JP3939868B2 - Electronic element cooling structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling structure for cooling electronic elements such as a central processing unit (CPU) to prevent overheating.
[0002]
[Prior art]
Recently, the amount of heat generated by electronic devices such as CPUs has increased due to higher speeds and larger capacities. Accordingly, in order to avoid malfunctions and damage due to temperature rise, heat dissipation and cooling are more effective. There is a need for it. Therefore, conventionally, as an example of a cooler for an electronic element, a metal heat receiving block is attached to the electronic element, and one end of a heat pipe is disposed on the heat receiving block, and a large number of flat fins are erected on the base plate. There is a structure in which a heat sink having a configuration provided is attached to the other end of the heat pipe, and a fan is further provided to supply an air flow to the heat sink.
[0003]
According to this cooler, since the heat of the electronic element is transported to the heat sink by the heat pipe having excellent heat transport capability, it is further sent to a place away from the electronic element by the air flow, so that the temperature rise of the electronic element is suppressed. It is possible.
[0004]
[Problems to be solved by the invention]
Incidentally, computers and servers equipped with electronic elements are required to be as small as possible, and accordingly, electronic device coolers are being made compact. For this reason, the conventional cooler employs a heat pipe having a diameter as small as possible. In addition, from the viewpoint of processability, thermal conductivity, cost, etc., metals such as copper or aluminum are often used as heat pipe container materials. Thus, the conventional cooler has a small diameter. In addition, since the heat receiving block and the heat sink are attached to both ends of the tube material made of a relatively soft metal, there is a possibility that sufficient rigidity may not be obtained.
[0005]
The present invention has been made against the background described above, and an object of the present invention is to provide a structure having excellent cooling ability for an electronic element and high rigidity.
[0006]
[Means for Solving the Problem and Action]
In order to achieve the above object, the present invention provides an electronic element cooling structure in which an electronic element that generates heat by operation and a heat dissipating member disposed away from the electronic element are connected by a heat pipe. pipes, together with the embedded along the mounting groove formed on the upper surface of the high support member rigidity than the heat pipe, the base portion for mounting the electronic device in close contact to one end of the support member the support It is formed on a member integral with further that the heat dissipation member to the other end of the support member mounting et been possible heat transfer, the surface and the heat radiating member facing with an installed surface of the electronic element in the base portion It is characterized by being in contact with the chassis .
[0007]
Therefore, according to the present invention, although the heat radiating member and the electronic element are substantially provided at both ends of the heat pipe, the heat pipe is supported by the support member over the entire length, and the pedestal. Since the portion is formed integrally with the support member, the rigidity of the entire structure is high.
[0008]
According to the invention, the heat generated from the electronic element is transmitted to the one end of the heat pipe at the pedestal, thereby causing a temperature difference at both ends of the heat pipe and starting the heat pipe operation. That is, the working fluid sealed in the container evaporates, and the vapor flows toward the other end portion where the internal pressure and temperature are low, and the heat is dissipated and condensed on the support member on the outer peripheral side of the end portion. The heat is further transmitted to the heat radiating member, and is dissipated from there to the outside. As a result, the electronic element is cooled.
[0009]
If, for example, a metal such as copper or aluminum having excellent thermal conductivity is employed as the material of the support member, the heat of the electronic element applied to the pedestal is satisfactorily supplied to the heat dissipation member via the support member. Therefore, the cooling capacity can be improved also in this respect.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be described based on a specific example applied to a personal computer. In FIG. 1, reference numeral 1 denotes a support member made of a metal such as aluminum or an alloy thereof. The support member 1 is a flat plate having a rectangular cross section slightly larger than the thickness of a heat pipe 2 to be described later. In this specific example, the support member 1 is curved in an L shape as shown in FIG.
[0011]
A pedestal 5 for attaching the electronic element 3 is formed at the right end of the support member 1 in FIG. The pedestal portion 5 is a rectangular or rectangular flat plate projecting left and right in the width direction of the support member 1, and the thickness thereof is set to be equal to the thickness of the support member 1. The pedestal portion 5 is formed integrally with the support member 1 by, for example, die casting.
[0012]
An electronic element 3 such as a CPU is attached to the upper surface portion of the pedestal portion 5. More specifically, a flange portion 4 protruding to the left and right is formed on the upper surface portion of the electronic element 3 having a flat plate shape, and a screw (not shown) penetrating the flange portion 4 from above in FIG. ) Is fastened to the pedestal portion 5, so that the electronic element 3 is assembled in close contact with the pedestal portion 5.
[0013]
On the other hand, an attachment groove 6 is formed on the upper surface portion in FIG. 1 of the support member 1 and the pedestal portion 5 in a posture toward the length direction of the support member 1. The mounting groove 6 has a rectangular cross-sectional shape in which the width of the opening end is equal to the width of the inside, and has a constant depth over the entire length thereof. For example, the heat pipe 2 having an elliptical cross section or a flat cross section is attached inside the mounting groove 6.
[0014]
The thickness of the heat pipe 2 in the plate thickness direction of the support member 1 is set to be equal to the depth of the attachment groove 6, and therefore the heat pipe 2 is exposed from the attachment groove 6 to the upper side in FIG. 1. The portions are flush with the surfaces of the support member 1 and the pedestal 5. That is, the portion of the heat pipe 2 disposed on the pedestal 5 is in close contact with the lower surface of the electronic element 3 in FIG. In other words, the electronic element 3 is fixed in close contact with the pedestal 5 and the heat pipe 2.
[0015]
In addition, as a fixing means of the heat pipe 2 and the mounting groove 6, adhesion using an epoxy adhesive having high heat conductivity, or deforming the container of the heat pipe 2 so as not to interfere with the function and press-fitting into the groove portion. Etc. And by any of these means, since the heat pipe 2 is assembled to the support member 1 over its entire length, not only high fixing strength can be obtained, but also heat transfer between the heat pipe 2 and the support member 1 is achieved. Become good.
[0016]
As is well known, the heat pipe 2 encloses a condensable fluid such as water as a working fluid in a state where both ends are hermetically sealed in a state where non-condensable gas such as air is deaerated. It is a heat conduction device provided with a wick for generating capillary pressure as required.
[0017]
On the other hand, a heat sink 7 corresponding to the heat radiating member of the present invention is provided at the other end of the support member 1. More specifically, a plurality of plate-like fins 8 are parallel to each other on the lower surface in FIG. 2 of the end portion of the support member 1, that is, the surface opposite to the surface to which the heat pipe 2 is attached, and the support member. 1 is attached in a posture directed in the width direction. That is, in this specific example, the support member 1 has a structure also serving as a so-called base plate for attaching the flat fins 8, and the heat sink 7 is configured by the support member 1 and each flat fin 8.
[0018]
As a means for attaching both of them, when the support member 1 and the pedestal portion 5 are formed by die casting, one edge portion of each flat fin 8 made of a rolled material is cast with molten metal that is a material of the support member 1. A means for integrating is employed. According to this means, the flat fins 8 can be made thin and high, and the pitch between the flat fins 8 can be set narrow, so that the heat exchange area of the flat fins 8 as a whole is increased. The heat dissipation efficiency can be improved. Moreover, since both are assembled | attached in the state without a clearance gap and an inclusion, the thermal resistance between the supporting member 1 and the flat fin 8 can be made small.
[0019]
As described above, one cooling unit 9 is formed by the support member 1 provided with the pedestal 5 and the heat pipe 2 and the heat sink 7 assembled to the support member 1. The personal computer case 10 is housed in a state of being placed on a chassis 11 provided at the bottom of the personal computer case 10. More specifically, the surface (lower surface) of the pedestal portion 5 on which the electronic element 3 is not attached and the heat sink 7 are fixed to the personal computer case 10 by appropriate means in a posture in which the heat sink 7 is in contact with the chassis 11. In addition, the end part provided with the heat sink 7 among the support members 1 is arranged at a position higher than the pedestal part 5.
[0020]
Further, a microfan 12 is installed in the vicinity of the heat sink 7 in the cooling unit 9. That is, the microfan 12 is installed in the vicinity of the side wall surface of the personal computer case 10 and is fixed to the chassis 11 or the personal computer case 10 by an appropriate means. As the micro fan 12, an axial fan having a configuration in which a blade 13 that is driven to rotate is provided inside the housing 14 is employed, and the suction portion 15 in the housing 14 is orthogonal to the flat fins 8 in the heat sink 7. It is attached with.
[0021]
On the other hand, the discharge part 16 in the housing 14 is directed to an exhaust port (not shown) provided in the personal computer case 10. Therefore, when the microfan 12 is driven, the air inside the personal computer case 10 passes between the flat fins 8 of the heat sink 7 and enters the inside of the housing 14 and is sent out of the personal computer case 10. It has a configuration.
[0022]
Therefore, in the above structure, the heat generated by the operation of the electronic element 3 is transmitted to the end portion of the heat pipe 2 disposed on the pedestal portion 5, and accordingly, a temperature difference is generated between both ends of the heat pipe 2. Therefore, the operation of the heat pipe 2 is started. That is, the working fluid sealed inside evaporates, and the vapor flows to the other end portion having a low temperature to radiate heat to the inner surface of the mounting groove 6. The heat is transmitted from the end of the support member 1 to each flat fin 8.
[0023]
The working fluid condensed by releasing heat flows down toward the end of the heat pipe 2 disposed on the pedestal 5 and evaporates again by the heat of the electronic element 3. That is, since the end portion disposed on the heat sink 7 side of the heat pipe 2 is higher than the end portion disposed on the electronic element 3, the operation mode is the bottom heat mode. Further, the heat held by the heat sink 7 is transmitted to the air flow flowing between the flat fins 8, and the high temperature air flow is discharged to the outside of the personal computer case 10. That is, the heat of the heat sink 7 is carried to the outside of the personal computer case 10 by the air flow, and as a result, the temperature rise of the electronic element 3 is suppressed or prevented.
[0024]
In particular, in the above configuration, since a large number of flat fins 8 are directly attached to the support member 1, there is an advantage that the thermal resistance between the heat pipe 2 and the heat sink 7 is extremely small. 3 is directly supplied to the heat sink 7 through the support member 1 made of aluminum and the pedestal portion 5 without passing through the heat pipe 2, the cooling efficiency as a whole is excellent.
[0025]
Further, in the above structure, since the pedestal portion 5 to which the electronic element 3 is attached is formed by substantially flattening the end portion of the support member 1, the mounting position of the electronic element 3 is clarified, and The element 3 can be securely and firmly fixed, and the conventional metal block is not required, so that the number of components can be reduced and the cost can be reduced.
[0026]
Further, in the above structure, in addition to covering the entire length of both side surfaces and the bottom surface of the heat pipe 2 in FIG. 1 with the support member 1 and the pedestal 5, mechanical caulking or adhesive is used. The plate-like fins 8 are cast into the support member 1 to form the heat sink 7 regardless of the means such as adhesion, which is excellent in strength or rigidity as a whole structure. In addition, although the support member 1 has sufficient rigidity, it is a plate-shaped member having substantially the same width as the heat pipe 2, so that it is possible to eliminate the cause of an increase in the size of the personal computer case.
[0027]
In the above-described specific example, an electronic element, a heat pipe, a metal block, or the like is directly attached to the support member. However, the term “direct” in the present invention refers to a filler that mediates heat transfer such as a so-called thermal joint. The inclusion of the inclusion may be included, and the existence of this kind of inclusion which is generally performed in the past is not excluded. Further, the electronic element targeted by the present invention is not limited to a CPU, and includes a wide range of general electronic components that generate heat when operated by being energized.
[0028]
Furthermore, the metal part that can be used in the present invention is not limited to aluminum or an alloy thereof, and may be another metal such as copper or a magnesium alloy. In the above specific example, the configuration in which the heat sink is provided on the surface opposite to the surface on which the attachment groove is formed in the support member is illustrated. However, for example, the heat sink can be provided on the support member in a state of straddling the attachment groove.
[0029]
【The invention's effect】
As described above, according to the present invention, the heat pipe is embedded along the support member having higher rigidity than the heat pipe, and the pedestal portion for the electronic element is integrally formed at one end portion of the support member. Since the heat radiating member is attached to the other end portion of the member so as to be able to transfer heat and the heat pipe is supported by the support member over the entire length, the rigidity of the entire structure can be improved.
[Brief description of the drawings]
FIG. 1 is a schematic view showing a specific example in which the present invention is applied to a personal computer.
FIG. 2 is a cross-sectional view showing an arrangement state of a heat pipe, a support member, and a heat sink.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Support member, 2 ... Heat pipe, 3 ... Electronic element, 4 ... Flange part, 5 ... Base part, 6 ... Mounting groove, 7 ... Heat sink, 8 ... Flat fin, 9 ... Unit, 10 ... Computer case, 11 ... chassis, 12 ... micro fan.

Claims (1)

In the cooling structure of an electronic element in which an electronic element that generates heat by operation and a heat dissipating member arranged away from the electronic element are connected by a heat pipe,
Said heat pipe, with embedded along the mounting groove formed on the upper surface of the high support member rigidity than the heat pipe, the base portion attached to the close contact of the electronic element at one end of the support member is formed integrally with the support member, further the said heat radiating member to the other end of the support member mounting et been possible heat exchange, the heat radiating member and a surface facing the surface on which is mounted the electronic element in the base portion And a cooling structure for an electronic device, wherein the electronic device is in contact with the chassis .

Images