CN108491054A - A kind of server radiator structure based on gaseous exchange heat exchange - Google Patents
A kind of server radiator structure based on gaseous exchange heat exchange Download PDFInfo
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
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Abstract
本发明提供一种基于气体对流热交换的服务器散热结构,包括服务器机箱外壳,所述服务器机箱外壳包括顶板、底板、两侧板、前面板和后侧板;底板上设置有HDD硬盘模块和PSU电源模块,HDD硬盘模块和PSU电源模块上部均设置有散热片,底板的两侧板处分别设置有进风口;两侧板内侧分别设置有一个支板,两个支板高度相同,且均与底板平行,两个支板上通过螺丝固定有主板;主板上设置有CPU,主板中部及主板的两侧板处均设置有通风口;顶板内侧设置有散热风扇;底板上的进风口、主板上的通风口以及顶板上的散热风扇与服务器机箱外壳、HDD硬盘模块、PSU电源模块、散热片以及CPU之间形成散热风道。
The invention provides a server heat dissipation structure based on gas convection heat exchange, which includes a server chassis shell, the server chassis shell includes a top plate, a bottom plate, two side plates, a front panel and a rear side plate; HDD hard disk modules and PSUs are arranged on the bottom plate The upper parts of the power module, HDD hard disk module and PSU power module are all equipped with heat sinks, and the two side panels of the bottom plate are respectively equipped with air inlets; the inner sides of the two side panels are respectively equipped with a support plate. The bottom boards are parallel, and the main board is fixed by screws on the two support boards; the CPU is installed on the main board, and the middle part of the main board and both sides of the main board are provided with air vents; the inside of the top board is provided with a cooling fan; The air vents on the top plate and the cooling fan on the top plate form a cooling air duct between the server chassis shell, HDD hard disk module, PSU power supply module, heat sink, and CPU.
Description
技术领域technical field
本发明属于服务器散热领域,具体涉及一种基于气体对流热交换的服务器散热结构。The invention belongs to the field of server heat dissipation, and in particular relates to a server heat dissipation structure based on gas convection heat exchange.
背景技术Background technique
随着互联网时代的不断发展,服务器作为互联网发展的核心越来越受到大众的关注,性能的提高可以让服务器在客户的使用时感到放心,而性能提高的同时,整机散热也同样需要进一步优化。传统的刀片式机箱服务器,主板沉到机箱底部,前端硬盘以及主板上的散热均需要由系统风扇解决,风扇数量一般设计为4个双转子,风扇转子数量的增大同样意味着故障率的提高,而且成本也会随之提高。With the continuous development of the Internet era, the server, as the core of Internet development, has attracted more and more attention from the public. The improvement of performance can make the server feel at ease when customers use it. While the performance is improved, the heat dissipation of the whole machine also needs to be further optimized. . In traditional blade chassis servers, the motherboard sinks to the bottom of the chassis, and the heat dissipation on the front hard disk and the motherboard needs to be solved by the system fan. The number of fans is generally designed to be 4 dual rotors. The increase in the number of fan rotors also means an increase in the failure rate. , and the cost will increase accordingly.
此为现有技术的不足,因此,针对现有技术中的上述缺陷,提供一种基于气体对流热交换的服务器散热结构,是非常有必要的。This is the shortcoming of the prior art. Therefore, it is very necessary to provide a server heat dissipation structure based on gas convective heat exchange in view of the above-mentioned defects in the prior art.
发明内容Contents of the invention
本发明的目的在于,针对上述传统的刀片式机箱服务器,主板与硬盘均在机箱底部,散热量大,均需要系统风扇解决,系统风扇数量增多,则故障率提高,成本增加的缺陷,提供一种基于气体对流热交换的服务器散热结构,以解决上述技术问题。The purpose of the present invention is to provide a solution for the above-mentioned traditional blade chassis server, the motherboard and the hard disk are both at the bottom of the chassis, and the heat dissipation is large, which needs to be solved by the system fan. If the number of system fans increases, the failure rate will increase and the cost will increase. A server heat dissipation structure based on gas convective heat exchange is provided to solve the above technical problems.
为实现上述目的,本发明给出以下技术方案:To achieve the above object, the present invention provides the following technical solutions:
一种基于气体对流热交换的服务器散热结构,包括服务器机箱外壳,所述服务器机箱外壳包括顶板、底板、两侧板、前面板和后侧板;A server cooling structure based on gas convective heat exchange, comprising a server chassis shell, the server chassis shell includes a top plate, a bottom plate, two side plates, a front panel and a rear side plate;
底板上设置有HDD硬盘模块和PSU电源模块,HDD硬盘模块和PSU电源模块上部均设置有散热片,底板的两侧板处分别设置有进风口;A HDD hard disk module and a PSU power module are arranged on the bottom plate, heat sinks are arranged on the upper part of the HDD hard disk module and the PSU power supply module, and air inlets are respectively arranged on the two side plates of the bottom plate;
两侧板内侧分别设置有一个支板,两个支板高度相同,且均与底板平行,两个支板上通过螺丝固定有主板;A support plate is arranged on the inner side of the two side plates respectively, the height of the two support plates is the same, and both are parallel to the bottom plate, and the main board is fixed on the two support plates by screws;
主板上设置有CPU,主板中部及主板的两侧板处均设置有通风口;There is a CPU on the main board, and there are vents in the middle of the main board and on both sides of the main board;
顶板内侧设置有散热风扇;A cooling fan is installed on the inner side of the top plate;
底板上的进风口、主板上的通风口以及顶板上的散热风扇与服务器机箱外壳、HDD硬盘模块、PSU电源模块、散热片以及CPU之间形成散热风道。The air inlets on the bottom plate, the air vents on the main board, the heat dissipation fans on the top plate, and the server case shell, HDD hard disk module, PSU power supply module, heat sink, and CPU form a heat dissipation air duct.
散热片直接安装于HDD硬盘模块和PSU电源模块的上端,与进风口进入的空气进行热交换,形成上升的热气流,同时,冷空气由进风口进入服务器机箱内部后,被顶板内侧的散热风扇带动,吸入主板上端的空间后,热量均匀分布于服务器机箱内部的全部空间,最后排出服务器机箱,从而避免了风道死角,解决了热量容易在某一局部积聚而导致电子元器件损坏的问题,提高服务器的可靠性。The heat sink is directly installed on the upper end of the HDD hard disk module and the PSU power module, and exchanges heat with the air entering the air inlet to form a rising hot air flow. After being sucked into the upper space of the motherboard, the heat is evenly distributed in the entire space inside the server case, and finally discharged out of the server case, thereby avoiding the dead angle of the air duct and solving the problem that heat is easy to accumulate in a certain part and cause damage to electronic components. Improve server reliability.
进一步地,HDD硬盘模块与PSU电源模块高度相同。借助PSU电源模块自身的风扇达到同时为硬盘散热的目的。Furthermore, the HDD hard disk module is the same height as the PSU power supply module. With the help of the fan of the PSU power supply module itself, the purpose of cooling the hard disk at the same time is achieved.
进一步地,每个进风口上设置有滤网。进风口设置滤网可防止灰尘进入服务器机箱内。Further, each air inlet is provided with a filter screen. The air inlet is equipped with a filter to prevent dust from entering the server chassis.
进一步地,散热风扇上设置有滤网。散热风扇上设置滤网,可防止灰尘通过散热风扇的排风口进入服务器机箱内。Further, the cooling fan is provided with a filter screen. The cooling fan is provided with a filter screen, which can prevent dust from entering the server chassis through the air outlet of the cooling fan.
进一步地,HDD硬盘模块及设置在HDD硬盘模块上部的散热片与PSU电源模块及设置在PSU电源模块上部的散热片对称。Further, the HDD hard disk module and the cooling fins arranged on the upper part of the HDD hard disk module are symmetrical to the PSU power supply module and the cooling fins arranged on the upper part of the PSU power supply module.
进一步地,散热风扇的数量为3个。较少的风扇数目实现了整个服务器机箱内部的散热。Further, the number of cooling fans is three. Fewer fans achieve cooling inside the entire server chassis.
进一步地,主板上设置的CPU的数量为8个。Further, the number of CPUs set on the motherboard is 8.
进一步地,服务器机箱外壳的高度为2U。本专利可用于2U8路服务器的散热。Further, the height of the server chassis shell is 2U. This patent can be used for heat dissipation of 2U 8-way servers.
本发明的有益效果在于:The beneficial effects of the present invention are:
本发明结构设计合理,采用主板、支板平行结构,将主板上的元件与HDD硬盘模块、PSU电源模块隔离,强化风道通风效率,热量分散到服务器机箱外壳内部空间,提高了散热效率,避免热量局部积聚,保证了服务器运行的可靠性。The present invention has a reasonable structural design, adopts the parallel structure of the main board and the supporting board, isolates the components on the main board from the HDD hard disk module and the PSU power supply module, strengthens the ventilation efficiency of the air duct, and disperses the heat to the inner space of the server chassis shell, thereby improving the heat dissipation efficiency and avoiding Local heat accumulation ensures the reliability of server operation.
此外,本发明设计原理可靠,结构简单,具有非常广泛的应用前景。In addition, the design principle of the present invention is reliable, the structure is simple, and has very wide application prospects.
由此可见,本发明与现有技术相比,具有突出的实质性特点和显著的进步,其实施的有益效果也是显而易见的。It can be seen that, compared with the prior art, the present invention has outstanding substantive features and remarkable progress, and the beneficial effects of its implementation are also obvious.
附图说明Description of drawings
图1为服务器机箱打开前面板的主视图;Figure 1 is a front view of the server chassis with the front panel opened;
图2为服务器机箱顶板的仰视图;Fig. 2 is a bottom view of the top plate of the server case;
图3为服务器机箱主板的俯视图;Fig. 3 is a top view of the main board of the server chassis;
图4为服务器机箱底板的俯视图;Fig. 4 is a top view of the bottom plate of the server chassis;
其中,1-服务器机箱外壳;1.1-顶板;1.2-底板;1.3-第一侧板;1.4-第二侧板;1.5-前面板;1.6-后侧板;2-HDD硬盘模块;3-PSU电源模块;4.1- 第一散热片;4.2- 第二散热片;5-进风口;6-支板;7-主板;8-CPU;9-通风口;10-散热风扇。Among them, 1-server chassis shell; 1.1-top panel; 1.2-bottom panel; 1.3-first side panel; 1.4-second side panel; 1.5-front panel; 1.6-rear side panel; 2-HDD hard disk module; 3-PSU Power supply module; 4.1-first heat sink; 4.2-second heat sink; 5-air inlet; 6-support board; 7-main board; 8-CPU; 9-air vent;
具体实施方式:Detailed ways:
为使得本发明的目的、特征、优点能够更加的明显和易懂,下面将结合本发明具体实施例中的附图,对本发明中的技术方案进行清楚、完整地描述。In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the present invention will be clearly and completely described below in conjunction with the drawings in the specific embodiments of the present invention.
实施例:Example:
如图1、图2以及图4所示,本发明提供一种基于气体对流热交换的服务器散热结构,包括服务器机箱外壳1,所述服务器机箱外壳1包括顶板1.1、底板1.2、第一侧板1.3、第二侧板1.4、前面板1.5和后侧板1.6;服务器机箱外壳的高度为2U;As shown in Fig. 1, Fig. 2 and Fig. 4, the present invention provides a server cooling structure based on gas convective heat exchange, including a server chassis shell 1, and the server chassis shell 1 includes a top plate 1.1, a bottom plate 1.2, and a first side plate 1.3, the second side panel 1.4, the front panel 1.5 and the rear side panel 1.6; the height of the server chassis shell is 2U;
底板1.2上设置有HDD硬盘模块2和PSU电源模块3,HDD硬盘模块2与PSU电源模块3高度相同,HDD硬盘模块2上部设置有第一散热片4.1,PSU电源模块3上部设置有第二散热片4.2,第一散热片4.1与第二散热片4.2对称,底板1.2的第一侧板1.3处和底板1.2的第二侧板1.4处均设置有进风口5;每个进风口5上设置有滤网;采用HDD硬盘模块2与PSU电源模块3高度相同的布局,借助PSU电源模块自身的风扇达到同时为硬盘散热的目的;HDD hard disk module 2 and PSU power supply module 3 are arranged on the bottom plate 1.2, HDD hard disk module 2 and PSU power supply module 3 have the same height, HDD hard disk module 2 is provided with a first heat sink 4.1, and PSU power supply module 3 is provided with a second heat sink Sheet 4.2, the first heat sink 4.1 is symmetrical to the second heat sink 4.2, the first side plate 1.3 of the bottom plate 1.2 and the second side plate 1.4 of the bottom plate 1.2 are provided with an air inlet 5; each air inlet 5 is provided with Filter screen; the HDD hard disk module 2 and the PSU power module 3 have the same height layout, and the fan of the PSU power module is used to achieve the purpose of cooling the hard disk at the same time;
两侧板内侧分别设置有一个支板6,两个支板6高度相同,且均与底板1.2平行,两个支板6上通过螺丝固定有主板7;主板将服务器机箱的空间隔成上下两层;A support plate 6 is respectively arranged on the inner side of the two side plates, and the two support plates 6 have the same height and are parallel to the bottom plate 1.2. The two support plates 6 are fixed with a main board 7 by screws; Floor;
主板上7设置有CPU 8,主板7中部及主板7的两侧板处均设置有通风口9;The main board 7 is provided with a CPU 8, and the central part of the main board 7 and the two sides of the main board 7 are provided with air vents 9;
顶板1.1内侧设置有散热风扇10;散热风扇10的数量为3个,3个风扇均匀设置在顶板内侧;每个散热风扇10上设置有滤网;The inner side of the top plate 1.1 is provided with a cooling fan 10; the number of cooling fans 10 is three, and the three fans are evenly arranged on the inner side of the top plate; each cooling fan 10 is provided with a filter screen;
底板1.2上的进风口5、主板7上的通风口9以及顶板1.1上的散热风扇10与服务器机箱外壳1、HDD硬盘模块2、PSU电源模块3、第一散热片4.1、第二散热片4.2以及CPU 8之间形成散热风道。The air inlet 5 on the bottom plate 1.2, the air vent 9 on the main board 7, and the cooling fan 10 on the top plate 1.1 are connected with the server chassis shell 1, HDD hard disk module 2, PSU power supply module 3, first heat sink 4.1, and second heat sink 4.2 And a cooling air duct is formed between the CPUs 8 .
如图3所示,上述实施例中,主板7上设置的CPU的数量为8个。As shown in FIG. 3 , in the above embodiment, the number of CPUs disposed on the motherboard 7 is eight.
散热片直接安装于HDD硬盘模块和PSU电源模块的上端,与进风口进入的空气进行热交换,形成上升的热气流,同时,冷空气由进风口进入服务器机箱内部后,被顶板内侧的散热风扇带动,吸入主板上端的空间后,热量均匀分布于服务器机箱内部的全部空间,最后排出服务器机箱,从而避免了风道死角,解决了热量容易在某一局部积聚而导致电子元器件损坏的问题,提高服务器的可靠性。The heat sink is directly installed on the upper end of the HDD hard disk module and the PSU power module, and exchanges heat with the air entering the air inlet to form a rising hot air flow. After being sucked into the upper space of the motherboard, the heat is evenly distributed in the entire space inside the server case, and finally discharged out of the server case, thereby avoiding the dead angle of the air duct and solving the problem that heat is easy to accumulate in a certain part and cause damage to electronic components. Improve server reliability.
本发明的实施例是说明性的,而非限定性的,上述实施例只是帮助理解本发明,因此本发明不限于具体实施方式中所述的实施例,凡是由本领域技术人员根据本发明的技术方案得出的其他的具体实施方式,同样属于本发明保护的范围。The embodiments of the present invention are illustrative, rather than limiting, and the above-mentioned embodiments are only to help understand the present invention, so the present invention is not limited to the embodiments described in the specific implementation manner, and those skilled in the art according to the technology of the present invention Other specific implementation modes derived from the scheme also belong to the protection scope of the present invention.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109032283A (en) * | 2018-10-08 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of server optimizing mechanical hard disk performance |
| CN110471512A (en) * | 2019-09-17 | 2019-11-19 | 合肥恒研智能科技有限公司 | A kind of 5U reinforcing server of compact |
| CN110554750A (en) * | 2019-09-17 | 2019-12-10 | 合肥恒研智能科技有限公司 | Reinforcement server with keep apart wind channel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020126449A1 (en) * | 2001-03-12 | 2002-09-12 | Casebolt Matthew P. | Low profile highly accessible computer enclosure with plenum for cooling high power processors |
| CN203930670U (en) * | 2014-07-03 | 2014-11-05 | 浪潮电子信息产业股份有限公司 | A kind of 4U4 road server power supply radiator structure |
| CN204256655U (en) * | 2014-12-11 | 2015-04-08 | 山东工商学院 | A kind of machine box for server radiator structure air-cooled based on convection current |
| CN204679923U (en) * | 2015-05-08 | 2015-09-30 | 深圳市国鑫恒宇科技有限公司 | A kind of 2U high density server cabinet |
| CN208141324U (en) * | 2018-05-23 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of server radiator structure based on gaseous exchange heat exchange |
-
2018
- 2018-05-23 CN CN201810502448.1A patent/CN108491054B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020126449A1 (en) * | 2001-03-12 | 2002-09-12 | Casebolt Matthew P. | Low profile highly accessible computer enclosure with plenum for cooling high power processors |
| CN203930670U (en) * | 2014-07-03 | 2014-11-05 | 浪潮电子信息产业股份有限公司 | A kind of 4U4 road server power supply radiator structure |
| CN204256655U (en) * | 2014-12-11 | 2015-04-08 | 山东工商学院 | A kind of machine box for server radiator structure air-cooled based on convection current |
| CN204679923U (en) * | 2015-05-08 | 2015-09-30 | 深圳市国鑫恒宇科技有限公司 | A kind of 2U high density server cabinet |
| CN208141324U (en) * | 2018-05-23 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of server radiator structure based on gaseous exchange heat exchange |
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| CN110471512B (en) * | 2019-09-17 | 2024-05-17 | 中科恒研智能科技有限公司 | Compact 5U consolidates server |
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