CN101600326A - The cooling device of electronic equipment - Google Patents
The cooling device of electronic equipment Download PDFInfo
- Publication number
- CN101600326A CN101600326A CN200910118359.8A CN200910118359A CN101600326A CN 101600326 A CN101600326 A CN 101600326A CN 200910118359 A CN200910118359 A CN 200910118359A CN 101600326 A CN101600326 A CN 101600326A
- Authority
- CN
- China
- Prior art keywords
- heated
- refrigerant
- fin
- heat
- pressing component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 52
- 239000003507 refrigerant Substances 0.000 claims abstract description 52
- 238000003825 pressing Methods 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 108010025899 gelatin film Proteins 0.000 claims description 3
- 241000276425 Xiphophorus maculatus Species 0.000 claims description 2
- 238000000638 solvent extraction Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VZUGBLTVBZJZOE-KRWDZBQOSA-N n-[3-[(4s)-2-amino-1,4-dimethyl-6-oxo-5h-pyrimidin-4-yl]phenyl]-5-chloropyrimidine-2-carboxamide Chemical compound N1=C(N)N(C)C(=O)C[C@@]1(C)C1=CC=CC(NC(=O)C=2N=CC(Cl)=CN=2)=C1 VZUGBLTVBZJZOE-KRWDZBQOSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008149469A JP5117287B2 (en) | 2008-06-06 | 2008-06-06 | Electronic equipment cooling system |
JP2008149469 | 2008-06-06 | ||
JP2008-149469 | 2008-06-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101600326A true CN101600326A (en) | 2009-12-09 |
CN101600326B CN101600326B (en) | 2011-11-16 |
Family
ID=41399223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910118359.8A Expired - Fee Related CN101600326B (en) | 2008-06-06 | 2009-02-27 | Electronic apparatus cooling device |
Country Status (3)
Country | Link |
---|---|
US (2) | US20090301692A1 (en) |
JP (1) | JP5117287B2 (en) |
CN (1) | CN101600326B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102588248A (en) * | 2011-01-06 | 2012-07-18 | 株式会社丰田自动织机 | Fixing structure for electrical component |
CN109451696A (en) * | 2018-09-26 | 2019-03-08 | 天长市天毅电子科技有限公司 | A kind of water cooled electrodynamic vehicle charger |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6504832B2 (en) | 2014-01-28 | 2019-04-24 | ゼネラル・エレクトリック・カンパニイ | Integrated mounting and cooling devices, electronic devices and vehicles |
US10073512B2 (en) | 2014-11-19 | 2018-09-11 | General Electric Company | System and method for full range control of dual active bridge |
US20190041104A1 (en) * | 2017-08-07 | 2019-02-07 | Asia Vital Components Co., Ltd. | Heat exchange structure of heat dissipation device |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4072188A (en) * | 1975-07-02 | 1978-02-07 | Honeywell Information Systems Inc. | Fluid cooling systems for electronic systems |
EP0144579B1 (en) * | 1983-11-02 | 1987-10-14 | BBC Brown Boveri AG | Cooling body for the liquid cooling of power semiconductor devices |
US4561040A (en) * | 1984-07-12 | 1985-12-24 | Ibm Corporation | Cooling system for VLSI circuit chips |
US4758926A (en) * | 1986-03-31 | 1988-07-19 | Microelectronics And Computer Technology Corporation | Fluid-cooled integrated circuit package |
US5316075A (en) * | 1992-12-22 | 1994-05-31 | Hughes Aircraft Company | Liquid jet cold plate for impingement cooling |
US6019167A (en) * | 1997-12-19 | 2000-02-01 | Nortel Networks Corporation | Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments |
CA2329408C (en) * | 2000-12-21 | 2007-12-04 | Long Manufacturing Ltd. | Finned plate heat exchanger |
US20030214786A1 (en) * | 2002-05-15 | 2003-11-20 | Kyo Niwatsukino | Cooling device and an electronic apparatus including the same |
JP4134884B2 (en) * | 2003-11-04 | 2008-08-20 | 松下電器産業株式会社 | Cooling system |
CN2702586Y (en) * | 2004-04-28 | 2005-05-25 | 宣普科技股份有限公司 | Cooling device for electronic building brick |
JP4234635B2 (en) * | 2004-04-28 | 2009-03-04 | 株式会社東芝 | Electronics |
CN1809260A (en) * | 2004-12-27 | 2006-07-26 | 松下电器产业株式会社 | Heatsink apparatus |
US7543457B2 (en) * | 2005-06-29 | 2009-06-09 | Intel Corporation | Systems for integrated pump and reservoir |
US20070012423A1 (en) * | 2005-07-15 | 2007-01-18 | Koichiro Kinoshita | Liquid cooling jacket and liquid cooling device |
JP2007035901A (en) * | 2005-07-27 | 2007-02-08 | Matsushita Electric Ind Co Ltd | Heat receiver and cooling device equipped with it |
US7486516B2 (en) * | 2005-08-11 | 2009-02-03 | International Business Machines Corporation | Mounting a heat sink in thermal contact with an electronic component |
US7331380B2 (en) * | 2005-08-17 | 2008-02-19 | Delphi Technologies, Inc. | Radial flow micro-channel heat sink with impingement cooling |
US20070227698A1 (en) * | 2006-03-30 | 2007-10-04 | Conway Bruce R | Integrated fluid pump and radiator reservoir |
US7849914B2 (en) * | 2006-05-02 | 2010-12-14 | Clockspeed, Inc. | Cooling apparatus for microelectronic devices |
US7597135B2 (en) * | 2006-05-23 | 2009-10-06 | Coolit Systems Inc. | Impingement cooled heat sink with low pressure drop |
US7511957B2 (en) * | 2006-05-25 | 2009-03-31 | International Business Machines Corporation | Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled |
US7753662B2 (en) * | 2006-09-21 | 2010-07-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Miniature liquid cooling device having an integral pump therein |
JP4876975B2 (en) * | 2007-03-02 | 2012-02-15 | 株式会社日立製作所 | Cooling device and heat receiving member for electronic equipment |
JP5002522B2 (en) * | 2008-04-24 | 2012-08-15 | 株式会社日立製作所 | Cooling device for electronic equipment and electronic equipment provided with the same |
-
2008
- 2008-06-06 JP JP2008149469A patent/JP5117287B2/en not_active Expired - Fee Related
-
2009
- 2009-02-27 CN CN200910118359.8A patent/CN101600326B/en not_active Expired - Fee Related
- 2009-04-10 US US12/421,749 patent/US20090301692A1/en not_active Abandoned
-
2012
- 2012-02-29 US US13/408,306 patent/US20120160460A1/en not_active Abandoned
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102588248A (en) * | 2011-01-06 | 2012-07-18 | 株式会社丰田自动织机 | Fixing structure for electrical component |
US9065317B2 (en) | 2011-01-06 | 2015-06-23 | Kabushiki Kaisha Toyota Jidoshokki | Fixing structure for electrical component |
CN102588248B (en) * | 2011-01-06 | 2015-11-04 | 株式会社丰田自动织机 | For the fixed structure of electric component |
CN109451696A (en) * | 2018-09-26 | 2019-03-08 | 天长市天毅电子科技有限公司 | A kind of water cooled electrodynamic vehicle charger |
CN109451696B (en) * | 2018-09-26 | 2020-10-27 | 天长市天毅电子科技有限公司 | Water-cooled electric vehicle charger |
Also Published As
Publication number | Publication date |
---|---|
US20120160460A1 (en) | 2012-06-28 |
CN101600326B (en) | 2011-11-16 |
JP2009295869A (en) | 2009-12-17 |
US20090301692A1 (en) | 2009-12-10 |
JP5117287B2 (en) | 2013-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI LTD. Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20130816 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130816 Address after: Tokyo, Japan Patentee after: HITACHI CONSUMER ELECTRONICS Co.,Ltd. Address before: Tokyo, Japan Patentee before: Hitachi, Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: HITACHI MAXELL LTD. Free format text: FORMER OWNER: HITACHI LTD. Effective date: 20150302 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150302 Address after: Osaka Japan Patentee after: Hitachi Maxell, Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Consumer Electronics Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180710 Address after: Kyoto Japan Patentee after: MAXELL, Ltd. Address before: Osaka Japan Patentee before: Hitachi Maxell, Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: MAXELL, Ltd. Address before: Kyoto Japan Patentee before: MAXELL HOLDINGS, Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220607 Address after: Kyoto Japan Patentee after: MAXELL HOLDINGS, Ltd. Address before: Kyoto Japan Patentee before: MAXELL, Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 |