CN204268752U - Semiconductor refrigerating/heating combined equipment - Google Patents

Abstract

The utility model relates to a kind of refrigerating/heating device, be used on heat insulating box, freezed in the inner space of heat insulating box or heat, the tank wall of described heat insulating box is provided with refrigerating/heating device installation portion, described refrigerating/heating device is arranged on described refrigerating/heating device installation portion, described refrigerating/heating device comprises conduction cooling/heat conducting module, cold/heat source and heat radiation/cold scattering module, described cold/heat source is provided with two or more in parallel, described conduction cooling/heat conducting module is positioned at the inner side of described cold/heat source, described heat radiation/cold scattering module is positioned at the outside of described cold/heat source.Refrigerating/heating device of the present utility model, adopts two cold/heat source to work simultaneously, and conduction cooling/heat conducting module is initiatively quick to be transferred out cold wind, and heat radiation/cold scattering module composition heat dissipation wind channel, can be discharged in air by heat fast and effectively, reduces hot-side temperature.It is fast that the utility model has refrigerating speed, the advantages such as refrigeration end uniformity of temperature profile.

Description

Semiconductor cooling/heating device

technical field

The utility model relates to a refrigeration/heating device, in particular to a semiconductor refrigeration/heating device for cooling or heating the inside of a heat-insulating box.

Background technique

In recent years, the application of portable refrigeration appliances such as portable refrigerators, ice boxes, car refrigerators, freezers, and red wine preservation machines has become increasingly common. The core structure of portable refrigeration appliances is a cooling/heating device, which is directly related to the performance and practicability of the whole machine. At present, all kinds of portable refrigeration appliances on the market use one refrigeration chip to work, and there are defects such as insufficient cooling temperature, too long cooling time, uneven internal temperature, etc. These performance deficiencies will affect the quality of the whole machine.

Utility model content

In view of this, the purpose of the utility model is to provide a cooling/heating device to solve the technical problems in the prior art.

The refrigeration/heating device provided by the utility model is used on the heat insulation box to cool or heat the inner space of the heat insulation box. The device installation part, the cooling/heating device is arranged on the cooling/heating device installation part, the cooling/heating device includes a cold/heat conduction module, a cold/heat source and a heat dissipation/cooling module, the Two or more cold/heat sources are arranged in parallel, the cold/heat conduction module is located inside the cold/heat source, and the heat dissipation/cooling module is located outside the cold/heat source.

Preferably, the cold/heat source is a semiconductor cooling chip.

Preferably, the installation part of the cooling/heating device includes a through hole provided on the wall of the heat insulation box, the semiconductor cooling sheet is arranged at the position where the through hole is located, and the semiconductor cooling sheet is located at the position of the through hole. The outer side of the box wall of the heat insulation box body.

Preferably, the cold end surface of the semiconductor refrigeration sheet is flush with the outer surface of the wall of the heat insulation box.

Preferably, the cold/heat conduction module is located inside the heat insulation box, and includes a cold/heat conduction block, a cold/heat storage block, a cold/heat conduction fan, and a cold/heat conduction channel forming part.

Preferably, the cold/heat conduction block includes a protrusion passing through the through hole, and the end surface of the protrusion is closely attached to the cold end surface of the semiconductor refrigeration sheet; one of the cold storage/heat storage blocks The surface is close to the surface of the cold/heat conduction block away from the protrusion, and the cool/heat conduction fan is arranged on the cool/heat storage block at a position near its center.

Preferably, a groove is formed at the center of the cold/heat storage block, and the cooling/heat conducting fan is arranged in the groove.

Preferably, the cold/heat conduction channel forming part is arranged on the inside of the cold/heat storage block and the cold/heat conduction fan, the outer edge of which is fixed on the wall of the heat insulation box, and the heat insulation box The box wall of the body is integrally formed or separately formed; the air inlet hole and the air outlet hole are formed on the cold conduction/heat conduction passage forming part.

Preferably, a layer of heat-conducting silicone grease is uniformly applied between the cold/heat conduction block and the semiconductor refrigeration sheet, and/or between the cold/heat conduction block and the cold/heat storage block.

Preferably, the heat dissipation/cooling module includes a heat dissipation/cooling channel, a heat dissipation/cooling block and a heat dissipation/cooling fan, the number of the heat dissipation/cooling block is the same as the number of the semiconductor cooling fins, one The surface is closely attached to the hot end surface of the semiconductor cooling chip.

Preferably, the number of the heat dissipation/cooling fans is the same as the number of the heat dissipation/cooling blocks. When the number of the heat dissipation/cooling fans is two, the blowing direction of the heat dissipation/cooling fans is One out and one in is installed on the other side of the heat dissipation/cooling block away from the semiconductor cooling sheet; when the number of the heat dissipation/cooling fans is multiple, the heat dissipation/cooling fans use their The blowing direction is installed on the other side of the heat dissipation/cooling block away from the semiconductor cooling sheet in a manner of one out and one in.

Preferably, the heat dissipation/cooling passage is cylindrical, and is vertically set on the heat dissipation/cooling block and the heat dissipation/cooling fan with the wall of the heat insulation box, one end of which is fixed on the insulation box. On the wall of the thermal box.

Preferably, the conversion between cooling and heating is realized by exchanging the positive and negative poles of the input power on both sides of the semiconductor cooling plate.

The refrigerating/heating device in the utility model uses parallel double refrigerating plates or multiple refrigerating plates to work at the same time, which doubles or multiples the cooling capacity compared with the traditional single refrigerating plate, and overcomes the problem of insufficient cooling capacity of semiconductor refrigeration; At the same time, the cold/heat conduction module is set to actively and quickly transport the cold air, and the heat dissipation/cooling module is set to form a heat dissipation air duct, which can quickly and effectively discharge heat into the air and reduce the temperature of the hot end.

In the refrigeration/heating device of the utility model, the heat dissipation/cooling module adopts double fans with one input and one output. The fan at the upper end sucks air outward, and the fan at the lower end blows air inward. Heat is dissipated quickly.

In the cooling/heating device of the utility model, the cooling/heating module is added to the fan to actively and quickly transport the cold air, and the cooling/heating module is formed in the heat insulation box through the cooling air channel to absorb the hot air in the heat insulation box, and the upper and lower ends The air circulation that sends cold air to the heat insulation box makes the temperature in the heat insulation box cool down quickly and evenly distribute.

The semiconductor refrigeration device according to the utility model has the advantages of fast cooling speed, uniform temperature distribution at the cooling end, and the like.

Description of drawings

Through the following description of the embodiments of the utility model with reference to the accompanying drawings, the above-mentioned and other purposes, features and advantages of the utility model will be more clear, in the accompanying drawings:

Fig. 1 is a schematic diagram of the overall structure of the refrigeration/heating device of the present invention.

Detailed ways

Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In the various drawings, the same elements are denoted by the same or similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale.

Note, in this application, the side close to the inner space of the heat insulation box is "inner", and the side away from the inner space of the heat insulation box is "outer".

As shown in FIG. 1 , the refrigeration/heating device of the present invention is used in a heat insulation box 100 to cool or heat the inner space of the heat insulation box 100 . A cooling/heating device installation part 101 is arranged on the box wall of the heat insulation box 100 , and the cooling/heating device of the present invention is arranged on the cooling/heating device installation part 101 . The refrigeration/heating device of the present utility model includes a cooling/heating conduction module 1 , a cold/heat source and a heat dissipation/cooling module 3 . The cold/heat source is preferably a semiconductor cooling chip 2, and one or more semiconductor cooling chips can be provided. In the embodiment shown in FIG. 1, two parallel semiconductor cooling chips 2 are provided. The cooling/heating device installation part 101 includes a through hole 1011 provided on the wall of the heat insulation box 100 , and the semiconductor cooling chip 2 is arranged at the position where the through hole 1011 is located. Preferably, the semiconductor refrigerating sheet 2 is located outside the box wall of the heat insulation box 100 , and its cold end surface is flush with the outer surface of the box wall of the heat insulation box 100 .

The cold/heat conduction module 1 is located inside the semiconductor refrigeration sheet 2 and inside the heat insulation box 100, including a cold/heat conduction block 11, a cold/heat storage block 12, and a cold/heat conduction fan 13 And the cold conduction/heat conduction channel forming part 14. The cold/heat conduction block 11 is an aluminum block, including a protruding part 111 passing through the through hole 1011, and the end face of the protruding part 111 is close to the cold end face of the semiconductor cooling chip 2, in order to increase the To ensure the heat conduction capacity between the cold/heat conduction block 11 and the semiconductor cooling chip 2, evenly apply a layer of heat conduction silicone grease between the two. The cold storage/heat storage block 12 is made of aluminum profile, one surface of which is close to the surface of the cold/heat conduction block 11 away from the protruding part 111, in order to increase the heat conduction capacity between the two, between the two A layer of thermal conductive silicone grease is evenly applied between them. The cold/heat conduction fan 13 is arranged on the cold/heat storage block 12 at a position close to the center thereof. Preferably, a groove 121 is formed at the center of the cold/heat storage block 12 , and the cooling/heat conducting fan 13 is disposed in the groove 121 . The cold/heat conduction channel forming part 14 is arranged on the inner side of the cold/heat storage block 12 and the cold/heat conduction fan 13, and its outer edge is fixed on the wall of the heat insulation box 100, and the heat insulation The box wall of the box body 100 is integrally formed or separately formed. The air inlet hole 141 and the air outlet hole 142 are formed on the cooling/heat conduction channel forming part 14, the position of the air inlet hole 141 is opposite to the position of the heat conduction/cooling fan 13, and is located near the cooling/heat conduction fan 13. At the center of the heat conducting channel forming part 14, the air outlet hole 142 is located near the edge of the cooling/heat conducting channel forming part 14, and the cold air flows between the air inlet hole 141 and the air outlet hole 142 to form a cooling/heat conducting channel.

The heat dissipation/cooling module 3 is located outside the semiconductor cooling fin 2 and includes a heat dissipation/cooling channel 31 , a heat dissipation/cooling block 32 and a heat dissipation/cooling fan 33 . The heat dissipation/cooling block 32 is made of aluminum profile, and its number is the same as that of the semiconductor cooling fins 2 , and one surface thereof is closely attached to the hot end surface of the semiconductor cooling fins 2 . The heat dissipation/cooling fans 33 are axial flow fans, and the number thereof is the same as that of the heat dissipation/cooling blocks 32 . In the embodiment (the embodiment shown in Fig. 1) that described semiconductor cooling sheet 2 is two, the blowing direction of described heat dissipation/radiation cooling fan 33 is installed on the heat dissipation/radiation cooling fan 33 in the direction of one in and one out. The block 32 is away from the other side of the semiconductor cooling sheet 2; when the number of the heat dissipation/radiation cooling fans 33 is multiple, the heat dissipation/radiation cooling fans 33 are separated by one out and one in in the blowing direction. Installed on the other side of the heat dissipation/cooling block 32 away from the semiconductor cooling fin 2 . The heat dissipation/cooling passage 31 is cylindrical, and is vertically set on the heat dissipation/cooling block 32 and the heat dissipation/cooling fan 33 with the wall of the heat insulation box 100, one end of which is fixed on the On the box wall of the heat insulation box body 100.

The operation process of the refrigeration/heating device of the utility model when used as a refrigeration device is as follows: after the semiconductor refrigeration sheet 2 is connected to a direct current, the temperature of the cold end surface of the semiconductor refrigeration sheet 2 decreases rapidly, and the cooling/heating The module 1 rapidly reduces the internal temperature of the heat insulation box 100, and the heat generated at the hot end is taken away by the heat dissipation/cooling module 3 and discharged into the air. Specifically, the cold air generated by the cold end surface of the semiconductor cooling chip 2 is transferred to the cold/heat storage block 12 by the cold/heat conduction block 11, and is formed as follows under the action of the cold/heat conduction fan 13. The cold air flow route shown by the solid arrow in FIG. 1 achieves the effect of quickly reducing the internal temperature of the heat insulation box 100 and making the temperature uniform everywhere. Under the action of the heat dissipation/cooling fan 33, the heat dissipation/cooling module 3 forms a hot air flow path as shown by the dotted arrow in Figure 1 on the outside of the semiconductor refrigeration sheet 2, and the semiconductor refrigeration sheet The heat generated by the hot end of 2 is quickly discharged into the air.

Preferably, the external voltage of the refrigeration/heating device of the present utility model is a DC power supply with a voltage of 3.6V-12V, and the conversion of cooling and heating inside the heat-insulating box 100 can be realized by exchanging the positive and negative poles of the input power supply, ideally The working state is 10V-12V for refrigeration or refrigeration working voltage, and about 3.6V is the working voltage for heat preservation state.

Finally, it should be noted that obviously, the above-mentioned embodiments are only examples for clearly illustrating the utility model, rather than limiting the implementation manner. For those of ordinary skill in the art, on the basis of the above description, other changes or changes in different forms can also be made. It is not necessary and impossible to exhaustively list all the implementation manners here. And the obvious changes or changes derived therefrom are still within the protection scope of the present utility model.

Claims (13)

1. A refrigerating/heating device, which is used on a heat-insulating box to refrigerate or heat the inner space of the heat-insulating box, and a refrigerating/heating device is arranged on the wall of the heat-insulating box The installation part, the refrigeration/heating device is arranged on the installation part of the refrigeration/heating device, characterized in that the refrigeration/heating device includes a cooling/heating conduction module, a cold/heat source and a heat dissipation/cooling module , Two or more cold/heat sources are arranged in parallel, the cold/heat conduction module is located inside the cold/heat source, and the heat dissipation/cooling module is located outside the cold/heat source. 2. The cooling/heating device according to claim 1, wherein the cooling/heating source is a semiconductor cooling chip. 3. The cooling/heating device according to claim 2, characterized in that, the installation part of the cooling/heating device includes a through hole provided on the wall of the heat-insulating box, and the semiconductor refrigeration sheet It is arranged at the position where the through hole is located, and the semiconductor refrigeration sheet is located on the outer side of the box wall of the heat insulation box. 4 . The cooling/heating device according to claim 3 , wherein the cold end surface of the semiconductor cooling fin is flush with the outer surface of the wall of the heat insulation box. 5 . 5. The refrigeration/heating device according to claim 3 or 4, characterized in that, the cold/heat conduction module is located inside the heat insulation box, including a cold/heat conduction block, a cold/heat storage block , a cooling/heating conduction fan and a cooling/heating conduction passage forming part. 6. The refrigeration/heating device according to claim 5, wherein the cooling/heat conducting block includes a protrusion passing through the through hole, and the end surface of the protrusion is closely attached to the The cold end face of the semiconductive refrigeration sheet; one surface of the cold/heat storage block is close to the surface of the cold/heat conduction block away from the protrusion, and the cold/heat conduction fan is arranged on the cold/heat storage on the block, located near its center. 7. The cooling/heating device according to claim 6, wherein a groove is formed at the center of the cold/heat storage block, and the cooling/heat conducting fan is arranged in the groove. 8. The refrigeration/heating device according to claim 7, characterized in that, the cold/heat conduction passage forming part is arranged inside the cold/heat storage block and the cool/heat conduction fan, and its outer edge is fixed On the box wall of the heat insulation box, it is integrally formed or separately formed with the box wall of the heat insulation box; an air inlet hole and an air outlet hole are formed on the cold conduction/heat conduction passage forming part. 9. The refrigeration/heating device according to claim 8, characterized in that, between the cold/heat conduction block and the semiconductor refrigeration sheet, and/or between the cold/heat conduction block and the cold storage/storage Apply a layer of thermal conductive silicone grease evenly between the thermal blocks. 10. The refrigeration/heating device according to any one of claims 2-4, wherein the heat dissipation/cooling module comprises a heat dissipation/cooling channel, a heat dissipation/cooling block and a heat dissipation/cooling fan, The number of the heat dissipation/cooling blocks is the same as the number of the semiconductor cooling fins, and one surface thereof is closely attached to the hot end surface of the semiconductor cooling fins. 11. The refrigeration/heating device according to claim 10, wherein the number of the heat dissipation/cooling fans is the same as the number of the heat dissipation/cooling blocks, when the number of the heat dissipation/cooling fans When there are two, the blowing direction of the heat dissipation/cooling fan is installed on the other side of the heat dissipation/cooling block away from the semiconductor cooling sheet in a manner of one out and one in; when the heat dissipation/cooling fan When there are multiple numbers, the heat dissipation/cooling fan is installed on the other side of the heat dissipation/cooling block away from the semiconductor cooling sheet in a manner of one out and one in in the blowing direction. 12. The refrigeration/heating device according to claim 11, characterized in that, the heat dissipation/cooling channel is cylindrical, and is vertically set on the heat dissipation/cooling channel with the wall of the heat insulation box. On the block and the heat dissipation/cooling fan, one end of which is fixed on the box wall of the heat insulation box. 13. The cooling/heating device according to any one of claims 2-4, characterized in that the switching between cooling and heating is achieved by switching the positive and negative poles of the power input on both sides of the semiconductor cooling sheet. conversion.