CN109375734A - A kind of notebook auxiliary radiating device - Google Patents
A kind of notebook auxiliary radiating device Download PDFInfo
- Publication number
- CN109375734A CN109375734A CN201811184004.4A CN201811184004A CN109375734A CN 109375734 A CN109375734 A CN 109375734A CN 201811184004 A CN201811184004 A CN 201811184004A CN 109375734 A CN109375734 A CN 109375734A
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- Prior art keywords
- cooling
- air
- chamber
- hot
- main body
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of notebook auxiliary radiating device, including main body, semiconductor cooling device, Hot-air fan, cooling fan；The main body is equipped with cooling chamber, heat dissipation chamber, cold air chamber, air inlet, cold air outlet and hot-air mouth；The Hot-air fan is fixed in main body；The cooling fan is fixed in main body；The semiconductor cooling device is fixed in main body；Air enters radiator by air inlet, a part flows through the heat that heat dissipation chamber takes away semiconductor cooling device hot end, then it is flowed out by hot-air mouth, another part flows through cooling chamber, cool down by semiconductor cooling device, enter cold air chamber by cold air outlet, then notebook base is blowed to by cooling fan, achievees the purpose that heat dissipation；The present invention improves the radiating efficiency of notebook for existing laptop heat-dissipation plate, the noise issued when effectively reducing laptop heat-dissipation.
Description
Technical field
The present invention relates to computer hardware field, specifically a kind of notebook auxiliary radiating device.
Background technique
It is the epoch of information-based high speed development now, the Working Life of people often all be unable to do without computer instantly, and takes down notes
This computer is the convenient and fast tool that current people's office uses, and can carry, significantly facilitate people's lives.But it is directed to
The use of laptop, the heat dissipation of its own are always a troubling problem, usually our CPU when using computer
Temperature be easy to increase, if operating for a long time, gently then can lead to computer blue screen and restart, it is heavy then may cause CPU and directly burn.
So external notebook computer radiating bracket comes into being.
The working principle of notebook computer radiating bracket is: by the radiator fan of cooling stand directly against laptop bottom
Portion dispels heat, and notebook heat is forced to blow out, and increases the air flowing of notebook bottom, to make inside laptop
Each heater element is radiated, effectively the low-temperature working environment inside holding, and notes instinct is allowed to work normally.
Existing notebook computer radiating bracket often can only by natural wind be sent into notebook inside, to extraneous condition depended compared with
Greatly, when ambient temperature is higher, the effect of notebook computer radiating bracket is greatly reduced, simultaneously because the air of notebook sucking
Temperature is higher, and the included fan of notebook needs bigger revolving speed acceleration notebook inner air flow, can just be effectively reduced hard
Part temperature, while notebook generates biggish noise, influences operator's work.
Summary of the invention
It is mentioned above in the background art to solve the purpose of the present invention is to provide a kind of notebook auxiliary radiating device
Problem.
To achieve the above object, the invention provides the following technical scheme:
A kind of notebook auxiliary radiating device, including main body, semiconductor cooling device, Hot-air fan and cooling fan；The semiconductor
There are two refrigerating plants, and semiconductor cooling device is symmetrically fixed on main body upper end, will flow through the sky of semiconductor cooling device
Temperature degree reduces, and so that the air themperature for blowing to notebook base is lower, to effectively reduce the temperature of notebook；The hot wind
Fan is fixed on main body upper end, and is located among semiconductor cooling device on hot wind, is mainly responsible for and takes away semiconductor cooling device heat
The temperature at end, so that semiconductor cooling device cold end be made to keep low temperature；The cooling fan is fixed on body interior lower end, by device
Air after interior cooling blows to notebook base, achievees the purpose that heat dissipation.
As a further solution of the present invention: the notebook auxiliary radiating device further include upper cover plate, support rubber and
USB interface.
As a further solution of the present invention: the main body is equipped with cooling chamber, heat dissipation chamber, cold air chamber, air inlet, cold air outlet
And hot-air mouth；Air a part is entered by air inlet, is flowed through heat dissipation chamber and is taken away semiconductor cooling device hot end heat, then leads to
Hot-air mouth outflow is crossed, another part flows through cooling chamber, by cooling, enters cold air chamber by cold air outlet, then blowed to by cooling fan
Notebook base.
As further scheme of the invention: the cooling chamber is connected to by cold air outlet with cold air chamber, and passes through air inlet
Mouth is in communication with the outside；The heat dissipation chamber is in communication with the outside by air inlet and hot-air mouth；The air inlet and hot-air mouth are netted
Structure；The cooling chamber is not connected to heat dissipation chamber.
As further scheme of the invention: the semiconductor cooling device is equipped with cooling fin, semiconductor and refrigeration
Piece；The cooling fin is fixed on the hot end of semiconductor, and cooling fin is located in heat dissipation chamber；The cooling piece is fixed on semiconductor
Cold end, and cooling piece is located in cooling chamber.
As further scheme of the invention: the upper cover plate is fixed in main body, and the cooperation of upper cover plate and main body
Place's sealing, upper cover plate are equipped with latticed air outlet.
As further scheme of the invention: the support rubber is fixed on the lower section of main body；USB interface connects hot wind
Fan, cooling fan and semiconductor cooling device, USB interface are Hot-air fan, cooling fan and semiconductor cooling device by connection computer
Electric power required for work is provided.
Compared with prior art, the beneficial effects of the present invention are:
The present invention increases refrigerating plant for existing laptop heat-dissipation plate, and the air of notebook sucking is lower than environment
Temperature, improves the radiating efficiency of notebook, even if making notebook computer radiating device will not in the higher situation of environment temperature
Heavy-duty service, the noise issued when effectively reducing laptop heat-dissipation.
Detailed description of the invention
Fig. 1 is the top view of the notebook auxiliary radiating device.
Fig. 2 is the left view of the notebook auxiliary radiating device.
Fig. 3 is the schematic diagram of internal structure of the notebook auxiliary radiating device.
Fig. 4 is the schematic diagram of semiconductor refrigerating in the notebook auxiliary radiating device.
Fig. 5 is the chamber distribution map of main body in the notebook auxiliary radiating device.
In figure: 1- main body, 11- cooling chamber, 12- heat dissipation chamber, 13- cold air chamber, 14- air inlet, 15- cold air outlet, 16- hot wind
Mouthful, 2- semiconductor cooling device, 21- cooling fin, 22- semiconductor, 23- cooling piece, 24-N type semiconductor, 25-P type semiconductor,
26- insulating ceramic film, 27- metallic conductor, 28- DC power supply, 3- Hot-air fan, 4- cooling fan, 5- upper cover plate, 6- support rubber,
7-USB interface.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1~5, in the embodiment of the present invention, a kind of notebook auxiliary radiating device, including main body 1, semiconductor system
Device for cooling 2, Hot-air fan 3, cooling fan 4, upper cover plate 5, support rubber 6 and USB interface 7；The main body 1 is equipped with cooling chamber 11, dissipates
Hot cell 12, cold air chamber 13, air inlet 14, cold air outlet 15 and hot-air mouth 16；The heat dissipation chamber 13 passes through air inlet 14 and hot-air mouth
16 are in communication with the outside, and heat dissipation chamber 12 is located at 1 upper end of main body；The cooling chamber 12 is connected to by cold air outlet 15 with cold air chamber 13,
It is in communication with the outside by air inlet 14, and cooling chamber 12 is located at 13 lower end of heat dissipation chamber；The air inlet 14 is located at 1 both ends of main body；
The hot-air mouth 16 is located at the middle part of heat dissipation chamber 12, and hot-air mouth 16 is reticular structure；The cooling chamber 11 and heat dissipation chamber 12 are not
Connection；The cold air chamber 13 is located at 1 lower section of main body；
The semiconductor cooling device 2 is equipped with cooling fin 21, semiconductor 22 and cooling piece 23, and semiconductor cooling device 2 is fixed
On the body 1；The cooling fin 21 is fixed on the hot end of semiconductor 22, and cooling fin 21 is located in heat dissipation chamber 12；The cooling piece
23 are fixed on the cold end of semiconductor 22, and cooling piece 23 is located in cooling chamber 11；The fixed hot wind on the body 1 of the Hot-air fan 3
At mouth 16；The cooling fan 4 is fixed in the cold air chamber 13 of main body 1；The upper cover plate 5 is fixed on the body 1, upper cover plate 5 with
It is sealed at the cooperation of main body 1, upper cover plate 5 is equipped with latticed air outlet；Support rubber 6 is fixed on the lower section of main body 1；USB connects
Mouth 7 connects Hot-air fans 3, cooling fan 4 and semiconductor cooling device 2.
Working principle of the present invention is:
Semiconductor refrigerating principle: referring to Fig. 4, working as the heat that one piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to
Heat transfer will be generated when having electric current to pass through in galvanic couple pair, between both ends, heat will be transferred to the other end from one end, thus
It generates the temperature difference and forms hot and cold side.
When radiator turn-on current, semiconductor cooling device work, Hot-air fan and cooling fan starting, Hot-air fan are driven
The indoor air that radiates flows, to take away the heat in semiconductor cooling device hot end, reduces semiconductor cooling device hot end temperature
Degree；Cooling fan drives cooling chamber and the flowing of cold air chamber's air, and outside air flows to cold air chamber by heat dissipation chamber, when outside air is logical
When crossing heat dissipation chamber, the heat in air is absorbed by semiconductor cooling device, and temperature reduction becomes Cryogenic air, and Cryogenic air passes through
Cold air outlet enters cold air chamber, and the indoor Cryogenic air of cold wind is blowed to notebook base by cooling fan, to reach notebook auxiliary
The purpose of cooling.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where not departing from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention, and any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (7)
1. a kind of notebook auxiliary radiating device, which is characterized in that including main body (1) and semiconductor cooling device (2)；Described half
Conductor refrigerating plant (2) shares 2, and is symmetricly set on main body (1) inner upper end；Between the semiconductor cooling device (2)
Equipped with Hot-air fan (3)；Main body (1) interior lower end is equipped with cooling fan (4).
2. notebook auxiliary radiating device according to claim 1, which is characterized in that further include upper cover plate (5), support rubber
Glue (6) and USB interface (7).
3. notebook auxiliary radiating device according to claim 1, which is characterized in that the main body (1) is equipped with cooling chamber
(11), heat dissipation chamber (12), cold air chamber (13), air inlet (14), cold air outlet (15) and hot-air mouth (16).
4. notebook auxiliary radiating device according to claim 3, which is characterized in that the cooling chamber (12) passes through cold wind
Mouth (15) is connected to cold air chamber (13), and is in communication with the outside by air inlet (14)；The heat dissipation chamber (13) passes through air inlet
(14) it is in communication with the outside with hot-air mouth (16)；The air inlet (14) and hot-air mouth (16) are reticular structure；The cooling chamber
(11) it is not connected to heat dissipation chamber (12).
5. notebook auxiliary radiating device according to claim 3, which is characterized in that the semiconductor cooling device (2)
It is equipped with cooling fin (21), semiconductor (22) and cooling piece (23)；The cooling fin (21) is fixed on the hot end of semiconductor (22),
And cooling fin (21) is located in heat dissipation chamber (12)；The cooling piece (23) is fixed on the cold end of semiconductor (22), and cooling piece
(23) it is located in cooling chamber (11).
6. notebook auxiliary radiating device according to claim 2, which is characterized in that the upper cover plate (5) is fixed on master
It on body (1), is sealed at the cooperation of upper cover plate (5) and main body (1), and upper cover plate (5) is equipped with latticed air outlet.
7. notebook auxiliary radiating device according to claim 2, which is characterized in that the support rubber (6) is fixed on
The lower section of main body (1)；USB interface (7) connection Hot-air fan (3), cooling fan (4) and semiconductor cooling device (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811184004.4A CN109375734A (en) | 2018-10-11 | 2018-10-11 | A kind of notebook auxiliary radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811184004.4A CN109375734A (en) | 2018-10-11 | 2018-10-11 | A kind of notebook auxiliary radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109375734A true CN109375734A (en) | 2019-02-22 |
Family
ID=65402973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811184004.4A Pending CN109375734A (en) | 2018-10-11 | 2018-10-11 | A kind of notebook auxiliary radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109375734A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111103954A (en) * | 2019-12-30 | 2020-05-05 | 黄冈师范学院 | Novel notebook computer heat dissipation frame |
| CN113741664A (en) * | 2021-08-04 | 2021-12-03 | 武汉造悟科技有限公司 | Protective heat dissipation device for Internet system equipment and use method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203482569U (en) * | 2013-09-13 | 2014-03-12 | 东华理工大学 | Radiating seat with function of temperature adjustability |
| CN206162362U (en) * | 2016-11-15 | 2017-05-10 | 滁州市拓海信息科技有限公司 | External radiator of computer that easily carries |
| CN206906973U (en) * | 2017-04-27 | 2018-01-19 | 西安交通大学 | A kind of semiconductor refrigerating heat dissipation pad for notebook computer |
-
2018
- 2018-10-11 CN CN201811184004.4A patent/CN109375734A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203482569U (en) * | 2013-09-13 | 2014-03-12 | 东华理工大学 | Radiating seat with function of temperature adjustability |
| CN206162362U (en) * | 2016-11-15 | 2017-05-10 | 滁州市拓海信息科技有限公司 | External radiator of computer that easily carries |
| CN206906973U (en) * | 2017-04-27 | 2018-01-19 | 西安交通大学 | A kind of semiconductor refrigerating heat dissipation pad for notebook computer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111103954A (en) * | 2019-12-30 | 2020-05-05 | 黄冈师范学院 | Novel notebook computer heat dissipation frame |
| CN113741664A (en) * | 2021-08-04 | 2021-12-03 | 武汉造悟科技有限公司 | Protective heat dissipation device for Internet system equipment and use method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190222 |