CN204268752U - Semiconductor refrigerating/heating combined equipment - Google Patents
Semiconductor refrigerating/heating combined equipment Download PDFInfo
- Publication number
- CN204268752U CN204268752U CN201420744486.5U CN201420744486U CN204268752U CN 204268752 U CN204268752 U CN 204268752U CN 201420744486 U CN201420744486 U CN 201420744486U CN 204268752 U CN204268752 U CN 204268752U
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- heating device
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Abstract
The utility model relates to a kind of refrigerating/heating device, be used on heat insulating box, freezed in the inner space of heat insulating box or heat, the tank wall of described heat insulating box is provided with refrigerating/heating device installation portion, described refrigerating/heating device is arranged on described refrigerating/heating device installation portion, described refrigerating/heating device comprises conduction cooling/heat conducting module, cold/heat source and heat radiation/cold scattering module, described cold/heat source is provided with two or more in parallel, described conduction cooling/heat conducting module is positioned at the inner side of described cold/heat source, described heat radiation/cold scattering module is positioned at the outside of described cold/heat source.Refrigerating/heating device of the present utility model, adopts two cold/heat source to work simultaneously, and conduction cooling/heat conducting module is initiatively quick to be transferred out cold wind, and heat radiation/cold scattering module composition heat dissipation wind channel, can be discharged in air by heat fast and effectively, reduces hot-side temperature.It is fast that the utility model has refrigerating speed, the advantages such as refrigeration end uniformity of temperature profile.
Description
Technical field
The utility model relates to a kind of refrigerating/heating device, particularly relates to a kind of semiconductor refrigerating/heating combined equipment freezing to heat insulating box inside or heat.
Background technology
In recent years, portable refrigerator, ice chest, car refrigerator, refrigerator-freezer, the application of the pocket electric refrigerators such as refreshing red wine machine is more prevalent.The core texture of pocket electric refrigerator is exactly a kind of refrigerating/heating device, is directly connected to the performance and operational of complete machine.Various portable refrigeration electrical equipment in the market all adopt a cooling piece job, there is cryogenic temperature low not, and cooling time is too of a specified duration, and the defects such as internal temperature is uneven, the deficiency in these performances can affect the quality of complete machine.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of refrigerating/heating device, to solve the technical problem existed in prior art.
The refrigerating/heating device that the utility model provides, be used on heat insulating box, freezed in the inner space of heat insulating box or heat, the tank wall of described heat insulating box is provided with refrigerating/heating device installation portion, described refrigerating/heating device is arranged on described refrigerating/heating device installation portion, described refrigerating/heating device comprises conduction cooling/heat conducting module, cold/heat source and heat radiation/cold scattering module, described cold/heat source is provided with two or more in parallel, described conduction cooling/heat conducting module is positioned at the inner side of described cold/heat source, described heat radiation/cold scattering module is positioned at the outside of described cold/heat source.
Preferably, described cold/heat source is semiconductor chilling plate.
Preferably, described refrigerating/heating device installation portion is included in the through hole that the tank wall of described heat insulating box is arranged, and described semiconductor chilling plate is arranged on the position at described through hole place, and described semiconductor chilling plate is positioned at the outside of described heat insulating box tank wall.
Preferably, the cold junction face of described semiconductor chilling plate and the flush with outer surface of described heat insulating box tank wall.
Preferably, described conduction cooling/heat conducting module is positioned at the inside of described heat insulating box, comprises conduction cooling/heat-conducting block, cold-storage/regenerative block, conduction cooling/heat conduction fan and conduction cooling/passage of heat forming portion.
Preferably, described conduction cooling/heat-conducting block comprises the protuberance through described through hole, and the end face of described protuberance is close to the cold junction face of described semiconductor chilling plate; The surface of described conduction cooling/heat-conducting block away from described protuberance is close on a surface of described cold-storage/regenerative block, and described conduction cooling/heat conduction fan is arranged on described cold-storage/regenerative block, is positioned at it by paracentral position.
Preferably, be formed with groove in the center of described cold-storage/regenerative block, described conduction cooling/heat conduction fan is arranged in this groove.
Preferably, described conduction cooling/passage of heat forming portion is arranged on the inner side of described cold-storage/regenerative block and conduction cooling/heat conduction fan, and its outer rim is fixed on the tank wall of described heat insulating box, and the tank wall of heat insulating box is one-body molded or divide body formed; Described conduction cooling/passage of heat forming portion is formed with air admission hole and venthole.
Preferably, at described conduction cooling/between heat-conducting block and semiconductor chilling plate, and/or, uniform application one deck heat-conducting silicone grease between described conduction cooling/heat-conducting block and cold-storage/regenerative block.
Preferably, described heat radiation/cold scattering module comprises heat radiation/cold scattering passage, heat radiation/cold scattering block and heat radiation/cold scattering fan, the quantity of described heat radiation/cold scattering block is identical with the quantity of described semiconductor chilling plate, and one surface is close on the face, hot junction of described semiconductor chilling plate.
Preferably, the quantity of described heat radiation/cold scattering fan is identical with the quantity of described heat radiation/cold scattering block, when the quantity of described heat radiation/cold scattering fan is two, the blow-off direction of described heat radiation/cold scattering fan goes out a mode entered with one and is arranged on the described heat radiation/another side of cold scattering block away from described semiconductor chilling plate; When the quantity of described heat radiation/cold scattering fan is multiple, described heat radiation/cold scattering fan goes out a mode entering to be separated by with its blow-off direction with one and is arranged on the described heat radiation/another side of cold scattering block away from described semiconductor chilling plate.
Preferably, described heat radiation/cold scattering passage is tubular, and vertical with the tank wall of described heat insulating box is sleeved on described heat radiation/cold scattering block and heat radiation/cold scattering fan, and its one end is fixed on the tank wall of described heat insulating box.
Preferably, refrigeration is realized to transferring and conversion between heating by the both positive and negative polarity of the both sides input power at described semiconductor chilling plate.
Refrigerating/heating device in the utility model adopts two cooling piece in parallel or many cooling pieces to work simultaneously, and than traditional single cooling piece work, refrigerating capacity doubles or many times, overcomes the problem of the refrigerating capacity deficiency of semiconductor refrigerating; Arrange that conduction cooling/heat conducting module is initiatively quick to be transferred out cold wind simultaneously, heat radiation/cold scattering module composition heat dissipation wind channel is set, can fast and effectively heat is discharged in air, reduction hot-side temperature.
Refrigerating/heating device in the utility model, heat radiation/cold scattering module adopts one-in-and-one-out double fan, and the fan air draught outward of upper end, the fan of lower end is dried inward, the rapid air movement in air channel, and the heat in refrigerating plant hot junction is discharged fast.
Refrigerating/heating device in the utility model, conduction cooling/heat conducting module adds that fan is initiatively quick to be transferred out cold wind, formed in heat insulating box in the middle of conduction cooling/heat conducting module by cold scattering air channel and inhale hot gas in heat insulating box, upper and lower side send the airflow circulating of cold wind in heat insulating box, makes the temperature in heat insulating box cool fast and be uniformly distributed.
According to semiconductor cooling device of the present utility model, there is refrigerating speed fast, the advantages such as refrigeration end uniformity of temperature profile.
Accompanying drawing explanation
By referring to the description of accompanying drawing to the utility model embodiment, above-mentioned and other objects of the present utility model, feature and advantage will be more clear, in the accompanying drawings:
Fig. 1 is the overall structure schematic diagram of the utility model refrigerating/heating device.
Detailed description of the invention
Hereinafter with reference to accompanying drawing, various embodiment of the present utility model is described in more detail.In various figures, identical element adopts same or similar Reference numeral to represent.For the sake of clarity, the various piece in accompanying drawing is not drawn in proportion.
Illustrate, in the application, be " interior " near the side of described heat insulating box inner space, the side away from described heat insulating box inner space is " outward ".
As shown in Figure 1, refrigerating/heating device of the present utility model is used for heat insulating box 100, freezes or heat the inner space of heat insulating box 100.The tank wall of heat insulating box 100 is provided with refrigerating/heating device installation portion 101, and refrigerating/heating device of the present utility model is arranged on this refrigerating/heating device installation portion 101.Refrigerating/heating device of the present utility model comprises conduction cooling/heat conducting module 1, cold/heat source and heat radiation/cold scattering module 3.Described cold/heat source is preferably semiconductor chilling plate 2, can arrange a slice or multi-disc, is provided with the semiconductor chilling plate 2 of two panels parallel connection in the embodiment shown in fig. 1.Described refrigerating/heating device installation portion 101 is included in the through hole 1011 that the tank wall of heat insulating box 100 is arranged, and described semiconductor chilling plate 2 is arranged on the position at described through hole 1011 place.Preferably, described semiconductor chilling plate 2 is positioned at the outside of described heat insulating box 100 tank wall, the flush with outer surface of its cold junction face and described heat insulating box 100 tank wall.
Described conduction cooling/heat conducting module 1 is positioned at the inner side of described semiconductor chilling plate 2, is positioned at the inside of described heat insulating box 100, comprises conduction cooling/heat-conducting block 11, cold-storage/regenerative block 12, conduction cooling/heat conduction fan 13 and conduction cooling/passage of heat forming portion 14.Described conduction cooling/heat-conducting block 11 is aluminium block, comprise the protuberance 111 through described through hole 1011, the end face of described protuberance 111 is close to the cold junction face of described semiconductor chilling plate 2, in order to increase the capacity of heat transmission between described conduction cooling/heat-conducting block 11 and semiconductor chilling plate 2, uniform application one deck heat-conducting silicone grease between.Described cold-storage/regenerative block 12 is made up of aluminium section bar, and one surface is close to the surface of described conduction cooling/heat-conducting block 11 away from described protuberance 111, in order to increase the capacity of heat transmission between the two, and also uniform application one deck heat-conducting silicone grease between.Described conduction cooling/heat conduction fan 13 is arranged on described cold-storage/regenerative block 12, is positioned at it by paracentral position.Preferably, be formed with groove 121 in the center of described cold-storage/regenerative block 12, described conduction cooling/heat conduction fan 13 is arranged in this groove 121.Described conduction cooling/passage of heat forming portion 14 is arranged on the inner side of described cold-storage/regenerative block 12 and conduction cooling/heat conduction fan 13, and its outer rim is fixed on the tank wall of described heat insulating box 100, and the tank wall of heat insulating box 100 is one-body molded or divide body formed.Described conduction cooling/passage of heat forming portion 14 is formed with air admission hole 141 and venthole 142, the position of described air admission hole 141 is relative with the position of described conduction cooling/heat conduction fan 13, be positioned at the position near described conduction cooling/passage of heat forming portion 14 center, described venthole 142 is positioned at the position near institute conduction cooling/passage of heat forming portion 14 edge, and cold air flows and forms conduction cooling/passage of heat between air admission hole 141 and venthole 142.
Described heat radiation/cold scattering module 3 is positioned at the outside of described semiconductor chilling plate 2, comprises heat radiation/cold scattering passage 31, heat radiation/cold scattering block 32 and heat radiation/cold scattering fan 33.Described heat radiation/cold scattering block 32 is made up of aluminium section bar, and its quantity is identical with the quantity of described semiconductor chilling plate 2, and one surface is close on the face, hot junction of described semiconductor chilling plate 2.Described heat radiation/cold scattering fan 33 is aerofoil fan, and its quantity is identical with the quantity of described heat radiation/cold scattering block 32.In described semiconductor chilling plate 2 embodiment that is two (shown in Fig. 1 embodiment), the blow-off direction of described heat radiation/cold scattering fan 33 is arranged on the another side of described heat radiation/cold scattering block 32 away from described semiconductor chilling plate 2 with the direction of one-in-and-one-out; When the quantity of described heat radiation/cold scattering fan 33 is multiple, described heat radiation/cold scattering fan 33 goes out a mode entering to be separated by with its blow-off direction with one and is arranged on the another side of described heat radiation/cold scattering block 32 away from described semiconductor chilling plate 2.Described heat radiation/cold scattering passage 31 is tubular, vertical with the tank wall of described heat insulating box 100 be sleeved on described heat radiation/cold scattering block 32 and dispel the heat/cold scattering fan 33 on, its one end is fixed on the tank wall of described heat insulating box 100.
The running of refrigerating/heating device of the present utility model when using as refrigerating plant is: after leading to direct current work to described semiconductor chilling plate 2, the cold junction surface temperature of described semiconductor chilling plate 2 reduces rapidly, rapidly heat insulating box 100 internal temperature is reduced by conduction cooling/heat conducting module 1, the caloric value in hot junction dispelled the heat/and cold scattering module 3 takes away and is discharged in air.Be specially, the cold air that the cold junction face of described semiconductor chilling plate 2 produces is delivered on described cold-storage/regenerative block 12 by described conduction cooling/heat-conducting block 11, the cold wind glide path in as Fig. 1 shown in solid arrow is formed under the effect of described conduction cooling/heat conduction fan 13, reach and reduce heat insulating box 100 internal temperature fast, and make effect of homogeneous temperature everywhere.Described heat radiation/cold scattering module 3 is under the effect of described heat radiation/cold scattering fan 33, form hot wind flow route as indicated by the dashed arrow in fig. 1 in the outside of described semiconductor chilling plate 2, the heat that the hot junction of described semiconductor chilling plate 2 produces is discharged in air rapidly.
Preferably, the external voltage of refrigerating/heating device of the present utility model is the dc source of 3.6V-12V, the refrigeration and the conversion heated that can realize heat insulating box 100 inside is exchanged by the both positive and negative polarity of input power, ideal operation state is 10V-12V is refrigeration or refrigeration work voltage, and about 3.6V is the operating voltage of keeping warm mode.
Last it is noted that obviously, above-described embodiment is only for the utility model example is clearly described, and the restriction not to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.And thus the apparent change of amplifying out or variation be still among protection domain of the present utility model.
Claims (13)
1. a refrigerating/heating device, be used on heat insulating box, freezed in the inner space of heat insulating box or heat, the tank wall of described heat insulating box is provided with refrigerating/heating device installation portion, described refrigerating/heating device is arranged on described refrigerating/heating device installation portion, it is characterized in that, described refrigerating/heating device comprises conduction cooling/heat conducting module, cold/heat source and heat radiation/cold scattering module, described cold/heat source is provided with two or more in parallel, described conduction cooling/heat conducting module is positioned at the inner side of described cold/heat source, described heat radiation/cold scattering module is positioned at the outside of described cold/heat source.
2. refrigerating/heating device according to claim 1, is characterized in that, described cold/heat source is semiconductor chilling plate.
3. refrigerating/heating device according to claim 2, it is characterized in that, described refrigerating/heating device installation portion is included in the through hole that the tank wall of described heat insulating box is arranged, described semiconductor chilling plate is arranged on the position at described through hole place, and described semiconductor chilling plate is positioned at the outside of described heat insulating box tank wall.
4. refrigerating/heating device according to claim 3, is characterized in that, the cold junction face of described semiconductor chilling plate and the flush with outer surface of described heat insulating box tank wall.
5. the refrigerating/heating device according to claim 3 or 4, is characterized in that, described conduction cooling/heat conducting module is positioned at the inside of described heat insulating box, comprises conduction cooling/heat-conducting block, cold-storage/regenerative block, conduction cooling/heat conduction fan and conduction cooling/passage of heat forming portion.
6. refrigerating/heating device according to claim 5, is characterized in that, described conduction cooling/heat-conducting block comprises the protuberance through described through hole, and the end face of described protuberance is close to the cold junction face of described semiconductor chilling plate; The surface of described conduction cooling/heat-conducting block away from described protuberance is close on a surface of described cold-storage/regenerative block, and described conduction cooling/heat conduction fan is arranged on described cold-storage/regenerative block, is positioned at it by paracentral position.
7. refrigerating/heating device according to claim 6, is characterized in that, is formed with groove in the center of described cold-storage/regenerative block, and described conduction cooling/heat conduction fan is arranged in this groove.
8. refrigerating/heating device according to claim 7, it is characterized in that, described conduction cooling/passage of heat forming portion is arranged on the inner side of described cold-storage/regenerative block and conduction cooling/heat conduction fan, its outer rim is fixed on the tank wall of described heat insulating box, and the tank wall of heat insulating box is one-body molded or divide body formed; Described conduction cooling/passage of heat forming portion is formed with air admission hole and venthole.
9. refrigerating/heating device according to claim 8, is characterized in that, at described conduction cooling/between heat-conducting block and semiconductor chilling plate, and/or, uniform application one deck heat-conducting silicone grease between described conduction cooling/heat-conducting block and cold-storage/regenerative block.
10. the refrigerating/heating device according to any one of claim 2-4, it is characterized in that, described heat radiation/cold scattering module comprises heat radiation/cold scattering passage, heat radiation/cold scattering block and heat radiation/cold scattering fan, the quantity of described heat radiation/cold scattering block is identical with the quantity of described semiconductor chilling plate, and one surface is close on the face, hot junction of described semiconductor chilling plate.
11. refrigerating/heating devices according to claim 10, it is characterized in that, the quantity of described heat radiation/cold scattering fan is identical with the quantity of described heat radiation/cold scattering block, when the quantity of described heat radiation/cold scattering fan is two, the blow-off direction of described heat radiation/cold scattering fan goes out a mode entered with one and is arranged on the described heat radiation/another side of cold scattering block away from described semiconductor chilling plate; When the quantity of described heat radiation/cold scattering fan is multiple, described heat radiation/cold scattering fan goes out a mode entering to be separated by with its blow-off direction with one and is arranged on the described heat radiation/another side of cold scattering block away from described semiconductor chilling plate.
12. refrigerating/heating devices according to claim 11, it is characterized in that, described heat radiation/cold scattering passage is tubular, and vertical with the tank wall of described heat insulating box is sleeved on described heat radiation/cold scattering block and heat radiation/cold scattering fan, and its one end is fixed on the tank wall of described heat insulating box.
13. refrigerating/heating devices according to any one of claim 2-4, is characterized in that, realize refrigeration and conversion between heating by the both positive and negative polarity of the both sides input power at described semiconductor chilling plate to transferring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420744486.5U CN204268752U (en) | 2014-12-01 | 2014-12-01 | Semiconductor refrigerating/heating combined equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420744486.5U CN204268752U (en) | 2014-12-01 | 2014-12-01 | Semiconductor refrigerating/heating combined equipment |
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| CN204268752U true CN204268752U (en) | 2015-04-15 |
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| CN201420744486.5U Active CN204268752U (en) | 2014-12-01 | 2014-12-01 | Semiconductor refrigerating/heating combined equipment |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107328001A (en) * | 2017-08-12 | 2017-11-07 | 浙江聚珖科技股份有限公司 | Semiconductor air conditioner module |
| CN107975998A (en) * | 2017-10-13 | 2018-05-01 | 江苏捷帝机器人股份有限公司 | A kind of quick cooler bin for metal machinery part |
| CN108981225A (en) * | 2018-07-27 | 2018-12-11 | 王雪格 | A kind of semiconductor refrigerating heating attemperator and method |
| CN109915423A (en) * | 2019-04-04 | 2019-06-21 | 大连理工大学 | It is a kind of based on semiconductor refrigerating element without leaf refrigerating fan |
| CN110307172A (en) * | 2019-07-30 | 2019-10-08 | 苏州市职业大学 | A kind of wearable cold-warm fan |
| CN110513907A (en) * | 2018-05-22 | 2019-11-29 | 讯凯国际股份有限公司 | Formula radiator and register are taken outside |
| CN111998592A (en) * | 2020-09-22 | 2020-11-27 | 中山东菱威力电器有限公司 | Air-cooled insulation can |
| CN113439955A (en) * | 2021-06-18 | 2021-09-28 | 杭州大和热磁电子有限公司 | Semiconductor red wine cabinet |
| CN113686047A (en) * | 2021-09-01 | 2021-11-23 | 重庆广达自动化设备有限公司 | Heat insulation device for subway electric actuating mechanism |
| CN113865187A (en) * | 2021-10-09 | 2021-12-31 | 长虹美菱股份有限公司 | Beauty refrigerator with modular refrigeration assembly and assembling method |
| CN113865189A (en) * | 2021-10-13 | 2021-12-31 | 长虹美菱股份有限公司 | Refrigerating device of beauty box |
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2014
- 2014-12-01 CN CN201420744486.5U patent/CN204268752U/en active Active
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107328001A (en) * | 2017-08-12 | 2017-11-07 | 浙江聚珖科技股份有限公司 | Semiconductor air conditioner module |
| CN107975998A (en) * | 2017-10-13 | 2018-05-01 | 江苏捷帝机器人股份有限公司 | A kind of quick cooler bin for metal machinery part |
| CN110513907B (en) * | 2018-05-22 | 2022-01-25 | 讯凯国际股份有限公司 | External-lap type heat dissipation device and temperature adjusting device |
| CN110513907A (en) * | 2018-05-22 | 2019-11-29 | 讯凯国际股份有限公司 | Formula radiator and register are taken outside |
| CN108981225A (en) * | 2018-07-27 | 2018-12-11 | 王雪格 | A kind of semiconductor refrigerating heating attemperator and method |
| CN109915423A (en) * | 2019-04-04 | 2019-06-21 | 大连理工大学 | It is a kind of based on semiconductor refrigerating element without leaf refrigerating fan |
| CN110307172A (en) * | 2019-07-30 | 2019-10-08 | 苏州市职业大学 | A kind of wearable cold-warm fan |
| CN111998592A (en) * | 2020-09-22 | 2020-11-27 | 中山东菱威力电器有限公司 | Air-cooled insulation can |
| CN113439955A (en) * | 2021-06-18 | 2021-09-28 | 杭州大和热磁电子有限公司 | Semiconductor red wine cabinet |
| CN113686047A (en) * | 2021-09-01 | 2021-11-23 | 重庆广达自动化设备有限公司 | Heat insulation device for subway electric actuating mechanism |
| CN113686047B (en) * | 2021-09-01 | 2022-05-06 | 重庆广达自动化设备有限公司 | Heat insulation device for subway electric actuating mechanism |
| CN113865187A (en) * | 2021-10-09 | 2021-12-31 | 长虹美菱股份有限公司 | Beauty refrigerator with modular refrigeration assembly and assembling method |
| CN113865189A (en) * | 2021-10-13 | 2021-12-31 | 长虹美菱股份有限公司 | Refrigerating device of beauty box |
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