KR20040052010A - CPU Cooling Module - Google Patents

Abstract

PURPOSE: A device for cooling an electronic chip is provided to secure a sufficient heat radiating area in spite of the high integration of an internal space caused by the compact/slim of a notebook computer. CONSTITUTION: A terminal base(110) transfers the heat by directly contacting to a heated element such as a CPU. Heat pipes(120,130) are soldered to an upper part of the terminal base. Heat radiating blocks(140,150) are soldered to an end of the heat pipe. A fan motor(160) supplies a cooling fluid to the heat radiating block by placing to a center of the heat radiating block. A base frame(170) fixes the fan motor and the terminal base. A fan cover(180) efficiently inflows/discharges the cooling fluid by blocking a majority portion excepting the upper center of the part installing the fan motor. The fan cover formed to a lower side of the heat pipe is formed as one body by soldering to the heat pipe. Thus, the heat of the heat pipe is transferred/discharged to the air.

Description

Electronic Chip Cooling System {CPU Cooling Module}

The present invention relates to an electronic chip cooling device for cooling peripheral electronic devices such as a central processing unit (CPU) and a semiconductor of a desktop / laptop, and in particular, has a structural role that allows the cooling fluid to smoothly flow into the fan motor. The present invention relates to an electronic chip cooling device that has a structure for improving a fan cover to be used as a heat sink to increase the total heat dissipation area.

In recent years, small portable computers such as laptops have become increasingly thinner and lighter in performance.

For miniaturization and thinning of these electronic products, it is inevitable to miniaturize, speed up, and increase the capacity of the central processing unit (CPU) and peripheral electronic devices used inside the computer.

As such, as the capacity of electronic components such as a miniaturized CPU becomes relatively large, the amount of heat generated is extremely increased.

In order to prevent overheating of the electronic parts as the heating element, a faster and more effective cooling means should be provided. However, as electronic products become thinner and thinner, the space inside is inevitably denser, and due to this space limitation, the flow of cooling fluid (air) does not flow smoothly, which leads to difficulty in dissipating heat generated from the electronic chip. .

In particular, since the CPU is relatively high compared to the temperature of other components, the problem caused by the high temperature of the CPU is serious. That is, the high temperature of the CPU results in a decrease in clock speed, malfunction, and a sudden increase in failure rate.

At present, researches are being actively conducted to effectively dissipate a heating element such as a CPU. In the past, a cooling device using a fan motor, a heat dissipation fin, and a heat pipe is attached to a processor to attach a processor or a high heat generation component. It is used to cool.

1 is a perspective view showing an electronic chip cooling apparatus according to the prior art, the conventional electronic chip cooling apparatus, as shown in the figure, the terminal base (10) which directly serves to conduct heat by contacting a heating element such as a CPU ), First and second heat pipes 20 and 30 to be soldered to the upper end of the terminal base 10, and a plurality of heat dissipation fins 41 are soldered at predetermined intervals at ends of the first heat pipe 20. The first heat dissipation block 40 to form a block in the horizontal direction, and the second heat dissipation block to form a block in the vertical direction by soldering a plurality of heat dissipation fins (51) at regular intervals at the end of the second heat pipe ( 50, a fan motor 60 and a fan motor 60 and a terminal base 10 fixed to the center of the first and second heat dissipation blocks 40 and 50 so as to supply a cooling fluid. A base frame 70 and the base To block the fan motor 60, most part except the top center of the installation frame (70) to consist of configurations, including a fan cover 80 that allows cooling fluid to be efficiently introduced and discharged.

Here, since the terminal base 10 is in direct contact with the CPU to conduct heat, the terminal base 10 uses a material having excellent thermal conductivity and is formed in a plate shape which can form an area somewhat wider.

The first and second heat pipes 30 and 40 are soldered to the upper end of the terminal base 10 to transfer heat generated from the CPU to the heat dissipation blocks 40 and 50. The structure and principle will be described with reference to FIG.

Figure 2 is a cross-sectional view showing a conventional heat pipe internal structure, as shown in the structure of the heat pipe (20, 30) is generally formed on the inner wall of the hermetic container wick (Wick) is formed, the inside Is filled by the working fluid.

The heat pipe of this structure forms an evaporation unit, a heat insulation unit, and a condensation unit for each part, and the evaporation unit absorbs heat from an external heat source and causes the working fluid to evaporate in a gaseous state. It moves in the direction of the condenser. On the contrary, in the condensation unit, the working fluid is condensed from the gas state to the liquid state while the heat is taken away from the outside of the low temperature, and is moved to the evaporation unit by the capillary force of the wick. .

That is, the heat pipe is a device that transfers heat by using latent heat to a device that transfers heat between both ends of the vessel through the phase-change process between the gas and the liquid. Compared to phosphorus heat transfer devices, it has a very large heat transfer performance.

The first and second heat dissipation blocks 40 and 50 are formed by soldering a plurality of heat dissipation fins 41 and 51 arranged at regular intervals using separate jigs to the lower ends of the heat pipes 20 and 30. At this time, the installation angle of the heat radiation fins 41 and 51 is selected to match the flow direction of the cooling fluid.

In addition, the fan motor 60 causes forced convection to supply cooling fluid to the first and second heat dissipation blocks. Mostly, axial fan motors are used to transfer the cooling fluid drawn in the vertical direction in the horizontal direction.

The base frame 70 is formed of an integral casting, and a motor mounting portion 71 for mounting the fan motor 60 is formed at one side, and a terminal device portion 73 for mounting the terminal base is formed at one side thereof. do.

In addition, the fan cover 80 is a plate-shaped body shielding the upper portion of the motor mounting portion 71, the suction hole 81 for sucking the cooling fluid is formed in the center.

Referring to the operation of the conventional electronic chip cooling device having the configuration as described above is as follows.

First, high temperature heat is generated in an electronic chip such as a CPU, and the terminal base 10 is in direct contact with the surface of the heating element.

Heat generated in the CPU is conducted to the terminal base 10. The heat conducted to the terminal base 10 is transferred to the heat dissipation blocks 40 and 50 formed at each end of the heat pipes 20 and 30 through the heat pipes 20 and 30.

The heat transferred to the heat dissipation blocks 40 and 50 is partially cooled by natural convection, but this is a very small part, and by driving a fan motor 60 installed inside the heat dissipation blocks 40 and 50, Forced convection causes cooling.

At this time, the fan motor 60 is formed by the motor mounting portion 71 and the fan cover 80 formed on one side of the base frame 70 to effectively send the external air to the heat radiation block (40, 50). It becomes possible.

However, in the conventional electronic chip cooling device having the above configuration, the heat transfer efficiency is important because heat must be discharged in a limited space, and the heat dissipation area is secured through the heat dissipation fins 41 and 51 due to space limitations. It may be said that the situation has already reached its limit.

In other words, notebooks and the like will be further miniaturized and thinner, and accordingly, electronic chips such as CPUs will be further miniaturized, and thus high capacity will be generated. On the other hand, it is obvious that the inner space will be more narrow and have a great difficulty in securing the heat dissipation area.

Therefore, a way to secure the heat dissipation area of the more innovative and efficient cooling system should be presented.

The present invention has been proposed to solve the above problems, and an object of the present invention is to provide an electronic chip cooling apparatus that can secure a sufficient heat dissipation area despite the increase in the internal space due to miniaturization and thinning of a notebook. There is a purpose.

1 is a perspective view showing an electronic chip cooling apparatus according to the prior art.

Figure 2 is a cross-sectional view showing a conventional heat pipe internal structure.

Figure 3 is a perspective view showing the structure of the electronic chip cooling apparatus according to the present invention.

Figure 4 is a graph measuring the heat resistance value according to the heat dissipation area.

5 is a perspective view showing another embodiment of the fan cover according to the present invention.

* Description of the symbols for the main parts of the drawings *

110: terminal base 120: first heat pipe

130: second heat pipe 140: first heat radiation block

141, 151: heat dissipation fin 150: second heat dissipation block

160: fan motor 170: base frame

171: motor mounting portion 173: terminal device portion

180: fan cover 190: soldering portion

An electronic chip cooling apparatus according to the present invention for achieving the above object is a terminal base that directly contacts a heating element such as a CPU and conducts heat, a heat pipe soldered to the upper end of the terminal base, and the heat pipe end A heat dissipation block soldered to the heat dissipation block, a fan motor positioned at a central portion thereof to supply cooling fluid to the heat dissipation block, a base frame to which the fan motor and the terminal base are fixed, and an upper end of the fan motor installation unit of the base frame. In the electronic chip cooling device consisting of a fan cover for blocking the most of the center except for allowing the cooling fluid to flow in and out efficiently,

By integrating the fan cover formed under the installation line of the heat pipe by soldering it to the heat pipe, it is characterized in that it is used as a heat sink that conducts heat from the heat pipe and radiates heat in the air.

Preferably, the material of the fan cover is characterized by using a copper series having excellent thermal conductivity.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 3 is a perspective view showing the structure of the electronic chip cooling apparatus according to the present invention.

As shown in the figure, the electronic chip cooling apparatus according to the present invention forms a terminal base 110 to be in direct contact with a heating element such as a CPU.

In addition, first and second heat pipes 120 and 130 are integrated with each other on the upper end of the terminal base 110 by soldering.

At this time, a plurality of heat dissipation fins 141 are soldered at predetermined intervals at the end of the first heat pipe 120 to integrate the first heat dissipation block 140 in a horizontal direction, and a plurality of heat dissipation fins 141 at the end of the second heat pipe 130. The heat radiation fins 151 are soldered at regular intervals to integrate the second heat dissipation block 150 in the vertical direction.

In addition, a fan motor 160 is installed at a central portion thereof to supply cooling fluids by forced convection to the first and second heat dissipation blocks 140 and 150.

Here, the fan motor 160 and the terminal base 110 is fixed by the base frame 170, the base frame 170 is made of an integral structure by casting.

The base frame 170 forms a motor mounting unit 171 for mounting the fan motor 160, and a terminal device unit 173 for mounting the terminal base 110 is integrally formed at one side thereof.

In addition, the plate-shaped body which shields the upper opening of the motor mounting portion 171 of the base frame 170, and has a fan cover 180 formed with a suction hole 181 for sucking the cooling fluid in the center .

Here, in particular, the fan cover 180 passes through the heat pipes 120 and 130, which are a kind of heat transport pipe that carries heat upward, so that the fan cover 180 is soldered to the heat pipes 120 and 130 to be integrated.

Referring to the operation of the electronic chip cooling device according to the present invention having the configuration as described above are as follows.

First, heat generated in a heating element such as a CPU is conducted to the heat pipes 120 and 130 through the terminal base 110, and then moved to the heat dissipation blocks 140 and 150 formed at each end of the heat pipes 120 and 130. The heat transferred to blocks 140 and 150 is driven by the fan motor 160 to cause forced convection to cool, as mentioned in the action by the prior art.

Here, the present invention is remarkably distinguished from the prior art is that the fan cover 180 and the heat pipes 120 and 130 are integrated by structural coupling.

As described above, when the fan cover 180 is integrated with the heat pipes 120 and 130 by soldering, the heat of the heat pipes 120 and 130 can be moved to the fan cover 180.

As a result, a new heat dissipation area corresponding to the area of the fan cover 180 can be additionally secured.

At this time, preferably by using the material of the fan cover 180 in the same copper series rather than the normal aluminum series, it is possible to further improve the thermal conductivity characteristics.

In this way, the heat moved to the fan cover 180 is dissipated through natural convection with the ambient air and forced convection by the air introduced through the vent hole 181 of the fan cover 180.

As the fan cover 180 is integrated with the heat pipes 120 and 130 as in the present invention, the fan cover 180 made of a thin plate is attracted by the suction force of the fan motor 160 to prevent a phenomenon in which friction occurs. You can do it.

Figure 4 is a graph measuring the heat resistance value due to the increase in heat dissipation area, (a) and (b) shows the measured value before and after the heat dissipation area increase, respectively.

Here, the heat dissipation capability of the radiator may be represented by a thermal resistance value θ sa, and ° C / W is used as a unit. That is, it means the rising temperature per watt.

As can be seen from the graph of FIG. 4, in the case of (a), the thermal resistance value is 0.90 to 0.98 ° C / W, while in (b), the thermal resistance value is very low as 0.86 to 0.88 ° C / W. Can be.

In other words, the drop in the thermal resistance means that the heat dissipation performance of the cooling apparatus is improved.

5 is a perspective view showing another embodiment of the fan cover according to the present invention. As shown in the figure, a plurality of cooling fins 183 are formed on the fan cover 180 to form a larger heat dissipation area. can do.

The present invention has the effect of maximizing the heat dissipation area by integrating the fan cover into the heat pipe by soldering or the like.

In addition, the heat pipe reinforcement structure prevents the phenomenon of friction between the fan cover and the fan motor.

Claims (3)

Supplying a cooling fluid to the terminal base, a heat pipe soldered on top of the terminal base, a heat dissipation block soldered to the end of the heat pipe, and a cooling fluid to the heat dissipation block by directly contacting a heat generating element such as a CPU The fan motor, which is located at the center thereof, the base frame to which the fan motor and the terminal base are fixed, and most of the upper and lower centers of the fan motor installation part of the base frame are blocked to efficiently introduce and discharge the cooling fluid. In the electronic chip cooling device comprising a fan cover to enable And an integrated fan cover formed under the installation line of the heat pipes by soldering the heat pipes so that the fan cover can be used as a heat sink that conducts heat from the heat pipes and radiates heat in the air. The method of claim 1, Electronic chip cooling device, characterized in that for the material of the fan cover using the same series. The method of claim 1, Electronic chip cooling apparatus characterized in that to form a plurality of cooling fins on the fan cover to increase the heat dissipation area.