JPS60103845U - semiconductor cooling equipment - Google Patents
semiconductor cooling equipmentInfo
- Publication number
- JPS60103845U JPS60103845U JP19659583U JP19659583U JPS60103845U JP S60103845 U JPS60103845 U JP S60103845U JP 19659583 U JP19659583 U JP 19659583U JP 19659583 U JP19659583 U JP 19659583U JP S60103845 U JPS60103845 U JP S60103845U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor cooling
- heat sink
- cooling device
- cooling equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体の冷却装置を示す断面側面図、第
２図は第１図の■−■線の断面図、第３図はこの考案の
一実施例を示す断面側面図、第４図は第３図のＩＶ−Ｉ
Ｖ線の断面図である。
図中、１は半導体、２はヒートシンク、３は箱体、４は
支持材、５は換気扇、６はドア、９はヒートパイプであ
る。尚図中、同一符号は同一また □は相当部分を示す
。Fig. 1 is a cross-sectional side view showing a conventional semiconductor cooling device, Fig. 2 is a cross-sectional view taken along the line ■-■ in Fig. 1, Fig. 3 is a cross-sectional side view showing an embodiment of this invention, and Fig. 4 is a cross-sectional side view showing a conventional semiconductor cooling device. The figure is IV-I in Figure 3.
It is a sectional view taken along the V line. In the figure, 1 is a semiconductor, 2 is a heat sink, 3 is a box, 4 is a support member, 5 is a ventilation fan, 6 is a door, and 9 is a heat pipe. In the figures, the same symbols or □ indicate corresponding parts.
Claims (3)
ートシンクを収納したものにおいて、上記ヒートシンク
と箱体との間を熱抵抗の少ない熱伝導部材で接続し、箱
体を放熱器の一部として利用したことを特徴とする半導
体の冷却装置。(1) In a metal box housing a semiconductor and a heat sink for cooling the semiconductor, the heat sink and the box are connected by a thermally conductive member with low thermal resistance, and the box is used as a heat sink. A semiconductor cooling device characterized by being used as a part.
求の範囲第１項記載の半導体の冷却装置。(2) The semiconductor cooling device according to claim 1, wherein the heat conductive member is a heat pipe.
う配置された換気扇を併設してなる実用新案登録請求の
範囲第１項または第２項記載の半導体の冷却装置。(3) A semiconductor cooling device according to claim 1 or 2 of the utility model registration claim, which is also provided with a ventilation fan arranged so that cooling air is forcibly passed through the inside of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19659583U JPS60103845U (en) | 1983-12-19 | 1983-12-19 | semiconductor cooling equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19659583U JPS60103845U (en) | 1983-12-19 | 1983-12-19 | semiconductor cooling equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60103845U true JPS60103845U (en) | 1985-07-15 |
Family
ID=30421694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19659583U Pending JPS60103845U (en) | 1983-12-19 | 1983-12-19 | semiconductor cooling equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60103845U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396258A (en) * | 1989-09-08 | 1991-04-22 | Furukawa Electric Co Ltd:The | Heat-pipe type cooler |
| JP2007123641A (en) * | 2005-10-28 | 2007-05-17 | Digital Electronics Corp | Electronic device and case therefor |
-
1983
- 1983-12-19 JP JP19659583U patent/JPS60103845U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396258A (en) * | 1989-09-08 | 1991-04-22 | Furukawa Electric Co Ltd:The | Heat-pipe type cooler |
| JP2007123641A (en) * | 2005-10-28 | 2007-05-17 | Digital Electronics Corp | Electronic device and case therefor |
| JP4558627B2 (en) * | 2005-10-28 | 2010-10-06 | 株式会社デジタル | Electronic device casing and electronic device |
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