KR100488104B1 - Plate Radiator Structure of CPU Cooling Module - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device used in a computer and the like, and more particularly, to a heat dissipation fin assembly structure of an electronic chip cooling device in which an installation angle of a heat dissipation fin that is finally exchanged is varied.

The heat dissipation fin assembly structure of the electronic chip cooling apparatus according to the present invention includes a terminal base that directly contacts a heating element such as a CPU and conducts heat, first and second heat pipes soldered to the upper end of the terminal base, First and second heat dissipation blocks formed by soldering a plurality of heat dissipation fins at the ends of the first and second heat pipes in a horizontal and vertical direction, a fan motor for forced convection of cooling fluid to the heat dissipation block, and the fan motor and the terminal. Electronic chip is installed in the corner of the cabinet is composed of a base frame for fixing the base and a fan cover for blocking the most of the base frame, except for the upper center of the fan motor installation portion to allow the cooling fluid to flow in and out efficiently In the chiller,

Each of the heat dissipation fins forming the heat dissipation block may be configured to vary the installation angle in fluidity according to the flow of the cooling fluid.

The present invention can minimize the heat loss due to the frictional resistance of the heat radiation fins and the cooling fluid, it has the effect that can maximize the flow amount of the cooling fluid.

Description

Plate Radiator Structure of CPU Cooling Module

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device used in a computer and the like, and more particularly, to a heat dissipation fin assembly structure of an electronic chip cooling device in which an installation angle of a heat dissipation fin that is finally exchanged is varied.

In recent years, small portable computers such as laptops have become increasingly thinner and lighter in performance.

For miniaturization and thinning of these electronic products, it is inevitable to miniaturize, speed up, and increase the capacity of the central processing unit (CPU) and peripheral electronic devices used inside the computer.

As such, as the capacity of electronic components such as a miniaturized CPU becomes relatively large, the amount of heat generated is extremely increased.

In order to prevent overheating of the electronic parts as the heating element, a faster and more effective cooling means should be provided. However, as electronic products become thinner and thinner, the space inside is inevitably denser, and due to this space limitation, the flow of cooling fluid (air) does not flow smoothly, which leads to difficulty in dissipating heat generated from the electronic chip. .

In particular, since the CPU is relatively high compared to the temperature of other components, the problem caused by the high temperature of the CPU is serious. That is, the high temperature of the CPU results in a decrease in clock speed, malfunction, and a sudden increase in failure rate.

At present, researches are being actively conducted to effectively dissipate a heating element such as a CPU. In the past, a cooling device using a fan motor, a heat dissipation fin, and a heat pipe is attached to a processor to attach a processor or a high heat generation component. It is used to cool.

1 is a perspective view showing an electronic chip cooling apparatus according to the prior art, the conventional electronic chip cooling apparatus, as shown in the figure, the terminal base (10) which directly serves to conduct heat by contacting a heating element such as a CPU ), First and second heat pipes 20 and 30 to be soldered to the upper end of the terminal base 10, and a plurality of heat dissipation fins 41 are soldered at predetermined intervals at ends of the first heat pipe 20. The first heat dissipation block 40 to form a block in the horizontal direction, and the second heat dissipation block to form a block in the vertical direction by soldering a plurality of heat dissipation fins (51) at regular intervals at the end of the second heat pipe ( 50, a fan motor 60 and a fan motor 60 and a terminal base 10 fixed to the center of the first and second heat dissipation blocks 40 and 50 so as to supply a cooling fluid. A base frame 70 and the base To block the fan motor 60, most part except the top center of the installation frame (70) to consist of configurations, including a fan cover 80 that allows cooling fluid to be efficiently introduced and discharged.

Here, since the terminal base 10 is in direct contact with the CPU to conduct heat, the terminal base 10 uses a material having excellent thermal conductivity and is formed in a plate shape which can form an area somewhat wider.

The first and second heat pipes 30 and 40 are soldered to the upper end of the terminal base 10 to transfer heat generated from the CPU to the heat dissipation blocks 40 and 50. The structure and principle will be described with reference to FIG.

Figure 2 is a cross-sectional view showing a conventional heat pipe internal structure, as shown in the structure of the heat pipe (20, 30) is generally formed on the inner wall of the hermetic container wick (Wick) is formed, the inside Is filled by the working fluid.

The heat pipe of this structure forms an evaporation unit, a heat insulation unit, and a condensation unit for each part, and the evaporation unit absorbs heat from an external heat source and causes the working fluid to evaporate in a gaseous state. It moves in the direction of the condenser. On the contrary, in the condensation unit, the working fluid is condensed from the gas state to the liquid state while the heat is taken away from the outside of the low temperature, and is moved to the evaporation unit by the capillary force of the wick. .

That is, the heat pipe is a device that transfers heat by using latent heat to a device that transfers heat between both ends of the vessel through the phase-change process between the gas and the liquid. Compared to phosphorus heat transfer devices, it has a very large heat transfer performance.

The first and second heat dissipation blocks 40 and 50 are formed by soldering a plurality of heat dissipation fins 41 and 51 arranged at regular intervals using separate jigs to the lower ends of the heat pipes 20 and 30. At this time, the installation angle of the heat radiation fins 41 and 51 is selected to match the flow direction of the cooling fluid.

In addition, the fan motor 60 causes forced convection to supply cooling fluid to the first and second heat dissipation blocks. Mostly, axial fan motors are used to transfer the cooling fluid drawn in the vertical direction in the horizontal direction.

The base frame 70 is formed of an integral casting, and a motor mounting portion 71 for mounting the fan motor 60 is formed at one side, and the terminal device portion 73 for mounting the terminal base 10 to one side thereof. ) Is formed.

In addition, the fan cover 80 is a plate-shaped body shielding the upper portion of the motor mounting portion 71, the suction hole 81 for sucking the cooling fluid is formed in the center.

Referring to the operation of the conventional electronic chip cooling device having the configuration as described above is as follows.

First, high temperature heat is generated in an electronic chip such as a CPU, and the terminal base 10 is in direct contact with the surface of the heating element.

Heat generated in the CPU is conducted to the terminal base 10. The heat conducted to the terminal base 10 is transferred to the heat dissipation blocks 40 and 50 formed at each end of the heat pipes 20 and 30 through the heat pipes 20 and 30 again.

The heat transferred to the heat dissipation blocks 40 and 50 is partially cooled by natural convection, but this is a very small part, and by driving the fan motor 60 installed inside the heat dissipation blocks 40 and 50, Forced convection causes cooling.

At this time, the fan motor 60 may form a flow path by the motor mounting unit 71 and the fan cover 80 formed on one side of the base frame 70 to send external air to the heat dissipation blocks 40 and 50. Will be.

The number of heat radiating fins 41 and 51 (plate radiators) used in the electronic chip cooling apparatus of the related art having the above configuration is about 50, and the soldering on the heat pipes 20 and 30 is assembled. As such, there may be various methods of integrating the heat dissipation fins 41 and 51 on the heat pipes 20 and 30, but two methods may be representatively mentioned.

In the first method, after supporting and fixing a plurality of heat dissipation fins 41 and 51 by using a separate jig, soldering them on a heat sink (not shown) made of a thin plate, and then again, the heat sink is heat pipe ( 20,30 is a method of soldering on.

In the second method, as shown in FIG. 3, the heat dissipation fins 45 are formed in a “??” shape, and the heat dissipation fins 45 are repeatedly formed in a plurality of protrusions 45a and a plurality of protrusions. After the fastening holes 45b are formed and woven together in a chain structure for engaging them, there is a method of soldering the heat pipes 20 and 30.

However, in the above-described conventional structure, all of the heat dissipation fins are fixed by soldering. When the fan motor is variable in speed and the wind direction angle is changed or the installation angle of the heat dissipation fin is undesirably set by the assembly tolerance, the cooling fluid and Friction resistance is generated, and thus a problem of loss of flow rate of the cooling fluid occurs.

The present invention has been proposed to solve the above problems, an object of the present invention is to make the heat dissipation fin assembly structure of the electronic chip cooling apparatus to make the heat dissipation fin assembly structure to the fluid structure to maximize the flow amount of the cooling fluid. The purpose is to provide.

The heat dissipation fin assembly structure of the electronic chip cooling apparatus according to the present invention for achieving the above object is a terminal base that serves to conduct heat by being in direct contact with a heating element such as a CPU, the first and the first soldered on the terminal base 2 heat pipes, first and second heat dissipation blocks formed in horizontal and vertical directions by soldering a plurality of heat dissipation fins at the ends of the first and second heat pipes, and a fan motor for forced convection of cooling fluid to the heat dissipation blocks. And a base frame for fixing the fan motor and the terminal base, and a fan cover to block most of the base frame except for the upper center of the fan motor installation unit so that the cooling fluid can be efficiently introduced and discharged. In the electronic chip cooling device installed in the corner,

Each of the heat dissipation fins forming the heat dissipation block may be configured to vary the installation angle in fluidity according to the flow of the cooling fluid.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

4 is a perspective view showing a heat dissipation fin assembly structure according to the present invention, Figure 5 is a cross-sectional view showing a heat dissipation fin assembly structure according to the present invention, Figure 6 is a perspective view of an electronic chip cooling device to which the heat dissipation fin assembly structure according to the present invention is applied. .

As shown in the figure, the heat dissipation blocks 140 and 150 according to the heat dissipation fin assembly structure of the present invention are heat sinks 143 and 153 joined to the bottoms of the heat pipes 120 and 130 by soldering, and bottoms of the heat sinks 143 and 153. Hinge holes 145a and 155a coupled to the plurality of hinge protrusions 143a and 153a formed are formed of a plurality of heat dissipation fins 141 and 151, respectively.

In addition, the upper surfaces of the heat dissipation fins 141 and 151 may be bent to form ground surfaces 145 and 155 to be in surface contact with the heat sinks 143 and 153 so that heat may be conducted.

Here, the heat dissipation fins 141 and 151 hinge holes 145a and 155a are hinged to the plurality of hinge protrusions 143a and 153a formed on the bottom surfaces of the heat sinks 143 and 153, respectively. The ends of the hinge protrusions 143a and 153a penetrating through the 145a and 155a are riveted.

As a result, the heat dissipation fins 141 and 151 may form a heat dissipation fin integrated structure having excellent heat conduction effect while freely flowing at an installation angle according to the flow of the cooling fluid.

In particular, the heat dissipation fins 141 and 151 forming the heat dissipation blocks 140 and 150 are spaced apart by a predetermined distance to form the flow width a, so that the heat dissipation fins 141 and 151 can correspond to each other according to the wind direction and position. do. That is, depending on the flow width (a), the installation angle of the heat radiation fins (141, 151) can be varied.

Referring to Figure 5 with respect to the operation of the cooling apparatus according to the heat dissipation fin assembly structure of the present invention having the configuration as described above are as follows.

First, heat generated from a heating element such as a CPU is conducted to the heat pipes 120 and 130 through the terminal base 110, and the first heat radiation block 140 formed on each of the heat pipes 120 and 130 and the second heat sink. The heat is moved to the heat dissipation block 150, and the heat transferred to the heat dissipation blocks 140 and 150 drives the fan motor 160 to cause forced convection to cool.

At this time, even if the wind direction angle changes according to the speed change of the fan motor 160 of the heat dissipation blocks 140 and 150, the heat dissipation fins 141 and 151 may automatically reset the installation angle accordingly.

According to the present invention, the heat dissipation fins can be minimized by the frictional resistance of the heat dissipation fins and the cooling fluid by forming the assembly structure of the heat dissipation fins according to the flow of the cooling fluid. Has the effect of being able to.

In addition, since the cooling fluid flow and the optimum installation angle is always maintained, the noise is reduced.

1 is a perspective view showing an electronic chip cooling apparatus according to the prior art.

Figure 2 is a cross-sectional view showing a conventional heat pipe internal structure.

Figure 3 is a perspective view showing a conventional heat radiation fin integrated structure.

Figure 4 is a perspective view showing a heat dissipation fin assembly according to the invention.

Figure 5 is a cross-sectional view showing a heat dissipation fin assembly structure according to the present invention.

6 is a perspective view of an electronic chip cooling apparatus to which a heat dissipation fin assembly structure according to the present invention is applied.

* Description of the symbols for the main parts of the drawings *

10: terminal base 20: first heat pipe

30: second heat pipe 40: first heat radiation block

41, 51: heat dissipation fin 50: second heat dissipation block

60: axial fan motor 70: base frame

71: motor mounting portion 73: terminal device portion

80: fan cover 140,150: heat dissipation block

141,151: heat sink fins 143,153: heat sink

143a, 153a: Hinge protrusion 145,155: ground plane

145a, 155a: hinge hole

Claims (5)

A terminal base in direct contact with the heating element, At least one heat pipe soldered on top of the terminal base, A heat dissipation block in contact with the heat pipe and dissipating heat transferred to the heat pipe to the outside; A heat dissipation fin assembly of an electronic chip cooling device, characterized in that it comprises a fan motor forcibly blowing to cool the heat radiated from the heat radiating block. The method of claim 1, The heat dissipation block is composed of a heat sink which is joined to the bottom surface of the heat pipe by soldering, and a plurality of heat dissipation fins each having a hinge hole coupled to a plurality of hinge protrusions formed on the bottom surface of the heat sink. Heat dissipation fin assembly of the device. The method of claim 2, The heat dissipation fin assembly structure of the electronic chip cooling device, characterized in that to form a ground plane to be bent in contact with the heat sink by bending the upper end of the heat dissipation fins so that heat can be conducted. The method of claim 2, The heat dissipation fin assembly of the electronic chip cooling device, characterized in that for riveting the end of the hinge projection penetrating the hinge hole of the heat dissipation fin. The method of claim 1, The heat dissipation fin assembly structure of the electronic chip cooling apparatus, characterized in that the installation angle of the heat dissipation fins of the heat dissipation block forming the heat dissipation block is variable according to the wind direction and position forced by the fan motor.