CN203884118U - Active heat dissipation structure inside a cabinet - Google Patents
Active heat dissipation structure inside a cabinet Download PDFInfo
- Publication number
- CN203884118U CN203884118U CN201420106226.5U CN201420106226U CN203884118U CN 203884118 U CN203884118 U CN 203884118U CN 201420106226 U CN201420106226 U CN 201420106226U CN 203884118 U CN203884118 U CN 203884118U
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- Prior art keywords
- cabinet
- heat dissipation
- utility
- model
- structure inside
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title abstract description 22
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004377 microelectronic Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型属于微电子及计算机技术领域，涉及一种机柜内部散热结构，特别是一种利用热对流进行主动式散热的结构。本实用新型一种机柜内部主动式散热结构，包括机柜、机柜底部安装的主板及主板上安装的CPU散热片，所述机柜于CPU散热片的上方设有气流挡板，所述机柜内部空间通过气流挡板形成一条热气流腔道和两条冷气流腔道。本实用新型相比现有技术，具有以下有益效果：本实用新型实现了机柜内无风扇散热结构，消除了风扇噪音影响，节约了电能，散热稳定、可靠。
The utility model belongs to the field of microelectronics and computer technology, and relates to a heat dissipation structure inside a cabinet, and in particular to a structure that uses heat convection for active heat dissipation. The utility model is an active heat dissipation structure inside a cabinet, comprising a cabinet, a motherboard installed at the bottom of the cabinet, and a CPU heat sink installed on the motherboard. The cabinet is provided with an airflow baffle above the CPU heat sink, and the internal space of the cabinet forms a hot air flow cavity and two cold air flow cavities through the airflow baffle. Compared with the prior art, the utility model has the following beneficial effects: the utility model realizes a fanless heat dissipation structure inside the cabinet, eliminates the influence of fan noise, saves electric energy, and has stable and reliable heat dissipation.
Description
技术领域technical field
本实用新型属微电子及计算机技术领域，涉及一种机柜内部散热结构，特别是一种利用热对流进行主动式散热的结构。The utility model belongs to the technical field of microelectronics and computers, and relates to a cooling structure inside a cabinet, in particular to a structure for active cooling by heat convection.
背景技术Background technique
随着人们对电子设备高性能的追求，电子设备上芯片的发展也日新月异，随之而来不可忽视的是良好的散热方案，电子产品散热是否到位，决定着该产品的使用效果、稳定性及寿命，这就要求针对产品设计一种可靠的散热方式。With people's pursuit of high-performance electronic equipment, the development of chips on electronic equipment is also changing with each passing day. What follows is a good heat dissipation solution. Whether the heat dissipation of an electronic product is in place determines the use effect, stability and quality of the product. life, which requires designing a reliable heat dissipation method for the product.
目前电子产品的散热方式可以分为主动式散热和被动式散热两种。市场上的机柜，其内部主动式散热就是采用风扇将CPU散热片的热量散发到空气中。散热主要靠散热风扇进行，这样不可避免地会带来一定的风扇噪音影响；同时风扇的可靠性及稳定性也会给散热带来影响。At present, the heat dissipation methods of electronic products can be divided into active heat dissipation and passive heat dissipation. The internal active cooling of the cabinets on the market is to use fans to dissipate the heat of the CPU heat sink into the air. The heat dissipation is mainly carried out by the cooling fan, which will inevitably bring about a certain amount of fan noise; at the same time, the reliability and stability of the fan will also affect the heat dissipation.
实用新型内容Utility model content
本实用新型的目的在于提供一种无风扇、节约电能、稳定、可靠的机柜内部主动式散热结构，以解决现有技术中的不足之处。The purpose of the utility model is to provide a fanless, energy-saving, stable and reliable internal active heat dissipation structure of the cabinet to solve the deficiencies in the prior art.
本实用新型采用的技术方案是：一种机柜内部主动式散热结构，包括机柜、机柜底部安装的主板及主板上安装的CPU散热片，所述机柜于CPU散热片的上方设有气流挡板，所述机柜内部空间通过气流挡板形成一条热气流腔道和两条冷气流腔道。The technical solution adopted by the utility model is: an active cooling structure inside the cabinet, including the cabinet, the main board installed at the bottom of the cabinet and the CPU cooling fin installed on the main board, the cabinet is provided with an airflow baffle above the CPU cooling fin, The inner space of the cabinet forms a hot air flow channel and two cold air flow channels through the air flow baffle.
本实用新型的改进之处还在于：The improvement of the utility model also lies in:
所述机柜顶部于气流挡板的上方设有出风口。The top of the cabinet is provided with an air outlet above the airflow baffle.
本实用新型相比现有技术，具有以下有益效果：Compared with the prior art, the utility model has the following beneficial effects:
1、本实用新型通过在机柜内主板CPU散热片上方设置气流挡板，机柜内部空间通过气流挡板形成一条热气流腔道和两条冷气流腔道，实现了机柜内无风扇散热结构，消除了风扇噪音影响，节约了电能，散热稳定、可靠；1. The utility model sets an air flow baffle above the CPU heat sink of the main board in the cabinet, and the inner space of the cabinet forms a hot air flow channel and two cold air flow channels through the air flow baffle, thereby realizing a fanless heat dissipation structure in the cabinet and eliminating Reduce the impact of fan noise, save power, stable and reliable heat dissipation;
2、机柜顶部于气流挡板的上方设有出风口，散热效果好。2. The top of the cabinet is equipped with an air outlet above the airflow baffle, which has a good heat dissipation effect.
附图说明Description of drawings
附图是本实用新型结构示意图。Accompanying drawing is the structural representation of the utility model.
图中，1.机柜，2.主板，3.散热片，4.气流挡板，5.热气流腔道，6.冷气流腔道，7.出风口，8.热空气，9.冷空气。In the figure, 1. Cabinet, 2. Main board, 3. Heat sink, 4. Airflow baffle, 5. Hot air flow channel, 6. Cold air flow channel, 7. Air outlet, 8. Hot air, 9. Cold air .
具体实施方式Detailed ways
下面结合附图和具体实施方式对本实用新型进行详细说明。The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
如附图所示，本实用新型一种机柜内部主动式散热结构，包括内部空间较大的机柜1、机柜1底部安装的主板2及主板2上安装的CPU散热片3，所述机柜1于CPU散热片3的上方设有气流挡板4，所述机柜1内部空间通过气流挡板4形成一条热气流腔道5和两条冷气流腔道6；所述机柜1顶部于气流挡板4的上方设有出风口7。As shown in the drawings, the utility model is an active heat dissipation structure inside a cabinet, which includes a cabinet 1 with a relatively large internal space, a main board 2 installed at the bottom of the cabinet 1, and a CPU cooling fin 3 installed on the main board 2. The top of the CPU cooling fin 3 is provided with an air flow baffle 4, and the inner space of the cabinet 1 forms a hot air flow channel 5 and two cold air flow channels 6 through the air flow baffle 4; The top is provided with air outlet 7.
本实用新型机柜1内设备运行时，机柜1内主板2CPU散热片3源源不断地将CPU发出的热量传递到上方空气中，产生热空气8，热空气8通过热气流腔道5上升至腔道顶部并降温，气体向气流挡板4两边分流进入冷气流腔道6，冷空气9下降，直至到达散热片3附近，将散热片3上热量带走，整个过程形成两个气流循环，实现机柜内部无风扇散热，消除了风扇噪音影响，节约了电能，散热稳定、可靠；机柜顶部于气流挡板的上方设有出风口，散热效果好。When the equipment in the cabinet 1 of the utility model is running, the main board 2CPU heat sink 3 in the cabinet 1 continuously transfers the heat emitted by the CPU to the upper air to generate hot air 8, which rises to the cavity through the hot air flow channel 5 The top is cooled down, the gas diverts to both sides of the airflow baffle 4 and enters the cold airflow channel 6, and the cold air 9 descends until it reaches the vicinity of the heat sink 3, taking away the heat on the heat sink 3, and the whole process forms two airflow cycles to realize the cabinet There is no internal fan for heat dissipation, which eliminates the influence of fan noise, saves power, and has stable and reliable heat dissipation; the top of the cabinet is equipped with an air outlet above the airflow baffle, which has a good heat dissipation effect.
以上仅为本实用新型的优选实施例而已，并不用于限制本实用新型，对于本领域的技术人员来说，本实用新型可以有各种更改和变化。凡在本实用新型的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本实用新型的权利要求范围之内。The above are only preferred embodiments of the utility model, and are not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included within the scope of the claims of the present utility model.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420106226.5U CN203884118U (en) | 2014-03-10 | 2014-03-10 | Active heat dissipation structure inside a cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420106226.5U CN203884118U (en) | 2014-03-10 | 2014-03-10 | Active heat dissipation structure inside a cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203884118U true CN203884118U (en) | 2014-10-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420106226.5U Expired - Fee Related CN203884118U (en) | 2014-03-10 | 2014-03-10 | Active heat dissipation structure inside a cabinet |
Country Status (1)
| Country | Link |
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| CN (1) | CN203884118U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636412A (en) * | 2016-02-22 | 2016-06-01 | 北京飞讯数码科技有限公司 | Internally-circulated sealed cooling machine case |
| CN105992506A (en) * | 2015-03-31 | 2016-10-05 | 杭州迪普科技有限公司 | Business board structure and distributed network device |
| CN111628626A (en) * | 2019-02-26 | 2020-09-04 | 株洲中车时代电气股份有限公司 | Converter with ventilation noise elimination wind channel |
-
2014
- 2014-03-10 CN CN201420106226.5U patent/CN203884118U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992506A (en) * | 2015-03-31 | 2016-10-05 | 杭州迪普科技有限公司 | Business board structure and distributed network device |
| CN105992506B (en) * | 2015-03-31 | 2018-07-31 | 杭州迪普科技股份有限公司 | Business harden structure and distributed network equipment |
| CN105636412A (en) * | 2016-02-22 | 2016-06-01 | 北京飞讯数码科技有限公司 | Internally-circulated sealed cooling machine case |
| CN111628626A (en) * | 2019-02-26 | 2020-09-04 | 株洲中车时代电气股份有限公司 | Converter with ventilation noise elimination wind channel |
| CN111628626B (en) * | 2019-02-26 | 2021-06-08 | 株洲中车时代电气股份有限公司 | Converter with ventilation noise elimination wind channel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 Termination date: 20200310 |