JPH0396258A - Heat-pipe type cooler - Google Patents
Heat-pipe type coolerInfo
- Publication number
- JPH0396258A JPH0396258A JP1234199A JP23419989A JPH0396258A JP H0396258 A JPH0396258 A JP H0396258A JP 1234199 A JP1234199 A JP 1234199A JP 23419989 A JP23419989 A JP 23419989A JP H0396258 A JPH0396258 A JP H0396258A
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- base plate
- heat
- fins
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims abstract description 20
- 238000001704 evaporation Methods 0.000 claims abstract description 3
- 230000008020 evaporation Effects 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims 1
- 238000009833 condensation Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 3
- 238000001125 extrusion Methods 0.000 abstract description 3
- 238000004512 die casting Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 6
- 238000007664 blowing Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体素子などの発熱を、ヒートパイプを用
いて拡散させて、強制空冷するヒートパイプ式冷却器に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a heat pipe type cooler that uses a heat pipe to diffuse heat generated from a semiconductor element or the like and cools it with forced air.
サイリスク,パワートランジスタなどの発熱量が中容量
の半導体素子の冷却は、ファンを用いた強制空冷方弐の
ものが多い。Semiconductor devices that generate a medium amount of heat, such as silices and power transistors, are often cooled by forced air cooling using fans.
第l2図は、従来の強制空冷式冷却器の一例を示した斜
視図である。FIG. 12 is a perspective view showing an example of a conventional forced air cooler.
冷却ブロック7は、銅またはアルミニウムなどの熱伝導
性材料を用いて、押出戒形や鋳造により、ベース部7a
とフィン部7bをもつような形状に作製されたものであ
る.発熱素子6は、冷却ブロック7のベー,ス部7aの
表側の平面に密着して搭載されており、ファン4により
フィン部7bを強制空冷していた。The cooling block 7 is made of a thermally conductive material such as copper or aluminum, and has a base portion 7a formed by extrusion or casting.
It is manufactured in such a shape as to have a fin portion 7b. The heating element 6 was mounted in close contact with the front surface of the base portion 7a of the cooling block 7, and the fan 4 forcedly air-cooled the fin portion 7b.
しかし、前述した従来の冷却器では、発熱素子の放熱量
が増大するに伴って、冷却ブロック7の重量が重くなる
とともに、形状も大型になるという問題があった。However, the conventional cooler described above has a problem in that as the amount of heat dissipated by the heating element increases, the weight of the cooling block 7 becomes heavier and the shape becomes larger.
また、冷却ブロック7のフィン部7bのピッチを一定間
隔以下に狭くできず、容量が一定の場合には、放熱面積
に制限を受け、冷却能力が低下するという問題があった
。Further, if the pitch of the fin portions 7b of the cooling block 7 cannot be narrowed to a certain interval or less, and the capacity is constant, there is a problem that the heat dissipation area is limited and the cooling capacity is reduced.
一方、電子機器などの場合には、限られた内部空間に他
の素子などとともに配置されるので、冷却器の基本的な
形状はそのままにして、冷却性能を向上させるとともに
、占有体積の減少や軽量化を実現しなければならない。On the other hand, in the case of electronic equipment, etc., which are placed together with other elements in a limited internal space, the basic shape of the cooler can be left as is, improving cooling performance and reducing the occupied volume. We must realize weight reduction.
本発明の目的は、前述の課題を解決し、冷却性能を向上
させるとともに、小型かつ軽量なヒートパイプ式冷却器
を提供することである。An object of the present invention is to solve the above-mentioned problems and provide a small and lightweight heat pipe cooler with improved cooling performance.
前記課題を解決するために、本発明によるヒートパイプ
式冷却器は、外側に素子搭載面が設けられ内側にヒート
パイプ取付部が設けられたベース板と、前記ベース仮の
ヒートパイプ取付部に蒸発部が取り付けられ凝縮部が曲
げ起こされたヒートパイプと、前記ヒートパイプの凝縮
部に取り付られた複数枚のフィンと、前記ベース板の側
面で前記フィンと直交する面に設けられた強制空冷用の
ファンとから構成されている.
〔作用〕
前記構戒によれば、ベース板に搭載された発熱素子から
の熱をヒートパイプを用いて末端のフィンにまで効率よ
く伝達できるとともに、ファンにより強制冷却すること
ができる。In order to solve the above problems, the heat pipe type cooler according to the present invention includes a base plate having an element mounting surface on the outside and a heat pipe attachment part on the inside, and an evaporator on the temporary heat pipe attachment part of the base. a plurality of fins attached to the condensing section of the heat pipe, and forced air cooling provided on a side surface of the base plate perpendicular to the fins; It consists of a fan for use. [Function] According to the above structure, heat from the heating element mounted on the base plate can be efficiently transmitted to the fins at the end using the heat pipe, and can be forcedly cooled by the fan.
以下、図面等を参照して、実施例について、本発明を詳
細に説明する。EMBODIMENT OF THE INVENTION Hereinafter, with reference to drawings etc., this invention will be described in detail about an Example.
第1図〜第7図は、本発明によるヒートパイプ式冷却器
の実施例を示した図であって、第1図は斜視図、第2図
は平面図、第3図は背面図、第4図は側面図、第5図は
正面図、第6図はヒートパイプの取付部を示した斜視図
、第7図はフィンの取付部を示した斜視図である。1 to 7 are views showing an embodiment of a heat pipe type cooler according to the present invention, in which FIG. 1 is a perspective view, FIG. 2 is a plan view, FIG. 3 is a rear view, and FIG. 4 is a side view, FIG. 5 is a front view, FIG. 6 is a perspective view showing a heat pipe attachment portion, and FIG. 7 is a perspective view showing a fin attachment portion.
ベース{反lは、銅またはアノレミニウムなどの熱伝導
性の材料を用いて、押出法またはグイキャスト法等によ
り作製されており、外側にはフラントな素子搭載面1a
が形威され、内側には取付凹部lbが形威されている。The base is made of a thermally conductive material such as copper or anoleminium by an extrusion method or a guicasting method, and has a flat element mounting surface 1a on the outside.
is formed, and a mounting recess lb is formed inside.
ヘース仮1の素子搭載面laには、サイリスクやパワー
トランジスタなどの発熱素子6がl個または複数個搭載
されている。On the element mounting surface la of the Heath temporary 1, l or a plurality of heat generating elements 6 such as cyrisks and power transistors are mounted.
ヒートパイプ2は、断面が円形,矩形.異形の銅製コン
テナの内面に溝が形威されたり、メッシ二等のウイソク
が挿入されたものであり、内部には作動液として純水等
が封入されたものである。The heat pipe 2 has a circular and rectangular cross section. It is an irregularly shaped copper container with a groove formed on its inner surface and a mesh-like liquid inserted into it, and purified water or the like as a working fluid is sealed inside.
このヒートパイプ2は、U字形に曲げ加工されており、
蒸発部となる基部2aがベース板lの取付凹部1bに挿
入され、固定板1cで上側から覆ってねし止めすること
により、密着して固定されている(第6図)。ヒートパ
イプ2は、ベース板1の取付凹部1bに取り付けられる
ので、接触面積を十分にとれるとともに、基部2aと取
付凹部lbおよび固定板1cの間には熱伝導性グリース
などを塗布することにより、外側の素子搭載面1aに搭
載された発熱素子6からの熱を内側のヒートバイプ2に
効率的に伝達できる。This heat pipe 2 is bent into a U shape,
The base 2a, which becomes the evaporator, is inserted into the mounting recess 1b of the base plate 1, covered from above with the fixing plate 1c, and fixed tightly by screwing (FIG. 6). Since the heat pipe 2 is attached to the mounting recess 1b of the base plate 1, a sufficient contact area can be obtained, and by applying thermally conductive grease or the like between the base 2a, the mounting recess lb, and the fixing plate 1c, Heat from the heating element 6 mounted on the outer element mounting surface 1a can be efficiently transferred to the inner heat vip 2.
フィン3は、ヒートバイプ2の凝縮部となる腕部2bに
、圧入またはロウ付けなどにより取り付けられている(
第7図)。このフィン3は、銅またはアルミニウムなど
の金属を、O. 1〜0.5mm程度の薄肉板状に加工
したものであり、1〜5mm程度の比較的小さいピッチ
で、必要な枚数だけ取り付けられている。The fins 3 are attached to the arm portion 2b, which serves as the condensing portion, of the heat vip 2 by press-fitting or brazing.
Figure 7). This fin 3 is made of metal such as copper or aluminum. It is processed into a thin plate shape of about 1 to 0.5 mm, and the required number of plates are attached at a relatively small pitch of about 1 to 5 mm.
ファン4は、強制空冷用のものであり、軸流ファン等が
用いられており、ベース板1の側面、つまり、フィン3
と直交するいずれかの面に取り付けられている。The fan 4 is for forced air cooling, and an axial fan or the like is used.
attached to either side perpendicular to the
ケーシング5は、ファン4による冷却風airの流入口
]Nと流出口OUTを除いた残りの開口を全て覆うよう
にしたものであり、例えば、断面をコの字形に曲げ加工
した鉄1アル稟ニウムなどの金属板、あるいはプラスチ
ック等の樹脂製板を用いることができる。The casing 5 is designed to cover all the remaining openings except for the inlet N and the outlet OUT for the cooling air generated by the fan 4, and is made of, for example, a piece of iron with a U-shaped cross section. A metal plate made of aluminum or the like or a resin plate made of plastic or the like can be used.
なお、ベース板1と平行に配置されるケーシング5は、
フィン3の最も外側のもので兼用することができる。In addition, the casing 5 arranged parallel to the base plate 1 is
The outermost one of the fins 3 can be used for both purposes.
第8図、第9図は、本発明によるヒートバイプ式冷却器
の変形例を示した斜視図である。FIGS. 8 and 9 are perspective views showing modified examples of the heat-vib type cooler according to the present invention.
第8図のように、ヒートパイプ2Aは、L字形に曲げ加
工して、蒸発部である基部2c側をへ一ス板1Aの取付
凹部1dにロウ材1eにより、接合することができる。As shown in FIG. 8, the heat pipe 2A can be bent into an L-shape, and the base 2c side, which is the evaporation part, can be joined to the mounting recess 1d of the heel plate 1A with a brazing material 1e.
このヒートバイプ2Aの凝縮部となる腕部2dに、第7
図と同様にフィン3を取り付ければよい。A seventh
Just attach the fins 3 as shown in the figure.
第9図のように、2木のヒートバイプ2B,2Cを、1
枚のベースFi.I Bに取り付けるようにしてもよい
。As shown in Figure 9, two wooden heat vips 2B and 2C are connected to one
Base Fi. It may also be attached to IB.
なお、U字形のヒートパイプ2をロウ付けしてもよいし
、L字形のヒートパイプ2Aを固定板ICで固定しても
よい。2本のヒートパイプ2B,2Cも、L字形でもよ
いし、取付方法も、第6図または第8図のいずれの方法
でもよい.第10図,第11図は、本発明によるヒート
パイプ式冷却器の実施例の送風方向を説明するための斜
視図である。Note that the U-shaped heat pipe 2 may be brazed, or the L-shaped heat pipe 2A may be fixed with a fixing plate IC. The two heat pipes 2B and 2C may also be L-shaped, and the mounting method may be either the method shown in FIG. 6 or FIG. 8. FIGS. 10 and 11 are perspective views for explaining the air blowing direction of the embodiment of the heat pipe type cooler according to the present invention.
ファン4やケーシング5などの取付位置によって、送風
方向を変化させることができる。The air blowing direction can be changed depending on the mounting position of the fan 4, casing 5, etc.
例えば、第10図に示したように、ファン4の両側に直
交する側面を全てケーシング5で覆ってしまえば、ファ
ン4と対向する面から冷却風airを直線的に排気する
ことができる.
また、第11図に示したように、ファン4の対向する面
をケーシング5で覆い、ファン4に直交する側面のいず
れか1面を解放にして他の面をケーシング5で覆ってお
けば、冷却風airを直角に屈曲して排気することがで
きる。For example, as shown in FIG. 10, if all the side surfaces perpendicular to both sides of the fan 4 are covered with the casing 5, the cooling air can be exhausted linearly from the surface facing the fan 4. Furthermore, as shown in FIG. 11, if the opposing surfaces of the fan 4 are covered with the casing 5, one of the sides perpendicular to the fan 4 is left open, and the other side is covered with the casing 5. The cooling air can be bent at right angles and exhausted.
このように送風方向を選択できるので、本発明によるヒ
ートパイプ式冷却器を電子機器などに組み込む場合に、
冷却風airの流入および流出方向が限定されるときで
も、容易に取り付けることができる.
〔発明の効果〕
以上詳しく説明したように、本発明によれば、ベース板
に搭載した発熱素子からの熱をヒートパイプを用いて拡
散して末端のフィンに至るまで伝達できるので、フィン
効率が改善され、従来の冷却器に比較して、フィンの占
有する体積を大幅に減少させることができる。Since the air blowing direction can be selected in this way, when the heat pipe type cooler according to the present invention is incorporated into electronic equipment, etc.
Easy to install even when the inflow and outflow directions of cooling air are limited. [Effects of the Invention] As explained in detail above, according to the present invention, the heat from the heating element mounted on the base plate can be diffused and transmitted to the terminal fin using a heat pipe, so that the fin efficiency can be improved. Improved, the volume occupied by the fins can be significantly reduced compared to conventional coolers.
また、フィンを極めて薄くでき、フィンを取り付けるピ
ンチを狭くできるので、占有する体積の減少とあいまっ
て、同一容積では重量を大幅に減少させることができる
。Further, since the fins can be made extremely thin and the pinch to which the fins are attached can be made narrower, the weight can be significantly reduced for the same volume, together with the reduction in the volume occupied.
したがって、同一の冷却能力では占有体積と重量の両者
を大幅に減少させることができる。Therefore, both the occupied volume and weight can be significantly reduced for the same cooling capacity.
さらに、冷却風の流れ方向を多様化させることができる
ので、取付場所の自由度が広がる。Furthermore, since the flow direction of the cooling air can be diversified, the degree of freedom in the mounting location is increased.
第1図〜第7図は、本発明によるヒートパイプ式冷却器
の実施例を示した図であって、第1図は斜視図、第2図
は平面図、第3図は背面図、第4図は側面図、第5図は
正面図、第6図はヒートパイプの取付部を示した斜視図
、第7図はフィンの取付部を示した斜視図である.
第8図、第9図は、本発明によるヒートパイプ式冷却器
の変形例を示した斜視図である。
第10図.第11図は、本発明によるヒートパイプ式冷
却器の実施例の送風方向を説明するための図である.
第12図は、従来の強制空冷式冷却器の一例を示した斜
視図である.
l・・・ベース板
2・・・ヒートパイプ
3・・・フィン
4・・・ファン
5・・・ケーシング
6・・・発熱素子1 to 7 are views showing an embodiment of a heat pipe type cooler according to the present invention, in which FIG. 1 is a perspective view, FIG. 2 is a plan view, FIG. 3 is a rear view, and FIG. 4 is a side view, FIG. 5 is a front view, FIG. 6 is a perspective view showing the heat pipe attachment part, and FIG. 7 is a perspective view showing the fin attachment part. FIGS. 8 and 9 are perspective views showing modified examples of the heat pipe type cooler according to the present invention. Figure 10. FIG. 11 is a diagram for explaining the air blowing direction of the embodiment of the heat pipe type cooler according to the present invention. FIG. 12 is a perspective view showing an example of a conventional forced air cooler. l...Base plate 2...Heat pipe 3...Fin 4...Fan 5...Casing 6...Heating element
Claims (1)
が設けられたベース板と、前記ベース板のヒートパイプ
取付部に蒸発部が取り付けられ凝縮部が曲げ起こされた
ヒートパイプと、前記ヒートパイプの凝縮部に取り付ら
れた複数枚のフィンと、前記ベース板の側面で前記フィ
ンと直交する面に設けられた強制空冷用のファンとから
構成したヒートパイプ式冷却器。A base plate having an element mounting surface on the outside and a heat pipe attachment part on the inside, a heat pipe in which an evaporation part is attached to the heat pipe attachment part of the base plate and a condensation part is bent, and the heat pipe. A heat pipe type cooler comprising a plurality of fins attached to a condensing part of the base plate, and a fan for forced air cooling provided on a side surface of the base plate perpendicular to the fins.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1234199A JP2685918B2 (en) | 1989-09-08 | 1989-09-08 | Heat pipe cooler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1234199A JP2685918B2 (en) | 1989-09-08 | 1989-09-08 | Heat pipe cooler |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0396258A true JPH0396258A (en) | 1991-04-22 |
JP2685918B2 JP2685918B2 (en) | 1997-12-08 |
Family
ID=16967242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1234199A Expired - Fee Related JP2685918B2 (en) | 1989-09-08 | 1989-09-08 | Heat pipe cooler |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2685918B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5224367A (en) * | 1991-02-22 | 1993-07-06 | Eduard Kusters Maschinenfabrik Gmbh & Co Kg | Method for the treatment of the steel belts of a double belt press |
US7106589B2 (en) * | 2003-12-23 | 2006-09-12 | Aall Power Heatsinks, Inc. | Heat sink, assembly, and method of making |
US7156158B2 (en) | 1997-10-20 | 2007-01-02 | Fujitsu Limited | Heat pipe type cooler |
JP2007532854A (en) * | 2004-04-09 | 2007-11-15 | エーヴィッド サーモロイ エルエルシー | Multiple evaporator heat pipe assisted heat sink |
DE102013000223A1 (en) | 2012-01-11 | 2013-12-05 | Fanuc Corporation | Heat Sink Servo Amplifier, which has two sets of heat dissipating plates that are perpendicular to each other |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60103845U (en) * | 1983-12-19 | 1985-07-15 | 三菱電機株式会社 | semiconductor cooling equipment |
JPS63199A (en) * | 1986-06-19 | 1988-01-05 | 富士通株式会社 | Heat radiation structure of electronic parts in electronic equipment |
-
1989
- 1989-09-08 JP JP1234199A patent/JP2685918B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60103845U (en) * | 1983-12-19 | 1985-07-15 | 三菱電機株式会社 | semiconductor cooling equipment |
JPS63199A (en) * | 1986-06-19 | 1988-01-05 | 富士通株式会社 | Heat radiation structure of electronic parts in electronic equipment |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5224367A (en) * | 1991-02-22 | 1993-07-06 | Eduard Kusters Maschinenfabrik Gmbh & Co Kg | Method for the treatment of the steel belts of a double belt press |
US7156158B2 (en) | 1997-10-20 | 2007-01-02 | Fujitsu Limited | Heat pipe type cooler |
US7721789B2 (en) | 1997-10-20 | 2010-05-25 | Fujitsu Limited | Heat pipe type cooler |
US7106589B2 (en) * | 2003-12-23 | 2006-09-12 | Aall Power Heatsinks, Inc. | Heat sink, assembly, and method of making |
JP2007532854A (en) * | 2004-04-09 | 2007-11-15 | エーヴィッド サーモロイ エルエルシー | Multiple evaporator heat pipe assisted heat sink |
DE102013000223A1 (en) | 2012-01-11 | 2013-12-05 | Fanuc Corporation | Heat Sink Servo Amplifier, which has two sets of heat dissipating plates that are perpendicular to each other |
Also Published As
Publication number | Publication date |
---|---|
JP2685918B2 (en) | 1997-12-08 |
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