CN203478683U - Semiconductor cooler - Google Patents
Semiconductor cooler Download PDFInfo
- Publication number
- CN203478683U CN203478683U CN201320402011.3U CN201320402011U CN203478683U CN 203478683 U CN203478683 U CN 203478683U CN 201320402011 U CN201320402011 U CN 201320402011U CN 203478683 U CN203478683 U CN 203478683U
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- CN
- China
- Prior art keywords
- chilling plate
- semiconductor chilling
- semiconductor
- aluminum
- seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a semiconductor cooler which adopts a semiconductor refrigeration technology for refrigeration. The semiconductor cooler comprises a semiconductor chilling plate which consists of multiple pairs of P type semiconductors and N type semiconductors, an insulating ceramic sheet and a metallic conductor; the semiconductor chilling plate is connected to a power source; the top end of the semiconductor chilling plate is a hot end; the bottom end of the semiconductor chilling plate is a cold end; the bottom end of the semiconductor chilling plate is bonded and fixed with an aluminium cold conduction seat by heat conduction silicone grease; an aluminium cold emission fin is manufactured on the aluminium cold conduction seat; the top end of the semiconductor chilling plate is bonded and fixed with an aluminium heat conduction seat by heat conduction silicone grease; an aluminium heat radiating fin is manufactured on the aluminium heat conduction seat; further, the power source is a direct current power source.
Description
Technical field
The utility model relates to art of refrigeration units, is specifically related to semiconductor cooler.
Background technology
Existing market has multiple refrigeration modes, and most of refrigeration product adopts vapour compression refrigeration mode, and this refrigeration modes power consumption is large, and noise is large and be attended by the cold-producing medium of pollution; Brought negative effect to human health and environment.
Utility model content
Technical problem to be solved in the utility model is, for above-mentioned deficiency of the prior art, to provide novel refrigerator, and this New Refrigerating device adopts semiconductor refrigerating technology refrigeration.
The utility model solves the technical scheme that its technical problem adopts: a kind of semiconductor cooler, comprise by a plurality of paired P-type semiconductors and N-type semiconductor, insulating ceramic film, the semiconductor chilling plate that metallic conductor forms, this semiconductor chilling plate is connected to power supply, semiconductor chilling plate top is hot junction, and bottom is cold junction;
Above-mentioned semiconductor chilling plate bottom, by the heat-conducting silicone grease aluminum conduction cooling seat that is adhesively fixed, makes aluminum cold scattering fin on aluminum conduction cooling seat; Above-mentioned semiconductor chilling plate top, by the heat-conducting silicone grease aluminum heat-conducting seat that is adhesively fixed, makes aluminum radiating fin on aluminum heat-conducting seat.
Further: above-mentioned power supply is dc source.
The utility model compared with prior art has the following advantages:
The utility model semiconductor cooler, adopts semiconductor refrigerating technology, produces high thermoelectrical potential after energising, and good refrigeration effect is pollution-free, noiselessness, and meanwhile, the upper and lower side of refrigerator is all provided with heat radiation and cold scattering device, has further strengthened refrigeration.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Description of reference numerals:
1-power supply, 2-cold scattering fin, 3-conduction cooling seat, 4-insulating ceramic film, 5-metallic conductor, 6-P type semiconductor, 7-insulating ceramic film, 8-heat-conducting seat, 9-radiating fin, 10-metallic conductor, 11-N type semiconductor.
The specific embodiment
Below in conjunction with drawings and Examples, the utility model specific embodiment is described:
Fig. 1 shows a kind of concrete structure of the related cotton-wadded quilt body of the utility model, as shown in the figure, a semiconductor cooler, comprises by a plurality of paired P-type semiconductors 6 and N-type semiconductor 11, insulating ceramic film (4,7), the semiconductor chilling plate that metallic conductor (5,10) forms, this semiconductor chilling plate is connected to power supply 1, semiconductor chilling plate top is hot junction, and bottom is cold junction;
Above-mentioned semiconductor chilling plate bottom, by the heat-conducting silicone grease aluminum conduction cooling seat 3 that is adhesively fixed, makes aluminum cold scattering fin 2 on aluminum conduction cooling seat; Above-mentioned semiconductor chilling plate top, by the heat-conducting silicone grease aluminum heat-conducting seat 8 that is adhesively fixed, makes aluminum radiating fin 9 on aluminum heat-conducting seat 8.
Further, above-mentioned power supply 1 is dc source.
By reference to the accompanying drawings the utility model preferred embodiment is explained in detail above, but the utility model is not limited to above-mentioned embodiment, in the ken possessing those of ordinary skills, can also under the prerequisite that does not depart from the utility model aim, make a variety of changes.
Do not depart from design of the present utility model and scope and can make many other changes and remodeling.Should be appreciated that the utility model is not limited to specific embodiment, scope of the present utility model is defined by the following claims.
Claims (2)
1. a semiconductor cooler, it is characterized in that: comprise by a plurality of paired P-type semiconductors (6) and N-type semiconductor (11), insulating ceramic film (4,7), the semiconductor chilling plate that metallic conductor (5,10) forms, this semiconductor chilling plate is connected to power supply (1), semiconductor chilling plate top is hot junction, and bottom is cold junction;
Above-mentioned semiconductor chilling plate bottom, by the heat-conducting silicone grease aluminum conduction cooling seat (3) that is adhesively fixed, makes aluminum cold scattering fin (2) on aluminum conduction cooling seat; Above-mentioned semiconductor chilling plate top is by the heat-conducting silicone grease aluminum heat-conducting seat (8) that is adhesively fixed, the upper aluminum radiating fin (9) of making of aluminum heat-conducting seat (8).
2. a kind of semiconductor cooler as claimed in claim 1, is characterized in that: described power supply (1) is dc source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320402011.3U CN203478683U (en) | 2013-07-05 | 2013-07-05 | Semiconductor cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320402011.3U CN203478683U (en) | 2013-07-05 | 2013-07-05 | Semiconductor cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203478683U true CN203478683U (en) | 2014-03-12 |
Family
ID=50227002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320402011.3U Expired - Fee Related CN203478683U (en) | 2013-07-05 | 2013-07-05 | Semiconductor cooler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203478683U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103954070A (en) * | 2014-04-15 | 2014-07-30 | 河南工业大学 | Thermoelectric refrigerating unit based on alternating magnetic field driving |
| CN105091400A (en) * | 2015-09-16 | 2015-11-25 | 广东富信科技股份有限公司 | Thermoelectric cooling integrated system |
| CN107943145A (en) * | 2017-12-21 | 2018-04-20 | 大连中工策控科技有限公司 | A kind of easy to remove and heat dissipation industrial personal computer |
| CN108550475A (en) * | 2018-06-27 | 2018-09-18 | 安徽盛美金属科技有限公司 | A kind of circulating refrigerating device of thin film capacitor production radiator |
| CN108788360A (en) * | 2018-05-22 | 2018-11-13 | 滁州华海中谊工业炉有限公司 | A kind of vacuum high-temperature soldering oven being quickly cooled down |
| WO2021115249A1 (en) * | 2019-12-12 | 2021-06-17 | 维沃移动通信有限公司 | Circuit board apparatus and electronic device |
-
2013
- 2013-07-05 CN CN201320402011.3U patent/CN203478683U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103954070A (en) * | 2014-04-15 | 2014-07-30 | 河南工业大学 | Thermoelectric refrigerating unit based on alternating magnetic field driving |
| CN103954070B (en) * | 2014-04-15 | 2016-01-13 | 河南工业大学 | A kind of TEC driven based on alternating magnetic field |
| CN105091400A (en) * | 2015-09-16 | 2015-11-25 | 广东富信科技股份有限公司 | Thermoelectric cooling integrated system |
| CN107943145A (en) * | 2017-12-21 | 2018-04-20 | 大连中工策控科技有限公司 | A kind of easy to remove and heat dissipation industrial personal computer |
| CN108788360A (en) * | 2018-05-22 | 2018-11-13 | 滁州华海中谊工业炉有限公司 | A kind of vacuum high-temperature soldering oven being quickly cooled down |
| CN108550475A (en) * | 2018-06-27 | 2018-09-18 | 安徽盛美金属科技有限公司 | A kind of circulating refrigerating device of thin film capacitor production radiator |
| WO2021115249A1 (en) * | 2019-12-12 | 2021-06-17 | 维沃移动通信有限公司 | Circuit board apparatus and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140312 Termination date: 20140705 |
|
| EXPY | Termination of patent right or utility model |