CN206977887U - A kind of rack semiconductor cooling device - Google Patents

A kind of rack semiconductor cooling device Download PDF

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Publication number
CN206977887U
CN206977887U CN201720504817.1U CN201720504817U CN206977887U CN 206977887 U CN206977887 U CN 206977887U CN 201720504817 U CN201720504817 U CN 201720504817U CN 206977887 U CN206977887 U CN 206977887U
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CN
China
Prior art keywords
rack
air
cold
cooling
hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720504817.1U
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Chinese (zh)
Inventor
杨晚生
陈世林
王璋元
毕崟
赵旭东
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Guangdong University of Technology
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Guangdong University of Technology
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Filing date
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Priority to CN201720504817.1U priority Critical patent/CN206977887U/en
Application granted granted Critical
Publication of CN206977887U publication Critical patent/CN206977887U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of rack semiconductor cooling device, including is arranged on the cold air duct of rack bottom, the hot-air channel being arranged on below cold air duct, blower fan and the left clapboard and right clapboard being arranged at left and right sides of rack;Wherein, central dividing plate is provided between the cold air duct and hot-air channel, the central dividing plate is provided with semiconductor chilling plate;The both ends of fin heat pipe air cooling heat exchanger on the cold air duct and on hot-air channel are equipped with blower fan;Vent passages are provided between the left side of the left clapboard and rack, are connected together on the left of the vent passages and cold air duct, form rack air-out passage;Vent passages are provided between the right side of the right clapboard and rack, are connected together on the right side of the vent passages and cold air duct, form rack air intake passage.Semiconductor chilling plate, fin heat pipe air cooling heat exchanger and blower fan etc. are incorporated in one by the utility model, improve radiating efficiency, reduce the air conditioning energy consumption of computer room.

Description

A kind of rack semiconductor cooling device
Technical field
It the utility model is related to a kind of cabinet heat dissipation device, and in particular to a kind of rack semiconductor cooling device.
Background technology
With the development of electronic equipment, equipment cabinet server power density and the gradual of quantity are increased in data center module, its Heat dissipation capacity also increases with surprising rapidity, therefore, particularly important as the cooling system of the rack of capital equipment using electronic equipment; In the prior art, radiating treatment is carried out by installing radiator fan in the outside of rack, and air-conditioning is installed in computer room Reduce temperature and reach the purpose of radiating, but still many problems be present:
1st, in the outside of rack, installation radiator fan carries out radiating treatment, it is difficult to takes away the heat in rack completely, leads The electronic equipment in rack is caused easily to break down, service life reduces;
2nd, indoor temperature can only be reduced by air-conditioning being installed in computer room, it is impossible to taken away heat from the inside of electronic equipment, dissipated Thermal effect is poor, and air conditioning energy consumption is very high.
Utility model content
The utility model aims to overcome that the deficiencies in the prior art, there is provided a kind of rack semiconductor cooling device, the dress Put and semiconductor chilling plate, fin heat pipe air cooling heat exchanger and blower fan etc. are incorporated in one so that the hot-air of interior of equipment cabinet Sufficiently scattered and disappeared, reduce cabinet air conditioner refrigeration duty, save energy resource consumption, and it is fast to the radiating rate of rack.
The purpose of this utility model is achieved through the following technical solutions:
A kind of rack semiconductor cooling device, including be arranged on the cold air duct of rack bottom, be arranged under cold air duct Hot-air channel, blower fan and the left clapboard and right clapboard being arranged at left and right sides of rack in face;Wherein, the cold air duct and heat Central dividing plate is provided between wind passage, the central dividing plate is provided with semiconductor chilling plate, and above the semiconductor chilling plate It is hot junction below for cold end;The cold end of the semiconductor chilling plate is provided with upper soaking plate, and hot junction is provided with lower soaking plate;Institute State and be designed with fin heat pipe air cooling heat exchanger in soaking plate and lower soaking plate;Wing on the cold air duct and on hot-air channel The both ends of piece heat-pipe air-cooling heat exchanger are equipped with blower fan;Vent passages are provided between the left side of the left clapboard and rack, this is logical It is connected together on the left of wind passage and cold air duct, forms rack air-out passage;Between the right side of the right clapboard and rack Provided with vent passages, it is connected together on the right side of the vent passages and cold air duct, forms rack air intake passage;The cold wind leads to Road, rack air intake passage, interior of equipment cabinet passage and rack air-out passage are in turn connected to form circulation passage.
The operation principle of above-mentioned rack semiconductor cooling device is:
When the electronic equipment in rack produces amount of heat due to working long hours, semiconductor chilling plate work, pass through The upper soaking plate being arranged in cold end is by the Conduction At Low Temperature in cold end to the air-cooled heat exchange of fin heat pipe being arranged in upper soaking plate In device so that the temperature of cold air duct reduces;The hot junction of the semiconductor chilling plate is by lower soaking plate by the high temperature on hot junction It is transmitted in the fin heat pipe air cooling heat exchanger being arranged in lower soaking plate so that the temperature rise of hot-air channel;It is arranged on cold Blower fan work on wind passage, the cold wind in cold air duct is blown in the rack air intake passage connected with cold air duct, it is described Cold wind takes away heat after interior of equipment cabinet, becomes hot blast after temperature rise, the hot blast after rack air-out passage by entering To the cold air duct connected with rack air-out passage, the hot blast, which passes through, is provided with the relatively low fin heat pipe air cooling heat exchanger of temperature After cold air duct, become cold wind again, continue through rack air intake passage and take away heat into rack the inside, so constantly Circulation;While the blower fan work on cold air duct, the blower fan work of hot-air channel, it is passed through from the air inlet of hot-air channel cold Wind, discharged after hot-air channel from air outlet, realize the cooling of hot-air channel, ensure the normal work of semiconductor chilling plate.
A preferred scheme of the present utility model, wherein, it is provided with several levels along vertical direction inside the rack The demarcation strip of placement, the space between two neighboring demarcation strip form the cooling duct of interior of equipment cabinet.By being set inside rack Demarcation strip is put, rack is separated into some cooling ducts so that it is more uniform into the cold wind inside rack, fully by inside rack Heat take away.
A preferred scheme of the present utility model, wherein, being designed with for the left side of each cooling duct of the rack is auxiliary Help blower fan.Provided with the accessory fan, the cold wind for being on the one hand advantageous to accelerate rack air intake passage is brought into cooling duct, and will be each Heat inside the rack of part is fully taken away;On the other hand, allow the quick rack air-out passage of the hot blast after rack, return to cold Wind passage, accelerate circulation rate.
A preferred scheme of the present utility model, wherein, the right side of the hot-air channel is air inlet, and left side is air-out Mouthful, and air outlet is disposed in the outdoor.The air outlet of hot-air channel is disposed in the outdoor, is easy to independently discharging heat into outdoor, Advantageously reduce computer room room conditioning refrigeration duty.
A preferred scheme of the present utility model, wherein, the semiconductor chilling plate being arranged on central dividing plate has more It is individual, and be equidistantly arranged on central dividing plate.By setting multiple semiconductor chilling plates, be advantageous to allow each on cold air duct Individual fin heat pipe air cooling heat exchanger is sufficiently cooled so that it is lower to be transported to the cold wind temperature of interior of equipment cabinet, radiating rate Faster.
A preferred scheme of the present utility model, wherein, the central dividing plate is by being arranged on the thermal insulation layer of centre and setting The coating of both sides is formed above and below thermal insulation layer;The top surface of the cold air duct and the bottom surface of hot-air channel are equipped with thermal insulation layer. By the structure for being arranged to be made up of thermal insulation layer and coating by central dividing plate, allow central dividing plate by cold wind using thermal insulation layer Passage and hot-air channel are thermally isolated, while enough rigids are provided for whole central dividing plate using coating, are allowed to As the structural member of rack;Thermal insulation layer is set by the top surface in cold air duct, the inside of cold air duct and rack is subjected to heat Isolation, is advantageous to circulating current and interior of equipment cabinet is fully radiated;Thermal insulation board is set below hot-air channel, avoided in heat Heat in wind passage is lost in computer room, causes computer room indoor temperature to raise, and increases air conditioning energy consumption.
A preferred scheme of the present utility model, wherein, the fin heat pipe of the cold air duct and hot-air channel is air-cooled to be changed Hot device is U-shaped fin heat pipe air cooling heat exchanger, and the bottom of the U-shaped fin heat pipe air cooling heat exchanger is arranged in soaking plate;It is described Assembling is in the centre of U-shaped fin heat pipe air cooling heat exchanger.Using the U-shaped fin heat pipe air cooling heat exchanger of this spline structure, have Fully contacted with U-shaped fin heat pipe air cooling heat exchanger beneficial to the air caused in cold air duct, can quickly reduce cold air duct Temperature;On the other hand, blower fan is installed among U-shaped fin heat pipe air cooling heat exchanger, be advantageous to the cold wind in cold air duct Interior of equipment cabinet is transported to by rack air intake passage, loss of the cold wind in course of conveying is avoided, it is also possible to which hot blast is led to Heat in road is more efficiently taken away.
A preferred scheme of the present utility model, wherein, the thermal insulation layer in the central dividing plate, which is provided with, to be used to install half The mounting groove of conductor cooling piece, the coating on the upside of the central dividing plate, which is provided with, installs U-shaped fin heat pipe air cooling heat exchanger and upper The upper shed groove of soaking plate, the coating on the downside of the central dividing plate be provided with install U-shaped fin heat pipe air cooling heat exchanger and it is lower The under shed groove of hot plate;The upper soaking plate and lower soaking plate be fitted in respectively semiconductor chilling plate cold end and hot junction and they Edge extend out to edge more than semiconductor chilling plate.Using the central dividing plate of this spline structure, by setting upper shed Groove and under shed groove, on the one hand it is easy to allow soaking plate and lower soaking plate to be connected with semiconductor chilling plate, on the other hand also allows for Firmly U-shaped fin heat pipe air cooling heat exchanger is arranged in upper soaking plate and lower soaking plate.
A preferred scheme of the present utility model, wherein, the centre of the upper soaking plate is provided with a U-shaped fin heat pipe wind Cold heat exchanger, the both ends of the lower soaking plate are respectively provided with a U-shaped fin heat pipe air cooling heat exchanger.The U-shaped fin so set Heat-pipe air-cooling heat exchanger, the U-shaped fin heat pipe for being advantageous to the high temperature in semiconductor hot junction being fully transferred to hot-air channel exchange heat In device, avoid semiconductor chilling plate hot-side temperature too high, influence the normal work of cold end.
A preferred scheme of the present utility model, wherein, the bearing of trend phase between the cold air duct and hot-air channel It is mutually vertical.
The utility model has the advantages that compared with prior art:
1st, semiconductor chilling plate, fin heat pipe air cooling heat exchanger and blower fan etc. are incorporated in one, form efficiently cooling Circulation passage, improve radiating efficiency, substantially reduce the air conditioning energy consumption of computer room.
2nd, device installation is simple, is easy to be installed on original rack.
3rd, device installation settings is not take up computer room space, while heat dissipation capacity independently discharges outdoor, can reduce in rack bottom Air conditioner in machine room refrigeration duty.
Brief description of the drawings
Fig. 1 is a kind of structural representation of first embodiment of rack semiconductor cooling device of the utility model Figure.
Fig. 2 is a kind of structural representation of second embodiment of rack semiconductor cooling device of the utility model Figure.
Embodiment
The utility model is further described with reference to embodiment and accompanying drawing, but embodiment of the present utility model is not It is only limitted to this.
Embodiment 1
Referring to Fig. 1, a kind of rack semiconductor cooling device of present embodiment, including be arranged on the cold wind of rack bottom and lead to Road 5, the hot-air channel 7 being arranged on below cold air duct 5, blower fan 4 and the left clapboard 12 being arranged at left and right sides of rack and the right side Dividing plate 3;Wherein, central dividing plate 17 is provided between the cold air duct 5 and hot-air channel 7, the central dividing plate 17 is provided with half Conductor cooling piece 8, and be cold end above the semiconductor chilling plate 8, it is hot junction below;The cold end of the semiconductor chilling plate 8 Upper soaking plate 9 is provided with, hot junction is provided with lower soaking plate 6;Fin heat pipe is designed with the upper soaking plate 9 and lower soaking plate 6 Air cooling heat exchanger 10;The both ends of fin heat pipe air cooling heat exchanger 10 on the cold air duct 5 and on hot-air channel 7 are equipped with wind Machine 4;Vent passages are provided between the left clapboard 12 and the left side of rack, the vent passages connect with the left side of cold air duct 5 Together, rack air-out passage 13 is formed;Vent passages, the vent passages are provided between the right clapboard 3 and the right side of rack It is connected together with the right side of cold air duct 5, forms rack air intake passage 1;The cold air duct 5, rack air intake passage 1, machine Cabinet inner passage and rack air-out passage 13 are in turn connected to form circulation passage.
Referring to Fig. 1, several horizontal positioned demarcation strips 2 are provided with along vertical direction inside the rack, it is two neighboring Space between demarcation strip 2 forms the cooling duct of interior of equipment cabinet.By setting demarcation strip 2 inside rack, rack is separated Some cooling ducts so that it is more uniform into the cold wind inside rack, fully the heat inside rack is taken away.
Referring to Fig. 1, the left side of each cooling duct of the rack is designed with accessory fan 11.Provided with the accessory fan 11, the cold wind for being on the one hand advantageous to accelerate rack air intake passage 1 is brought into cooling duct, and by the heat inside each several part rack Fully take away;On the other hand, allow the quick rack air-out passage 13 of the hot blast after rack, return to cold air duct 5, accelerate circulation Speed.
Referring to Fig. 1, the right side of the hot-air channel 7 is air inlet, and left side is air outlet, and air outlet is arranged on room Outside.The air outlet of hot-air channel 7 is disposed in the outdoor, is easy to independently discharging heat into outdoor, advantageously reduces computer room Interior Space Adjust refrigeration duty.
Referring to Fig. 1, the semiconductor chilling plate 8 being arranged on central dividing plate 17 has multiple, and is equidistantly arranged on On central dividing plate 17.By setting multiple semiconductor chilling plates 8, each fin heat pipe for being advantageous to allow on cold air duct 5 is air-cooled Heat exchanger 10 is sufficiently cooled so that is transported to that the cold wind temperature of interior of equipment cabinet is lower, and radiating rate is faster.
Referring to Fig. 1, a kind of operation principle of rack semiconductor cooling device of present embodiment is:
When the electronic equipment in rack produces amount of heat due to working long hours, semiconductor chilling plate 8 works, and passes through The upper soaking plate 9 being arranged in cold end changes the Conduction At Low Temperature in cold end to the fin heat pipe being arranged in upper soaking plate 9 is air-cooled In hot device 10 so that the temperature of cold air duct 5 reduces;The hot junction of the semiconductor chilling plate 8 is by lower soaking plate 6 by hot junction High temperature be transmitted in the fin heat pipe air cooling heat exchanger 10 being arranged in lower soaking plate 6 so that the temperature liter of hot-air channel 7 It is high;The blower fan 4 being arranged on cold air duct 5 is worked, and the cold wind in cold air duct 5 is blown to the rack connected with cold air duct 5 In air intake passage 1, the cold wind takes away heat after interior of equipment cabinet, becomes hot blast after temperature rise, the hot blast passes through machine The cold air duct 5 connected with rack air-out passage 13 is entered after cabinet air-out passage 13, the hot blast passes through relatively low provided with temperature Fin heat pipe air cooling heat exchanger 10 cold air duct 5 after, become cold wind again, continue through rack air intake passage 1 and enter Heat is taken away inside rack, so constantly circulation;While the blower fan 4 on cold air duct 5 works, the wind of hot-air channel 7 Machine 4 is worked, and cold wind is passed through from the air inlet of hot-air channel 7, is discharged after hot-air channel 7 from air outlet, is realized hot-air channel 7 Cooling, ensure semiconductor chilling plate 8 normal work.
Embodiment 2
The difference of the present embodiment compared with Example 1 is:
Referring to Fig. 2, the central dividing plate 17 is by being arranged on the thermal insulation layer 15 of centre and being located at thermal insulation layer about 15 both sides Coating 18 form;The top surface of the cold air duct 5 and the bottom surface of hot-air channel 7 are equipped with thermal insulation layer 15.By by centre Dividing plate 17 is arranged to the structure being made up of thermal insulation layer 15 and coating 18, allows central dividing plate 17 by cold wind using thermal insulation layer 15 Passage 5 and hot-air channel 7 are thermally isolated, while are that whole central dividing plate 17 provides enough rigidity by force using coating 18 Degree, make the structural member of rack;Thermal insulation layer 15 is set by the top surface in cold air duct 5, by cold air duct 5 and rack Inside is thermally isolated, and is advantageous to circulating current and interior of equipment cabinet is fully radiated;Set below hot-air channel 7 heat-insulated Plate, avoid the heat in hot-air channel 7 from being lost in computer room, cause computer room indoor temperature to raise, increase air conditioning energy consumption.
Referring to Fig. 2, the fin heat pipe air cooling heat exchanger 10 of the cold air duct 5 and hot-air channel 7 is U-shaped fin heat pipe wind Cold heat exchanger 16, the bottom of the U-shaped fin heat pipe air cooling heat exchanger 16 are arranged in soaking plate;The blower fan 4 is arranged on U-shaped wing The centre of piece heat-pipe air-cooling heat exchanger 16.Using the U-shaped fin heat pipe air cooling heat exchanger 16 of this spline structure, cold wind is advantageously allowed Air in passage 5 fully contacts with U-shaped fin heat pipe air cooling heat exchanger 16, can quickly reduce the temperature of cold air duct 5;Separately On the one hand, the installation blower fan 4 among U-shaped fin heat pipe air cooling heat exchanger 16, is advantageous to the cold wind in cold air duct 5 passing through machine Cabinet air intake passage 1 is transported to interior of equipment cabinet, avoids loss of the cold wind in course of conveying, it is also possible to by hot-air channel 7 Heat more efficiently take away.
Referring to Fig. 2, the thermal insulation layer 15 in the central dividing plate 17 is provided with the installation for being used for installing semiconductor chilling plate 8 Groove, the coating 18 of the upside of the central dividing plate 17, which is provided with, installs the upper of U-shaped fin heat pipe air cooling heat exchanger 16 and upper soaking plate 9 Open slot, the coating 18 of the downside of central dividing plate 17, which is provided with, installs U-shaped fin heat pipe air cooling heat exchanger 16 and lower soaking plate 6 Under shed groove;The upper soaking plate 9 and lower soaking plate 6 be fitted in respectively semiconductor chilling plate 8 cold end and hot junction and they Edge extend out to the edge more than semiconductor chilling plate 8.Using the central dividing plate 17 of this spline structure, by being opened in setting Mouth groove and under shed groove, are on the one hand easy to allow soaking plate 9 and lower soaking plate 6 to be connected with semiconductor chilling plate 8, on the other hand It is easy to that firmly U-shaped fin heat pipe air cooling heat exchanger 16 is arranged in upper soaking plate 9 and lower soaking plate 6.
Referring to Fig. 2, the centre of the upper soaking plate 9 is provided with a U-shaped fin heat pipe air cooling heat exchanger 16, the lower soaking The both ends of plate 6 are respectively provided with a U-shaped fin heat pipe air cooling heat exchanger 16.The U-shaped fin heat pipe air cooling heat exchanger 16 so set, Be advantageous to the high temperature in semiconductor hot junction being fully transferred in the U-shaped fin heat pipe heat exchanger of hot-air channel 7, avoid semiconductor The hot-side temperature of cooling piece 8 is too high, influences the normal work of cold end.
Referring to Fig. 2, the bearing of trend between the cold air duct 5 and hot-air channel 7 is mutually perpendicular to, and is so easy to according to machine The concrete structure reasonable Arrangement cold air duct 5 and hot-air channel 7 of cabinet so that the position of the inlet and outlet of hot-air channel 7 can be flexible Arrangement.
Above-mentioned is the preferable embodiment of the utility model, but embodiment of the present utility model is not by the above Limitation, it is other it is any without departing from Spirit Essence of the present utility model with made under principle change, modification, replacement, combine, letter Change, should be equivalent substitute mode, be included within the scope of protection of the utility model.

Claims (10)

  1. A kind of 1. rack semiconductor cooling device, it is characterised in that including be arranged on the cold air duct of rack bottom, be arranged on it is cold Hot-air channel, blower fan below wind passage and the left clapboard and right clapboard being arranged at left and right sides of rack;Wherein, the cold wind Central dividing plate is provided between passage and hot-air channel, the central dividing plate is provided with semiconductor chilling plate, and the semiconductor refrigerating It is cold end above piece, is hot junction below;The cold end of the semiconductor chilling plate is provided with upper soaking plate, and hot junction is provided with lower equal Hot plate;Fin heat pipe air cooling heat exchanger is designed with the upper soaking plate and lower soaking plate;Lead on the cold air duct with hot blast The both ends of fin heat pipe air cooling heat exchanger on road are equipped with blower fan;It is logical that ventilation is provided between the left side of the left clapboard and rack Road, it is connected together on the left of the vent passages and cold air duct, forms rack air-out passage;The right side of the right clapboard and rack Vent passages are provided between side, are connected together on the right side of the vent passages and cold air duct, form rack air intake passage;It is described Cold air duct, rack air intake passage, interior of equipment cabinet passage and rack air-out passage are in turn connected to form circulation passage.
  2. 2. rack semiconductor cooling device according to claim 1, it is characterised in that along vertical side inside the rack To provided with several horizontal positioned demarcation strips, the space between two neighboring demarcation strip forms the cooling duct of interior of equipment cabinet.
  3. 3. rack semiconductor cooling device according to claim 2, it is characterised in that each cooling duct of the rack Left side be designed with accessory fan.
  4. 4. rack semiconductor cooling device according to claim 1, it is characterised in that the right side of the hot-air channel be into Air port, left side is air outlet, and air outlet is disposed in the outdoor.
  5. 5. rack semiconductor cooling device according to claim 1, it is characterised in that described to be arranged on central dividing plate Semiconductor chilling plate have it is multiple, and equidistantly be arranged on central dividing plate on.
  6. 6. rack semiconductor cooling device according to claim 1, it is characterised in that during the central dividing plate is by being arranged on Between thermal insulation layer and be located at thermal insulation layer up and down both sides coating form;The top surface of the cold air duct and the bottom of hot-air channel Face is equipped with thermal insulation layer.
  7. 7. rack semiconductor cooling device according to claim 1, it is characterised in that the cold air duct and hot-air channel Fin heat pipe air cooling heat exchanger be U-shaped fin heat pipe air cooling heat exchanger, the bottom of the U-shaped fin heat pipe air cooling heat exchanger is set In soaking plate;The assembling is in the centre of U-shaped fin heat pipe air cooling heat exchanger.
  8. 8. rack semiconductor cooling device according to claim 6, it is characterised in that the thermal insulation layer in the central dividing plate Provided with the mounting groove for being used to install semiconductor chilling plate, the coating on the upside of the central dividing plate, which is provided with, installs U-shaped fin heat The upper shed groove of manage-style cold heat exchanger and upper soaking plate, the coating on the downside of the central dividing plate, which is provided with, installs U-shaped fin heat pipe The under shed groove of air cooling heat exchanger and lower soaking plate;The upper soaking plate and lower soaking plate are fitted in semiconductor chilling plate respectively Cold end and hot junction and their edge extend out to the edge more than semiconductor chilling plate.
  9. 9. rack semiconductor cooling device according to claim 1, it is characterised in that the centre of the upper soaking plate is provided with One U-shaped fin heat pipe air cooling heat exchanger, the both ends of the lower soaking plate are respectively provided with a U-shaped fin heat pipe air cooling heat exchanger.
  10. 10. rack semiconductor cooling device according to claim 1, it is characterised in that the cold air duct and hot blast lead to Bearing of trend between road is mutually perpendicular to.
CN201720504817.1U 2017-05-08 2017-05-08 A kind of rack semiconductor cooling device Expired - Fee Related CN206977887U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720504817.1U CN206977887U (en) 2017-05-08 2017-05-08 A kind of rack semiconductor cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720504817.1U CN206977887U (en) 2017-05-08 2017-05-08 A kind of rack semiconductor cooling device

Publications (1)

Publication Number Publication Date
CN206977887U true CN206977887U (en) 2018-02-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720504817.1U Expired - Fee Related CN206977887U (en) 2017-05-08 2017-05-08 A kind of rack semiconductor cooling device

Country Status (1)

Country Link
CN (1) CN206977887U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110829239A (en) * 2019-11-24 2020-02-21 安徽明坤电器设备有限公司 High-low voltage electric appliance heat dissipation structure and use method thereof
CN111193211A (en) * 2020-01-19 2020-05-22 浙江唯卓信息科技有限公司 Monitoring system of power distribution station
CN113141761A (en) * 2021-04-25 2021-07-20 先控捷联电气股份有限公司 Novel heat pipe type heat dissipation system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110829239A (en) * 2019-11-24 2020-02-21 安徽明坤电器设备有限公司 High-low voltage electric appliance heat dissipation structure and use method thereof
CN111193211A (en) * 2020-01-19 2020-05-22 浙江唯卓信息科技有限公司 Monitoring system of power distribution station
CN113141761A (en) * 2021-04-25 2021-07-20 先控捷联电气股份有限公司 Novel heat pipe type heat dissipation system

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Granted publication date: 20180206

Termination date: 20180508