JP2007073579A - Cooling device of electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device of an electronic apparatus capable of effectively transporting heat of a heater to the outside of a casing of the electronic apparatus without using an operation component such as an air cooling fan. <P>SOLUTION: In the cooling device of an electronic apparatus; heat dissipation means is an exhaust cylinder 1 with its mounting attitude fixed vertically in the electronic apparatus 5, and heat dissipation parts of one or a plurality of heat pipes 2 are inserted into and fitted to an outer wall thick part of the exhaust cylinder 1 vertically. The exhaust cylinder is made of copper or aluminum having large heat conductivity, a periphery of which is covered with a metal with low emissivity, and an inner periphery of which is applied with a paint with high emissivity; and heat received by the exhaust cylinder is prevented from being radiated to the outside of the exhaust cylinder. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a cooling device for an electronic device for cooling a heat generating part such as a CPU disposed in the electronic device.

  An electronic element such as a CPU mounted on a conventional electronic device such as a personal computer has been dramatically improved in performance by increasing the operating clock speed and integration. However, the higher the performance of electronic devices, the greater the amount of heat generated during operation.

  In general, in an electronic device such as a desktop personal computer housed in a casing, the outer dimensions can be made relatively large. Therefore, as a cooling means, a method of cooling by combining a heat sink and an air cooling fan is adopted.

  However, in the case of thin and high-density mounting such as a notebook computer, the vertical thickness is several tens of millimeters or less, so it is a small size that uses heat pipes instead of conventional cooling means. Cooling means capable of efficient cooling have been proposed (see, for example, Patent Document 1).

  In this personal computer cooling device disclosed in Japanese Patent Laid-Open No. 2000-277963, one end of at least two heat pipes is disposed on the CPU so that heat can be transferred and the other end of the second heat pipe is provided. A heat sink provided in the personal computer with the other end portion of the first heat pipe being isolated from the hinge mechanism and arranged to be able to transfer heat to a hinge mechanism provided in the vicinity of the connecting portion between the personal computer body and the display The heat generated from the CPU is transferred to a heat sink via a heat pipe and released to the outside of the computer.

  However, since all of the cooling means are configured such that the heat pipe heat dissipating part is connected to the fan disposed inside the PC housing, heat is accumulated inside the PC, so the temperature of other parts There are problems that adversely affect the environment.

Therefore, heat generated from heat-generating parts such as CPUs is transported outside the PC case with a heat pipe, and the heat-radiating part of the heat pipe insulated from the inside of the PC is efficiently radiated to the outside of the PC case. A cooling device for a personal computer that prevents heat from being accumulated in the personal computer casing is disclosed. (For example, refer to Patent Document 2).
Japanese Unexamined Patent Publication No. 2000-277963 (FIG. 1, page 1) Japanese Patent Laying-Open No. 2003-209385 (FIG. 1, page 1)

  However, although the cooling means disclosed in Japanese Patent Application Laid-Open No. 2003-209385 has a structure in which heat is not stored in the housing, a forced air cooling fan outside the personal computer housing fails, and a heat generating portion such as an electronic element is predetermined. Therefore, it is necessary to stop the operation of the personal computer in order to avoid damage to the electronic elements.

  In Japanese Patent Application Laid-Open No. 2003-209385, when a personal computer or the like is a standing type, an opening is provided on the upper surface of the cylindrical portion, so that an air cooling fan is unnecessary in the case of a CPU with a small amount of heat generation. Although described, there is no substitute for the heat dissipation part fin-coupled to the heat pipe, and an efficient chimney effect cannot be obtained.

  The present invention has been made to solve such a conventional problem, and in a cooling device for an electronic device having a heat generating part such as an electronic element, an operation part such as an air cooling fan is not used. An object of the present invention is to provide a cooling device for an electronic device capable of efficiently transferring heat to the outside of the housing of the electronic device.

  In order to achieve the above object, a cooling device for an electronic device according to claim 1 of the present invention includes a heat receiving unit that receives heat in contact with the high heat generating part in an electronic device having a high heat generating part built in the housing, One end is in contact with the heat receiving portion to receive heat, and the other heat radiating portion is transported to the heat pipe, and heat transferred in contact with the heat radiating portion of the heat pipe is transferred to the outside of the electronic device. An electronic device cooling apparatus comprising a heat radiating means for radiating heat, wherein the heat radiating means is an exhaust pipe having a cavity arranged in a vertical direction, and the heat radiating portion of one or a plurality of the heat pipes is connected to the exhaust pipe. It is characterized by having an outer wall.

  In order to achieve the above object, in the electronic apparatus cooling apparatus according to claim 2 of the present invention, the exhaust tube is made of copper or aluminum having a high thermal conductivity, and its outer periphery is covered with a metal having a low emissivity. A high emissivity paint is applied to the inner circumference so that heat received by the exhaust pipe is not radiated to the outside of the exhaust pipe.

  In order to achieve the above object, according to a third aspect of the present invention, there is provided a cooling device for an electronic device, wherein the casing is provided with an air inlet provided with a dustproof filter on a bottom outer wall thereof.

  To achieve the above object, the electronic device cooling apparatus according to claim 4 according to the present invention is characterized in that one end of the heat pipe is connected by a heat connector. Cooling system.

  As described above, according to the present invention, the heat of the heat generating part is transported by the heat pipe, and the heat pipe heat radiating part is inserted into the outer peripheral thick part of the bottom part of the exhaust pipe fixed in the vertical direction. The heat pipe heat is transferred to the exhaust pipe to dissipate heat from the inner surface of the exhaust pipe side wall into the exhaust pipe space, and the air temperature inside the exhaust pipe is raised to a high temperature difference from the outside of the housing. Because the exhaust air flow is strengthened and the air in the exhaust stack is naturally blown in the vertical direction to exhaust heat, operating parts such as fans are used in cooling devices for electronic devices that have heating elements such as electronic elements. Therefore, it is possible to provide a cooling device for an electronic device capable of efficiently transporting heat outside the electronic device casing.

  Embodiments of the present invention will be described below with reference to the drawings.

  Embodiment 1 of the present invention will be described below with reference to FIGS. FIG. 1 is an external perspective view of a cooling device for an electronic device having a high heat generating portion such as a CPU, for example.

  The configuration of the cooling apparatus for an electronic device having a plurality of heat generating units 3 on a substrate 4 in a housing 5 includes a heat pipe 2 that receives heat from the heat generating unit 3 and transports the heat received by the exhaust tube 1, and a heat The exhaust pipe 1 is configured to exhaust the heat transported by the pipe 2 to the outside of the housing 5.

  Next, the detailed structure of each part will be described. The heat generating unit 3 is a high heat generating electronic element that operates at a high speed, such as a CPU. Normally, the heat generating unit 3 is provided at a plurality of locations on a substrate 4 arranged in the horizontal direction of the housing 5.

  The heat generating portion 3 is provided with a heat sink 3a having a high thermal conductivity such as a ceramic substrate or an aluminum substrate that receives heat from the heat generating portion 3, and the heat sink 3a and the heat receiving portion of the heat pipe 2 are in contact with each other as heat. I have received it.

  The heat pipe 2 includes a heat receiving portion (also referred to as an evaporation portion) at one end, a heat radiating portion (also referred to as a condensing portion) at the other end, and a heat insulating portion that transports heat between the heat receiving portion and the heat radiating portion. Depending on the amount of heat generated, the one that can secure a predetermined heat transport amount is selected in advance.

  Then, as shown in FIG. 2, the heat radiating portions 2 a of the plurality of heat pipes 2 extend from the bottom portion of the exhaust tube 1 provided in the vertical direction with respect to the substrate 4 to the attachment holes in the outer peripheral thick portion of the exhaust tube 1. Inserted or inserted.

  Next, the exhaust pipe 1 will be described with reference to FIG. The exhaust tube 1 is formed of a thick copper pipe or the like, a predetermined long hole is made in advance in the outer peripheral portion, and the heat radiating portion of the heat pipe 2 is inserted.

  In order to reduce the thermal resistance of the contact portion, silicon grease having a high thermal conductivity is applied and inserted. A metal 1a having a low emissivity such as a polished aluminum sheet or aluminum foil is wound around the outer periphery of the exhaust tube 1, and a paint 1b having a high emissivity such as a black paint is applied to the inner wall thereof. The

  The heat of the exhaust pipe 1 configured as described above and transferred from the heat pipe 2 is not radiated to the outside, but is radiated from the inner wall of the exhaust pipe 1 to the space inside the cavity, and the air temperature in this space is reduced. Increase.

  Further, between the exhaust tube 1 and the substrate 4, a predetermined space gap is secured so that air from the lower portion can easily flow, and the exhaust tube 1 is fixed to the base 4 or the housing 5.

  In addition, an air inlet 5a provided with a dustproof filter 5a is provided at the bottom of the housing 5 so that the inside of the housing 5 is not contaminated when air is taken in.

  The heat transport operation of the electronic apparatus cooling apparatus configured as described above will be described with reference to FIG. 1 again.

  The heat of the heat generating part 3 is received by the heat receiving part of the heat pipe 2 and transported to the heat radiating part 2 a of the heat pipe in the exhaust stack 1. The heat transported from each heat pipe is transferred to the exhaust pipe 1 and collected.

  The collected heat of the exhaust tube 1 is radiated from the side surface of the inner wall to the hollow space. When the temperature of this space increases, as indicated by the broken line arrow in FIG.

  Therefore, an upward air flow is generated in the exhaust cylinder due to the temperature difference between the air sucked from the intake port 5a at the bottom of the casing 5 and the air in the casing 5 and the high-temperature air in the exhaust cylinder 1, and this air flow causes The heat in the exhaust tube 1 is discharged.

  If intake air is taken into the intake port 5a through a dustproof filter, the effect of reducing contamination of other electronic components in the housing 5 with dust can be obtained.

  Further, since the cooling capacity of the exhaust tube 1 is determined by the surface area of the inner wall side surface and the temperature difference between the outside air and the exhaust tube 1, it can be mounted from the heat of the heat generating portion 3 and the required cooling capacity. The shape and the number of the exhaust cylinders 5 are determined in advance.

  According to such natural convection of air, not only the problem of failure of the air cooling fan does not occur, but also noise does not occur, and a cooling capacity corresponding to the heat generation amount can be obtained.

  A second embodiment of the present invention will be described below with reference to FIG. 4 that are the same as those of the electronic apparatus cooling apparatus according to the first embodiment illustrated in FIGS. 1 to 3 are denoted by the same reference numerals, and description thereof is omitted.

  The difference between the second embodiment and the first embodiment is that, in the first embodiment, the single substrate 4 is mounted in the housing 5 in the horizontal direction. However, in the second embodiment, the horizontal and vertical directions are used. The heat of the heat generating portion from the two bases 4 attached in the direction is collected directly or relayed by the heat pipe coupler 2b to the exhaust pipe 2 by the heat pipe 2.

  In other words, the heat pipe 2 and its heat pipe coupler 2b can transport heat from the heat generating portion located at different positions to the bottom mounting position of the exhaust tube 1 and exhaust the heat. However, it is possible to collect heat from the heat generating portions provided at different positions in a complicated shape and discharge the heat outside the housing 5.

  The present invention is not limited to the above-described embodiments, and the shape and number of the exhaust pipes 1 are not limited as long as a predetermined cooling capacity can be obtained depending on the amount of exhaust heat and the shape of the electronic device. It is possible to carry out various modifications by changing the shape of the heat pipe and the shape of the exhaust pipe without departing from the scope of the present invention.

  Needless to say, in the case of an electronic device that does not require an air inlet, the exhaust tube can be provided outside the housing.

1 is an external view of a cooling device for an electronic device according to a first embodiment of the present invention. Sectional drawing of the junction part of the exhaust pipe and heat pipe of Example 1 of this invention. The detailed structure figure of the exhaust pipe of Example 1 of this invention. The external view of the cooling device of the electronic device of Example 2 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Exhaust cylinder 1a Reflector 1b Black paint 2 Heat pipe 2a Heat radiating part 2b Heat pipe coupler 3 Heat generating part 3a Heat sink 4 Substrate 5 Case 5a Inlet

Claims (4)

In an electronic device incorporating a high heat generation part inside a housing, a heat receiving part that receives heat by contacting the high heat generation part, and heat received by the other heat dissipation part by receiving one end of the heat contact part by contacting the heat receiving part A cooling device for an electronic device comprising: a heat pipe for transporting heat; and a heat radiation means for radiating heat transported in contact with a heat radiation portion of the heat pipe to the outside of the electronic device,
The cooling device for an electronic device, wherein the heat radiating means is an exhaust pipe having a cavity arranged in a vertical direction, and a heat radiating portion of one or a plurality of the heat pipes is used as an outer wall of the exhaust pipe.   The exhaust pipe is made of copper or aluminum having a high thermal conductivity, the outer periphery thereof is covered with a low emissivity metal, the inner periphery is coated with a high emissivity paint, and the heat received by the exhaust cylinder is the 2. The electronic apparatus cooling apparatus according to claim 1, wherein the electronic apparatus is not radiated outside the exhaust tube.   2. The electronic apparatus cooling apparatus according to claim 1, wherein the casing is provided with an air inlet provided with a dustproof filter on a bottom outer wall thereof.   The electronic apparatus cooling device according to claim 1, wherein one end of the heat pipe is connected by a heat connector.

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