JP4360624B2 - Heat sink for semiconductor element cooling - Google Patents

Description

  The present invention relates to a cooling device for a cooled element having a high heat generation density such as a semiconductor element using a heat pipe and a thermoelectric cooling element.

In recent years, electronic devices have built-in high-power, highly-integrated parts such as microprocessors. Microprocessors have a very high degree of integration and perform processing such as computation and control at high speed, so that a large amount of heat is released. Various cooling systems have been proposed for cooling chips and the like, which are high output and highly integrated parts. As one of the typical cooling systems, there are a heat pipe and a thermoelectric cooling element.
The heat pipe includes a round pipe-shaped heat pipe and a planar heat pipe. For cooling a component to be cooled of an electronic device such as a CPU, a flat heat pipe is preferably used because it can be easily attached to the component to be cooled and a wide contact surface can be obtained.

Furthermore, the heat pipe is divided into a top heat mode in which the part to be cooled is located at the upper part and a bottom heat mode in which the part to be cooled is located in the lower part at the attachment position of the part to be cooled. In the bottom heat mode, the liquid recirculates due to gravity, but in the top heat mode, the liquid must be recirculated against gravity, and normally a capillary phenomenon due to wicking is used.
A space serving as a flow path for the working fluid is provided inside the heat pipe, and the working fluid accommodated in the space undergoes a phase change or movement such as evaporation or condensation, thereby transferring heat.

The details of the operation of the heat pipe having a sealed cavity and in which heat is transferred by phase transformation and movement of the working fluid contained in the cavity are as follows.
On the heat absorption side of the heat pipe, the heat generated by the part to be cooled that has been conducted through the material of the container that constitutes the heat pipe is absorbed as latent heat, the working fluid evaporates, and the vapor is dissipated from the heat pipe. Move to the side. On the heat radiating side, the working fluid vapor condenses to release latent heat and returns to the liquid phase. The working fluid that has returned to the liquid phase in this way moves (refluxs) again to the heat absorption side. Heat is transferred by such phase transformation and movement of the working fluid.
In a gravity heat pipe, the working fluid that has become a liquid phase by phase transformation moves (refluxs) to the heat absorption side by gravity.

In recent years, semiconductor elements that process high-speed signals have a higher heat generation density, and cannot be sufficiently cooled only by the heat pipe described above. There has been proposed a cooling device in which a thermoelectric cooling element is directly combined with an element for cooling an element having a high heat generation density.
In general, when two types of conductors A and B are connected and a current flows at a constant temperature, heat is generated or absorbed at the contacts of the conductors A and B. This is called the Peltier effect. There is a thermoelectric cooling element, for example, a Peltier element, using this principle. That is, p-type semiconductor elements and n-type semiconductor elements, which are thermoelectric elements, are alternately arranged in parallel, and electrodes are disposed at both ends of each semiconductor element. Both ends of each semiconductor element and the electrodes are joined by solder. The p-type semiconductor element and the n-type semiconductor element are electrically joined in series alternately via electrodes.

Further, a pair of electrically insulating substrates is provided outside each electrode in order to electrically insulate an electric circuit formed by the electrode and the p-type semiconductor element and the n-type semiconductor, which are thermoelectric elements, from the outside. The electrode and the electrically insulating substrate are joined by solder. Thus, the thermoelectric cooling element forms a structure in which an electric circuit formed by an electrode, a p-type semiconductor element, and an n-type semiconductor element is sandwiched between two electrically insulating substrates. With the thermoelectric cooling element described above, the heat on the electrically insulating substrate side is moved to the electrically insulating substrate side, and the electrically insulating substrate side is cooled.
Conventionally, a method in which a low temperature side of a thermoelectric cooling element is attached to a heat source and a heat sink or a heat pipe type heat sink is attached to a high temperature side of the thermoelectric cooling element has been generally performed.
JP 2004-47809

However, the conventional method of attaching the heat sink or the heat pipe type heat sink to the high temperature side of the thermoelectric cooling element with the low temperature side of the thermoelectric cooling element has the following problems.
That is, it is difficult to increase the temperature difference between the heat sink or the heat pipe type heat sink and the cooling air, and it is difficult to improve the cooling performance. Furthermore, in order to improve the cooling performance, a large amount of cooling air flow is required, so that the noise of the fan increases. Furthermore, in order to lower the temperature of the heat source, it is necessary to operate the thermoelectric cooling element at a low temperature, and there is a risk of destruction of the semiconductor element due to condensation.

  Furthermore, in order to ensure stable operation of the CPU, switching elements such as FETs are arranged in the periphery, but this increases the power consumption due to the speeding up of the CPU, and the peripheral elements such as FETs increase in size and generate a large amount of heat. Become. This needs to be cooled for stable operation of the CPU, but this becomes impossible if the heat sink capacity is insufficient. If thermoelectric cooling elements are attached to individual elements in order to increase the capacity of the heat sink, the heat sink becomes complicated.

  In addition, the heat sink volume increases and the weight increases as the amount of heat generation increases.However, in the method of attaching the heat sink directly to the heat source, the substrate bends due to the weight of the heat sink, particularly in semiconductor elements that process high-speed signals. There has been a problem that signal deterioration becomes large, transmission characteristics deteriorate, and stable operation cannot be performed.

  Therefore, the object of the present invention is to solve the conventional problems, to increase the temperature difference between the heat sink and the cooling air, to improve the cooling performance, there is no risk of destruction of the semiconductor element due to condensation, An object of the present invention is to provide a semiconductor element cooling heat sink capable of cooling a semiconductor element without deteriorating signal characteristics due to substrate deflection.

  The present inventor has intensively studied to solve the conventional problems described above. As a result, the heat sink is fixed to the part inside the housing outside the mounting board where the heat generating element that processes high-speed signals is mounted, the thermoelectric cooling element is placed on the heat sink, and the high temperature side is thermally connected to the heat sink. , The low temperature side is thermally connected to the heat dissipation part of the heat pipe, and the heat generating element and the heat absorption part of the heat pipe are thermally connected to prevent the substrate from being bent due to the weight of the heat sink, thereby generating heat with high heat generation density. It has been found that the device can be cooled efficiently.

The present invention has been made based on the above research results, and a first aspect of the semiconductor element cooling heat sink of the present invention is a heat sink fixed in a housing having a mounting substrate on which a heating element is mounted. At least one thermoelectric cooling element disposed on the heat sink and having a high temperature side thermally connected to the heat sink; and at least one heat pipe thermally connecting the heating element and the thermoelectric cooling element. And (I) thermally connecting the heat generating element and the heat absorbing part of the heat pipe and thermally connecting the heat radiating part of the heat pipe to the low temperature side of the thermoelectric cooling element, and (II) the heat sink and so as to prevent bending of the substrate due to the load of the thermoelectric cooling element, the heat sink a housing outside the mounting substrate, the mounting substrate is disposed The heat sink is fixed so that the fins of the heat sink are in contact with the surface on substantially the same horizontal plane as the surface being mounted, and the heat absorbing portion of the heat pipe is positioned lower in the vertical direction than the heat radiating portion. It arrange | positions like this.

  According to a second aspect of the heat sink for cooling a semiconductor element of the present invention, the heat sink is fixed in a housing by a fixture, and the fixture has a duct function for restricting air flow in a specific direction. It is a heat sink for element cooling.

  According to a third aspect of the heat sink for cooling a semiconductor element of the present invention, the heat pipe is composed of a plurality of round heat pipes, and a heat absorbing portion of the heat pipe is thermally connected to the heat generating element via a heat receiving block. A heat sink for cooling a semiconductor element, connected and thermally connected to a low temperature side of the thermoelectric cooling element via a heat dissipation block.

According to a fourth aspect of the heat sink for cooling a semiconductor element of the present invention , there is provided a radiating fin group fixed on substantially the same horizontal plane as the inner side surface of the housing on which the mounting board is disposed outside the mounting board, and the heat dissipation. A first heat pipe in which a heat dissipating part is thermally connected and fixed to the fin group, a low temperature side is arranged vertically upward, a high temperature side is arranged vertically downward, and the high temperature side is the first heat. at least one thermoelectric cooling element is thermally connected to the heat absorbing portion of the pipe, at least the heat absorption part and the heat generation element is the low temperature side and the heat radiating portion of the thermally connected to the thermoelectric cooling element is thermally connected And a second heat pipe, wherein the heat absorbing portion of the second heat pipe is disposed at a lower position in the vertical direction than the heat radiating portion, and cools the heat generating element. cooling It is a heat sink.

A fifth aspect of the semiconductor device cooling heat sink of the invention, the heat radiation burring the fin group is applied, the burring process is heat portion release of the heat pipe applied portion is inserted, the semiconductor element cooling Heatsink.

According to a sixth aspect of the semiconductor element cooling heat sink of the present invention, the heat pipe is a plate heat pipe, and the plate heat pipe includes a plurality of heat absorbing portions corresponding to a plurality of heat generating elements having different heights. A semiconductor element cooling heat sink.

A seventh aspect of the heat sink for cooling a semiconductor element of the present invention is a heat sink for cooling a semiconductor element, wherein the heat generating element has a heat generation density of 12 W / cm ² or more.

  Another aspect of the heat sink for cooling a semiconductor element according to the present invention includes a radiating fin group and at least one cylindrical thermoelectric cooling element fixed to the radiating fin group and having a high temperature side thermally connected to the radiating fin group. The semiconductor element cooling heat sink.

  The present invention has the following effects. That is, since the temperature difference between the heat sink temperature and the cooling air becomes large, the heat radiation amount increases and the heat radiation performance of the heat sink is improved. As the heat dissipation performance of the heat sink is improved, the amount of cooling air can be reduced, so that the rotational speed of the fan can be reduced and the noise can be reduced. Since the contact thermal resistance between the heat source and the heat pipe and between the heat pipe and the heat sink base plate can be reduced, the heat radiation performance can be improved. It is not necessary to attach the thermoelectric cooling element directly to the heat generation source, and it can be installed at a location away from the heat generation source, so that it is possible to prevent the semiconductor element from being damaged due to dew condensation due to the operation of the thermoelectric cooling element. Further, it is possible to eliminate the deflection of the mounting substrate of the semiconductor element due to the weight of the heat sink, and it is possible to cool the semiconductor element without deteriorating the signal characteristics.

The semiconductor element cooling heat sink of the present invention will be described in detail with reference to the drawings.
The semiconductor element cooling heat sink of the present invention is disposed on the heat sink fixed to the inside of the casing outside the substrate substrate on which the heat generating element for processing high-speed signals is mounted, and the high temperature side is thermally connected to the heat sink. At least one thermoelectric cooling element connected to the heat generating element, the heat generating element and the heat absorbing part are thermally connected, and at least one heat pipe in which the low temperature side of the thermoelectric cooling element and the heat radiating part are thermally connected This is a semiconductor element cooling heat sink that cools the heating element by preventing the substrate from being bent by the load of the heat sink.

  That is, in the present invention, the temperature difference between the cooling air temperature and the heat sink temperature is increased by increasing the temperature of the heat sink by attaching a thermoelectric cooling element between the heat radiation portion side of the heat pipe and the base plate of the heat sink. To do. As a result, the heat dissipation amount increases. Further, the shape of the heat pipe is designed so that the heat sink and the thermoelectric cooling element are located outside the mounting substrate, and the heat sink is fixed to a structure such as a housing. Furthermore, the heat sink attachment has a function of a duct so that all the cooling air from the electric fan hits the heat sink. Further, in another aspect, the heat pipe is a round heat pipe, and is attached to the heat pipe in the inner hole portion of the cylindrical thermoelectric cooling element, and the outer surface of the thermoelectric cooling element is subjected to burring processing. A group is attached. In another aspect, the heat pipe is a plate-type heat pipe, and the plate-type heat pipe is bent according to the height of a plurality of heating elements having different heights to form a plurality of heat receiving surfaces. A plurality of heating elements having different heights can be attached to the heat pipe.

  FIG. 1 is a schematic view showing one embodiment of a heat sink for cooling a semiconductor element of the present invention. As shown in FIG. 1, a semiconductor element 101 such as a CPU is mounted on a mounting substrate 102. The heat absorption part of the heat pipe may be thermally directly connected to the semiconductor element. Furthermore, when using a plurality of heat pipes corresponding to the size of the semiconductor element or when expecting a soaking effect, as shown in the figure, on the semiconductor element 101, copper, aluminum, Alternatively, the heat receiving block 201 made of a material having excellent thermal conductivity (such as carbon, but not limited to metal) such as carbon has a means for reducing contact resistance with the semiconductor element 101 (for example, thermal conductive grease or carbon Using nanotubes).

  As a method of fixing the heat receiving block 201, there is a method of fixing to the mounting substrate 101 using screws and a spring structure. In the case where it is not desired to apply extra stress to the substrate substrate 101, it is possible to adopt a friend fastening method together with the housing 103.

The heat receiving block 201 is provided with a hole for attaching the heat pipe 202. The end of the heat pipe is inserted into the hole of the heat receiving block, and the heat pipe is attached to the heat receiving block so that the contact resistance between the heat pipe 202 and the heat receiving block 201 is reduced by a joining method such as caulking or soldering. It is done. At this time, in order to reduce the contact thermal resistance between the hole of the heat receiving block and the heat pipe 202, heat conductive grease or carbon nanotubes may be filled.
A heat radiation block 203 is attached to the end of the heat pipe opposite to the heat receiving block 201 by the same method as the heat receiving block 201.

  A low temperature side of the thermoelectric cooling element 204 is attached to the heat dissipation block 203 using means (thermal conductive grease, carbon nanotube) that reduces the contact thermal resistance of this portion. On the high temperature side of the thermoelectric cooling element, for example, a heat sink 205 including a base portion and a fin portion is attached. As described above, the thermoelectric cooling element and the heat sink are also thermally connected using thermal conductive grease, carbon nanotubes, or the like so that the contact thermal resistance is reduced.

A heat dissipating mechanism including the heat dissipating block 203, the thermoelectric cooling element 204, and the heat sink 205 is disposed so as to be located outside the mounting substrate 102, and is fixed to the housing 103 by mounting fixtures 104 and 105. In this way, since the load of the heavy heat sink is fixed to the housing so as not to be directly applied to the mounting substrate, the stress applied to the mounting substrate 102 is reduced.
In semiconductor elements that process high-speed signals, if a large stress is applied to the mounting substrate, the substrate will bend, resulting in significant signal degradation, and transmission characteristics will be degraded and stable operation will not be possible. Therefore, the stress applied to the mounting substrate 102 can be reduced. is important.

  In this case, a duct for restricting the air flow in a specific direction may be formed by the mounting fixtures 104 and 105 so that the cooling air of the cooling fan hits the heat sink without waste. Note that the heat dissipation mechanism may be attached anywhere as long as it is outside the mounting substrate 102.

  Heat generated from the heating element 101 is transmitted to the evaporation portion of the heat pipe 202 through the heat receiving block 201. When heat enters the evaporating part of the heat pipe, the working fluid sealed inside evaporates and moves to the condensing part where the heat radiation block 203 is attached as vapor. The heat that has moved to the condensing part is pumped up by the thermoelectric cooling element 204, released to the outside by the heat sink 205, and removed. That is, the end of the heat pipe on the condensing part side is thermally connected to the low temperature side of the thermoelectric cooling element via the heat dissipation block, and the high temperature side of the thermoelectric cooling element is thermally connected to the base plate of the heat sink. When heat is removed at the condensing part of the heat pipe, the working fluid is condensed and returns to the liquid phase again. The working fluid that has become a liquid phase recirculates in the heat pipe to the evaporation section by gravity or capillary force again.

  Here, the thermoelectric cooling element 204 attached to the heat dissipation block 203 increases the temperature difference between the cooling air that circulates through the housing and is heated by the peripheral devices by increasing the temperature of the heat sink 205. As a result, the heat removal amount of the heat sink can be improved.

  FIG. 2 is a schematic view showing another embodiment of the semiconductor element cooling heat sink of the present invention. FIG. 2 is the same as the mode shown in FIG. 1 except that the arrangement of the heat dissipating mechanism including the heat dissipating block 203, the thermoelectric cooling element 204, and the heat sink 205 is different. That is, as shown in FIG. 2, the heat dissipation mechanism is fixed to a housing portion outside the substrate substrate 102 so that the weight of the heat sink or the like is not applied to the mounting substrate.

FIG. 3 is a schematic view showing another embodiment of the heat sink for cooling a semiconductor element of the present invention using a cylindrical thermoelectric cooling element. FIG. 4 is a diagram for explaining a method of attaching the heat receiving block, the heat pipe, the thermoelectric cooling element, and the radiating fin group.
As shown in FIG. 3, a cylindrical thermoelectric cooling element 206 is used in this embodiment. In this case, the inner hole side of the cylindrical thermoelectric cooling element is the low temperature side, and the outer surface side is the high temperature side.

  That is, as shown in FIG. 4, the heat absorbing portion which is one end portion of the heat pipe 202 is inserted and fixed in the hole portion of the heat receiving block 201. The heat radiating portion, which is the other end of the heat pipe 202, is inserted into the inner hole of the cylindrical thermoelectric cooling element 206 and fixed. On the outer surface side of the cylindrical thermoelectric cooling element 206, for example, a plate-shaped radiating fin group 207 having a hole is attached. The radiating fin may be subjected to burring. As a result, the heat connection portion on the outer surface side of the heat dissipating fin and the cylindrical thermoelectric cooling element is widened, and the heat dissipating efficiency is increased. In order to reduce the contact thermal resistance between the heat receiving block, the heat pipe, and the cylindrical thermoelectric cooling element, it is preferable to fill these members with heat conductive grease and carbon nanotubes.

  According to the semiconductor element cooling heat sink of this aspect, the heat generated by the heat generating element 101 is transmitted to the evaporation part of the heat pipe 202 inserted and fixed in the hole of the heat receiving block 201 and enclosed inside the evaporation part of the heat pipe. The working fluid is evaporated by the heat transmitted from the heat receiving block through the material of the heat pipe, and is converted into vapor to move to the condensing part inserted and fixed in the thermoelectric cooling element. The heat that has moved to the condensing part is pumped up by the thermoelectric cooling element 206, released to the outside by the radiating fin group 207, and removed.

  That is, the condensing part of the heat pipe is thermally connected to the low temperature side of the inner hole of the cylindrical thermoelectric cooling element, and the high temperature side of the outer surface of the cylindrical thermoelectric cooling element is thermally connected to the radiating fin group. When heat is removed at the condensing part of the heat pipe, the working fluid is condensed and returns to the liquid phase again. The working fluid that has become a liquid phase recirculates in the heat pipe to the evaporation section by gravity or capillary force again. The radiating fin group may be, for example, an L-shaped plate-shaped radiating fin including a vertical portion and a horizontal portion. Also in this aspect, it is important that the heat dissipation mechanism is fixed to the housing portion outside the mounting substrate 102 and the weight of the heat sink or the like is not applied to the mounting substrate.

FIG. 5 is a schematic diagram showing another embodiment of the heat sink for cooling a semiconductor element of the present invention using a plate-like heat pipe.
In the semiconductor element cooling heat sink of this aspect, the heat pipe is a plate heat pipe, and the plate heat pipe has a plurality of heat receiving surfaces corresponding to the plurality of heat generating elements having different heights.

  As CPU speed increases and power consumption increases, the amount of heat generated by transistors such as FETs increases when switching elements such as FETs are placed around them, so that stable operation of the CPU is possible. It is necessary to cool the FET etc. as well. As described above, this aspect is a semiconductor element cooling heat sink that can cope with cooling of a plurality of heating elements having different heights. As shown in FIG. 5, the heat pipe 202 is formed of a plate-like heat pipe, is bent according to the height of each of the plurality of heating elements 102 and 106, and has a corresponding heat receiving surface. .

  That is, not only the CPU 101 but also the elements 106 such as FETs and peripheral chips are collectively cooled by a single plate heat pipe. In the case of using a plate-like heat pipe, the heat receiving block 201 and the heat radiating block 203 are not necessary, so that there is no loss of thermal resistance in these portions, and the heat radiating performance is further improved. The heat radiating part of the plate heat pipe is thermally connected to the low temperature side of the thermoelectric cooling element, and the high temperature side of the thermoelectric cooling element is thermally connected to the heat sink.

  Also in this aspect, it is important that the heat dissipation mechanism is fixed to the housing portion outside the mounting substrate 102 and the weight of the heat sink or the like is not applied to the mounting substrate. Further, similarly to the embodiment described with reference to FIG. 1, the mounting fixtures 104 and 105 form a duct for restricting the air flow in a specific direction so that the cooling air of the cooling fan hits the heat sink without waste. May be.

FIG. 6 is a schematic view showing another embodiment of the heat sink for cooling a semiconductor element of the present invention using two heat pipes.
In the heat sink for cooling a semiconductor element of this aspect, a radiating fin group fixed to a portion inside a housing outside a mounting board on which a heat generating element for processing a high-speed signal is mounted, and a burring of the radiating fin group A first heat pipe that is thermally connected and fixed to the processed portion, at least one thermoelectric cooling element whose high temperature side is thermally connected to a heat absorbing portion of the first heat pipe, and a heating element And at least one second heat pipe in which the heat absorption part is thermally connected and the low temperature side of the thermoelectric cooling element and the heat dissipation part are thermally connected.

  As shown in FIG. 6, the heat absorption element of the heat pipe (second heat pipe) 202 is thermally connected to the heating element 101, and the low temperature side of the thermoelectric cooling element is thermally connected to the heat dissipation part of the heat pipe. Is done. On the high temperature side of the thermoelectric cooling element, for example, a heat absorbing portion of another heat pipe (first heat pipe) that is inserted and fixed in a plate-like heat radiating fin group subjected to burring is thermally connected. . The first and second heat pipes thermally connected to the low temperature side and the high temperature side of the thermoelectric cooling element are fixed by fixtures 106 and 107.

  As described above, the first heat pipe is inserted and fixed in the burring hole of the radiating fin group. By fixing the heat dissipating fin group to which the heat pipe is fixed in this manner to the portion of the casing outside the substrate, the heat dissipation mechanism is fixed to the casing portion outside the mounting substrate 102, and the weight of the heat sink and the like. Is not applied to the mounting board. The fixtures 106 and 107 for fixing the first and second heat pipes and the thermoelectric cooling element may be fixed to the casing. In any case, it is important that the heat dissipation mechanism is fixed to the outer casing portion of the mounting substrate 102.

  The thermoelectric cooling element and the heat pipe are thermally connected between the radiating fin group and the heat pipe using heat conductive grease, carbon nanotubes, or the like so as to reduce the contact thermal resistance as described above.

  According to the heat sink for cooling a semiconductor element of this aspect, the heat generated by the heating element 101 is transmitted to the evaporation part of the heat pipe 202, and the working fluid sealed inside the evaporation part of the heat pipe is transferred from the heating element to the heat pipe. It is evaporated by the heat transmitted through the material of the material, becomes steam and moves to the condensing part in the heat pipe, is thermally connected to the low temperature side of the thermoelectric cooling element and is pumped by the thermoelectric cooling element 203, The working fluid evaporates in the heat-absorbing part of the first heat pipe that is thermally connected to the high-temperature side, moves to the condensing part in the heat pipe as vapor, and is released to the outside by the radiating fin group 207 for removal. Is done.

According to the semiconductor element cooling heat sink of the present invention described above, an element having a high heat generation density can be effectively cooled. For example, a chip having a size of 31 mm × 31 mm and a heat generation density of 12.5 W / cm ^{2 and} a chip having a size of 20 mm × 20 mm and a heat generation density of 37.5 W / cm ² can be effectively cooled.

  As described above, according to the present invention, the temperature difference between the heat sink temperature and the cooling air is large, the heat radiation amount is increased, the heat radiation performance is improved, the rotation speed of the fan can be reduced, and the noise can be reduced. The semiconductor element can be prevented from failing due to dew condensation caused by the operation of the cooling element, the deflection of the mounting board of the semiconductor element due to the weight of the heat sink can be eliminated, and the semiconductor element can be cooled without deteriorating the signal characteristics. Is possible and has high industrial utility value.

FIG. 1 is a schematic view showing one embodiment of a heat sink for cooling a semiconductor element of the present invention. FIG. 2 is a schematic view showing another embodiment of the semiconductor element cooling heat sink of the present invention. FIG. 3 is a schematic view showing another embodiment of the heat sink for cooling a semiconductor element of the present invention using a cylindrical thermoelectric cooling element. FIG. 4 is a diagram for explaining a method of attaching the heat receiving block, the heat pipe, the thermoelectric cooling element, and the radiating fin group. FIG. 5 is a schematic diagram showing another embodiment of the heat sink for cooling a semiconductor element of the present invention using a plate-like heat pipe. FIG. 6 is a schematic view showing another embodiment of the heat sink for cooling a semiconductor element of the present invention using two heat pipes.

Explanation of symbols

101. Heating element
102. Mounting board
103. Enclosure
104, 105, 106, 107. Fixture
201. Heat receiving block
202. heat pipe
203. Heat dissipation block
204. Thermoelectric cooling element
205. heatsink
206. Cylindrical thermoelectric cooling element
207. Radiation fin group
208. (Another) heat pipe

Claims (7)

A heat sink fixed in a housing having a mounting substrate on which a heat generating element is mounted; at least one thermoelectric cooling element disposed on the heat sink and having a high temperature side thermally connected to the heat sink; and the heat generating element. Comprising at least one heat pipe that thermally connects the thermoelectric cooling element;
(I) thermally connecting the heat generating element and the heat absorbing part of the heat pipe and thermally connecting the heat radiating part of the heat pipe to the low temperature side of the thermoelectric cooling element;
(II) so as to prevent the deflection of the substrate due to the load of the heat sink and the thermoelectric cooling element, the heat sink a housing outside the mounting substrate, the surface having substantially the same horizontal plane in which the mounting board is placed Further, the heat sink is fixed so that fins of the heat sink are in contact with the surface, and the heat absorbing portion of the heat pipe is disposed at a position lower than the heat radiating portion in the vertical direction. A heat sink for cooling a semiconductor element for cooling the heat generating element.   2. The heat sink for cooling a semiconductor element according to claim 1, wherein the heat sink is fixed in a housing by an attachment, and the attachment has a duct function for restricting an air flow in a specific direction.   The heat pipe is composed of a plurality of heat pipes, a heat absorption part of the heat pipe is thermally connected to the heat generating element via a heat receiving block, and a heat dissipation part of the heat pipe is connected to the thermoelectric power via a heat dissipation block. The heat sink for cooling a semiconductor element according to claim 1, which is thermally connected to a low temperature side of the cooling element. A heat dissipating fin group fixed on substantially the same horizontal surface as the inner side surface of the housing on which the mounting substrate is disposed outside the mounting substrate, and a heat dissipating part being thermally connected and fixed to the heat dissipating fin group The first heat pipe and the low temperature side are arranged vertically above, the high temperature side is arranged vertically below, and the high temperature side is thermally connected to the heat absorption part of the first heat pipe. A cooling element; and at least one second heat pipe in which a heat generating element and a heat absorbing part are thermally connected, and the low temperature side of the thermoelectric cooling element and a heat radiating part are thermally connected, and the second heat A heat sink for cooling a semiconductor element, wherein the heat absorption part of the pipe is disposed at a position lower in the vertical direction than the heat dissipation part, and cools the heating element. The heat sink for cooling a semiconductor element according to claim 4, wherein the radiating fin group is subjected to burring processing, and a heat radiating portion of a heat pipe is inserted into the burring processed portion. 5. The semiconductor element according to claim 1, wherein the heat pipe is a plate heat pipe, and the plate heat pipe includes a plurality of heat absorbing portions corresponding to a plurality of heat generating elements having different heights. Heat sink for cooling. The heat generation density of the heating element is 12 W / cm ² The heat sink for cooling a semiconductor element according to any one of claims 1 to 6, which is the above.

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