CN110513907B

CN110513907B - External-lap type heat dissipation device and temperature adjusting device

Info

Publication number: CN110513907B
Application number: CN201810497607.3A
Authority: CN
Inventors: 林文贤; 林建良
Original assignee: Cooler Master Co Ltd
Current assignee: Cooler Master Co Ltd
Priority date: 2018-05-22
Filing date: 2018-05-22
Publication date: 2022-01-25
Anticipated expiration: 2038-05-22
Also published as: CN110513907A

Abstract

An externally-mounted heat dissipation device is used for matching with a portable electronic device. The externally-mounted heat dissipation device comprises an air guide carrier and a refrigeration host. The wind guide carrier seat is provided with a bearing surface and at least one air outlet. The bearing surface is used for bearing the portable electronic device, and the at least one air outlet is positioned on the bearing surface. The refrigeration host comprises a shell, at least one refrigeration chip, a cold transmission set and a heat discharge set. The shell is provided with an accommodating space, and at least one air inlet, a first air outlet and a second air outlet which are communicated with the accommodating space. The first air outlet is communicated with the air outlet. The refrigerating chip is arranged in the accommodating space and is provided with a refrigerating surface and a heating surface which are opposite. The cold transmission set comprises a first liquid cooling plate and a first liquid cooling row which are communicated with each other. The first liquid cooling plate is in thermal contact with the refrigerating surface of the refrigerating chip. The heat removal unit comprises a second liquid cooling plate and a second liquid cooling row which are communicated with each other. The second liquid cooling plate is in thermal contact with the heating surface of the refrigeration chip.

Description

External-lap type heat dissipation device and temperature adjusting device

Technical Field

The present invention relates to an externally-mounted heat dissipation device and a temperature adjustment device, and more particularly, to an externally-mounted heat dissipation device and a temperature adjustment device capable of improving heat dissipation efficiency of a portable electronic device.

Background

With the change of computer use habits, notebook computers have become an important product type in the market. Because the notebook computer is small in size and convenient to carry, people often take the notebook computer to commute, do word processing in offices, surf the internet to watch articles or films in coffee shops, and possibly play games with three or five friends by using the notebook computer. If the user particularly requires the fluency or the screen fineness of the video game of the notebook computer, the notebook computer needs to be equipped with a higher-order processor and a higher-order display chip. However, the higher-order processor and display chip generate excessive waste heat, and the volume of the notebook computer is limited, which is not ideal in heat dissipation design.

Conventionally, some notebook computers have fans inside, which suck air from the bottom of the notebook computer and blow out the air from the side or the back of the notebook computer, so as to take away the waste heat inside the notebook computer by using airflow. However, the lower part of the notebook computer is usually tightly attached to the desktop, and in addition to being difficult to suck air, even if air is sucked, the cooling effect is limited because the air is only room temperature.

Disclosure of Invention

The invention provides an externally-mounted heat dissipation device and a temperature regulation device, so that portable electronic equipment can absorb air below room temperature, and further the heat dissipation problem of a notebook computer can be solved.

The externally-mounted heat dissipation device disclosed by the embodiment of the invention is used for matching with a portable electronic device. The externally-mounted heat dissipation device comprises an air guide carrier and a refrigeration host. The wind guide carrier seat is provided with a bearing surface and at least one air outlet. The bearing surface is used for bearing the portable electronic device, and the at least one air outlet is positioned on the bearing surface. The refrigeration host comprises a shell, at least one refrigeration chip, a cold transmission set and a heat discharge set. The shell is provided with an accommodating space, and at least one air inlet, a first air outlet and a second air outlet which are communicated with the accommodating space. The first air outlet is communicated with the air outlet. The refrigerating chip is arranged in the accommodating space and is provided with a refrigerating surface and a heating surface which are opposite. The cold transmission set comprises a first liquid cooling plate and a first liquid cooling row which are communicated with each other. The first liquid cooling plate is in thermal contact with the refrigerating surface of the refrigerating chip. The heat removal unit comprises a second liquid cooling plate and a second liquid cooling row which are communicated with each other. The second liquid cooling plate is in thermal contact with the heating surface of the refrigeration chip. The cooling chip, the first liquid cooling plate and the second liquid cooling plate divide the accommodating space into a cold chamber and a hot chamber, and the cold chamber and the hot chamber are respectively communicated with the first air outlet and the second air outlet.

The temperature adjusting device disclosed by another embodiment of the invention comprises a shell, at least one cooling chip, a power supply and a switch. The shell is provided with an accommodating space, and at least one air inlet and a first air outlet which are communicated with the accommodating space. The first air outlet is communicated with the air outlet. At least one refrigerating chip is arranged in the accommodating space and is provided with a refrigerating surface and a heating surface which are opposite. The at least one refrigeration chip has a first positive electrode and a first negative electrode. The power supply is located in the accommodating space and has a second positive electrode and a second negative electrode. The first positive pole and the first negative pole of the refrigeration chip are connected with the second positive pole and the second negative pole of the power supply through the change-over switch, and the connection relation among the first positive pole, the first negative pole, the second positive pole and the second negative pole is adjusted through the change-over of the change-over switch, so that cold air formed on the refrigeration surface of the refrigeration chip is blown to the first air outlet or hot air formed on the heating surface of the refrigeration chip is blown to the first air outlet.

According to the externally-overlapped heat dissipation device and the temperature adjusting device in the embodiment, the lower-layer space is divided into the cold chamber and the hot chamber through the refrigeration chip, the first liquid cooling plate and the second liquid cooling plate, so that hot air in the hot chamber is not easy to flow back to the cold chamber and the temperature of cold air in the cold chamber is not easy to rise. Therefore, the externally-mounted heat dissipation device can provide cold air with lower temperature for the portable electronic device, and further improve the heat dissipation effect of the externally-mounted heat dissipation device on the interior of the portable electronic device.

In addition, the power supply is connected with the refrigeration chip through the change-over switch, so that the change-over switch can switch the operation mode of the refrigeration chip, and the externally-mounted heat dissipation device can be used as a temperature adjustment device capable of providing cold air or warm air. For example, when cold air is required to cool the portable electronic device, the cold chamber is communicated with the first air outlet. On the contrary, when the ambient temperature is raised by heating, the mode of the refrigeration chip is switched to enable the hot chamber to be communicated with the first air outlet.

The foregoing description of the present disclosure and the following description of the embodiments are provided to illustrate and explain the principles of the present disclosure and to provide further explanation of the scope of the invention as claimed.

Drawings

Fig. 1 is an exploded view of a heat sink 10 according to a first embodiment of the present invention.

Fig. 2 is a perspective view of the hidden housing 210 of the refrigeration unit 200 of fig. 1.

Fig. 3 is a partially exploded view of fig. 2.

Fig. 4 is a cross-sectional view of the main cooling unit 200 and the air guide carrier 100 of the external heat sink 10 of fig. 1.

Wherein the reference numerals are:

10 externally-lapping type heat sink

100 wind guide carrier seat

110 base frame

120 additional circuit board

121 bearing surface

122 air outlet

130 pivot

200 refrigeration host

210 outer casing

211 base plate

212 front plate

2121 first air outlet

213 Back Panel

2131 second air outlet

214. 215 side plate

2141. 2151 air intake

216 Top plate

2161 Ventilation opening

220 diaphragm plate

230 refrigeration chip

231 first positive electrode

232 first cathode

233 refrigerating surface

234 heating surface

240 cold transfer group

241 first liquid cooling plate

242 first liquid cooling bank

243 first fan

250 heat removal set

251 second liquid cooling plate

252 second liquid cooling bank

253 second fan

260 wind scooper

261 fluid inlet

262 fluid outlet

270 power supply

271 second positive electrode

272 second negative electrode

280 change-over switch

S containing space

Su upper space

Sdawn lower layer space

Scold cold chamber

Shot hot chamber

Detailed Description

Please refer to fig. 1 to 4. Fig. 1 is an exploded view of a heat sink 10 according to a first embodiment of the present invention. Fig. 2 is a perspective view of the hidden housing 210 of the refrigeration unit 200 of fig. 1. Fig. 3 is a partially exploded view of fig. 2. Fig. 4 is a cross-sectional view of the main cooling unit 200 and the air guide carrier 100 of the external heat sink 10 of fig. 1.

The externally-mounted heat sink 10 of the present embodiment is used to cooperate with a portable electronic device (not shown). The portable electronic device, such as a notebook computer or a tablet computer, includes an external heat dissipation device 10 including an air guide base 100 and a cooling host 200.

The wind guide carrier 100 includes a base frame 110 and an additional circuit board 120. The additional circuit board 120 is pivoted to the base frame 110 by a pivot 130, so that the additional circuit board 120 has different inclined positions. The additional circuit board 120 has a carrying surface 121 and a plurality of air outlets 122. The carrying surface 121 is located on a side of the additional circuit board 120 away from the base frame 110 and is used for carrying the portable electronic device. The air outlets 122 are located on the carrying surface 121 and are arranged in several groups, for example, but not limited to.

In the present embodiment, the additional circuit board 120 is pivotally disposed on the base frame 110 through a pivot 130, but not limited thereto, and in other embodiments, the additional circuit board 120 may also be fixedly disposed on the base frame 110.

The cooling unit 200 includes a housing 210, a diaphragm 220, a plurality of cooling chips 230, a cooling unit 240, and a heat dissipating unit 250. The housing 210 is, for example, but not limited to, detachably assembled to the wind guide seat 100. The housing 210 includes a bottom plate 211, a front plate 212, a back plate 213, two

side plates

214, 215, and a top plate 216. The front plate 212, the back plate 213 and the two

side plates

214, 215 are respectively connected to different sides of the bottom plate 211, the front plate 212 and the back plate 213 are opposite to each other, and the two

side plates

214, 215 are opposite to each other. The top plate 216 is connected to the front plate 212, the back plate 213 and the two

side plates

214 and 215 at a side away from the bottom plate 211, so that the bottom plate 211, the top plate 216, the front plate 212, the back plate 213 and the two

side plates

214 and 215 together surround an accommodating space S.

The diaphragm 220 is disposed between the bottom plate 211 and the top plate 216 to divide the receiving space S into an upper space Sup and a lower space Sdown. The two

side plates

214 and 215 each have a plurality of

air inlets

2141 and 2151, and these

air inlets

2141 and 2151 communicate with the lower space Sdown. The front plate 212 has a plurality of first air outlets 2121, and the first air outlets 2121 communicate the lower space Sdown with the air outlets 122 of the additional circuit board 120. The back plate 213 has a plurality of second air outlets 2131, and the second air outlets 2131 communicate with the lower space Sdown. The top plate 216 has a vent port 2161 communicating with the upper space Sup.

The plurality of cooling chips 230 are located in the lower space Sdown, and the cooling chips 230 are electrically driven and respectively have a cooling surface 233 and a heating surface 234 opposite to each other. The cooling surface 233 provides cooling effect below room temperature, and the cooling chip 230 emits heat energy from the heating surface 234 after providing cooling effect.

In the present embodiment, the number of the cooling chips 230 is plural and is arranged along a straight line, but not limited thereto. In other embodiments, the number of cooling chips 230 may be only a single one.

The cold transfer set 240 is located in the lower space Sdown and includes a first liquid-cold plate 241 and a first liquid-cold row 242. The first liquid-cooled plate 241 is in thermal contact with the cooling surface 233 of the cooling chip 230, and the first liquid-cooled row 242 is interposed between the first liquid-cooled plate 241 and the first air outlet 2121. The first liquid-cooling plate 241 and the first liquid-cooling row 242 are used for accommodating cooling liquid, and the cooling liquid is pumped to form a cooling cycle inside the first liquid-cooling plate 241 and the first liquid-cooling row 242.

The heat discharging set 250 is located in the lower space Sdown and includes a second liquid-cooling plate 251 and a second liquid-cooling row 252. The second liquid cooling plate 251 is in thermal contact with the heat generating surface 234 of the refrigeration chip 230, and the second liquid cooling row 252 is disposed between the second liquid cooling plate 251 and the second air outlet 2131. The second liquid-cooling plate 251 and the second liquid-cooling row 252 are used for accommodating a cooling liquid, and the cooling liquid is pumped to form another cooling cycle in the second liquid-cooling plate 251 and the second liquid-cooling row 252.

In the present embodiment, the refrigeration chips 230 are sandwiched between the first liquid-cooling plate 241 and the second liquid-cooling plate 251, and the refrigeration chips 230, the first liquid-cooling plate 241 and the second liquid-cooling plate 251 divide the lower space Sdown into a cold chamber Scold and a hot chamber Shot. The cold chamber Scold and the hot chamber Shot are respectively communicated with the first air outlet 2121 and the second air outlet 2131. For example, when the cooling chip 230 is operating, the cooling surface 233 of the cooling chip 230 provides a cooling source, and the heating surface 234 of the cooling chip 230 dissipates waste heat, so that one side of the cooling chip 230 forms a cooling chamber Scold lower than the room temperature, and the other side of the cooling chip 230 forms a heating chamber Shot higher than the room temperature.

In addition, the cold transfer set 240 further includes a first fan 243, and the heat removal set 250 further includes a second fan 253. The first fan 243 is located in the cold chamber Scold and is configured to direct the airflow from the first liquid-cold plate 241 to the first air outlet 2121 after flowing through the first liquid-cold row 242. The second fan 253 is located in the hot chamber Shot and is used for guiding the airflow from the second liquid-cooled plate 251 to the second air outlet 2131 after flowing through the second liquid-cooled row 252.

The external heat dissipation device 10 further includes an air guiding cover 260. The wind scooper 260 has a fluid inlet 261 and a fluid outlet 262 opposite to each other. The size of the fluid inlet 261 is larger than that of the fluid outlet 262, and the fluid inlet 261 communicates with the cold chamber Scold and the fluid outlet 262 communicates with the air outlet 122. The wind scooper 260 is used to guide the cold air in the cold room below the room temperature into the wind guide seat 100.

The external heat dissipation device 10 further includes a power supply 270, and the power supply 270 is located in the upper space Sup and electrically connected to the cooling chips 230. In addition, the power supply 270 generates heat energy during operation, but the heat energy generated by the power supply 270 is blocked by the diaphragm 220, so that the influence of the heat energy generated by the power supply 270 on the temperature rise of the cold chamber Scold can be reduced. Furthermore, the heat energy from the power supply 270 can be dissipated to the outside of the cooling host through the air vent 2161 of the top plate 216, thereby reducing the temperature of the upper space Sup and reducing the heat efficiency of the power supply 270.

In the present embodiment, the power supply 270 discharges heat through the ventilation port 2161, instead of concentrating heat energy through the heat chamber Shot of the lower space Sdown, in order to reduce the heat discharge load of the heat discharge group 250 on the heat chamber Shot. Therefore, the high temperature can be prevented from affecting the cooling efficiency and cooling time of the cooling chip 230.

When the portable electronic device is mounted on the carrying surface 121 of the additional circuit board 120 and the portable electronic device needs to dissipate heat, the external heat dissipation device 10 can be turned on, so that the cooling chip 230, the first fan 243 and the second fan 253 start to operate. When the first fan 243 is operated, the cool air in the cold chamber Scold below the room temperature is guided to the first air outlet 2121 and then flows to the air outlet 122 of the additional circuit board 120. In this way, the portable electronic device mounted above the additional circuit board 120 can suck the cool air blown out from the air outlet 122 and lower than the room temperature, so as to dissipate the heat of the internal heat source of the portable electronic device. When the second fan 253 is operated, the hot air in the hot chamber Shot higher than the room temperature is discharged from the second air outlet 2131. Therefore, the hot air above the room temperature can be kept away from the portable electronic device as far as possible, which not only can prevent the portable electronic device from sucking the hot air above the room temperature by mistake, and further improve the heat dissipation effect of the external heat dissipation device 10 on the portable electronic device, but also can prevent the hot air discharged from the external heat dissipation device 10 from blowing to the user.

In this embodiment, the refrigeration chip 230, the first liquid cooling plate 241 and the second liquid cooling plate 251 divide the lower layer space Sdown into the cold chamber Scold and the hot chamber Shot, so that the hot air in the hot chamber Shot is less likely to flow back to the cold chamber Scold and is less likely to cause the temperature rise of the cold air in the cold chamber Scold. Therefore, the external heat sink 10 can provide cool air with a lower temperature to the portable electronic device, thereby improving the heat dissipation effect of the external heat sink to the inside of the portable electronic device.

Please refer to fig. 5 and fig. 6. Fig. 5 is a schematic connection diagram of a power supply, a switch and a cooling chip of the externally-mounted heat dissipation device of fig. 1. Fig. 6 is a schematic cross-sectional view of the refrigeration chip of fig. 4 in another state. In the present embodiment, the refrigeration host 200 further includes a switch 280. The switch 280 is used for switching the operation modules of the cooling chip 230, besides controlling the power supply 270 to be turned on or off. In detail, at least one of the refrigeration chips 230 has a first positive electrode 231 and a first negative electrode 232. The power supply 270 has a second positive electrode 271 and a second negative electrode 272. The second positive electrode 271 and the second negative electrode 272 of the power supply 270 are connected to the first positive electrode 231 and the first negative electrode 232 of the refrigeration chip 230 through the switch 280. The switch 280 has a first switching state and a second switching state.

As shown in fig. 4 and 5, when the switch 280 is in the first switching state, the second positive electrode 271 and the second negative electrode 272 of the power supply 270 are respectively connected to the first positive electrode 231 and the first negative electrode 232 of the refrigeration chip 230, so that the refrigeration surface 233 and the heat-generating surface 234 of the refrigeration chip 230 respectively face the first air outlet 2121 and the second air outlet 2131 (as shown in fig. 4). That is, when the switch 280 is in the first switching state, the cooling host 200 can perform the function of cooling the portable electronic device.

On the contrary, if the portable electronic device does not need to be cooled, the switch 280 is switched to the second switching state as shown in fig. 5 and 6. At this time, the second positive electrode 271 and the second negative electrode 272 of the power supply 270 are respectively connected to the first negative electrode 232 and the first positive electrode 231 of the refrigeration chip 230, so that the positions of the cooling surface 233 and the heating surface 234 of the refrigeration chip 230 are reversed, the cooling surface 233 of the refrigeration chip 230 faces the second air outlet 2131, and the heating surface 234 of the refrigeration chip 230 faces the first air outlet 2121 (as shown in fig. 6). That is, when the switch 280 is in the second switching state, the cooling host 200 becomes a heating machine, and can provide warm air for warming a user in a cold environment. That is, the refrigeration chip, the first liquid cooling plate and the second liquid cooling plate divide the lower space Sdown into a first chamber and a second chamber, and the first chamber and the second chamber are changed into a cold chamber or a hot chamber according to the switching state of the switch.

As can be seen from the above, the cooling main unit 200 can selectively provide cold air for cooling the portable electronic device or provide hot air for avoiding cold by the user due to the switch 280, so that the cooling main unit 200 becomes a temperature adjustment device.

Although the present invention has been described with reference to the foregoing embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. An externally-mounted heat dissipation device for use with a portable electronic device, the externally-mounted heat dissipation device comprising:

the air guide carrier seat is provided with a bearing surface and at least one air outlet, the bearing surface is used for bearing the portable electronic device, and the at least one air outlet is positioned on the bearing surface; and

a refrigeration host, comprising:

the shell is provided with an accommodating space, at least one air inlet, a first air outlet and a second air outlet, wherein the air inlet, the first air outlet and the second air outlet are communicated with the accommodating space;

at least one refrigerating chip, which is positioned in the accommodating space and is provided with a refrigerating surface and a heating surface which are opposite, wherein the at least one refrigerating chip is provided with a first positive electrode and a first negative electrode;

a power supply device located in the containing space and having a second anode and a second cathode;

the first positive pole and the first negative pole of the refrigeration chip are connected with the second positive pole and the second negative pole of the power supply through the change-over switch, and the connection relation among the first positive pole, the first negative pole, the second positive pole and the second negative pole is adjusted through the change-over of the change-over switch, so that cold air formed on the refrigeration surface of the refrigeration chip is blown to the first air outlet or hot air formed on the heating surface of the refrigeration chip is blown to the first air outlet;

the cold transmission set comprises a first liquid cooling plate and a first liquid cooling row which are communicated, and the first liquid cooling plate is in thermal contact with the refrigerating surface of the refrigerating chip; and

the heat discharge group comprises a second liquid cooling plate and a second liquid cooling row which are communicated, and the second liquid cooling plate is in thermal contact with the heating surface of the refrigeration chip;

the cooling chip, the first liquid cooling plate and the second liquid cooling plate divide the accommodating space into a cold chamber and a hot chamber, and the cold chamber and the hot chamber are respectively communicated with the first air outlet and the second air outlet; the cold transfer set further comprises a first fan, the first fan is positioned in the cold chamber and is used for guiding air to flow through the first air outlet and flow to the air outlet;

the heat removal set further includes a second fan located in the hot chamber and used for guiding the airflow to the second air outlet.

2. The externally-mounted heat dissipating device according to claim 1, wherein the main cooling unit further comprises a transverse partition and a power supply, the transverse partition is located in the accommodating space to divide the accommodating space into an upper space and a lower space, the power supply is located in the upper space and electrically connected to the cooling chip, the cold transfer set and the heat removal set are located in the lower space, and the cooling chip, the first liquid-cooling plate and the second liquid-cooling plate stand in the lower space to divide the lower space into the cold chamber and the hot chamber.

3. The externally-connected heat sink according to claim 2, wherein the housing comprises a bottom plate, a front plate, a back plate, two side plates and a top plate, the front plate, the back plate and the two side plates are respectively connected to different sides of the bottom plate, the front plate and the back plate are opposite to each other, the two side plates are opposite to each other, the top plate is connected to one side of the front plate, the back plate and the two side plates away from the bottom plate, so that the bottom plate, the top plate, the front plate, the back plate and the two side plates jointly surround the accommodating space, the transverse partition plate is disposed between the bottom plate and the top plate to divide the accommodating space into the upper space and the lower space, the at least one air inlet is disposed on one of the side plates, the first air outlet is disposed on the front plate, and the second air outlet is disposed on the back plate.

4. The externally-mounted heat sink as claimed in claim 3, wherein the top plate has a ventilation opening, and the ventilation opening is connected to the upper space.

5. The externally-mounted heat dissipation device of claim 1, wherein the main refrigeration unit further comprises an air guiding cover, the air guiding cover has a fluid inlet and a fluid outlet opposite to each other, the fluid inlet is larger than the fluid outlet in size, the fluid inlet is communicated with the cold chamber, and the fluid outlet is communicated with the air outlet.

6. The externally-mounted heat sink as claimed in claim 1, wherein the housing of the cooling main unit is detachably assembled to the air guide seat.

7. The externally-mounted heat dissipation device as claimed in claim 1, wherein the wind-guiding carrier comprises a base frame and an additional circuit board, the additional circuit board is pivotally mounted on the base frame to make the additional circuit board have different inclined positions, and the carrying surface is located on a side of the additional circuit board away from the base frame.

8. The externally-mounted heat sink according to claim 1, wherein the number of the at least one refrigeration chip is plural, and the refrigeration chips are arranged along a straight line and are all sandwiched between the first liquid-cooling plate and the second liquid-cooling plate.

9. A thermostat, comprising:

the air guide carrier seat is provided with a bearing surface and at least one air outlet, the bearing surface is used for bearing a portable electronic device, and the at least one air outlet is positioned on the bearing surface;

the shell is provided with an accommodating space, at least one air inlet, a first air outlet and a second air outlet, wherein the at least one air inlet, the first air outlet and the second air outlet are communicated with the accommodating space;

a power supply device located in the containing space and having a second anode and a second cathode; and

the first positive pole and the first negative pole of the refrigeration chip are connected with the second positive pole and the second negative pole of the power supply through the change-over switch, and the connection relation among the first positive pole, the first negative pole, the second positive pole and the second negative pole is adjusted through the change-over of the change-over switch, so that cold air formed on the refrigeration surface of the refrigeration chip is blown to the first air outlet or hot air formed on the heating surface of the refrigeration chip is blown to the first air outlet; the heat dissipation assembly comprises a first liquid cooling plate and a first liquid cooling row which are communicated with each other, the first liquid cooling plate is in thermal contact with the refrigerating surface of the refrigerating chip, the heat dissipation assembly comprises a second liquid cooling plate and a second liquid cooling row which are communicated with each other, the second liquid cooling plate is in thermal contact with the heating surface of the refrigerating chip, the first liquid cooling plate and the second liquid cooling plate divide the accommodating space into a first chamber and a second chamber, and the first chamber and the second chamber are respectively communicated with the first air outlet and the second air outlet; the cold transfer set further comprises a first fan, the first fan is located in the first chamber and is used for guiding the airflow to flow to the first air outlet;

the heat removal set further includes a second fan located in the second chamber and used for guiding the airflow to the second air outlet.

10. The temperature regulating device according to claim 9, further comprising a refrigeration host, wherein the refrigeration host further comprises a diaphragm and a power supply, the diaphragm is located in the accommodating space to divide the accommodating space into an upper space and a lower space, the power supply is located in the upper space and electrically connected to the refrigeration chip, the cold transfer set and the heat removal set are located in the lower space, and the refrigeration chip, the first liquid-cooling plate and the second liquid-cooling plate stand in the lower space to divide the lower space into the first chamber and the second chamber.

11. The temperature control device as claimed in claim 10, wherein the housing comprises a bottom plate, a front plate, a back plate, two side plates and a top plate, the front plate, the back plate and the two side plates are respectively connected to different sides of the bottom plate, the front plate and the back plate are opposite to each other, the two side plates are opposite to each other, the top plate is connected to one side of the front plate, the back plate and the two side plates away from the bottom plate, so that the bottom plate, the top plate, the front plate, the back plate and the two side plates jointly surround the accommodating space, the cross partition is disposed between the bottom plate and the top plate to divide the accommodating space into the upper space and the lower space, the at least one air inlet is located in one of the side plates, the first air outlet is located in the front plate, and the second air outlet is located in the back plate.

12. The thermostat of claim 11, wherein the top plate has a vent opening communicating with the upper space.

13. The thermostat of claim 12, wherein the first liquid cooling bank is interposed between the first liquid cooling plate and the first fan.

14. The thermostat of claim 12, wherein the second liquid cooling bank is interposed between the second liquid cooling plate and the second fan.

15. The thermostat of claim 9, wherein the number of the at least one refrigeration chip is plural, and the refrigeration chips are arranged in a line and are all sandwiched between the first liquid-cooled plate and the second liquid-cooled plate.

16. The temperature conditioning device of claim 9, further comprising a wind scooper having a fluid inlet and a fluid outlet opposite to each other, the fluid inlet being larger in size than the fluid outlet, the fluid inlet communicating with the first chamber, and the fluid outlet communicating with the first air outlet.