CN110513907A - Formula radiator and register are taken outside - Google Patents
Formula radiator and register are taken outside Download PDFInfo
- Publication number
- CN110513907A CN110513907A CN201810497607.3A CN201810497607A CN110513907A CN 110513907 A CN110513907 A CN 110513907A CN 201810497607 A CN201810497607 A CN 201810497607A CN 110513907 A CN110513907 A CN 110513907A
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- CN
- China
- Prior art keywords
- plate
- liquid cooling
- gas outlet
- chip
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
Abstract
Formula radiator is taken outside a kind of, to a portable electronic devices of arranging in pairs or groups.Taking formula radiator outside includes that a wind-guiding carries seat and a refrigeration host computer.Wind-guiding, which carries seat tool, a loading end and at least an air outlet.Loading end is to carry the portable electronic devices, and at least an air outlet is located at the loading end for this.Refrigeration host computer includes a shell, at least a cooling chip, a cold biography group and a heat extraction group.Shell has an accommodating space and is connected to an at least air inlet and one first gas outlet and one second gas outlet of the accommodating space.First gas outlet is connected to the air outlet.Cooling chip is located at accommodating space and has opposite consistent huyashi-chuuka (cold chinese-style noodles) and a heating surface.Cold biography group includes be connected one first liquid cooling plate and one first liquid cooling row.First liquid cooling plate is thermally contacted in the refrigeration face of the cooling chip.Heat extraction group includes be connected one second liquid cooling plate and one second liquid cooling row.Second liquid cooling plate is thermally contacted in the heating surface of the cooling chip.
Description
Technical field
The present invention can be improved portable electronic dress about formula radiator and register, especially one kind is taken outside one kind
It sets the outer of radiating efficiency and takes formula radiator and register.
Background technique
With the change of people's computer use habit, laptop has become critically important product class on the market
Type.Due to small in size and be convenient for carrying, people's laptop can usually commute with laptop, do a little words in office
Processing, sees a little articles or film in cafe online, it is also possible to several electronic game trips are played with laptop with several friends
Play.If user specially requires laptop in the fluency or picture fineness of video game, need pen
Remember the standby processor and display chip for matching higher order of this computer.But the processor of higher order and display chip are along with generation
The problem of excessive waste heat, and the volume of laptop is restricted, it is often not ideal enough in heat dissipation design.
Traditionally, the interior design of some laptops has fan, by the lower section draw air of laptop, then by
Side or rear blow out air are taken out of the waste heat inside laptop using air-flow.But the lower section of laptop is logical
Often it is close to desktop, other than being not easy to be drawn to air, even if being drawn to air, also makes cooling effect because air is only room temperature
Fruit is limited.
Summary of the invention
The invention reside in providing to take formula radiator and register outside one kind so that portable electronic device be drawn to it is low
In the air of room temperature, and then it is more conducive to solve the heat dissipation problem of laptop.
Formula radiator is taken outside one embodiment of the invention is revealed, to a portable electronic devices of arranging in pairs or groups.It takes outside
Formula radiator includes that a wind-guiding carries seat and a refrigeration host computer.Wind-guiding, which carries seat tool, a loading end and at least an air outlet.Carrying
Face is to carry the portable electronic devices, and at least an air outlet is located at the loading end for this.Refrigeration host computer includes a shell, at least
One cooling chip, a cold biography group and a heat extraction group.Shell has an accommodating space and is connected to an at least air inlet for the accommodating space
Mouth and one first gas outlet and one second gas outlet.First gas outlet is connected to the air outlet.Cooling chip is located at accommodating space
And there is opposite consistent huyashi-chuuka (cold chinese-style noodles) and a heating surface.Cold biography group includes be connected one first liquid cooling plate and one first liquid cooling row.It should
First liquid cooling plate is thermally contacted in the refrigeration face of the cooling chip.Heat extraction group includes be connected one second liquid cooling plate and one second liquid
Cold row.Second liquid cooling plate is thermally contacted in the heating surface of the cooling chip.Wherein, the cooling chip, first liquid cooling plate and
The accommodating space is distinguished a cold house and a hot cell by second liquid cooling plate, and the cold house and the hot cell are respectively communicated with first outlet
Mouth and second gas outlet.
The revealed register of another embodiment of the present invention is supplied comprising a shell, at least a cooling chip, a power supply
Answer device and a switching switch.Shell has an accommodating space and is connected at least air inlet and one first outlet of the accommodating space
Mouthful.First gas outlet is connected to the air outlet.An at least cooling chip is located at the accommodating space and has opposite consistent huyashi-chuuka (cold chinese-style noodles)
An and heating surface.An at least cooling chip has one first anode and one first cathode.Power supply unit is located at accommodating sky
Between, and there is one second anode and one second cathode.First anode of the cooling chip passes through the switching with first cathode
Switch is connected to second anode and second cathode of the power supply unit, and adjusts this by switching that the switching switchs
The connection relationship of first anode, first cathode, second anode, second cathode, and enable the refrigeration face of the cooling chip
Be formed by cold air blow to first gas outlet or enable the heating surface of the cooling chip be formed by hot-air blow to this
One gas outlet.
Outer according to above-described embodiment takes formula radiator and register, passes through cooling chip, the first liquid cooling plate and
Lower layer space is distinguished cold house and hot cell by two liquid cooling plates, so that, the indoor hot-air of heat is less susceptible to be back to cold house and be not easy
Cause cold indoor cold air heating.In this way, which taking formula radiator outside is capable of providing the cold air of more low temperature to portable
Electronic device, and then formula radiator is taken to the heat dissipation effect inside portable electronic devices outside promotion.
In addition, being connected between power supply unit and cooling chip by switching switch, so that switching switchs changeable refrigeration core
The operation mode of piece, and then allow and take formula radiator outside and can be used as the register that can provide cold air or heating.Citing comes
It says, when needing cold air to cool down portable electronic devices, then cold house is allowed to be connected to the first gas outlet.Conversely, when needing heating
When promoting environment temperature, then switch the mode of cooling chip, is changed to that hot cell is allowed to be connected to the first gas outlet.
The explanation of explanation and following implementation above with respect to the content of present invention is to demonstrate and explain original of the invention
Reason, and patent claim of the invention is provided and is further explained.
Detailed description of the invention
Fig. 1 is the outer decomposition diagram for taking formula radiator 10 according to first embodiment of the invention.
Fig. 2 is that the refrigeration host computer 200 of Fig. 1 hides the stereoscopic schematic diagram of shell 210.
Fig. 3 is the partial exploded view of Fig. 2.
Section when the outer refrigeration host computer 200 for taking formula radiator 10 that Fig. 4 is Fig. 1 carries 100 phase group of seat with wind-guiding is illustrated
Figure.
Wherein appended drawing reference are as follows:
Formula radiator is taken outside 10
100 wind-guidings carry seat
110 pedestals
120 additional circuit boards
121 loading ends
122 air outlets
130 pivots
200 refrigeration host computers
210 shells
211 bottom plates
212 foreboards
2121 first gas outlets
213 backboards
2131 second gas outlets
214,215 side plate
2141,2151 air inlet
216 top plates
2161 ventilation mouths
220 diaphragm plates
230 cooling chips
231 first anodes
232 first cathode
233 refrigeration faces
234 heating surfaces
240 cold biography groups
241 first liquid cooling plates
242 first liquid coolings row
243 first fans
250 heat extraction groups
251 second liquid cooling plates
252 second liquid coolings row
253 second fans
260 wind scoopers
261 fluid inlets
262 fluid outlets
270 power supply units
271 second anodes
272 second cathode
280 switching switches
S accommodating space
Sup upper space
Sdown lower layer space
The cold house Scold
The hot cell Shot
Specific embodiment
It please refers to Fig.1 to Fig.4.Fig. 1 is the outer decomposition for taking formula radiator 10 according to first embodiment of the invention
Schematic diagram.Fig. 2 is that the refrigeration host computer 200 of Fig. 1 hides the stereoscopic schematic diagram of shell 210.Fig. 3 is the partial exploded view of Fig. 2.
The outer refrigeration host computer 200 for taking formula radiator 10 that Fig. 4 is Fig. 1 carries diagrammatic cross-section when 100 phase group of seat with wind-guiding.
The outer of the present embodiment takes formula radiator 10, (is not painted) to a portable electronic devices of arranging in pairs or groups.Portable electricity
Sub-device is, for example, to take formula radiator 10 outside laptop or tablet computer to carry seat 100 and a refrigeration master comprising a wind-guiding
Machine 200.
It includes a pedestal 110 and an additional circuit boards 120 that wind-guiding, which carries seat 100,.Additional circuit boards 120 pass through a pivot 130
It is hubbed at pedestal 110, to enable additional circuit boards 120 that there is different obliquity.Additional circuit boards 120 have a loading end 121
And multiple air outlets 122.Loading end 121 is located at side of the additional circuit boards 120 far from pedestal 110 and to carry portable electricity
Sub-device.These air outlets 122 are located at loading end 121, and such as, but not limited to array type arranges.
In the present embodiment, additional circuit boards 120 are hubbed at pedestal 110 by a pivot 130, but are not limited thereto,
In other embodiments, additional circuit boards 120 can also be fixedly arranged on pedestal 110.
Refrigeration host computer 200 includes a shell 210, a diaphragm plate 220, multiple cooling chips 230, a cold biography group 240 and one
Heat extraction group 250.Shell 210 is such as, but not limited to separably assembled in wind-guiding and carries seat 100.Shell 210 include a bottom plate 211,
One foreboard 212, a backboard 213, two side plates 214,215 and a top plate 216.214,215 points of foreboard 212, backboard 213 and two side plates
Be not connected to the phase heteropleural of bottom plate 211, and foreboard 212 and backboard 213 opposite to each other and two side plates 214,215 opposite to each other.
Top plate 216 connects foreboard 212,214,215 side far from bottom plate 211 of backboard 213 and two side plates, to enable bottom plate 211, top plate
216, foreboard 212, backboard 213 and two side plates 214,215 are jointly around an accommodating space S out.
Diaphragm plate 220 between bottom plate 211 and top plate 216, by accommodating space S be distinguished into a upper space Sup and
One lower layer space Sdown.Two side plates 214,215 respectively have multiple air inlets 2141,2151, these air inlets 2141,2151 connect
Logical lower layer space Sdown.Foreboard 212 has multiple first gas outlets 2121, these first gas outlets 2121 are connected to lower layer space
These air outlets 122 of Sdown and additional circuit boards 120.Backboard 213 has multiple second gas outlets 2131, these second go out
Port 2131 is connected to lower layer space Sdown.Top plate 216 has a ventilation mouth 2161, is connected to upper space Sup.
Multiple cooling chips 230 are located at lower layer space Sdown, and these cooling chips 230 by electric drive respectively to be had
There are opposite consistent huyashi-chuuka (cold chinese-style noodles) 233 and a heating surface 234.Refrigeration face 233 is lower than the cooling effect of room temperature, and refrigeration core to provide
Piece 230 can give out thermal energy in heating surface 234 after providing cooling effect.
In the present embodiment, the quantity of cooling chip 230 is multiple, and along arranged in a straight line, but be not limited thereto.In
In other embodiments, the quantity of cooling chip 230 be may also be only individually.
Cold biography group 240 is located at lower layer space Sdown, and includes be connected one first liquid cooling plate 241 and one first liquid cooling row
242.The thermo-contact of first liquid cooling plate 241 is in the refrigeration face of cooling chip 230 233, and the first liquid cooling row 242 is between the first liquid cooling plate
241 and first between gas outlet 2121.First liquid cooling plate 241 and the first liquid cooling row 242 are to accommodate coolant liquid, and coolant liquid example
Such as a cooling cycle is formed in the first liquid cooling plate 241 and 242 inside of the first liquid cooling row by pumping driving.
Heat extraction group 250 is located at lower layer space Sdown, and includes be connected one second liquid cooling plate 251 and one second liquid cooling row
252.The thermo-contact of second liquid cooling plate 251 is in the heating surface 234 of cooling chip 230, and the second liquid cooling row 252 is between the second liquid cooling plate
251 and second between gas outlet 2131.Second liquid cooling plate 251 and the second liquid cooling row 252 are to accommodate coolant liquid, and coolant liquid example
Such as another cooling cycle is formed in the second liquid cooling plate 251 and 252 inside of the second liquid cooling row by pumping driving.
In the present embodiment, these cooling chips 230 are located between the first liquid cooling plate 241 and the second liquid cooling plate 251, and
A cold house Scold is distinguished in the space lower layer space Sdown by cooling chip 230, the first liquid cooling plate 241 and the second liquid cooling plate 251
An and hot cell Shot.Cold house Scold and hot cell Shot are respectively communicated with the first gas outlet 2121 and the second gas outlet 2131.Citing comes
It says, when cooling chip 230 operates, the refrigeration face 233 of cooling chip 230 can provide the fever of cold source and cooling chip 230
Face 234 can distribute waste heat, so that the side of cooling chip 230 will form the cold house Scold and cooling chip lower than room temperature
230 other side will form the hot cell Shot higher than room temperature.
In addition, cold biography group 240 further includes one first fan 243 and heat extraction group 250 further includes one second fan 253.The
One fan 243 is located at cold house Scold, and flows to again to guide after air-flow flows through the first liquid cooling row 242 from the first liquid cooling plate 241
First gas outlet 2121.Second fan 253 is located at hot cell Shot, and flows through second from the second liquid cooling plate 251 to guide air-flow
The second gas outlet 2131 is flowed to again after liquid cooling row 252.
Taking formula radiator 10 further includes a wind scooper 260 outside.Wind scooper 260 have an opposite fluid inlet 261 and
One fluid outlet 262.The size of fluid inlet 261 is greater than the size of fluid outlet 262, and fluid inlet 261 is connected to cold house
Scold and fluid outlet 262 are connected to air outlet 122.Wind scooper 260 is to import the cold air for being lower than room temperature in cold house
Wind-guiding carries seat 100.
Taking formula radiator 10 further includes a power supply unit 270 outside, and power supply unit 270 is located at upper space Sup, and
It is electrically connected at these cooling chips 230.In addition, power supply unit 270 can issue thermal energy when operating, but because of power supply unit
270 thermal energy issued will receive the barrier of diaphragm plate 220, therefore the thermal energy pair that power supply unit capable of reducing power source 270 is issued
The heating of cold house Scold influences.Furthermore the thermal energy that power supply unit 270 is issued can pass through the ventilation mouth 2161 of top plate 216
It dissipates to outside refrigeration host, reduces the temperature of upper space Sup whereby and reduce the probability that 270 heat of power supply unit is worked as.
In the present embodiment, power supply unit 270 is rather than centralized heat energy to be passed through lower layer by 2161 heat extraction of ventilation mouth
The hot cell Shot heat extraction of space S down is the heat extraction burden in order to mitigate heat extraction group 250 to hot cell Shot.In this way, will
Avoidable high temperature influences freezing capacity and the refrigeration time of cooling chip 230.
It needs to dissipate when portable electronic devices are set up in the loading end 121 of additional circuit boards 120 and portable electronic devices
When hot, it can be opened formula radiator 10 is taken outside, cooling chip 230, the first fan 243 and the second fan 253 is made to start running.
After the cold air that be lower than room temperature in cold house Scold being directed to the first gas outlet 2121 when the operating of the first fan 243, then flow
To the air outlet 122 of additional circuit boards 120.In this way, be set up in the portable electronic devices of 120 top of additional circuit boards just
The cold air lower than room temperature that air outlet 122 can be blown out sucks, to radiate to portable electronic devices internal heat resource.Again
The hot-air that be higher than room temperature in the Shot of hot cell can be discharged from the second gas outlet 2131 when the second fan 253 fortune by person.Such one
Come, the hot-air that can will be above room temperature is away as far as possible portable electronic devices, misses in addition to can avoid portable electronic devices
Sucking is higher than the hot-air of room temperature, and then is further promoted and take formula radiator 10 to the heat dissipation effect of portable electronic devices outside
Except, it is more avoidable that taking the hot wind that formula radiator 10 gives off blows to user outside.
In the present embodiment, by cooling chip 230, the first liquid cooling plate 241 and the second liquid cooling plate 251 by lower layer space
Sdown distinguishes in space cold house Scold and hot cell Shot, so that, the hot-air in the Shot of hot cell is less susceptible to be back to cold house
Scold is without easily causing the cold air in cold house Scold to heat up.In this way, take outside formula radiator 10 be capable of providing it is lower
The cold air of temperature promotes outer formula radiator of taking and imitates to the heat dissipation inside portable electronic devices to portable electronic devices
Fruit.
Please refer to Fig. 5 and Fig. 6.The outer power supply unit for taking formula radiator, switching switch and the refrigeration core that Fig. 5 is Fig. 1
The connection schematic diagram of piece.The cooling chip that Fig. 6 is Fig. 4 is in diagrammatic cross-section when another state.In the present embodiment, freeze
Host 200 further includes a switching switch 280.Switching switch 280 is in addition to opening or closing it to control power supply unit 270
Outside, module more is operated to switch cooling chip 230.Specifically, an at least cooling chip 230 has one first anode 231
And one first cathode 232.Power supply unit 270 has one second anode 271 and one second cathode 272.Power supply unit 270
The first anode 231 and first that second anode 271 and the second cathode 272 are connected to cooling chip 230 by switching switch 280 is negative
Pole 232.Switching switch 280 has the first switching state and the second switching state.
As shown in figs. 4 and 5, when switching switch 280 is in the first switching state, the second of power supply unit 270 is just
Pole 271 and the second cathode 272 are connected to the first anode 231 and the first cathode 232 of cooling chip 230, to make cold core
The refrigeration face 233 of piece 230 and heating surface 234 are respectively for the first gas outlet 2121 and the second gas outlet 2131 (as shown in Figure 4).
That is, refrigeration host computer 200 can play its and cool down portable electronic dress when switching switch 280 is in the first switching state
The function set.
Conversely, if as shown in figs. 5 and 6, switching switch 280 is switched to when without cooling portable electronic devices
Second switching state.At this point, the second anode 271 of power supply unit 270 and the second cathode 272 are connected to cooling chip
230 the first cathode 232 and the first anode 231, to enable the refrigeration face 233 of cooling chip 230 and the position pair of heating surface 234
It adjusts, and allows heating surface 234 face of the refrigeration face 233 of cooling chip 230 towards the second gas outlet 2131 and cooling chip 230
To the first gas outlet 2121 (as shown in Figure 6).That is, when switching switch 280 is in the second switching state, refrigeration host computer
200 become warming machine, and the heating of warm user can be provided in cold environment.That is, by cooling chip, first
Lower layer space Sdown is distinguished first chamber and second chamber by liquid cooling plate and the second liquid cooling plate, and first chamber and the second chamber
Switching state of the room then according to switching switch becomes cold house or hot cell.
From the foregoing, it is cold for portable electronic devices that offer cold air may be selected because switching switch 280 for refrigeration host computer 200
But or hot gas is provided to go to a winter resort for user, so that refrigeration host computer 200 becomes register.
Outer according to above-described embodiment takes formula radiator and register, passes through cooling chip, the first liquid cooling plate and
Lower layer space is distinguished cold house and hot cell by two liquid cooling plates, so that, the indoor hot-air of heat is less susceptible to be back to cold house and be not easy
Cause cold indoor cold air heating.In this way, which taking formula radiator outside is capable of providing the cold air of more low temperature to portable
Electronic device, and then formula radiator is taken to the heat dissipation effect inside portable electronic devices outside promotion.
In addition, being connected between power supply unit and cooling chip by switching switch, so that switching switchs changeable refrigeration core
The operation mode of piece, and then allow and take formula radiator outside and can be used as the register that can provide cold air or heating.Citing comes
It says, when needing cold air to cool down portable electronic devices, then cold house is allowed to be connected to the first gas outlet.Conversely, when needing heating
When promoting environment temperature, then switch the mode of cooling chip, is changed to that hot cell is allowed to be connected to the first gas outlet.
Although the present invention is disclosed as above with all embodiment above-mentioned, however, it is not to limit the invention, any to be familiar with
Alike those skilled in the art, without departing from the spirit and scope of the present invention, when can make some changes and embellishment, thus it is of the invention special
Sharp protection scope must regard subject to this specification the attached claims institute defender.
Claims (21)
1. formula radiator is taken a kind of outer, to a portable electronic devices of arranging in pairs or groups, which is characterized in that this is outer to take formula radiator
Include:
One wind-guiding carries seat, has a loading end and an at least air outlet, which, should to carry the portable electronic devices
At least an air outlet is located at the loading end；And
One refrigeration host computer includes:
One shell has an accommodating space and is connected to an at least air inlet and one first gas outlet and one second of the accommodating space
Gas outlet, first gas outlet are connected to the air outlet；
An at least cooling chip positioned at the accommodating space and has opposite consistent huyashi-chuuka (cold chinese-style noodles) and a heating surface；
One cold biography group, comprising one first liquid cooling plate and the one first liquid cooling row of being connected, first liquid cooling plate thermo-contact is in the refrigeration
The refrigeration face of chip；And
One heat extraction group, comprising one second liquid cooling plate and the one second liquid cooling row of being connected, second liquid cooling plate thermo-contact is in the refrigeration
The heating surface of chip；
Wherein, which is distinguished a cold house and a heat by the cooling chip, first liquid cooling plate and second liquid cooling plate
Room, the cold house and the hot cell are respectively communicated with first gas outlet and second gas outlet.
2. taking formula radiator outside as described in claim 1, which is characterized in that the refrigeration host computer further includes a diaphragm plate and one
Power supply unit, the diaphragm plate are located at the accommodating space and the accommodating space are distinguished into a upper space and a lower layer space,
The power supply unit is located at the upper space, and is electrically connected the cooling chip, the cooling chip, the cold biography group and the heat extraction group
Positioned at the lower layer space, and the cooling chip, first liquid cooling plate and second liquid cooling plate are stood in the lower layer space, should
Lower layer space distinguishes the cold house and the hot cell.
3. taking formula radiator outside as claimed in claim 2, which is characterized in that the shell includes a bottom plate, a foreboard, a back
Plate, two side plates and a top plate, the foreboard, the backboard and two side plate are connected to the phase heteropleural of the bottom plate, and the foreboard with
The backboard is relative to each other and two side plate is relative to each other, which connects the foreboard, the backboard and two side plate far from the bottom
The side of plate, to enable the bottom plate, the top plate, the foreboard, the backboard and two side plate surround out the accommodating space jointly, the tabula
Plate is distinguished into the upper space and the lower layer space between the bottom plate and the top plate, by the accommodating space, this at least one
Air inlet is located therein the side plate, which is located at the foreboard, which is located at the backboard.
4. taking formula radiator outside as claimed in claim 3, which is characterized in that the top plate has a ventilation mouth, the ventilation mouth
It is connected to the upper space.
5. taking formula radiator outside as described in claim 1, which is characterized in that the refrigeration host computer further includes a wind scooper, should
Wind scooper has opposite a fluid inlet and a fluid outlet, and the size of the fluid inlet is greater than the size of the fluid outlet,
And the fluid inlet is connected to the cold house and the fluid outlet is connected to the air outlet.
6. taking formula radiator outside as described in claim 1, which is characterized in that the cold biography group further includes one first fan, should
First fan is located at the cold house, and flows to the air outlet through first gas outlet to guide air-flow.
7. taking formula radiator outside as claimed in claim 6, which is characterized in that the heat extraction group further includes one second fan, should
Second fan is located at the hot cell, and to guide air flow direction second gas outlet.
8. as described in claim 1 outer formula radiator of taking, which is characterized in that the shell of the refrigeration host computer separably group
Seat is carried loaded on the wind-guiding.
9. taking formula radiator outside as described in claim 1, which is characterized in that it includes that a pedestal and one are additional that the wind-guiding, which carries seat,
Circuit board, the additional circuit boards are hubbed at the pedestal, and to enable the additional circuit boards have different obliquity, which is located at
Side of the additional circuit boards far from the pedestal.
10. register as claimed in claim 11, which is characterized in that the quantity of an at least cooling chip is multiple, institute
Cooling chip is stated along arranged in a straight line, and is all located between first liquid cooling plate and second liquid cooling plate.
11. a kind of register, characterized by comprising:
One shell has an accommodating space and is connected to an at least air inlet and one first gas outlet of the accommodating space, this first
Gas outlet is connected to the air outlet；
An at least cooling chip positioned at the accommodating space and has opposite consistent huyashi-chuuka (cold chinese-style noodles) and a heating surface, an at least refrigeration
Chip has one first anode and one first cathode；
One power supply unit is located at the accommodating space, and has one second anode and one second cathode；And
First anode of one switching switch, the cooling chip is connected to power supply confession by switching switch with first cathode
Second anode and second cathode of device are answered, and adjusts by switching that the switching switchs that first anode, this is first negative
Pole, second positive, second cathode the connection relationship, and enable the refrigeration face of the cooling chip be formed by cold air and blow to
First gas outlet enables the heating surface of the cooling chip be formed by hot-air blowing to first gas outlet.
12. register as claimed in claim 10, which is characterized in that further include a cold biography group and a heat extraction group, the cold biography
Group includes one first liquid cooling plate and the one first liquid cooling row of being connected, and first liquid cooling plate thermo-contact is in the refrigeration of the cooling chip
Face, the heat extraction group include be connected one second liquid cooling plate and one second liquid cooling row, and second liquid cooling plate thermo-contact is in the refrigeration core
The heating surface of piece, and the accommodating space is distinguished one first by the cooling chip, first liquid cooling plate and second liquid cooling plate
Chamber and a second chamber, the first chamber and the second chamber are respectively communicated with first gas outlet and second gas outlet.
13. register as claimed in claim 11, which is characterized in that the refrigeration host computer further includes a diaphragm plate and a power supply
Power supply unit, the diaphragm plate are located at the accommodating space and the accommodating space are distinguished into a upper space and a lower layer space, the electricity
Source power supply unit is located at the upper space, and is electrically connected the cooling chip, and the cooling chip, the cold biography group and the heat extraction group are located at
The lower layer space, and the cooling chip, first liquid cooling plate and second liquid cooling plate are stood in the lower layer space, by the lower layer
Distinguish the first chamber and the second chamber in space.
14. register as claimed in claim 12, which is characterized in that the shell include a bottom plate, a foreboard, a backboard,
Two side plates and a top plate, the foreboard, the backboard and two side plate are connected to the phase heteropleural of the bottom plate, and the foreboard and the back
Plate is relative to each other and two side plate is relative to each other, which connects the foreboard, the backboard and two side plate far from the bottom plate
Side, to enable the bottom plate, the top plate, the foreboard, the backboard and two side plate surround out the accommodating space jointly, which is situated between
Between the bottom plate and the top plate, which is distinguished into the upper space and the lower layer space, an at least air inlet
Mouth is located therein the side plate, which is located at the foreboard, which is located at the backboard.
15. register as claimed in claim 13, which is characterized in that the top plate has a ventilation mouth, ventilation mouth connection
The upper space.
16. register as claimed in claim 11, which is characterized in that the cold biography group further includes one first fan, this first
Fan is located at the first chamber, and to guide air flow direction first gas outlet.
17. register as claimed in claim 15, which is characterized in that first liquid cooling row is between first liquid cooling plate and is somebody's turn to do
Between first fan.
18. register as claimed in claim 15, which is characterized in that the heat extraction group further includes one second fan, this second
Fan is located at the second chamber, and to guide air flow direction second gas outlet.
19. register as claimed in claim 15, which is characterized in that second liquid cooling row is between second liquid cooling plate and is somebody's turn to do
Between second fan.
20. register as claimed in claim 11, which is characterized in that the quantity of an at least cooling chip is multiple, institute
Cooling chip is stated along arranged in a straight line, and is all located between first liquid cooling plate and second liquid cooling plate.
21. register as claimed in claim 10, which is characterized in that further include a wind scooper, which has opposite
A fluid inlet and a fluid outlet, the size of the fluid inlet is greater than the size of the fluid outlet, and the fluid inlet connects
Lead to the first chamber and the fluid outlet is connected to first gas outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810497607.3A CN110513907B (en) | 2018-05-22 | 2018-05-22 | External-lap type heat dissipation device and temperature adjusting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810497607.3A CN110513907B (en) | 2018-05-22 | 2018-05-22 | External-lap type heat dissipation device and temperature adjusting device |
Publications (2)
| Publication Number | Publication Date |
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| CN110513907A true CN110513907A (en) | 2019-11-29 |
| CN110513907B CN110513907B (en) | 2022-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810497607.3A Active CN110513907B (en) | 2018-05-22 | 2018-05-22 | External-lap type heat dissipation device and temperature adjusting device |
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| CN107728758A (en) * | 2017-11-20 | 2018-02-23 | 运城学院 | A kind of notebook radiator of high cooling efficiency |
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| CN2921938Y (en) * | 2006-06-22 | 2007-07-11 | 庄智远 | Radiating device |
| US20100309622A1 (en) * | 2007-09-18 | 2010-12-09 | Whirlpool S.A. | Computer docking station |
| CN204268752U (en) * | 2014-12-01 | 2015-04-15 | 玛斯特（杭州）酒文化推广有限公司 | Semiconductor refrigerating/heating combined equipment |
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| CN206906973U (en) * | 2017-04-27 | 2018-01-19 | 西安交通大学 | A kind of semiconductor refrigerating heat dissipation pad for notebook computer |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110513907B (en) | 2022-01-25 |
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