling the work of radiator 3 with cold end and hot end; Refrigeration circuit board 6 passes ship type switch 11 Connected with an external power supply, the rocker switch 11 is used to control the connection or closure of the power supply. The main fan 12 is connected with a USB plug and can be inserted into a USB interface of a notebook computer to take power.

主风扇12和制冷电路板6由热熔胶胶粘在外壳4上,船型开关11由热熔胶胶粘在外壳4 上,风从无制冷要求时,风从主风扇12下方进入,区别于已有技术,本实用新型采用的冷却方式为:无制冷要求时,由网面5吹向笔记本;有制冷要求时,风从主风扇12下方进风口进入,由冷腔进风口7进入冷腔,由带冷端和热端的散热器3进行制冷冷却,区别于已有技术本实用新型为了解决通用性问题:面板2上设有多个开口,开口上设有可拆卸的塞子1,冷腔中的冷气由某一个拆掉塞子1的未堵塞开口喷入笔记本电脑底部对应的吸风口,塞子数量最多8 个全部覆盖开口,根据不同的笔记本模具进行开合。The main fan 12 and the refrigeration circuit board 6 are glued on the casing 4 by hot-melt adhesive, and the boat-type switch 11 is glued on the casing 4 by hot-melt glue. In the prior art, the cooling mode adopted by the utility model is as follows: when there is no cooling requirement, it is blown from the mesh surface 5 to the notebook; when there is a cooling requirement, the wind enters from the air inlet below the main fan 12, and enters the cold chamber from the air inlet 7 of the cold chamber , is refrigerated and cooled by a radiator 3 with a cold end and a hot end, which is different from the prior art. In order to solve the problem of versatility, the utility model is provided with a plurality of openings on the panel 2, and a detachable plug 1 is provided on the opening, and the cold chamber The cold air in the plug is sprayed into the corresponding suction port at the bottom of the notebook computer through an unblocked opening where the plug 1 is removed. The number of plugs is at most 8 to cover all the openings, and they are opened and closed according to different notebook molds.

Claims (8)

1. a kind of semiconductor refrigerating heat dissipation pad for notebook computer, it is characterised in that including shell (4), the radiator with cold end and hot junction And main fan (12) (3);
The open top of shell (4), inside are separated into two chambers by dividing plate (41);Respectively cold chamber and main fan chamber;Every The cold chamber air inlet (7) of cold chamber and main fan chamber is communicated with plate (41);
Main fan (12) is installed in main fan chamber;
The side wall of cold chamber is provided with a radiator installing port (8), and cold end and hot junction are provided with radiator installing port (8) Radiator (3);The cold end face radiator installing port (8) of radiator (3) with cold end and hot junction.
2. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that cold chamber is provided with panel Neck (9) is installed, panel (2) installs neck (9) by panel and is installed on cold chamber top;There are some openings on panel (2), be open It is provided with dismountable plug (1).
3. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that set on main fan chamber There is wire side that neck (10) is installed, wire side (5) installs neck (10) by wire side and is arranged on main fan chamber top.
A kind of 4. semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that with cold end and hot junction The hot junction of radiator (3) deviates from radiator installing port (8);Hot junction carries radiator fan.
5. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that in main fan chamber also The radiator (3) of refrigeration circuit plate (6), refrigeration circuit plate (6) connect band cold end and hot junction is installed.
A kind of 6. semiconductor refrigerating heat dissipation pad for notebook computer according to claim 5, it is characterised in that refrigeration circuit plate (6) External power supply is connected with by ship type switch (11).
7. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that main fan (12) connects There is USB plug.
8. a kind of semiconductor refrigerating heat dissipation pad for notebook computer according to claim 1, it is characterised in that notebook is positioned over outer The upper surface of shell (4), the inlet scoop of the region face notebook bottom of panel (2).
CN201720457742.6U 2017-04-27 2017-04-27 A kind of semiconductor refrigerating heat dissipation pad for notebook computer Expired - Fee Related CN206906973U (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108664096A (en) * 2018-05-18 2018-10-16 郑州赫恩电子信息技术有限公司 A kind of computer host box being easily installed
CN109375734A (en) * 2018-10-11 2019-02-22 郑州森之林电子科技有限公司 A kind of notebook auxiliary radiating device
CN110513907A (en) * 2018-05-22 2019-11-29 讯凯国际股份有限公司 External cooling device and temperature adjustment device
CN113220097A (en) * 2021-03-24 2021-08-06 杭州大和热磁电子有限公司 Notebook computer CPU heat sink
CN113923938A (en) * 2021-09-06 2022-01-11 联想(北京)有限公司 Electronic device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108664096A (en) * 2018-05-18 2018-10-16 郑州赫恩电子信息技术有限公司 A kind of computer host box being easily installed
CN110513907A (en) * 2018-05-22 2019-11-29 讯凯国际股份有限公司 External cooling device and temperature adjustment device
CN110513907B (en) * 2018-05-22 2022-01-25 讯凯国际股份有限公司 External-lap type heat dissipation device and temperature adjusting device
CN109375734A (en) * 2018-10-11 2019-02-22 郑州森之林电子科技有限公司 A kind of notebook auxiliary radiating device
CN113220097A (en) * 2021-03-24 2021-08-06 杭州大和热磁电子有限公司 Notebook computer CPU heat sink
CN113923938A (en) * 2021-09-06 2022-01-11 联想(北京)有限公司 Electronic device
CN113923938B (en) * 2021-09-06 2023-03-24 联想(北京)有限公司 Electronic device

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