CN101600326B - Electronic apparatus cooling device - Google Patents
Electronic apparatus cooling device Download PDFInfo
- Publication number
- CN101600326B CN101600326B CN200910118359.8A CN200910118359A CN101600326B CN 101600326 B CN101600326 B CN 101600326B CN 200910118359 A CN200910118359 A CN 200910118359A CN 101600326 B CN101600326 B CN 101600326B
- Authority
- CN
- China
- Prior art keywords
- heated
- refrigerant
- heat
- pressing component
- pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 49
- 239000003507 refrigerant Substances 0.000 claims abstract description 56
- 238000003825 pressing Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 8
- 108010025899 gelatin film Proteins 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 241000276425 Xiphophorus maculatus Species 0.000 claims description 2
- 238000000638 solvent extraction Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 10
- 239000007788 liquid Substances 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- VZUGBLTVBZJZOE-KRWDZBQOSA-N n-[3-[(4s)-2-amino-1,4-dimethyl-6-oxo-5h-pyrimidin-4-yl]phenyl]-5-chloropyrimidine-2-carboxamide Chemical compound N1=C(N)N(C)C(=O)C[C@@]1(C)C1=CC=CC(NC(=O)C=2N=CC(Cl)=CN=2)=C1 VZUGBLTVBZJZOE-KRWDZBQOSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a compact, low-cost electronic apparatus cooling device which provides a high heat receiving performance with less transfer of the heat of an exothermic body to a pump. In the device, a heat receiving part has fins in a given area of a plate-like base and the height of the fins is almost equal to the thickness of the base which surrounds them. A pressure member with an opening covers part of the top of the fins and part of the base. Refrigerant flows in from part of the top of the fins in contact with the opening of the pressure member and flow out from part of the top of the fins not covered by the pressure member.
Description
Technical field
The present invention relates to be equipped with the cooling device of the electronic equipment of semiconductor integrated circuit, relate to the efficient cooling device of the heating of cooling semiconductor integrated circuit well in inside such as personal computers.
Background technology
In electronic equipment in recent years, as the CPU with personal computer was representative, high performance semiconductor integrated circuit was carried.Also there is the requirement of the high performance of electronic equipment in this semiconductor integrated circuit, tries hard to realize high speed, highly integrated fast, and accompanies therewith, and caloric value also increases.And semiconductor integrated circuit then not only can not be kept the performance that semiconductor integrated circuit has if reach more than the temperature of regulation, and semiconductor integrated circuit is with destroyed under excessive heating.Like this, the semiconductor integrated circuit of electronic equipment need be cooled off by certain mode.
The general cooling means of the semiconductor integrated circuit of electronic equipment is with radiator and semiconductor integrated circuit hot link, by fan radiator is led to the air cooling mode that cooling air cools off.In this air cooling mode, for the corresponding cooling performance that improves of rising of the heating temp of heater, the fan that carry the large high-speed rotation increases ventilation quantity.On the other hand, electronic equipment also has the variation of purposes, the very fast development of exploitation of mini-plant that can the carrying type.That is, the cooling device of the semiconductor integrated circuit of electronic equipment requires small-sized and high performance cooling device, in the cooling device of air cooling mode, the fully situation of reply that is difficult to is arranged.Therefore, the type of cooling of transferring the liquid cooling that improves cooling performance of the heat by refrigerant liquid receives publicity.
But in this liquid cooling mode, because component count many than the air cooling mode, so miniaturization and cost degradation become problem.
Consider the incorporate method of each parts as the method for miniaturization, cost degradation.For example in patent documentation 1 and 2, disclose technology with portion of being heated and pump integrally.In patent documentation 1, the example of the cooling device of the fin (fin) that does not use heat transmission is disclosed wherein.In patent documentation 2, the example that uses the cooling device of the radiating wing with little wing is disclosed.
Patent documentation 1: the spy opens the 2005-142191 communique
Patent documentation 2: the spy opens the 2007-35901 communique
In the heating part of the heat exchanger of liquid cooling mode,, in conventional art as described above, there is the technical problem that must solve in order to realize miniaturization, cost degradation.
Disclosed cooling device forms a part that is made of housing the metal material of high thermoconductivity in the patent documentation 1, and this part is by contacting the structure of being heated with heater.But, consider under the situation that is subjected to hot property, be envisioned that with the portion of being heated with for example fine and close airfoil of bilge construction that is heated that is exclusively used in the ability of being heated relatively, it is reduced by hot property.In addition, the thermal capacitance of heater is easily passed to pump self, exists the life-span to pump that dysgenic problem is arranged.
On the other hand, patent documentation 2 its portions of being heated of disclosed cooling device use little fin.In this case, because the stream impedance height between fin, if with the chimeric of housing or contact insufficiently, then refrigerant does not flow between fin, and flows in the gap of part of chimeric and even contact, is subjected to the reduction of hot property remarkable.In addition, along with the miniaturization of fin, the distance at the top from the heater to the fin becomes near, so exist thermal capacitance The book of Changes of heater to be passed to the problem of pump portion one side by fin.But, solve not openly in section about the concrete of these.
Summary of the invention
The object of the invention is to provide a kind of and can addresses these problems, and it is functional to be heated, and then is difficult to pump portion one side is transmitted the small-sized cooling device for electronic equipments of the heat of heater.
To achieve these goals, the invention provides a kind of cooling device of electronic equipment, its heat by refrigerant is transferred and is cooled off heater, it is characterized in that: have the portion of being heated, this portion of being heated has: accept the substrate of the heat of described heater generation, have peristome and cover described substrate a part, be arranged at the stream of pressing component described heater and that toss about and described flow of refrigerant; Radiating part, this radiating part will be dispelled the heat by the heat that described refrigerant receives; And pump portion, it is used for making described refrigerant cycle described being heated between portion and the described radiating part, wherein, and in the described stream of the described portion of being heated, described refrigerant flows into from the described peristome of described pressing component, flows out around described pressing component beyond described peristome.
In addition, the present invention also provides a kind of cooling device of electronic equipment, its heat by refrigerant is transferred and is cooled off heater, it is characterized in that: have the portion of being heated, this portion of being heated has: the platy substrate of accepting the heat of described heater generation, the fin that forms in the height mode about equally of its height and on every side substrate in described substrate and zone described heater opposition side, have peristome and cover the part at top of described fin and the pressing component of the part of described substrate and the stream of described flow of refrigerant; Radiating part, this radiating part dispels the heat to the heat that is received by described refrigerant; And pump portion, it is used for making described refrigerant cycle described being heated between portion and the described radiating part, wherein, in the described stream of the described portion of being heated, the top of the described fin of described refrigerant in the described peristome of described pressing component flows into, and flow out at the top of the described fin beyond described peristome around the described pressing component.
(invention effect)
According to the present invention, can prevent to follow the reduction that is subjected to hot property of miniaturization.In addition, has the effect that is difficult to pump portion side is transmitted the heat of heater.As a result, can realize small-sized and well behaved cooling device for electronic equipments, help the performance of small-sized electronic equipments such as personal computer to improve.
Description of drawings
Fig. 1 represents an embodiment of the portion of being heated and the pump portion of cooling device of the present invention.Fig. 1 (a) is a perspective view.Fig. 1 (b) is a profile.
Fig. 2 is the stereogram of the portion of being heated of expression present embodiment.
Fig. 3 is the profile of expression another embodiment of the present invention.
Fig. 4 is the structure chart of an example of the expression electronic equipment that carries cooling device of the present invention.
Fig. 5 is the perspective view of example of shape of pressing component of the portion of being heated of expression present embodiment.
Fig. 6 represents another embodiment of the portion of being heated and the pump portion of cooling device of the present invention.
Fig. 7 represents another embodiment of the portion of being heated and the pump portion of cooling device of the present invention.
Symbol description
101 first suction inlets
102 first outlets
103 partition members
104 second outlets
105 second suction inlets
106 partition members
111O shape ring
201 substrates
202 fins
203 pressing components
The peristome of 204 pressing components
401 electronic equipments
402 circuit substrates
403 heaters
404 cooling devices
405 portions of being heated
406 pump portions
407 pipe arrangements
408 radiating parts
409 storage tanks
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.
Fig. 4 is the structure chart of an example that expression is equipped with the electronic equipment of cooling device of the present invention.
On electronic equipment 401, be equipped with circuit substrate 402, power supply 410, HDD411 etc.On this circuit substrate 402, have heaters 403 such as semiconductor element.
In addition, the cooling device 404 that cools off this heater 403 is made of following parts.Be heated portion 405 and heater 403 hot links are transmitted by the refrigerant heat absorption at internal circulation by heat.The heat that radiating part 408 absorbs refrigerant is passed through to logical cooling air such as core pipe and heat-dissipating fin and by the heat transmission to the heat radiation of the outside of electronic equipment 401.Pump portion 406 is integrated with the portion 405 of being heated in addition, and circulation drives refrigerant between portion of being heated 405 and radiating part 408.Storage tank 409 stores the refrigerant of cooling devices 404, and pipe arrangement 407 connects between pump portion 406 and radiating part 408 and makes refrigerant cycle.
At this, electronic equipment 401 is not the specific equipment of supposition, in addition among this embodiment as heater 403 explanation semiconductor elements, but be not limited to semiconductor element, also can be cooling device 404 at the heating of HDD etc.In addition, storage tank 409 is separate configurations, but also can form a shape with radiating part 408.
About the portion of being heated 405 and the pump portion 406 of cooling device 404 of the present invention, below describe in detail.Fig. 1 is the figure of an embodiment of expression portion of being heated of cooling device of the present invention and pump portion.
Fig. 1 (a) is the perspective view of seeing from pump portion side, and Fig. 1 (b) is the profile of the A-A ' of Fig. 1 (a).Among Fig. 1 (a), the part of fin 202 is hidden in the inboard of pressing component 203, so this part is illustrated by the broken lines.
The pump portion 406 of present embodiment is a turbulence type pump, has first suction inlet 101 that sucks refrigerant and first outlet 102 of discharging refrigerant, and they are communicated with pipe arrangement 407.Also have second outlet 104 and second suction inlet 105 in addition as feature of the present invention.These peristomes are towards the portion's of being heated 405 1 side settings.Between each suction inlet and outlet, have partition member 103 and 106 in addition.By their separation, each suction inlet and outlet are played a role.Impeller (impeller) the 107th is magnetized in addition, by this impeller and coil 109 and driving substrate 110, and impeller 107 rotations, blade 108 stirs refrigerant, thereby produces liquid stream.Flowing of the refrigerant of pump portion 406 inside carried out like this, and the refrigerant that enters from first suction inlet 101 flows out to second outlet 104, after the portion 405 of being heated, enters once more from second suction inlet 105, goes out from first outlet 102.
Then, the portion of being heated 405 that engages with pump portion 406 is described.Fig. 2 is a stereogram of only representing the portion of being heated 405.206 and 208 all represent refrigerant together with its flow direction.The central top of 207 expression fins 202.The part of fin 202 is hidden on the pressing component 203 in addition, or is in the inside of the portion of being heated 405, so this part is represented by dotted lines.
The portion 405 of being heated is made of substrate 201, fin 202, pressing component 203.The top of fin 202 is in and the upper surface of substrate 201 position in the roughly same height.Roughly contour being meant, processing fin 202 and the step difference between the upper surface of top that produce, fin 202 and substrate 201 can be absorbed by pressing component 203 when making degree so-called contour.
The bottom surface sections 205 of fin 202 is thinner than substrate 201.Have pressing component 203 on substrate 201 and the fin 202, on pressing component 203, have peristome 204.Even pressing component 203 under how many situations devious on the height equidimension of fin 202, also can be eliminated the gap of pump portion and fin, be used for forming reliably flowing of refrigerant airfoil.Therefore, pressing component 203 is by having flexibility, and has that stable on heating material that heat to fin can be heat-resisting forms.For example can use the gel film (gel sheet) that on big temperature range, to guarantee flexibility etc.If heater 403 be semiconductor element, then can for example-20 ℃ in 100 ℃ scope, guarantee flexibility in the environment temperature of its action of assurance.Thus, the top step difference of the top of aforesaid fin 202 and substrate 201 can be absorbed by press section 203 in the temperature range of necessity.
Be heated the flowing of refrigerant of portion 405 of this explanation.Mobile from the refrigerant 206 that second outlet 104 of pump portion 406 is discharged along the peristome 204 of pressing component, the central top 207 of inflow fin 202.The refrigerant that flows into fin 202 is gushed out around pressing component 203.The refrigerant gushed out 208 around it by 111 sealings of O shape ring, so automatically in second suction inlet 105 of inflow pump portion 406.More than, as described,, can help miniaturization even the position of the refrigerant gateway of the portion of being heated not on the top of fin, and under the situation on the top of substrate, also can be carried out the discrepancy action of refrigerant from fin top.In the portion of being heated of the present invention in addition,, also can tackle easily even the position of second outlet 104 is arbitrarily.For example shown in Figure 5, even second outlet 104 is not having to the position shown in Fig. 5 (a) of this explanation, and be present under the locational situation of Fig. 5 (b), also can tackle by the shape of form change pressing component 203 shown here.
Therefore, second outlet 104 can be configured in for pump portion and not have on the inadequate position.In addition, even in second suction inlet 105, so long as the position that the parts 203 that are not pressed cover can be arbitrarily.By this structure, can increase the degree of freedom of design, having can be with the big young pathbreaker's pump portion of necessary irreducible minimum and the integrally that is heated.
In addition as previously mentioned, owing to there is not the gap of pump portion and fin,, and obtain to solve the problem of the decreased performance of being heated so the part of refrigerant beyond fin is mobile.
In addition as previously mentioned, because second suction inlet 105 is towards the portion's of being heated 405 settings, so have the effect that can further improve cooling performance.
In addition in the present embodiment, the thickness of substrate 201 is 1.5mm, the thickness of pressing component 203 is 0.5mm, in addition because second outlet 104 and second suction inlet 105 of pump portion 406 only be opening shape, so the thickness of pump portion is owing to being free state and not increasing.Therefore, according to the state of pump monomer, the thickness increase that the joint portion of being heated causes only is 2mm.
In addition, in the past, exist easily via the problem of fin the heat of pump portion side conduction heater, particularly under near the situation that has pump shaft 112 fin, accelerate because of heat makes the deterioration of axle system, have the problem of the lost of life of pump, but pressing component 203 can be made of with the metal material that specific thermal conductivity is low mutually for example gel film etc. as previously mentioned, in addition, portion is provided with peristome 204 in the central.Because at the internal flow refrigerant of this peristome 204, so has the effect that the heat of the portion's side that keeps from heat is directly conducted to pump portion side.Therefore, has the effect that the heat that can solve heater passes to the problem of pump side.In fact, if compare, then can improve the temperature rising of pump side with 3～6 degree degree with the situation of not using pressing component 203.
In described embodiment so far, the shape of fin 202 is used tabular structure, but is not limited thereto, and for example also the fin of pin shape can be used side by side in addition.In addition, about pump, also being not limited to so far described turbulence type pump, for example also can be centrifugal pump or gear type pump.
The embodiment of the situation of gear type pump is used in expression among Fig. 3.At this 301 is that internal tooth, 302 is for external tooth.Other can be the structure identical with the embodiment of Fig. 1, and it is used identical Reference numeral.Gear type pump shown in Figure 3 drives liquid by internal tooth 301 and external tooth 302 while rotating to mesh.Also the embodiment with the front is identical in this pump, except having first suction inlet (not shown) and first outlet 102 that is used for being connected with the outside, also has second outlet 104 and second suction inlet 105 that are used for being connected with the portion of being heated.The top of fin 202 is in the height roughly the same with substrate 201 in addition, and pressing component 203 is between the fin 202 and second outlet 104.Embodiment by these structures and front similarly can access such effect, promptly can form refrigerant flowing reliably to little fin, prevent to be subjected to the reduction of hot property, avoid the heat of fin to pass to pump portion, in addition can be with the effect that engages with the portion of being heated with the roughly the same size of pump monomer.
In explanation so far,, represented the situation of a plurality of fins to be set, but be not limited thereto with short interval with headed by Fig. 1.Use Fig. 6 and Fig. 7, represent other embodiment.These perspective view and profiles for describing with the method identical with Fig. 1.To can being that the inscape of same structure is given identical Reference numeral.
Fig. 6 is that fin 202 is 3 a situation.Shown in this example,, can access identical effect even, also can be suitable for the present invention being provided with under the situation of a small amount of fin with long interval.The thickness of fin and the structure of Fig. 1 are thicker, so can thus increasing heat radiation effect.
Fig. 7 is the situation that fin is not set.This embodiment and Fig. 1 relatively form the gap easily between pressing component 203 and pump side, but constitute under situation of problem when this, can solve by using bonding agent etc.Refrigerant is discharged and the peristome 204 of inflow pressing component from second outlet 104.After particularly cooling off the bottom surface sections 205 of substrate, around pressing component 203, flow out, suck to pump portion from second water sucking mouth 105.Still with Fig. 1 similarly, can be suitable for the present invention, can access same effect.
Even in addition so far refrigerant flow towards being that the situation shown in arrow 206 and 208 is opposite with the situation of Fig. 2, also can access cooling effect.To reduce in order rising, for example also can to do as shown in Figure 2 with the temperature of the pump portion 406 headed by the pump shaft 112.
As mentioned above, according to the present invention, because the position of the refrigerant gateway of the small-sized and high performance portion of being heated can arbitrary decision, so realize being heated the integrated of portion and pump portion easily, becoming the little fin that is subjected to the reason that hot property reduces and the gap between the pump in the time of will having the portion of being heated of little fin and pump portion integrated in addition easily eliminates, in addition, can avoid heat to pass to pump and the life-span of pump is reduced from little fin, in addition can be to make the portion of being heated and pump integrated, so can realize high-performance with the roughly the same size of pump size, miniaturization, the liquid-cooled-type cooling device of cost degradation.
Claims (4)
1. the cooling device of an electronic equipment, its heat by refrigerant is transferred and is cooled off heater, it is characterized in that: have
The portion of being heated, this portion of being heated has: accept the substrate of the heat that described heater produces, have peristome and cover the part of described substrate, the pressing component of opposition side that is arranged at described heater and the stream of described flow of refrigerant;
Radiating part, this radiating part will be dispelled the heat by the heat that described refrigerant receives; And
Pump portion, it is used for making described refrigerant cycle described being heated between portion and the described radiating part,
Described pressing component is by having flexibility, and has that the stable on heating material that can tolerate the heat that described heater sends forms,
Described portion and the described pump portion of being heated be for constituting integrative-structure via described pressing component from engaging up and down,
Described pump portion has: described refrigerant is sucked first suction inlet in the described pump portion; First outlet that described refrigerant is discharged outside described pump portion; With second suction inlet of described refrigerant from the suction of the described portion of being heated; End face is configured in relative to the described portion of being heated second outlet last and that described refrigerant is discharged to the described portion of being heated,
Wherein, in the described stream of the described portion of being heated, described refrigerant flows into from the described peristome of described pressing component, flows out around described pressing component beyond described peristome.
2. the cooling device of an electronic equipment, its heat by refrigerant is transferred and is cooled off heater, it is characterized in that: have
The portion of being heated, this portion of being heated has: the platy substrate of accepting the heat of described heater generation, the fin that forms in the height mode about equally of its height and on every side substrate in described substrate and zone described heater opposition side, have peristome and cover the part at top of described fin and the pressing component of the part of described substrate and the stream of described flow of refrigerant;
Radiating part, this radiating part will be dispelled the heat by the heat that described refrigerant receives; And
Pump portion, it is used for making described refrigerant cycle described being heated between portion and the described radiating part,
Described pressing component is by having flexibility, and has that the stable on heating material that can tolerate the heat that described heater sends forms,
Described portion and the described pump portion of being heated be for constituting integrative-structure via described pressing component from engaging up and down,
Described pump portion has: described refrigerant is sucked first suction inlet in the described pump portion; First outlet that described refrigerant is discharged outside described pump portion; With second suction inlet of described refrigerant from the suction of the described portion of being heated; End face is configured in relative to the described portion of being heated second outlet last and that described refrigerant is discharged to the described portion of being heated,
Wherein, in the described stream of the described portion of being heated, the top of the described fin of described refrigerant in the described peristome of described pressing component flows into, and flow out at the top of the described fin beyond described peristome around the described pressing component.
3. the cooling device of electronic equipment as claimed in claim 1 or 2 is characterized in that:
Have the separating part that the pump chamber of refrigerant cycle is cut apart of being used to described pump portion inside,
Described first suction inlet and described second outlet are arranged on first partitioning portion of being cut apart by described separating part,
Described second suction inlet and described first outlet are arranged on second partitioning portion of being cut apart by described separating part.
4. the cooling device of electronic equipment as claimed in claim 1 or 2 is characterized in that:
As described pressing component, use keeps the gel film of flexibility in the scope of the environment temperature of the action that guarantees described heater.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-149469 | 2008-06-06 | ||
| JP2008149469 | 2008-06-06 | ||
| JP2008149469A JP5117287B2 (en) | 2008-06-06 | 2008-06-06 | Electronic equipment cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101600326A CN101600326A (en) | 2009-12-09 |
| CN101600326B true CN101600326B (en) | 2011-11-16 |
Family
ID=41399223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910118359.8A Expired - Fee Related CN101600326B (en) | 2008-06-06 | 2009-02-27 | Electronic apparatus cooling device |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US20090301692A1 (en) |
| JP (1) | JP5117287B2 (en) |
| CN (1) | CN101600326B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5626200B2 (en) | 2011-01-06 | 2014-11-19 | 株式会社豊田自動織機 | Electrical component fixing structure |
| JP6504832B2 (en) | 2014-01-28 | 2019-04-24 | ゼネラル・エレクトリック・カンパニイ | Integrated mounting and cooling devices, electronic devices and vehicles |
| US10073512B2 (en) | 2014-11-19 | 2018-09-11 | General Electric Company | System and method for full range control of dual active bridge |
| US20190041104A1 (en) * | 2017-08-07 | 2019-02-07 | Asia Vital Components Co., Ltd. | Heat exchange structure of heat dissipation device |
| CN109451696B (en) * | 2018-09-26 | 2020-10-27 | 天长市天毅电子科技有限公司 | Water-cooled electric vehicle charger |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2702586Y (en) * | 2004-04-28 | 2005-05-25 | 宣普科技股份有限公司 | Cooling device for electronic building brick |
| JP2005142191A (en) * | 2003-11-04 | 2005-06-02 | Matsushita Electric Ind Co Ltd | Cooling device |
| CN1809260A (en) * | 2004-12-27 | 2006-07-26 | 松下电器产业株式会社 | Heatsink apparatus |
| JP2007035901A (en) * | 2005-07-27 | 2007-02-08 | Matsushita Electric Ind Co Ltd | Heat receiver and cooling device equipped with it |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4072188A (en) * | 1975-07-02 | 1978-02-07 | Honeywell Information Systems Inc. | Fluid cooling systems for electronic systems |
| DE3466833D1 (en) * | 1983-11-02 | 1987-11-19 | Bbc Brown Boveri & Cie | Cooling body for the liquid cooling of power semiconductor devices |
| US4561040A (en) * | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
| US4758926A (en) * | 1986-03-31 | 1988-07-19 | Microelectronics And Computer Technology Corporation | Fluid-cooled integrated circuit package |
| US5316075A (en) * | 1992-12-22 | 1994-05-31 | Hughes Aircraft Company | Liquid jet cold plate for impingement cooling |
| US6019167A (en) * | 1997-12-19 | 2000-02-01 | Nortel Networks Corporation | Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments |
| CA2329408C (en) * | 2000-12-21 | 2007-12-04 | Long Manufacturing Ltd. | Finned plate heat exchanger |
| US20030214786A1 (en) * | 2002-05-15 | 2003-11-20 | Kyo Niwatsukino | Cooling device and an electronic apparatus including the same |
| JP4234635B2 (en) * | 2004-04-28 | 2009-03-04 | 株式会社東芝 | Electronics |
| US7543457B2 (en) * | 2005-06-29 | 2009-06-09 | Intel Corporation | Systems for integrated pump and reservoir |
| US20070012423A1 (en) * | 2005-07-15 | 2007-01-18 | Koichiro Kinoshita | Liquid cooling jacket and liquid cooling device |
| US7486516B2 (en) * | 2005-08-11 | 2009-02-03 | International Business Machines Corporation | Mounting a heat sink in thermal contact with an electronic component |
| US7331380B2 (en) * | 2005-08-17 | 2008-02-19 | Delphi Technologies, Inc. | Radial flow micro-channel heat sink with impingement cooling |
| US20070227698A1 (en) * | 2006-03-30 | 2007-10-04 | Conway Bruce R | Integrated fluid pump and radiator reservoir |
| US7849914B2 (en) * | 2006-05-02 | 2010-12-14 | Clockspeed, Inc. | Cooling apparatus for microelectronic devices |
| US7597135B2 (en) * | 2006-05-23 | 2009-10-06 | Coolit Systems Inc. | Impingement cooled heat sink with low pressure drop |
| US7511957B2 (en) * | 2006-05-25 | 2009-03-31 | International Business Machines Corporation | Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled |
| US7753662B2 (en) * | 2006-09-21 | 2010-07-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Miniature liquid cooling device having an integral pump therein |
| JP4876975B2 (en) * | 2007-03-02 | 2012-02-15 | 株式会社日立製作所 | Cooling device and heat receiving member for electronic equipment |
| JP5002522B2 (en) * | 2008-04-24 | 2012-08-15 | 株式会社日立製作所 | Cooling device for electronic equipment and electronic equipment provided with the same |
-
2008
- 2008-06-06 JP JP2008149469A patent/JP5117287B2/en not_active Expired - Fee Related
-
2009
- 2009-02-27 CN CN200910118359.8A patent/CN101600326B/en not_active Expired - Fee Related
- 2009-04-10 US US12/421,749 patent/US20090301692A1/en not_active Abandoned
-
2012
- 2012-02-29 US US13/408,306 patent/US20120160460A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005142191A (en) * | 2003-11-04 | 2005-06-02 | Matsushita Electric Ind Co Ltd | Cooling device |
| CN2702586Y (en) * | 2004-04-28 | 2005-05-25 | 宣普科技股份有限公司 | Cooling device for electronic building brick |
| CN1809260A (en) * | 2004-12-27 | 2006-07-26 | 松下电器产业株式会社 | Heatsink apparatus |
| JP2007035901A (en) * | 2005-07-27 | 2007-02-08 | Matsushita Electric Ind Co Ltd | Heat receiver and cooling device equipped with it |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009295869A (en) | 2009-12-17 |
| US20120160460A1 (en) | 2012-06-28 |
| CN101600326A (en) | 2009-12-09 |
| US20090301692A1 (en) | 2009-12-10 |
| JP5117287B2 (en) | 2013-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1988789B (en) | Fan heat sink and method and system using same | |
| CN100531535C (en) | Heat radiation model set | |
| US6695041B2 (en) | Double heat exchange module for a portable computer | |
| US8157001B2 (en) | Integrated liquid to air conduction module | |
| CN1979380B (en) | Embedded heat pipe in a hybrid cooling system | |
| EP1675451B1 (en) | Liquid cooling module | |
| CN101600326B (en) | Electronic apparatus cooling device | |
| CN101031195B (en) | A heat sink with a centrifugal fan | |
| CN100529426C (en) | Centrifugal fan, heat-radiation module using same and electronic device using the heat radiation module | |
| CN101026944A (en) | Radiating device | |
| CN101370370A (en) | Heat radiation model set and its fin group | |
| EP1533681A2 (en) | Electronic apparatus having cooling apparatus | |
| WO2005038859A2 (en) | Liquid cooling system | |
| CN109673139A (en) | Cooling system and aircraft with cooling system | |
| CN1697602A (en) | Cooling appts. | |
| TW201307689A (en) | Centrifugal fan module, heat sink device having the same and electric device having the heat sink device | |
| US7934540B2 (en) | Integrated liquid cooling unit for computers | |
| CN104412196B (en) | Computer system, the part of casing for computer system, heat exchanger and assemble computer system part method | |
| CN107041098B (en) | Radiator and electronic system | |
| US20050094371A1 (en) | Electronic device and heat-dissipating module thereof | |
| TW200823642A (en) | Centrifugal blower, thermal module having the centrifugal blower and electronic assembly incorporating the thermal module | |
| US20040114325A1 (en) | Cooling device and electric or electronic apparatus employing the same | |
| CN108352369B (en) | Heat sink and electric device | |
| CN209474657U (en) | Portable ultrasonic device | |
| CN201557360U (en) | Cooling fan device and electronic computing system thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HITACHI LTD. Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20130816 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20130816 Address after: Tokyo, Japan Patentee after: HITACHI CONSUMER ELECTRONICS Co.,Ltd. Address before: Tokyo, Japan Patentee before: Hitachi, Ltd. |
|
| ASS | Succession or assignment of patent right |
Owner name: HITACHI MAXELL LTD. Free format text: FORMER OWNER: HITACHI LTD. Effective date: 20150302 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150302 Address after: Osaka Japan Patentee after: Hitachi Maxell, Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Consumer Electronics Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180710 Address after: Kyoto Japan Patentee after: MAXELL, Ltd. Address before: Osaka Japan Patentee before: Hitachi Maxell, Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: MAXELL, Ltd. Address before: Kyoto Japan Patentee before: MAXELL HOLDINGS, Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220607 Address after: Kyoto Japan Patentee after: MAXELL HOLDINGS, Ltd. Address before: Kyoto Japan Patentee before: MAXELL, Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 |