JP2005093969A - Semiconductor device cooler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device cooler which efficiently dissipates heat generated from heating components such as CPU, etc. out of a frame to prevent heat from being stored in the frame. <P>SOLUTION: The cooler has a heating part composed of heating components such as CPU, etc. mounted on a board, etc. inserted in a frame. A heat pipe is closely contacted with the heating components and the frame to transport heat from the heating part to the frame, and the frame forms a dissipator. In the dissipator, the wall of a frame portion closely contacted with the heat pipe is removed and dissipation fins are mounted on the opposite side of the frame to the heat pipe, so that the heat pipe is closely contacted with the dissipation fins directly or through a heat conductive material. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic device cooling apparatus for cooling a heat generating component such as a CPU disposed in a housing.

  With the recent increase in the heat generation density of semiconductor elements and the miniaturization of the housing for housing them, heat radiation within the housing has become difficult. For example, a CPU mounted on a personal computer has dramatically improved performance due to an increase in operating clock speed and integration. However, the higher the performance of this CPU, the greater the amount of heat generated during operation. In order to adopt such a high-performance CPU when manufacturing a personal computer, first of all, it is necessary to take measures to efficiently dissipate the heat generated from the heat generating parts such as the CPU, that is, to take measures against heat. There is. Some processors that generate a large amount of heat, such as supercomputers, are water-cooled. However, if this method is used in a general-purpose computer, the cost will be extremely high, and the size of the device may increase. That's not true.

  Therefore, a commonly used cooling means is a combination of a heat sink and a small forced air cooling fan called a cooler that is closely attached to a heat generating component such as a CPU, and releases heat generated from the heat generating component. Yes. As an attempt to improve such cooling means, for example, there is a CPU cooling structure disclosed in Patent Document 1.

  According to this CPU cooling structure, a metal cooling guide plate having high thermal conductivity and a required amount of deflection is sandwiched between the active heat sink and the CPU surface, thereby fixing the AHS fixing spring member. It is said that it can absorb the amount of deformation and exhibits sufficient thermal conductivity.

  However, this prior art is intended to improve the cooling performance by increasing the degree of adhesion between the active heat sink and the CPU surface, and such technical means can cope with the heat generation amount of recent high-performance heat-generating components. I can't do it. However, the combination of a large active heat sink and a large fan seems to solve the problem at first glance. However, the following problems are caused.

  The first problem is that it is difficult to secure a mounting area to increase the size of the cooling device for the recent personal computers aiming for further miniaturization and weight reduction, which goes against the technical problem of miniaturization and weight reduction in the first place. It cannot be adopted very much.

  The second problem is that even if the cooling device is enlarged and adopted, the technical means is the same as before, so the heat from the fan-integrated heat sink raises the temperature inside the personal computer, and other units・ It may affect parts. Even if a fan that blows through the PC like a fan provided in the power supply section is provided separately, it is difficult to say that a sufficient cooling effect is obtained, and if this fan is enlarged, its driving sound and wind Sound becomes loud and cannot be adopted very much. Therefore, recently, a cooling means has been proposed in which the conventional cooling means is used and a heat pipe is used.

  Prior Art As an example of adopting this heat pipe, for example, a cooling control method and cooling device for a portable electronic device disclosed in Patent Document 2, a computer cooling device disclosed in Patent Document 3, and Patent Document 4 There are a disclosed personal computer cooling device, a personal computer cooling device disclosed in Patent Document 5, and the like.

  First, the portable electronic device cooling control method and cooling device disclosed in Patent Document 2 include a metal block to which one end (heat receiving portion) of a heat pipe is connected, a heat diffusion plate, and a heat dissipation plate. There is disclosed a notebook computer comprising a CPU (package) fixed integrally to a block and a fin that is fixed to the heat pipe with the other end (heat dissipating part) fixed to the side of the personal computer. The personal computer is radiated to the outside by fins driven by heat generated from a CPU (package) via a heat pipe.

  The cooling device for a computer disclosed in Patent Document 3 transfers heat from a heat-generating component such as a central processing unit by a heat pipe to a heat sink provided downstream of a power supply fan, and releases the computer by blowing air from the transmission fan. Released to the outside.

  In the personal computer cooling device disclosed in Patent Document 4, one end of at least two heat pipes is disposed in a CPU so as to be able to transfer heat, and the other end of the second heat pipe is connected to a personal computer main body, a display, The hinge mechanism disposed in the vicinity of the connecting portion of the first heat pipe is disposed so as to be able to transfer heat, and the other end of the first heat pipe is isolated from the hinge mechanism so that heat can be transferred to a heat sink provided in the personal computer. The heat generated from the CPU is transferred to the heat sink via the heat pipe and released to the outside of the computer.

A cooling device for a personal computer disclosed in Patent Document 5 connects a plurality of heat generating members disposed inside a housing by a heat pipe and a heat sink provided at one end of the heat pipe adjacent to a transmission fan. In this configuration, the heat generated from the heat generating member is transferred to the heat sink via the heat pipe and released to the outside of the computer by the transmission fan.
JP-A-10-308482 JP 2000-228594 A JP 2000-250660 A JP 2000-277963 A Japanese Patent Laid-Open No. 11-67997

  However, all of the cooling means mentioned in the prior art has a configuration in which the heat pipe heat dissipating part is communicated with a fan disposed inside the personal computer casing. As a result, there is a possibility that heat is accumulated in the personal computer in this cooling means, and it is difficult to say that it is extremely suitable if the influence on other components is taken into consideration.

Accordingly, an object of the present invention is to provide a personal computer cooling device that can efficiently dissipate heat generated from a heat generating component such as a CPU to the outside of the personal computer to prevent heat from being accumulated inside the personal computer.

In order to solve the above-described problems, the semiconductor element cooling apparatus according to the present invention employs the following technical means.
According to invention of Claim 1, it has a heat generating part comprised with heat generating parts, such as CPU with which a board etc. which were built in a case, etc. are equipped, a heat pipe adheres to the heat generating part and a case, The heat of the heat generating portion was transported to the housing by a heat pipe, and the heat radiating portion was constituted by the housing.
According to the invention of claim 2, in the heat radiating portion, a heat radiating fin is attached to a surface of the housing opposite to the heat pipe. Corrugated fins or the like can be considered as the fins.
According to invention of Claim 3, in the said thermal radiation part, the surface where the heat pipe of the said housing | casing closely_contact | adhered was comprised with the thermal radiation fin. Corrugated fins or the like can be considered as the fins.
According to invention of Claim 4, the surface with which the heat pipe and the radiation fin of the said housing | casing closely_contact | adhered was comprised with the heat conductive material. Examples of the fin include a corrugated fin.
According to the invention of claim 5, in the heat radiating portion, the wall of the portion of the housing where the heat pipe is in close contact is removed, and a heat radiating fin is attached to the surface opposite to the heat pipe of the housing, The heat radiating fins were brought into contact directly or through a heat conductive material. Examples of the heat conductive material include silicon grease and a heat conductive sheet.
According to the invention of claim 6, a plate-type perforated capillary heat pipe is used as the heat pipe. As the plate-type porous thin pipe heat pipe, it is possible to use an aluminum-based or magnesium-based flexible metal formed by extrusion and the passage is meandering or non-meandering.
According to the seventh aspect of the present invention, a heat pipe that is in close contact with a heat-generating component such as a CPU mounted on the substrate is turned at the end of the substrate to be in close contact with the housing.

Since the present invention is configured as described above, the following advantageous effects are obtained.
According to invention of Claim 1, it has a heat generating part comprised with heat generating parts, such as CPU with which a board etc. which were built in a case, etc. are equipped, a heat pipe adheres to the heat generating part and a case, By transporting the heat of the heat generating part to the case by a heat pipe and configuring the heat radiating part with the case, the temperature inside the case is not raised by transferring heat to the case and generating heat outside the case. Occurrence of damage due to high temperatures in other electronic devices in the body can be suppressed.
According to the second aspect of the present invention, in the heat radiating portion, the heat radiation efficiency to the outside of the housing can be further increased by attaching the heat radiating fin to the surface opposite to the heat pipe of the housing.
According to invention of Claim 3, in the said thermal radiation part, the surface where the heat pipe of the said housing | casing closely_contact | adhered was comprised with the thermal radiation fin. With such a configuration, the two contact processing steps of the housing and the fin and the housing and the heat pipe can be performed as a single contact processing step of the housing and the heat pipe formed of the fin.
According to the invention of claim 4, since the surface of the housing where the heat pipe and the radiating fin are in close contact with each other is made of a heat conductive material, the heat resistance from the heat pipe to the radiating fin becomes the housing. Will be able to prevent.
According to the invention of claim 5, in the heat radiating portion, the wall of the portion of the housing where the heat pipe is in close contact is removed, and a heat radiating fin is attached to the surface opposite to the heat pipe of the housing, The heat radiating fins were brought into contact directly or through a heat conductive material. By adopting such a configuration, there is no need to make the housing material a material with good thermal conductivity, the choice of housing material is increased, and heat conduction can be performed directly from the heat pipe to the fin. Thermal resistance can be reduced as much as possible.
According to the invention of claim 6, a plate-type perforated capillary heat pipe is used as the heat pipe. By adopting such a configuration, the semiconductor element cooling device of the present invention can perform good heat dissipation in any posture without being affected by the posture.
According to the seventh aspect of the present invention, a heat pipe that is in close contact with a heat-generating component such as a CPU mounted on the substrate is turned at the end of the substrate to be in close contact with the housing. In this way, even when the heating element mounted on the board and the housing are not in close proximity, heat is transferred to the back of the board in close proximity to the housing by a heat pipe through the shortest path. Heat can be dissipated.

Next, an embodiment of a semiconductor element cooling apparatus according to the present invention will be described with reference to the drawings.
1 and 2 are schematic views of a semiconductor element cooling apparatus according to the present invention. Reference numeral 101 denotes an electronic substrate, and a heating element 103 is mounted on the electronic substrate 101. The electronic substrate 101 is fixed to the housing 105. A heat pipe 107 is in close contact with the heat generating element 103 via a heat conductive material such as silicon grease or a heat conductive sheet to absorb heat from the heat generating element 103. The heat pipe 107 and the heat generating element 103 are fixed with screws 115 via a fixing member 113, thereby increasing the adhesion and reducing the thermal resistance. The heat pipe 107 is bent toward the housing 105 at the end of the electronic substrate 101. The housing 105 has a hole 109 in a portion where the heat pipe 107 contacts, and the heat sink 111 attached to the outside of the heat pipe and the housing 105 through the hole 109 is made of silicon grease, a heat conductive sheet or the like. By contacting through the thermally conductive material, a semiconductor device cooling device with good performance can be obtained without worrying about the thermal resistance of the housing 105.
Next, an embodiment for increasing the degree of adhesion between the heat pipe 207 and the radiation fins 211 will be described with reference to FIGS. 3 and 4. In this embodiment, the description of the same components as those in Embodiment 1 is omitted. The heat pipe 207 and the heat radiating fin 211 are fixed to the heat radiating fin 211 with the fixing member 215 sandwiched by the housing 205 with the screw 217 and the heat pipe 207 and the heat radiating fin 211 to the heat radiating fin 211. By fixing the housing 205 with the screw 223 to the heat radiation fin 211, the degree of adhesion between the heat pipe 207 and the heat radiation fin 211 can be increased, and the heat radiation performance is also improved. Further, when the fixing member is made of a material having good thermal conductivity such as copper, the fixing member portion may be in close contact with the heat sink fin. Further, when the heat pipe having a flat contact surface with the heat radiation fin is used, the heat radiation efficiency is further increased.
Moreover, by using a plate-type perforated capillary heat pipe as the heat pipe having the flat surface, a good semiconductor element cooling device can be configured regardless of the arrangement posture.
Here, the structure of the plate-type porous capillary heat pipe will be described with reference to FIGS.
The meandering pore tunnel plate type heat pipe of FIG. 5 or the parallel pore tunnel plate type heat pipe of FIG. 6 is used. The pore tunnel plate type heat pipe will be described by taking a meandering pore tunnel plate type heat pipe as an example.
Here, the meandering capillary heat pipe is a heat pipe having the following characteristics (refer to Japanese Patent Laid-Open No. 4-190090).
(1) Both ends of the narrow tube (heat medium passage) are connected and sealed so as to be able to flow with each other.
(2) The part with the thin tube is the heat receiving part, and the other part is the heat radiating part.
(3) The heat receiving portion and the heat radiating portion are alternately arranged, and a narrow tube meanders between the two portions.
(4) A two-phase condensable working fluid is sealed in the narrow tube.
(5) The inner wall of the narrow tube has a diameter equal to or smaller than the maximum fluid diameter that allows the working fluid to circulate or move while always closing the inside of the tube.
By using such a thin tube heat pipe, heat transport can be performed regardless of the attachment posture of the thin tube heat pipe to the heating element.
Next, FIGS. 7 and 8 show an embodiment in which a fixing member for bringing the heat pipe and the heat generating element into close contact with each other is a heat radiating fin. The configuration of FIGS. 7 and 8 is the same as that of FIGS. 1 and 2 except for the fixing member 301 made of fins, and is therefore omitted here. The fixing member 301 made of fins is fixed by screws 303, and the heat pipe 305, the heat generating element 307, and the fixing member 301 made of fins are brought into close contact with each other to increase the heat radiation efficiency.

It is the top view in a housing | casing which showed the implementation method of the semiconductor element cooling device of this invention. It is the side view in a housing | casing which showed the implementation method of the semiconductor element cooling device of this invention. It is the upper surface figure in a housing | casing which showed the fixing method to the housing | casing of the semiconductor element cooling device of this invention. It is the housing inner side view which showed the fixing method to the housing | casing of the semiconductor element cooling device of this invention. It is a plane sectional view of a meandering pore tunnel plate type heat pipe. It is a plane sectional view of a parallel pore tunnel plate type heat pipe. It is the upper surface figure in a housing | casing which showed another implementation method of the heating element side fixing member of the semiconductor element cooling device of this invention. It is the side view inside a housing | casing which showed another implementation method of the heating element side fixing member of the semiconductor element cooling device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Electronic substrate 103 Heating element 105 Case 107 Heat pipe 113 Fixing member 115 Screw 109 Hole

Claims (7)

  A heat generating part composed of a heat generating component such as a CPU mounted on a substrate or the like installed in the housing; a heat pipe is in close contact with the heat generating component and the case; and the heat of the heat generating unit is encased by the heat pipe. A semiconductor element cooling apparatus, characterized in that it is transported to a body and a heat radiating portion is constituted by the casing.   The semiconductor element cooling device according to claim 1, wherein in the heat radiating portion, a heat radiating fin is attached to a surface of the housing opposite to the heat pipe.   2. The semiconductor element cooling device according to claim 1, wherein a surface of the heat dissipating part that is in close contact with the heat pipe of the housing is configured with a heat dissipating fin. 3.   The semiconductor element cooling device according to claim 2 or 3, wherein a surface of the housing where the heat pipe and the heat radiation fin are in close contact is formed of a heat conductive material.   In the heat radiating part, the wall of the housing part where the heat pipe is in close contact is removed, and a heat radiating fin is attached to the opposite surface of the housing to the heat pipe, and the heat pipe and the heat radiating fin are directly or thermally conductive. The semiconductor element cooling apparatus according to claim 1, wherein the semiconductor element cooling apparatus is in contact with each other through a material.   6. The semiconductor element cooling apparatus according to claim 1, wherein a plate-type porous capillary heat pipe is used as the heat pipe.   The semiconductor element cooling device according to claim 1, wherein a heat pipe that is in close contact with a heat-generating component such as a CPU mounted on the substrate is turned at the end of the substrate and is in close contact with the housing. .

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