JPH1187961A - Heat-dissipating structure of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the heat sink property of an electronic device, which uses a high heating semiconductor element. SOLUTION: An air flow passage 20 is formed in the interior of a case body 1 and an air flow is formed in this air flow passage 20 by a fan 6. Heat, which is generated from a heating component mounted on a substrate 2, is conducted to a wall member 21, in which the air flow passage 20 is sectioned, through heat transfer members 3, such as heat pipes and is exhausted to the outside of the case body 10 using the air, which is made to flow in the air flow passage 20, as a medium.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure for electronic equipment such as a notebook personal computer.

[0002]

2. Description of the Related Art FIG. 16 shows a conventional notebook personal computer (hereinafter abbreviated as "notebook personal computer").
The internal structure of is shown. A board 2 on which a semiconductor element such as an MPU is mounted
HDD 90, PC card slot 91, battery 92
Are stored at high density. Among these components, an element having a large heat value such as an MPU (hereinafter, referred to as a “heat generating component”) is mounted on the substrate 2.
In order to cool such a heat-generating component, an air inlet and an air outlet are formed in the housing, and a fan 6 provided near the air outlet is used to move from the air inlet to the air outlet. 2. Description of the Related Art Conventionally, a flow of air is formed in a housing, and a heat-generating component is cooled using the flow of air in the housing.

[0003]

However, in recent years, due to an increase in the amount of heat generated due to the high performance of the MPU, which is a heat-generating component, there has been a case where a sufficiently satisfactory cooling performance cannot always be obtained by the conventional method. I have.

That is, as shown in FIG. 16, for example, when a fan is arranged in the vicinity of an air outlet, a negative pressure is formed in the housing by the fan, so that an intentionally provided air intake is provided. Air flows into the housing from a part other than the entrance, for example, a gap around the slot or the connector. When there are a large number of air inlets, the width of the air basin is widened, and as a result, the air velocity inside the housing is reduced. This makes it difficult to effectively cool the heat-generating components. Furthermore, if the basin width becomes wide, it becomes difficult to accurately grasp the flow of air inside the housing.
This also makes it difficult to design the heat dissipation of the device.

On the other hand, there is a system in which a fan is arranged near an air inlet to blow air into a housing. However, this system cannot effectively cool components other than the components near the fan. When components are arranged in a housing at high density, the installation position of the fan is actually limited to the periphery of the housing. However, if the heat-generating component is a CPU, it is necessary to mount the fan on the board. For convenience, it is not practical to arrange the CPU around the housing.

Further, in the conventional structure, when foreign matter such as dust or office clips enters from the air inlet or the air outlet, it may spread to any part of the substrate, and particularly the conductive foreign matter. In the case of the intrusion, the device may be broken due to a short circuit.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heat radiation structure for an electronic device, which has a high heat radiation efficiency and can easily take measures against intrusion of foreign matter into a housing. It is in.

[0008]

In order to achieve the above object, the present invention relates to a heat dissipation structure for an electronic device for discharging heat generated by a heat generating component disposed inside a housing to the outside of the housing. A wall member that partitions an air flow path inside the housing, and a fan that generates a flow of air in the air flow path, and heat generated by the heat-generating component flows through the air flow path. It is characterized in that air is discharged to the outside of the housing as a medium.

According to the present invention, the flow rate and the flow velocity of the cooling air flowing in the air passage can be made sufficiently large, so that the heat-generating components can be efficiently cooled.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. In the following description of the embodiments, a so-called notebook computer will be described as an example of an electronic apparatus to which the present invention is applied. Further, the application of the present invention is not limited to the embodiments described below, but can be widely applied to electronic devices in which components are arranged at high density, particularly to portable information devices.

[First Embodiment] First, FIGS.
The first embodiment will be described with reference to FIG.

FIG. 1 shows a notebook computer comprising a main unit A and a display unit B which are connected to each other by a hinge mechanism (not shown) so as to be relatively rotatable. In FIG. 1, the outline of the casing 10 of the main body A and the outline of the display B are indicated by two-dot chain lines.

As shown in FIG. 1, a casing 10 of a main body A includes a substrate 2 on which a component 1 having a large amount of heat generation (hereinafter referred to as a "heat generating component") such as an MPU (microprocessor unit) is mounted. , HDD 90, PC card slot 91, battery 92, and the like.

As shown in FIGS. 1 and 2, an end (left end in FIG. 1) of the main body A in the housing 10 is formed along the side wall 12 of the housing 10 so as to face the front of the housing 10. An air passage 20 extending from the wall 15 toward the back wall 17 is formed. As shown in FIG. 3, the air flow path 20 includes a plurality of wall members, that is, a top wall member 21 and a bottom wall member 2.
2, and a pair of side wall members 23 and 24.

In other words, the bottom wall member 22 and the side wall members 23, 24 form a groove-like structure whose upper part is opened, and the upper part of the groove-like structure is connected to the top wall. By covering with the member 21, the air flow path 2
Thus, a duct-like structure having 0 is formed.

Of these wall members 21 to 24, the bottom wall member 22 and the side wall members 23 and 24 are part of the casing 10 made of ABS resin or the like and formed by injection molding. That is, as shown particularly in FIG. 3, the side wall member 23 is formed by the side wall 13 of the housing 10, and the bottom wall member 22 is formed by the bottom wall 12 of the housing 10. The side wall member 24 is provided on the bottom wall 12 of the housing 10.
And is formed by a rib-like member 14 protruding in the vertical direction.

As shown in FIG. 2, both ends in the longitudinal direction of the duct-like structure constituted by the wall members 21 to 24 are open, and one end (right side in FIG. 2) is provided with a cooling air intake port 20a (air flow path). The other end (left side in FIG. 2) is an exhaust port 20b (exhaust side open end of the air flow path 20).

As shown in FIG. 2, an air inlet 16 for introducing cooling air is provided in the front wall 15 of the housing 10 at a position facing the air inlet 20a of the duct-like structure.
An air outlet 18 for discharging cooling air out of the housing 10 is provided at a position on the rear wall 17 of the housing 10 opposite to the air outlet 20b of the duct-like structure.
Is provided. The air inlet 16 and the air outlet 18 have a narrow slit shape to prevent foreign matter from entering.

At a position corresponding to the end of the duct-like structure on the side of the exhaust port 20b, the housing 10 of the main body part A is convex upward, and this part is a convex part for mounting the display part B. It is 19. The vertical width of the internal space of the main body portion A at the convex portion 19 is increased as shown in FIG. 2, and the vertical width of the air flow path 20 is also increased accordingly.

At the end of the duct-like structure located in the convex portion 19 on the side of the exhaust port 20b, a fan 6 having a horizontal rotating shaft is attached. By arranging the fan 6 in the convex portion 19 for attaching the display portion B in this manner, a fan having a diameter larger than the thickness of the main portion of the main portion A (meaning the main portion A other than the convex portion 19) can be obtained. Can be used, thereby increasing the flow rate and flow rate of the cooling air introduced into the air flow path 20,
Further, the thickness of the main part of the main body A can be reduced.

On the exhaust port 20b side, a wall member 21 (including a wall member that houses the fan 6 and that forms a convex portion 21a that forms a part of the top wall member 21) and a wall member Packing 4 between the housing 24 and the housing 10
0, and the packing 40 allows the exhaust port 2
The high temperature air discharged from Ob is prevented from flowing back into the housing 10.

The wall members other than the above-mentioned wall members 22 to 24, that is, the top wall member 21 are provided with the other wall members 22 to 2.
4 is formed separately from a magnesium alloy.
As shown in FIG. 3, the top wall member 21
And a plurality of fins 25 projecting inward and extending along the direction of air flow (in the horizontal direction in FIG. 2). Note that the material of the top wall member 21 is not limited to the magnesium alloy, and another metal material or a ceramic material having good thermal conductivity such as alumina or aluminum nitride may be used.

As shown in FIG. 3, a groove 27 is formed on the upper surface side of the top wall member 21, and the heat pipe 3 (heat transfer member) is mounted in the groove 27. When the heat pipe 3 is straight, the heat pipe 3 is press-fitted into the groove 27. On the other hand, when the heat pipe 3 has a low dimensional accuracy, such as a curved part, the heat pipe 3 The width is made larger than the width of the heat pipe 3 so that a margin is provided.
7).

The connection between the top wall member 21 and the heat pipe 3 is not limited to the above-described method. For example, as shown in FIG. 4, the upper surface of the top wall member 21 is formed in a flat shape. At the same time, a heat pipe 3 is placed on the upper surface, and a thin metal plate 28 is further covered with the heat conductive adhesive 2.
9, the top wall member 21, the heat pipe 3, and the thin metal plate 28 may be bonded to each other. In this case, as shown in FIG. 4, the gap between the top wall member 21, the heat pipe 3 and the metal sheet 28 is completely filled with the heat conductive adhesive 29. Further, as shown in FIG. 3, after the heat pipe 3 is mounted in the groove 27, the metal sheet 2 is further attached to the upper surface of the top wall member 21 and the heat pipe 3.
8 may be covered.

As described above, the other end of the heat pipe 3 whose one end is thermally and mechanically connected to the top wall member 21 constituting the duct-like structure is shown in FIGS. As described above, the heat transfer block 5 made of a good heat conductive material such as metal, which is thermally and mechanically connected to the heat generating component 1.
Is inserted, preferably press-fitted, into the hole 6 formed in the hole.

A heat conductive paste (heat transfer grease) or a heat conductive adhesive is applied to a contact surface between the heat pipe 3 and the top wall member 21 or the heat transfer block 2 to assemble the heat pipe 3. Heat transfer performance is improved.

Next, the operation of this embodiment having the above configuration will be described.

When the fan 6 rotates, the housing 1 of the main body A
Outside air (cooling air) is introduced into the housing 10 from an air intake 16 formed on the front surface of the housing 10. The introduced cooling air is introduced into the air flow path 20 from the intake port 20a,
After passing through the air flow path 20, the air flow path 2
It is exhausted outside zero. The air that has exited the exhaust port 20b is
The air is discharged to the outside of the housing 10 through the air outlet 18 of the air conditioner. As described above, the air flow from the intake port 20a to the exhaust port 20b is formed in the air flow path 20, and the cooling air flow corresponding to the rotation speed of the fan 6 and the cross-sectional shape of the air flow path 20 is formed. It will be formed in the air flow path 20.

Since a slight gap is provided between the air inlet 20a and the air inlet 16 of the housing 10,
Due to the negative pressure generated in the air flow path 20 by rotating the fan 6, a small amount of air flows into the air flow path 20 from another internal space of the housing 10 via the air inlet 20 a. The flow of air in the housing 10 formed in this manner can be used for cooling other components having a relatively small heat value.

Further, as described above, the space in the housing 10 between the exhaust port 20b and the air exhaust port 18 is closed by the packing 40 in the above embodiment (see FIG. 2).
The high-temperature air discharged from the exhaust port 20b is
Although the backflow is prevented, the gap between the exhaust port 20b and the air exhaust port 18 is sufficiently small,
If the temperature rise of the air exhausted from 0b is small,
The packing may be omitted as in the embodiment shown in FIG.

The heat generated from the heat-generating component 1 disposed on the substrate 2 is transmitted to the fin portion 25 through the heat transfer block 2, the heat pipe 3 and the top wall member 21 in order, and cooled in the air flow path 20. Released into the air.

As described above, according to the present embodiment, the air flow path 20 which is substantially isolated from the other internal space of the housing 10 by the wall members 21 to 24, in particular, the wall members 21 and 24 is formed. The cooling air is forced to flow through the air passage 20 by the fan 6. For this reason,
In the air passage 20, a flow of cooling air having a sufficient flow rate and flow velocity is formed. In addition, since a component having a particularly large amount of heat is selectively thermally connected to the air in the air flow path 20 via the heat transfer member 3, the high heat-generating component is efficiently cooled. be able to.

Further, since the air flow path 20 is substantially isolated from the other internal space of the housing 10, it is necessary to determine the cross-sectional shape of the air flow path 20 appropriately and use the fan 6 having an appropriate blowing performance. Accordingly, the flow rate and the flow rate of the cooling air flowing in the air flow path 20 can be set to desired values. This makes it easy to calculate the amount of heat radiation,
The heat radiation design of the device can be easily performed.

Further, since the air flow path 20 and the heat generating component 1 are connected via the heat transfer member 3, the positional relationship between the air flow path 20 and the heat generating component 1 in the housing is arbitrary. Can be set. Therefore, the heat-generating components can be efficiently cooled without being restricted by the arrangement of the components in the housing 10.

In the above-described embodiment (see FIG. 2), a gap is provided between the inlet 20a of the duct-like structure and the air inlet 16 of the housing 10, but the present invention is not limited to this. Instead, the space between the wall members 21 and 24 constituting the duct-like structure and the housing 10 is sealed by packing in the same manner as on the exhaust port 20b side, and the internal space of the duct-like structure, that is, the air flow path 20 is formed. You may make it completely isolate | separated from the other internal space in the housing | casing 10. In this way, it is possible to completely prevent foreign matter from entering the housing 10 from the air intake 16.

As in the above embodiment (see FIG. 2), the suction port 20a and the exhaust port 20b of the duct-like structure are provided.
Even if a gap is provided between the air inlet 16 and the air outlet 18 of the housing 10, dust floating in the air will flow into the air flow path 20 almost certainly. Intrusion of dust into the substrate 2 is effectively prevented.
Further, even if foreign matter that does not float in the air flows into the housing 10, the probability of intrusion into the substrate 2 can be extremely reduced.

In the above embodiment, the fan 6
The direction of the axis (see the dashed line in FIG. 2) coincides with the direction of the axis of the air flow path 20 (longitudinal direction), but is not limited thereto.

For example, as shown in FIG. 7A (in FIG. 7A and FIG. 7B, the illustration of the heat pipe 3 is omitted), the convex portion 19 for attaching the display portion B of the main body portion A is provided.
Of the hinge mechanism for connecting the main body part A and the display part B so as to be rotatable relative to each other.
9 (right side in FIG. 7 (a)), an air outlet 18 is provided on the upper surface of the mounting projection 19 and the axis of the fan 6 is oriented vertically. The fan 6 may be mounted, and the air in the air flow path 20 may be discharged from the air discharge port 18a provided on the upper surface of the mounting projection 19. In the case of such a configuration, since the vertical width of the air flow path 20, that is, the duct-like structure, can be reduced, the heat radiation structure can be used for a thinner device. The air outlet 18 is always open to the outside regardless of the opening and closing of the display unit B.
It is possible to discharge the cooling air from the air more smoothly.

Further, as shown in FIG.
May be arranged such that the axis of the fan 6 is inclined with respect to the axis of the air flow path 20 (facing in the horizontal direction). Also in this case, the thickness of the entire duct-shaped structure in the vertical direction can be reduced.

Further, the air passage 20 may be formed using a member completely different from the case 10. That is, for example,
As shown in FIG. 6, a pipe material (duct-like structure) in which a plurality of cavities are formed by extrusion molding using a metal material
May be formed and arranged in the housing 10, and the hollow of the pipe material may be used as the air flow path 20.

In the above embodiment, the air flow path 20 is provided linearly at the end of the housing 10 (the left end in FIG. 1), but the form and arrangement of the air flow path 20 are not limited to this. However, the air flow path 20 may be provided in another part of the housing 10 or the air flow path 20 may be provided by bending. Further, the duct-like structure may have one exhaust port and a plurality of intake ports, and the air flow paths extending from each intake port toward the exhaust port may be joined in the middle.

A part of the wall member defining the air passage 20 may be constituted by a component of an electronic device housed in a housing, for example, a casing of a hard disk drive (HDD) device.

As shown in FIG. 8, the top wall member 21
Is formed integrally with the housing 10, the heat pipe 3 is made to penetrate the wall member and protrude into the air flow path 20, and the heat pipe 3 emits heat directly to the cooling air in the air flow path 20. You may.

[Second Embodiment] Next, a second embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS. The second embodiment is different from the first embodiment in that a part of the wall member is formed by the substrate on which the heat-generating component is mounted, and the heat-generating component is arranged inside the air passage. Mainly different, the other parts are substantially the same as those of the first embodiment. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description of the corresponding parts will not be repeated.

As shown in FIG. 9, a part of the top wall member 21 that defines the air flow path is cut out, and
And the board | substrate 2 is inserted as shown in FIG.
That is, in the present embodiment, a part of the top wall member 21 is constituted by the substrate 2.

The top wall member 21 other than the notch portion is shown in FIG.
As shown in FIG. 1, it is composed of an appropriate plate-like structure 21a. The plate-like structure constituting the top wall member 21 may be prepared as a dedicated member, or alternatively, a metal or resin frame or a shield plate constituting the electronic device or a part thereof may be used. Is also good. The board 2 and the plate-like structure 21a are fixed to the housing 10 with screws 35.

Then, as shown in FIG.
Inside, a heat-generating component (semiconductor component) 1 mounted on the lower surface of the substrate 2 is located. In FIG. 10, the member denoted by reference numeral 1a is a semiconductor element that generates a relatively small amount of heat.

In order to improve the heat radiation efficiency, a heat sink 30 is attached to the heat generating component 1 with a heat conductive adhesive. The heat sink 30 has a plurality of fins 31 projecting downward in the air flow path 20. Have. These fins 31 extend in the transverse direction of the air passage 20 (FIG. 1).
0 left and right directions) and each fin 3
One end is provided so as to be close to the bottom wall member 22. Thereby, the cooling air passing through the air passage 20 efficiently passes between the fins 31. It is not always necessary to provide the heat sink 30 (see FIG. 12), and whether or not to provide the heat sink 30 is appropriately determined in consideration of the heat generation characteristics of the heat generating component 1, the mounting strength of the component 1 to the substrate 2, and the like. Just do it.

Next, the operation of this embodiment having the above configuration will be described. Also in this embodiment, the flow of cooling air is formed in the air flow path 20 by operating the fan 6, as in the first embodiment described above. In the present embodiment, the cooling air flowing in the air flow path 20 directly removes heat from the heat generating component 1 arranged in the air flow channel 20 and the heat sink 30 attached to the heat generating component 1. For this reason, the cooling efficiency can be further improved as compared with the first embodiment.

In the above-described embodiment, the substrate 2 is a single continuous substrate, but the present invention is not limited to this. As shown in FIG. Board 2b to which a semiconductor component having a larger size is attached, and first board 2a to which other components 1a are attached.
Alternatively, the two boards may be connected by the connector 2c so that a step is formed in the vertical direction, and a part of the top wall member 21 may be constituted only by the second board 2b. By doing so, the vertical width of the air flow path 20 is increased without increasing the space between the first substrate 2a having a large area and the bottom wall 12 of the housing 10, and the tall fins 31 are used. be able to. Therefore, the body A can be made thinner.

In the above-described embodiment, the heat sink 30 is bonded to the heat-generating component 1 with the heat-conductive adhesive. However, the bonding between the heat-generating component 1 and the heat sink 30 can be performed in the following manner without bonding. Thermal connection may be ensured.

That is, as shown in FIG. 14, the fins 31 at both ends of the heat sink 30 are made longer than the other fins 31, and the bottom wall 12 of the housing 10, that is, the bottom wall member 22 is formed in the longitudinal direction of the air flow path 20. A pair of extending grooves 22
a is formed. Then, a leaf spring 34 (which may be an elastic sheet of rubber or the like) is inserted between the central fin 31 and the bottom wall member 22. Thereafter, when the substrate 2a is fixed to the duct side walls 23 and 24 with the screws 35, the heat sink 30 is pressed against the heat generating component 1 by the plate spring 34, and the vertical position of the heat sink 30 is determined.
Further, since the fins 31 at both ends are accommodated in the grooves 22a, respectively, the movement of the heat sink 30 in the left-right direction in FIG. 14 is substantially restricted. In this case, the heat transfer efficiency is improved by interposing a heat transfer sheet or heat transfer grease on the contact surface between the heat generating component 1 and the heat sink 30.

In the above embodiment, a part of the wall member is constituted by the casing 10 over the entire area in the longitudinal direction of the air flow path 20. However, the present invention is not limited to this. Alternatively, there may be a portion where the air passage 20 is partitioned.

That is, for example, as shown in FIG.
Around the heat sink 30, the heat-generating component 1 and the heat sink 3 are formed integrally with the heat sink 30.
And a U-shaped covering member 32 surrounding the substrate 2 is provided.
And a space surrounded by the cover member 32 may form a part of the air flow path 20 in the longitudinal direction.

In this case, the space surrounded by the substrate 2 and the cover member 32 is formed by the wall members 22 and 2 integrally formed with the housing.
A series of air passages 20 are configured by being connected to the air passages defined by the plates 3 and 24 and the plate-like structure 21a.

In the embodiment shown in FIG. 15, since the heat sink 30 is protected by being surrounded by the U-shaped cover member 32, the tip of the fin 32 of the heat sink 30 may be changed when assembling the device. It is possible to prevent the object from being distorted or damaged by hitting the object.

[0057]

As described above, according to the present invention,
The heat radiation of a device using a semiconductor element with high heat generation can be improved. Further, it is possible to easily take measures against an accident such as a short circuit due to intrusion of foreign matter such as dust into the housing.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention,
FIG. 1 is a perspective view showing the internal structure of a notebook personal computer having a heat dissipation structure according to the present invention.

FIG. 2 is a diagram showing a II-II cross section in FIG.

FIG. 3 is a view showing a cross section taken along the line III-III in FIG. 2;

FIG. 4 is a view showing another connection method between the top wall member and the heat transfer member.

FIG. 5 is a view showing a VV cross section in FIG. 1, showing a method of connecting a heat transfer member and a heat generating component.

FIG. 6 is a diagram showing another structure of the air passage.

FIG. 7 is a view showing another example of arrangement of fans.

FIG. 8 is a view showing a method of releasing heat directly into an air passage by a heat transfer member.

FIG. 9 is a diagram showing a second embodiment of the present invention.

FIG. 10 is a view showing a XX section in FIG. 9;

FIG. 11 is a view showing a XI-XI cross section in FIG. 9;

FIG. 12 is a diagram showing a case where a heat sink is not provided on a heat generating component.

FIG. 13 illustrates a case where a substrate is divided.

FIG. 14 is a diagram showing another mounting structure of the heat sink.

FIG. 15 is a diagram showing another configuration of the air passage.

FIG. 16 is a diagram showing a heat dissipation structure of a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat generation component 2 Substrate 3 Heat transfer member (heat pipe) 6 Fan 10 Housing 20 Air passage 21-24 Wall member

Continued on the front page (72) Inventor Hiroshi Ogata 2-9-9 Suehirocho, Ome-shi, Tokyo Inside the Toshiba Ome Plant (72) Inventor Sadao Makita 2-9-9 Suehirocho, Ome-shi, Tokyo Stock Company Inside the Toshiba Ome Plant (72) Inventor Kentaro Tomioka 2-9-9 Suehirocho, Ome City, Tokyo Inside the Toshiba Ome Plant

Claims (15)

[Claims] 1. A heat dissipating structure for an electronic device for discharging heat generated by a heat generating component disposed inside a housing to the outside of the housing, wherein a wall member defining an air flow path inside the housing. And a fan that generates a flow of air in the air flow path, wherein the heat generated by the heat-generating component is released to the outside of the housing using the air flowing through the air flow path as a medium. Heat dissipation structure of electronic equipment. 2. The heat-generating component further includes a heat-transfer member disposed outside the air flow path, for transmitting heat generated by the heat-generating component to air in the air flow path. The heat dissipation structure for an electronic device according to claim 1, wherein 3. The heat radiating structure for an electronic device according to claim 2, wherein said heat transfer member comprises a heat pipe. 4. A wall member for partitioning the air flow path, at least a part of which is formed of a good heat conductive material such as a metal or a ceramic having good heat conductivity. The heat transfer member is connected, and the heat generated by the heat generating component transmitted by the heat transfer member is transmitted to the air in the air flow path via a wall member made of the good heat conductive material. The heat dissipation structure for an electronic device according to claim 2, wherein 5. The electronic device according to claim 4, wherein the wall member formed of the good heat conductive material is provided with a fin protruding toward an air flow path. Heat dissipation structure of equipment. 6. The heat transfer member, wherein a portion of the heat transfer member remote from the heat-generating component is located downstream of a portion near the heat-generating component with respect to an air flow in the air flow path. The heat radiating structure for an electronic device according to claim 4, wherein the heat radiating structure is connected to a duct wall formed of the good heat conductive material. 7. The heat dissipation structure according to claim 2, wherein said heat transfer member is made of a conductive material and is electrically grounded. 8. The heat transfer member and the wall member formed of the good heat conductive material are made of a conductive material, and the wall member formed of the conductive material is electrically grounded. The heat dissipation structure for an electronic device according to claim 4. 9. At least a part of a wall member for partitioning the air flow path is constituted by a substrate on which the heat-generating component is mounted, and the heat-generating component is attached to the substrate so as to be located in the air flow path. 2. The device according to claim 1, wherein the device is mounted.
A heat dissipation structure for an electronic device according to item 1. 10. The heat dissipation structure for an electronic device according to claim 9, wherein at least a part of the wall member that partitions the air flow path is formed integrally with the housing. 11. The apparatus according to claim 9, wherein at least a part of the wall member defining the air flow path is formed by a plate-like structure such as a frame and a shield plate attached to the housing. Heat dissipation structure of the electronic device described. 12. The heat radiating structure for an electronic device according to claim 9, wherein a heat sink having fins is connected to said heat generating component. 13. An elastic member having elasticity in a vertical direction is provided between a wall member defining a bottom side of the air passage and a fin of the heat sink, and the heat sink defines a top of the air flow path. 13. The electronic device according to claim 12, wherein a substrate serving as a wall member is attached to another wall member that defines a side portion of the air flow path, whereby the substrate is pressed against the heat-generating component and is restrained in a vertical direction. Heat dissipation structure. 14. A board formed integrally with the heat sink and surrounding the heat-generating component and the heat sink is attached to the board, and a space surrounded by the board and the covering member defines a space for the air flow path. 13. The heat dissipation structure for an electronic device according to claim 12, wherein the heat dissipation structure forms a part. 15. The heat radiating structure for an electronic device according to claim 1, wherein a rotation axis of said fan is inclined with respect to a longitudinal axis of said duct.