JP2007123641A5 - - Google Patents

Description

Electronic device casing and electronic device

The present invention relates to a housing of an electronic device on which a plurality of heat generating components such as a CPU are mounted, and the electronic device.

2. Description of the Related Art Conventionally, a technique for radiating heat of a heat generating component is known in an electronic device on which a heat generating component such as a CPU is mounted.

In general, there is known a natural air cooling technique in which a ventilation hole is provided in a casing of an electronic device, and air in the casing heated by the heat-generating component is replaced with external air of relatively low temperature. However, in the case of natural air cooling, the heat dissipating ability is low, and the heat dissipating effect is insufficient for a heat generating component having a high heat generation amount.

Therefore, Patent Document 1 is provided with a radiator such as a fan for discharging heat of the heat-generating component, and a suction port for introducing the air outside the housing into the housing, and the inside of the housing is heated. A technique is disclosed in which a discharge port for discharging air to the outside is provided in the vicinity of the radiator.

In Patent Document 2, a heat radiating fin (heat radiator) having holes formed in the vertical direction is joined to a substrate, and the heat from the substrate is increased by utilizing the chimney effect of the holes of the heat radiating fins. A technique for efficiently dissipating heat is disclosed.

Furthermore, Patent Document 3 discloses a technique for improving the heat dissipation effect by increasing the flow velocity of air by using a structure that restricts the flow path through which air flows.
JP 2000-112572 (released on April 21, 2000) JP 2001-68880 (published March 16, 2001) JP-A-11-307969 (published on November 5, 1999)

In general, electronic devices are very hot, such as heat-generating parts that generate large amounts of heat, such as power supply units and CPUs, those that generate heat, such as memories and HDDs, and those that are vulnerable to heat, such as electrolytic capacitors, crystal oscillators, and batteries. Many weak things are scattered.

These components are placed under the constraints of electronic circuit design. For this reason, there are many cases in which a high heat generation component or a heat-sensitive component must be arranged beside the high heat generation component.

However, in the above-described conventional configuration, when another heat generating component or a heat-sensitive component is disposed between the heat radiating portion connected to the high heat generating component and the exhaust port, the high temperature heated by the high heat generating component is high. Air flows around other heat-generating parts and heat-sensitive parts. Therefore, there arises a problem that the other heat-generating components and heat-sensitive components cannot be sufficiently radiated.

The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an electronic device capable of preventing a temperature rise of a heat generating component other than a heat generating component in contact with a heat radiating portion or a heat-sensitive component. The object is to realize a device casing and an electronic device.

The housing of the electronic device of the present invention is in contact with an exhaust port for exhausting air inside the electronic device, an intake port for taking air into the electronic device, and a heat generating component included in the electronic device. A heat dissipating part that dissipates heat transferred from the heat-generating component into the air, the heat dissipating part having one end connected to the exhaust port and the other end being air in the heat dissipating part. And is bent so as to change the traveling direction of the air that has entered the opening in a direction perpendicular to the opening to a direction toward the exhaust port. Is located between the exhaust port and the suction port.

According to the above configuration, the housing is incorporated into the electronic device so that the opening is positioned below the exhaust port and the opening is not perpendicular to the horizontal plane. The air taken into the electronic device rises and enters the opening. And the air which approached absorbs the heat | fever of a heat-emitting component via a thermal radiation part, and temperature rises. Then, the air whose temperature has risen tries to rise further.

Here, one end of the heat radiating portion is connected to the exhaust port, and the direction of the air that has entered the opening in a direction perpendicular to the other opening is directed to the exhaust port. It is bent to change to. Therefore, the air that has entered through the opening is bent in the traveling direction, is guided to the exhaust port, and is exhausted from the exhaust port.

Therefore, the high-temperature air that has absorbed the heat of the heat generating component through the heat radiating portion is exhausted to the outside as it is, and therefore does not come into contact with other heat generating components or heat-sensitive components. Thereby, it becomes possible to prevent the temperature rise of heat-generating components other than the heat-generating components that are in contact with the heat radiating portion or heat-sensitive components.

Further, the casing of the electronic device of the present invention is a casing configured as a side wall of the electronic device, and is located below the exhaust port for exhausting the air inside the electronic device. A suction port for taking air into the electronic device; and a heat radiating part that contacts the heat generating component provided in the electronic device and radiates heat transferred from the heat generating component into the air. Is a bent shape, one end is connected to the exhaust port, and the other end is an opening for allowing air to flow into the heat radiating part, and is incorporated into the electronic device. In addition, the opening is located between the exhaust port and the suction port and is not perpendicular to a horizontal plane.

According to the above configuration, when the air taken in from the suction port rises when the housing is incorporated in the electronic device, the heat enters the heat dissipation portion from the opening. And the air which approached absorbs the heat | fever of a heat-emitting component via a thermal radiation part, and temperature rises. Then, the air whose temperature has risen tries to rise further.

Here, the heat radiating portion has a bent shape, one end is connected to the exhaust port, and the other end is an opening for allowing air to flow into the heat radiating portion. Therefore, the air that has entered through the opening is bent in the traveling direction, is guided to the exhaust port, and is exhausted from the exhaust port.

Therefore, the high-temperature air that has absorbed the heat of the heat generating component through the heat radiating portion is exhausted to the outside as it is, and therefore does not come into contact with other heat generating components or heat-sensitive components. Thereby, it becomes possible to prevent the temperature rise of heat-generating components other than the heat-generating components that are in contact with the heat radiating portion or heat-sensitive components.

Further, the casing of the electronic device of the present invention is a casing configured as a side wall of the electronic device, and is located below the exhaust port for exhausting the air inside the electronic device. A suction port for taking air into the electronic device; and a heat radiating part that contacts the heat generating component provided in the electronic device and radiates heat transferred from the heat generating component into the air. The surface on the back side of the contact surface that comes into contact with the heat-generating component is bent so as to be connected to a part of the exhaust port, and when incorporated in the electronic device, it is taken into the electronic device from the suction port, The traveling direction of the rising air is changed to a direction toward the exhaust port.

According to the above configuration, when the air taken into the electronic device from the suction port rises when the housing is incorporated in the electronic device, the traveling direction of the air is changed to the direction toward the exhaust port. The Under the present circumstances, the air which collided with the surface on the back side of the said contact surface of a thermal radiation part absorbs the heat | fever of a heat-emitting component via a thermal radiation part. And since the air which became high temperature is going to the exhaust port, the advancing direction will be exhausted from an exhaust port.

Therefore, the high-temperature air that has absorbed the heat of the heat generating component through the heat radiating portion is exhausted to the outside as it is, and therefore does not come into contact with other heat generating components or heat-sensitive components. Thereby, it becomes possible to prevent the temperature rise of heat-generating components other than the heat-generating components that are in contact with the heat radiating portion or heat-sensitive components.

Furthermore, in addition to the above-described configuration, the housing of the electronic device according to the present invention, when incorporated in the electronic device, the heat radiating portion is inclined with respect to a horizontal plane, and is upward from the opening to the exhaust port. It extends to.

Thereby, the air that has entered the heat radiating section is smoothly exhausted from the exhaust port and does not stay in the heat radiating section.

Further, in the case of the electronic device according to the present invention, in addition to the above-described configuration, the heat radiating portion has fins formed on the surface facing the exhaust port.

According to said structure, the surface area of a thermal radiation part becomes large because a fin is formed in a thermal radiation part. And the said fin is formed in the surface facing an exhaust port in a thermal radiation part. Therefore, since the air exhausted from the exhaust port contacts the fins, the heat of the heat-generating component that is in contact with the heat radiating portion can be further absorbed.

In addition, it is preferable that a fin is plate shape. This simplifies fin formation.

Furthermore, in addition to the above configuration, the housing of the electronic device of the present invention is provided with a fan at the suction port. Thereby, the air taken in in an electronic device increases and the heat dissipation effect improves further.

In addition, an electronic apparatus according to the present invention includes the above-described casing. Thereby, since the high temperature air which absorbed the heat | fever of the heat-emitting component via the heat radiating part is exhausted as it is, it does not contact with other heat-generating components or heat-sensitive components. As a result, it is possible to prevent the temperature rise of heat-generating components other than the heat-generating components that are in contact with the heat radiating portion and heat-sensitive components.

According to the housing of the electronic device according to the present invention, the air that has entered the heat radiating part absorbs the heat of the heat-generating component through the heat radiating part, and the traveling direction is bent to the exhaust port, and the air is exhausted from the exhaust port. Is done. Thereby, since the high temperature air which absorbed the heat | fever of the heat-emitting component via the heat radiating part is exhausted as it is, it does not contact with other heat-generating components or heat-sensitive components. As a result, it is possible to prevent the temperature rise of heat-generating components other than the heat-generating components that are in contact with the heat radiating portion and heat-sensitive components.

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2 are perspective views of the electronic apparatus 1 according to the present embodiment. The electronic apparatus 1 according to the present embodiment is a display-integrated computer, but the present invention is not limited to this.

FIG. 1 is a perspective view of the electronic device 1 as viewed from below the back surface, and FIG. 2 is a perspective view of the electronic device 1 as viewed from above the front surface.

As shown in FIG. 1 and FIG. 2, the electronic device 1 has a substantially rectangular parallelepiped shape, and has six surfaces including a right side surface 11, a bottom surface 12, a back surface 13, a front surface 14, an upper surface 15, and a left side surface (not shown). In normal use, the bottom surface 12 is installed in contact with a desk or the like. A liquid crystal display is disposed on the front surface 14. The right side surface 11, the left side surface, the front surface 14, and the back surface 13 are surfaces outside the side wall of the electronic device 1.

In the drawing, the xy plane is a horizontal plane, and the z direction is perpendicular to the horizontal plane and upward. The same applies to the following drawings.

As shown in FIG. 1, the electronic device 1 includes a housing 20. The housing 20 is configured as a side wall of the electronic device 1, and the outer surface is the back surface 13 of the electronic device 1. The housing 20 is also a part of the right side surface 11, the left side surface (not shown), the bottom surface 12, and the top surface 15.

In the present specification, in the housing 20, the surface that becomes the outside of the electronic device 1 when incorporated in the electronic device 1 is called an “outer surface”, and the surface that becomes the inside of the electronic device 1 is an “inner surface”. That's it.

As shown in FIG. 1, a plurality of linear grooves 25 are formed in the vertical direction in parallel to each other in a portion close to the upper surface 15 side of the housing 20. A bank portion 26 is formed between adjacent grooves 25. Thereby, the surface area of the outer surface of the housing | casing 20 becomes large, the heat | fever which generate | occur | produced inside the electronic device 1 and was transmitted to the housing | casing 20 is efficiently thermally radiated with external air.

The material of the housing | casing 20 should just be a material with high heat conductivity, such as aluminum, for example. Thereby, a further heat radiation effect can be expected. Moreover, the housing | casing 20 is formed by the die-casting method, for example.

As shown in FIG. 1, the housing 20 is a side wall on the back surface 13 side of the electronic device 1 when incorporated into the electronic device 1, and includes two housings for exhausting the air inside the electronic device 1 to the outside. An exhaust port 21 is provided. Further, the housing 20 is provided with a plurality of suction ports 22 for taking outside air into the electronic device 1 in a direction from the exhaust port 21 toward the bottom surface 12.

As shown in FIG. 3, a suction fan 34 may be provided on the outer surface side of the suction port 22. Thereby, external air can be taken in the electronic device 1 more efficiently.

A filter is preferably provided outside the suction port 22. Thereby, it is possible to prevent dust from entering the electronic device 1.

FIG. 4 shows the internal structure of the electronic device 1 and is a perspective view when the electronic device 1 is viewed from the back surface 13 side when the housing 20 is removed. As shown in FIG. 4, the electronic device 1 includes a CPU (central processing unit) 31, a memory 33 disposed on the bottom surface 12 side from the CPU 31, and a power supply unit 32 disposed on the top surface 15 side from the CPU 31. It has. Note that the CPU 31 and the memory 32 are disposed on the substrate 30.

The CPU 31 is a heat generating component that generates a relatively large amount of heat and is a component that requires heat dissipation measures to prevent performance degradation. The most heat generating area in the CPU 31 is the area 31a. The power supply unit is also a heat generating component that generates a relatively large amount of heat. The memory 32 is a heat-sensitive component.

Since the HDD is arranged in the horizontal direction of the CPU 31, it is hardly affected by the heat of the CPU 31.

FIG. 5 is a perspective view of the housing 20 as seen from the inner surface side. FIG. 5 shows a state when the power supply unit 32 is attached to the housing 20.

The power supply unit 32 is mounted on the inner surface on the back side of the region where the groove 25 and the bank portion 26 are formed on the outer surface of the housing 20. Therefore, the heat of the power supply unit 32 is transmitted to the casing 20 made of a material having a relatively high thermal conductivity, and is radiated to the outside air through the large surface area region formed by the groove 25 and the bank portion 26.

As shown in FIG. 5, when the housing 20 is incorporated in the electronic apparatus 1, the housing 20 comes into contact with the CPU 31 and dissipates heat transferred from the CPU 31 into the air. 24. Further, the heat sink part 24 is formed so as to cover the exhaust port 21. The heat sink portion 24 is formed integrally with the housing 20, and the material thereof is the same as that of the housing 20 and has high thermal conductivity.

FIG. 6 is an enlarged view of the heat sink portion 24. The heat sink part 24 has a contact surface 242 that comes into contact with the CPU 31 provided in the electronic device 1 when the housing 20 is incorporated in the electronic device 1. The contact surface 242 of this embodiment is substantially parallel to the outer surface of the housing 20.

As described above, the heat sink portion 24 covers the exhaust port 21 and guides the air inside the electronic device 1 to the exhaust port 21. That is, one end portion of the heat sink portion 24 is connected to the exhaust port (here, since the heat sink portion 24 and the housing 20 are integrally formed), the other end portion is The air inlet (opening) 241 for taking air into the electronic device 1 is provided. The heat sink part 24 changes the traveling direction of the air flowing in the direction perpendicular to the inflow port 241 to the direction of the exhaust port 21. Note that the inflow port 241 is formed by connecting the heat sink portion 24 to the housing 20. In the portion of the inflow port 241, the heat sink portion 24 and the housing 20 can be said to be tubular.

In other words, the heat sink portion 24 functions as an exhaust hood that covers the exhaust port 21.

In other words, the heat sink portion 24 has a box shape that covers the exhaust port 21. A surface that does not face the exhaust port 21 is open, and the opening serves as an inflow port 241 through which air flows. Yes. That is, the exhaust port 21 and the inflow port 241 are not opposed to each other, and the air flowing in from the inflow port 241 is changed in the traveling direction toward the exhaust port 21 by the heat sink portion 24.

Note that the inflow port 241 may not be perpendicular to the horizontal plane. Thereby, the air located below the inflow port 241 can enter the heat sink portion 24 through the inflow port 241 by rising. However, as in the present embodiment, the inlet 241 is preferably substantially parallel to the horizontal plane (XY plane). As a result, most of the air located below the inlet 241 enters the heat sink portion 24 via the inlet 241.

Further, the inflow port 241 is located above the suction port 22. Further, the inflow port 241 is located below the exhaust port 21. That is, the inflow port 241 is located between the exhaust port 21 and the suction port 22.

7 is a cross-sectional view taken along the line AA of FIG. 1 and FIG. 6 when a part of the housing 20 including the heat sink portion 24 is sectioned. FIG. 8 is a cross-sectional view of the heat sink 24 taken along the line BB in FIG.

As shown in FIG. 7 and FIG. 8, the heat sink portion 24 covers the exhaust port 21 formed in the housing 20, and the hood main body portion 246 that opens only the inflow port 241, and the hood main body portion 246. And a plurality of fins 245 formed on the air guide surface 244 facing the exhaust port 21. Further, as described above, the inflow port 241 and the discharge port 21 are not opposed to each other.

As shown in FIG. 7, in the hood main body 246, the air guide surface 244 opposite to the contact surface 242 faces the exhaust port 21 and is curved toward a part of the exhaust port 21. It extends while forming. That is, the air guide surface 244 is bent to be continuous with a part of the exhaust port 21.

The hood main body 246 forms the inlet 241 together with the fins 245 and the housing 20 at the end opposite to the end continuous with the exhaust port 21.

Further, as shown in FIG. 8, the hood main body 246 has a substantially U-shaped cross section when cut along a plane (BB line) perpendicular to the direction from the inlet 242 toward the exhaust outlet 21. Both ends of the U shape are connected to the housing 20.

The fins 245 are formed on the air guide surface 244 of the hood main body 246 in the direction from the inflow port 241 to the exhaust port 21. The fins 245 are continuous with the bank portion 26 formed on the outer surface of the housing 20. And the fin 245 is plate-shaped.

Next, the principle of heat dissipation of the CPU 31 in the electronic device 1 will be described.
First, the heat dissipation action of an electronic device including a housing 20a having a heat sink portion 24a as a comparative example with respect to the present embodiment will be described.

FIG. 9 is a schematic diagram showing the heat dissipation action of the CPU 31 of the electronic apparatus as the comparative example. As shown in FIG. 9, the heat sink portion 24 a of the comparative example is in contact with the CPU 31, and the main body portion 246 a formed in parallel with the housing 20, and the opposite side of the contact surface with the CPU 31 in the main body portion 246 a. It consists of a plurality of fins 245a formed on the surface. The fins 245a extend in a direction perpendicular to the horizontal plane, and a plurality of fins 245a are formed at equal intervals.

And the fin 245a is connected to the housing | casing 20a in the edge part opposite to the edge part connected with the main-body part 246a.

In the comparative example, the arrangement of the CPU 31, the memory 33, and the power supply unit 32 is the same as that of the present embodiment.

Further, the casing 20a according to the comparative example does not have the exhaust port 21 in the portion where the heat sink portion 24a is formed. Instead, an exhaust port 21a is provided above the power supply unit. In addition, the housing 20a has a suction port 22 for taking air into the electronic device on the bottom side, as in the present embodiment.

As shown in FIG. 9, in the electronic device according to the comparative example, the air taken into the electronic device from the suction port 22 first absorbs the heat of the memory 33 that is weak against heat. Thereafter, the raised air passes between the fins 245a of the heat sink portion 24a. At this time, the air absorbs the heat of the CPU 31 through the fins 245a. Thereby, the heat of the CPU 31 having a large calorific value is radiated. The air that has absorbed the heat from the fins 245a and has reached a high temperature tends to rise further by expanding. The hot air flows to the power supply unit 32 located above the CPU 31. As a result, the power supply unit 32 that generates a relatively large amount of heat is surrounded by high-temperature air. And it becomes impossible to thermally radiate the heat of the power supply unit 32 efficiently.

As described above, in the electronic device according to the comparative example, the high-temperature air that has absorbed the heat from the CPU 31 flows to the other heat-generating component, and thus the other heat-generating component cannot be efficiently radiated.

On the other hand, in the electronic device 1 of the present embodiment, high-temperature air that has absorbed heat from the CPU 31 does not flow to the other electronic components as described below, and thus the heat dissipation of the other electronic components is efficient. Can be done automatically.

FIG. 10 is a schematic diagram illustrating the heat dissipation effect of the CPU 31 in the electronic apparatus 1 of the present embodiment.

As shown in FIG. 10, one end of the air guide surface 244 of the hood main body 246 forms a part of the inflow port 241, and the other end continues to a part of the exhaust port 21. Yes. That is, the hood main body 246 covers the exhaust port 21 so as to connect the inflow port 241 and the exhaust port 21.

Therefore, the air taken into the electronic apparatus 1 from the suction port 22 located below the inlet 241 first absorbs the heat of the memory 33 that is weak against heat and flows to the inlet 241. The air flowing from the inlet 241 into the heat sink part 24 absorbs the heat of the CPU 31 via the hood main body part 246 and the fins 245. Thereby, the heat of the CPU 31 is dissipated.

Thereafter, the hot air tends to rise further. However, the air guide surface 244 of the heat sink portion 24 is bent so that the traveling direction of the air traveling in the direction perpendicular to the inflow port 241 is changed to the exhaust port 21. Therefore, the air that has entered the heat sink portion 24 collides with the air guide surface 244 while absorbing the heat of the CPU 31, and the traveling direction becomes the direction of the exhaust port 21. Then, the high-temperature air that has absorbed the heat of the CPU 31 is exhausted from the exhaust port 21 to the outside of the housing 20.

Thus, unlike the comparative example, high-temperature air that has absorbed the heat of the CPU 31 does not flow around the power supply unit 32. And it is possible to cool the power supply unit 32 with the air which flows through another flow path. As a result, the power supply unit 32 can be efficiently radiated.

As a result of thermal analysis simulation of the CPU 31 and the power supply unit 32 using the comparative example as shown in FIG. 9 and the present embodiment as shown in FIG. 10 as models, the temperature of the CPU 31 is 93. It was 2 ° C, and in this embodiment, it was 91.0 ° C. Thus, it was confirmed that the heat dissipation effect of CPU31 is improving this embodiment with respect to the said comparative example.

The temperature of the power supply unit 32 was 96.2 ° C. in the comparative example, and 91.1 ° C. in the present embodiment. Thus, it was confirmed that the heat dissipation effect of the power supply unit 32 located in the vicinity of the CPU 31 in contact with the heat sink portion 24 is also improved.

The number, width, and shape of the fins 245 formed on the air guide surface 244 of the hood main body 246 may be set as appropriate. That is, what is necessary is just to design so that the surface area of the fin 245 whole may become large in the range which the flow volume of the air which passes between the several fins 245 does not reduce.

Further, the height of the fin 245 relative to the air guide surface 244 may be set in consideration of the appearance and strength of the housing 20 and the surface area of the entire fin 245. That is, in order to increase the entire surface area of the fin 245 and further improve the heat dissipation effect of the heat sink portion 24, the height of the fin 245 relative to the air guide surface 244 may be increased. At this time, the bank portion 26 continuing to the fins 245 may also be raised with respect to the groove 25.

However, if the height of the fin 245 relative to the air guide surface 244 is increased, the fin 245 may protrude beyond the outer surface of the housing 20. Thereby, the external appearance of the housing | casing 20 may deteriorate or the fin 245 may contact and break other objects. Therefore, the height of the fins 245 relative to the air guide surface 244 may be set in consideration of the overall appearance, strength, and heat dissipation effect of the housing 20.

In the above description, the exhaust port 21 is exposed to the outside of the electronic device 1. However, the housing 20 may be provided with a cover member at a predetermined distance from the exhaust port 21 on the outer surface thereof.

FIG. 11 is a perspective view of the electronic device 1 when the housing 20 includes the cover member 41 so as to cover the exhaust port 21. The cover member 41 is connected to the housing 20 at a side other than the side on the upper surface 15 side, and has a bag shape in which only the side on the upper surface 15 side is opened.

FIG. 12 is a schematic diagram illustrating the heat dissipation action of the CPU 31 when the housing 20 includes the cover member 41.

As shown in FIG. 12, the air exhausted from the exhaust port 21 passes through a flow path that is a gap between the housing 20 and the cover member 41 and is exhausted from the upper opening 42. Thus, by providing the cover member 41, the flow path of the air exhausted from the exhaust port 21 is narrowed, and the flow velocity of the air passing through the flow path that is the gap between the housing 20 and the cover member 41 is increased. . As a result, the flow rate of air passing through the heat sink part 24 is also increased, and the heat of the CPU 31 can be radiated into the air via the heat sink part 24 more efficiently.

In the above description, the heat sink portion 24 is formed integrally with the housing 20, but may be connected after being formed separately.

In the above description, the exhaust port 21 is provided in the housing 20 that is the back surface 13 of the electronic device 1. However, the present invention is not limited thereto, and the exhaust port 21 may be the housing 20 that serves as the side wall of the electronic device 1. For example, the housing | casing which becomes a front surface and a side surface on either side may be sufficient.

Further, the air guide surface 244 may be convex upward, and the highest position may be higher than the exhaust port 21. However, in this case, air may stay at a position higher than the exhaust port 21. Therefore, it is preferable that the air guide surface 244 is continuous with the exhaust port 21 while extending in the Z direction (that is, upward) toward the exhaust port 21. In other words, it is preferable that the Z-coordinate (or the height from the bottom surface 13) of the air guide surface 244 monotonously increases from the inflow port 241 toward the exhaust port 21. Thereby, the air which passes the heat sink part 24 flows smoothly.

As described above, the housing 20 of the electronic device 1 according to the present embodiment includes the exhaust port 21 for exhausting air inside the electronic device 1 and the suction port 22 for taking air into the electronic device 1. And a heat sink part (heat radiating part) 24 that contacts the CPU (heat generating component) 31 provided in the electronic apparatus 1 and radiates heat transferred from the CPU 31 into the air. The heat sink portion 24 has one end continuous with the exhaust port 21, and the other end is an inflow port 24 for allowing air to flow into the heat sink portion 24, with respect to the inflow port 241. The direction of travel of the air that has entered the inlet 241 in a vertical direction is bent so as to change to the direction toward the exhaust port 21. The opening 241 is located between the exhaust port 21 and the suction port 22.

Moreover, the housing | casing 20 of the electronic device 1 can also be expressed as follows. That is, the housing 20 is a housing configured as a side wall of the electronic device 1 and is located below the exhaust port 21 and the exhaust port 21 for exhausting air inside the electronic device 1. A suction port 22 for taking air into the electronic device 1; a heat sink part 24 that contacts the CPU (heat generating component) 31 provided in the electronic device 1 and dissipates heat transferred from the CPU 31 into the air; Is provided. The heat sink portion 24 has a bent shape, one end portion is continuous with the exhaust port 21, and the other end portion is an inflow port 24 for flowing air into the heat sink portion 24, When the casing 20 is incorporated as a side wall of the electronic device 1, the inflow port 24 is located between the exhaust port 21 and the suction port 22 and is not perpendicular to a horizontal plane.

Moreover, the housing | casing 20 of the electronic device 1 can also be expressed as follows. That is, the housing 20 is a housing configured as a side wall of the electronic device 1 and is located below the exhaust port 21 and the exhaust port 21 for exhausting air inside the electronic device 1. A suction port 22 for taking air into the electronic device 1; a heat sink part 24 that contacts the CPU (heat generating component) 31 provided in the electronic device 1 and dissipates heat transferred from the CPU 31 into the air; Is provided. In the heat sink portion 24, the air guide surface 244 on the back side of the contact surface 242 that contacts the CPU 31 is bent so as to be continuous with a part of the exhaust port 21, and the housing 20 is a side wall of the electronic device 1. When it is incorporated, the traveling direction of the air rising from below the exhaust port 21 is changed to the direction toward the exhaust port 21.

With the above configuration, the air that has entered the heat sink part 24 absorbs the heat of the CPU 31 through the heat sink part 24, the direction of travel is bent toward the exhaust port 21, and the air is exhausted from the exhaust port 21. Thus, the high-temperature air that has absorbed the heat of the CPU 31 is exhausted to the outside as it is, so that it does not come into contact with other heat-generating components or heat-sensitive components. As a result, it is possible to prevent a temperature rise of a heat generating component other than the CPU 31 that is in contact with the heat sink portion 24 or a heat-sensitive component.

Moreover, in this embodiment, the heat sink part 24 is installed in the place which contacts CPU31, and exhausts the air which flowed in. Therefore, the heat dissipation effect of other components can be enhanced without hindering the flow of air around the other components.

Further, when the housing 20 is incorporated in the electronic apparatus 1, the air guide surface 244 of the heat sink portion 24 is inclined with respect to the horizontal plane and extends upward from the inflow port 241 to the exhaust port 21. Thereby, the air that has entered the heat sink portion 24 is smoothly exhausted from the exhaust port 21 and does not stay in the heat sink portion 24.

Further, the heat sink portion 24 has fins 245 formed on the air guide surface 244 that faces the exhaust port 21. The formation of the fins 245 increases the surface area of the heat sink portion 24. The fin 245 is formed on the air guide surface 244 facing the exhaust port 21 at 245. Therefore, the air exhausted from the exhaust port 21 comes into contact with the fins 245, so that the heat of the CPU 31 can be further absorbed.

Further, the cover member 41 is connected to the outer surface of the housing 20 on the back side of the inner surface where the heat sink portion 24 is formed. The cover member 41 is formed so as to cover the exhaust port 21 while being separated from the exhaust port 21 by a predetermined distance.

Therefore, the air exhausted from the exhaust port 21 flows through the gap between the housing 20 and the cover member 41 as a flow path. As the flow path is narrowed in this way, the air flow rate increases, so that the heat of the CPU 31 can be further dissipated through the heat sink portion 24.

Further, the housing 20 is formed integrally with the heat sink portion 24. Thereby, the thermal conductivity from the heat sink part 24 to the housing | casing 20 improves, and the heat | fever of CPU31 is transmitted to the whole housing | casing 20, and there exists a further heat dissipation effect.

Furthermore, the suction port 22 is preferably provided with a filter. Thereby, dust can be prevented from entering the electronic apparatus 1.

Further, the suction port 22 is preferably provided with a suction fan 34. Thereby, the air taken in in the electronic device 1 increases, and the heat dissipation effect improves further.

The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims. That is, embodiments obtained by combining technical means appropriately changed within the scope of the claims are also included in the technical scope of the present invention.

The present invention can be applied to a housing of an electronic device having a plurality of heat generating components.

It is a perspective view when the electronic device of this embodiment is seen from the back side. It is a perspective view when the said electronic device is seen from the front side. It is a perspective view of the electronic device provided with the fan for suction | inhalation. It is a perspective view which shows the inside of an electronic device. It is a perspective view when the housing | casing which comprises the back surface of an electronic device is seen from the inner surface side. It is an enlarged view of the heat sink part (heat radiation part) with which the said housing | casing is provided. It is arrow sectional drawing of the AA line of FIG. It is arrow directional cross-sectional view of the BB line of FIG. It is a figure which shows the thermal radiation effect of CPU in the electronic device which concerns on the comparative example of this invention. It is a figure which shows the thermal radiation effect of CPU in the electronic device which concerns on this embodiment. It is a figure which shows the modification of the electronic device which concerns on this embodiment. It is a figure which shows the heat dissipation effect of CPU in the electronic device shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic device 20 Case 21 Exhaust port 22 Suction port 24 Heat sink part (heat dissipation part)
31 CPU (Heat-generating component)
32 Power supply unit 34 Suction fan (fan)
41 Cover member 241 Inflow port (opening)
242 Contact surface 244 Air guide surface (surface behind contact surface)
245 Fin 246 Hood body (heat dissipation part)

Claims (7)

An exhaust port for exhausting air inside the electronic device;
An inlet for taking air into the electronic device;
A heat-dissipating part that contacts the heat-generating component provided in the electronic device and dissipates heat transferred from the heat-generating component into the air;
The heat radiating portion has one end connected to the exhaust port, and the other end is an opening through which air flows into the heat radiating portion, and is perpendicular to the opening. Bending to change the direction of travel of the air that has entered the opening to the direction toward the exhaust port,
The housing of the electronic device, wherein the opening is located between the exhaust port and the suction port. A housing configured as a side wall of an electronic device,
An exhaust port for exhausting air inside the electronic device;
A suction port located below the exhaust port for taking air into the electronic device;
A heat-dissipating part that contacts the heat-generating component provided in the electronic device and dissipates heat transferred from the heat-generating component into the air;
The heat dissipating part has a bent shape, one end is connected to the exhaust port, and the other end is an opening for flowing air into the heat dissipating part,
The housing of an electronic device, wherein the opening is positioned between the exhaust port and the suction port and is not perpendicular to a horizontal plane when incorporated in the electronic device. A housing configured as a side wall of an electronic device,
An exhaust port for exhausting air inside the electronic device;
A suction port located below the exhaust port for taking air into the electronic device;
A heat-dissipating part that contacts the heat-generating component provided in the electronic device and dissipates heat transferred from the heat-generating component into the air;
In the heat dissipating part, the surface on the back side of the contact surface that comes into contact with the heat-generating component is bent so as to connect to a part of the exhaust port, and when incorporated in the electronic device, the suction port enters the electronic device. A housing for an electronic device, wherein a direction in which air that is taken in and ascends is changed to a direction toward the exhaust port. The case of the electronic device according to claim 2, wherein when incorporated in the electronic device, the heat dissipation portion is inclined with respect to a horizontal plane and extends upward from the opening to the exhaust port. body. The case of the electronic device according to claim 1, wherein the heat radiating portion has fins formed on a surface facing the exhaust port. Above the inlet, the housing of the electronic device according to any one of claims 1 to 5, characterized in that the fan is provided. An electronic apparatus, comprising a housing according to any one of claims 1-6.