JP4985390B2 - Heat dissipation device for electronic equipment - Google Patents

Description

  The present invention relates to a structure for radiating heat generated from an electronic component.

Some electronic components built in wireless communication devices, etc. generate heat, and a heat dissipation structure is used to radiate heat generated from the electronic components to prevent excessive temperature rise of the electronic components. There is.
As a heat dissipation structure for dissipating heat generated from this type of electronic component, a fin that conducts heat generated by the electronic component is provided in the chassis, and the outside air sucked by the fan is blown to the fin, so that the electronic component There has been proposed one that dissipates heat generated from the heat.
For example, in Patent Document 1 (Japanese Utility Model Laid-Open No. 5-15487), a fin with a heating element provided on the back surface is arranged inside the control box, and air sucked by a fan arranged outside the control box is blown onto the fin. A structure is disclosed.

Japanese Utility Model Publication No. 5-15487

  In the structure disclosed in Patent Document 1, it is preferable to improve the heat dissipation efficiency by blowing the sucked air on the fins as efficiently as possible. Intake air may flow, and the heat dissipation efficiency at the fins is not sufficient.

Therefore, the present invention has been made in view of such a problem, and an object of the present invention is to improve heat dissipation efficiency by efficiently blowing air taken in by a fan to fins.

The heat dissipating device for electronic equipment according to claim 1 of the present invention is:
In a heat dissipation device for an electronic device configured to dissipate heat generated by electronic components disposed in the chassis by passing the gas sucked by the intake fan through a ventilation path formed in the chassis,
The ventilation path is covered with a cover,
An air reservoir is provided at a position facing the blowout side of the intake fan of the chassis,
The air reservoir has a bottom surface and a side surface erected with respect to the bottom surface,
An opening is provided in a part of the side surface,
The gas sucked by the intake fan in a direction perpendicular to the flat surface portion of the cover is blown to the bottom surface of the air reservoir, and passes along the cover from an opening provided in a part of the side surface. By flowing into the ventilation path, the flow direction is forcibly changed from a direction orthogonal to the cover to a direction along the cover, and is configured to pass through the ventilation path. Yes.
In claim 2,
A partition member that separates and divides a heat dissipating region including the air reservoir and the ventilation path and a substrate disposing region where the substrate is disposed is formed in the chassis .
In claim 3,
In the chassis, an air discharge part is formed between the opening and the ventilation path,
The cross-sectional area of the ventilation path is smaller than the cross-sectional area of the air discharge part .

According to the heat dissipating device of the electronic device of claim 1 according to the present invention,
In a heat dissipation device for an electronic device configured to dissipate heat generated by electronic components disposed in the chassis by passing the gas sucked by the intake fan through a ventilation path formed in the chassis,
The ventilation path is covered with a cover,
An air reservoir is provided at a position facing the blowout side of the intake fan of the chassis,
The air reservoir has a bottom surface and a side surface erected with respect to the bottom surface,
An opening is provided in a part of the side surface,
The gas sucked by the intake fan in a direction perpendicular to the flat surface portion of the cover is blown to the bottom surface of the air reservoir, and passes along the cover from an opening provided in a part of the side surface. By flowing into the ventilation path, the direction of flow is forcibly changed from the direction perpendicular to the cover to the direction along the cover, so that the gas flow becomes turbulent rather than rectified. Since it passes through the ventilation path, it is possible to efficiently dissipate heat generated by the heat-generating electronic component by the air passing through the ventilation path.
In claim 2 ,
Since the partition member that separates and divides the heat dissipation area composed of the air reservoir and the ventilation path and the board arrangement area where the board is arranged is formed in the chassis,
Even if dust or the like is included in the sucked outside air, it does not adversely affect the substrate in the substrate arrangement region.
In claim 3 ,
In the chassis, an air discharge part is formed between the opening and the ventilation path,
Since the cross-sectional area of the ventilation path is formed smaller than the cross-sectional area of the air discharge part,
In the ventilation path, the flow velocity of air is accelerated, and heat can be radiated more efficiently.

Hereinafter, a heat dissipation device for an electronic device according to the present invention will be described in detail with reference to the drawings illustrating an embodiment thereof.
FIG. 1 is a perspective view of a wireless communication device provided with a heat dissipation device for an electronic device according to the present invention as viewed obliquely from the rear.
As shown in FIG. 1, the wireless communication device 10
A cover 13 that covers the upper surface of the housing 12 is provided, and a plurality of slits 11 that can be ventilated are formed in a part of the cover 13. An intake fan 3 is disposed below the slit 11 (inside the casing), and outside air sucked by the intake fan 3 passes through a ventilation portion B4 formed inside the casing, It is configured to exhaust air from an exhaust port 15 opened on the back surface. A plurality of external fins 12a projecting from the exhaust port 15 to the outside of the housing are provided in a projecting manner.
A chassis 14 made of, for example, aluminum die cast is built in the housing 12 of the wireless communication device 10.

FIG. 2 is a perspective view of the wireless communication apparatus 10 shown in FIG. 1 with the cover 13 removed and the intake fan 3 removed.
As shown in FIG. 2, the chassis 14 built in the housing 12 of the wireless communication device 10 according to the present invention is divided into a board placement area A where the board 5 is placed and a heat radiation area B by the partition member 6. It is separated.
Furthermore, the heat dissipation area B is configured by the intake fan installation part B1, the air reservoir part B2, the air discharge part B3, and the ventilation part B4.

As shown in the drawing, the chassis 14 built in the wireless communication device 10 is formed with the intake fan installation portion B1 for fixing the intake fan 3.
The intake fan installation portion B1 is a substantially rectangular space in plan view, and screw holes 32 for attaching the intake fan are formed at four corners thereof. The substantially rectangular air reservoir B2 is formed at the lower part of the intake fan installation part B1.
As shown in the drawing, the air reservoir B2 has a bottom surface and three side surfaces substantially upright on the bottom surface, and only one of the side surfaces is opened and continues to the air discharge portion B3.
With such a structure, the outside air sucked by the intake fan 3 changes its direction at the air reservoir B2 and flows only in the direction of the air outlet B3.

The air discharge part B3 is formed continuously from an opening B5 provided on one side surface of the air reservoir part B2, and air smoothly flows from the air discharge part B3 to the shallower ventilation part B4. It has a structure in which the bottom surface is inclined and gradually becomes shallow so as to flow.
The air discharge part B3 has a groove shape in which three sides are formed by an inclined bottom surface and side surfaces on both sides, and the top surface is covered by the cover 13 as shown in FIG. Therefore, all the air flowing in from the air reservoir B2 is configured to flow to the ventilation part B4 without leaking around the air discharge part B3.

The ventilation part B4 is
It has a groove shape in which three sides are formed by a bottom surface continuous from the air discharge part B3 side to the exhaust port side, and side surfaces formed by the internal fins 12b on both sides, and as shown in FIG. Since the top surface is covered by the cover 13, a cylindrical ventilation path 4 having only an entrance and an exit is formed in the ventilation part B4.
Therefore, all the air flowing in from the air discharge part B3 is exhausted to the outside of the housing from the exhaust port 15 opened on the back without leaking around the ventilation path 4.

In the ventilation part B4, a plurality of plate-like internal fins 12b are provided so as to protrude from the bottom surface of the chassis 14, and a plurality of cylindrical ventilation paths 4 are formed between the adjacent internal fins 12b. Each ventilation path 4 has a cylindrical structure in which a part of the chassis 14 is covered with a groove 13 having a substantially U-shaped cross-section and the cover 13 is covered to prevent air from leaking sideways. Is formed.
In this way, the air passing through the cylindrical ventilation path 4 flows along the surface of the internal fin 12b without leaking to the outside, and is configured to take heat away from the internal fin 12b and dissipate heat. .
The internal fins 12b and the external fins 12a are formed continuously.
The intake fan installation part B1, the air reservoir part B2, and the ventilation path 4 are formed by a part of the chassis 14, and specifically, are formed integrally with the chassis 14.
The air reservoir B2 is disposed on the blowing side of the intake fan 3, and the intake fan 3 is disposed so as to face the air reservoir B2.

FIG. 3 is a perspective view showing a state where the cover 13 of the wireless communication device 10 shown in FIG. 1 is removed, and a state where the intake fan 3 is attached to the state shown in FIG.
The intake fan 3 is provided with a rectangular case. The fixing screw 31 is passed through fixing screw holes provided at the four corners of the rectangular case, and the tip of the screw 31 is installed on the intake fan. It is fixed to the chassis 14 by being screwed into female screw holes formed at the four corners of the part B1.

4 is a cross-sectional view taken along line XX of FIG.
Below, with reference to sectional drawing shown in FIG. 4, the said intake fan installation part B1, the said air reservoir B2, the said air discharge part B3, and the said ventilation part B4 are further demonstrated.
A heat-generating electronic component 1 such as a power amplifier module is mounted on the back surface of the ventilation portion B4, and the heat-dissipating portion of the heat-generating electronic component 1 is connected to the chassis 14 with grease having excellent heat conductivity. Are arranged closely.

  As described above, the intake fan 3 is installed in the intake fan installation section B1. The intake side of the intake fan 3 faces the slit 11 formed in the cover 13, and the blowout side faces the air reservoir B <b> 2 that is recessed in the chassis 14. That is, since the intake fan 3 is arranged in parallel to the chassis 14 and faces the bottom surface of the air reservoir B2, the direction of the air flow sucked by the intake fan 3 arranged in this way As shown by an alternate long and short dash line with an arrow, it is configured to be orthogonal to the plane portion of the cover 13 in which the slit 11 is formed, and to be blown to the bottom surface of the air reservoir B2.

As shown in FIG. 3, the air reservoir portion B2 is formed with a bottom surface and three side surfaces standing substantially perpendicular to the bottom surface, and only the side surface in the direction of the air discharge portion B3. Is opened to form an opening B5 and a substantially box-shaped space is formed, and the outside air sucked by the intake fan 3 passes through the space of the air reservoir B2 in the direction of the air discharge part B3. It is configured to flow only to.
As described above, the intake fan 3 is fixed to the chassis 14 with screws.

The discharge part B3 is formed continuously to the opening part B5 on one side surface of the air reservoir part B2, and the bottom surface thereof is inclined as shown in FIG. The air is gradually shallower so that the air is smoothly guided to the shallower ventilation portion B4.
The discharge part B3 has a groove shape in which three sides are formed by an inclined bottom surface and side surfaces on both sides, and further, as shown in the figure, the top surface is covered by the cover 13, All the air that has flowed in from the air discharge part B3 is configured to flow only to the ventilation part B4.

As described above, the internal fins 12b are formed so as to protrude in the internal space of the ventilation path 4 of the ventilation part B4, and the internal fins 12b are continuously formed up to the external fins 12a. Since the air taken in from the outside by the intake fan 3 is configured to flow through the ventilation path 4 without leaking in the middle, the flow velocity of the ventilation path 4 is sufficiently high. Further, since the direction of the air flow is forcibly changed in the air reservoir B2, the air flow is not rectified but is turbulent and blown to the internal fins 12b.
In particular, since the height h2 of the ventilation part B4 is lower than the height h1 of the opening B5 and the width is substantially the same, the cross-sectional area of the ventilation part B4 is the opening B5 or the air. It becomes smaller than the cross-sectional area of the discharge part B3.
Therefore, the flow velocity of the air that has flowed through the opening B5 and then into the ventilation portion B4 through the air discharge portion B3 is accelerated, and is faster than the flow velocity when passing through the opening B5. Therefore, the heat dissipation capability in the ventilation part B4 is improved.

In the above configuration,
When the heat generating electronic component 1 generates heat, the generated heat is conducted from the heat radiating portion to the chassis 14 and further to the internal fins 12b formed integrally with the chassis 14.
Since the air sucked from the outside of the housing by the intake fan 3 flows through the ventilation path 4 where the internal fins 12b are projected, the heat of the internal fins 12b is radiated by the air flow.
Since the external fin 12a is further extended to the internal fin 12b, heat is radiated by the external fin 12a.
In this way, since the air taken from the outside is blown onto the surfaces of the internal fins 12b and the external fins 12a at a sufficient speed, a sufficient heat dissipation effect can be obtained.

Since a plurality of internal fins 12b are formed in the ventilation path 4, a sufficiently large heat radiation area can be obtained and a sufficient heat radiation effect can be obtained.
In addition, the air flow taken in from the outside is forced to change in the direction of flow in the air reservoir B2, so that it becomes a turbulent flow instead of rectification, and is blown to the internal fins 12b to sufficiently radiate heat. An effect is obtained.

And since the substrate bowl area | region A where the board | substrate is arrange | positioned, and the said thermal radiation area | region B are separated and divided by the said partition member 6, the air attracted | sucked by the said intake fan 3 arrange | positions in the said substrate bowl area | region A. There is no contact with the substrate, and even if dust or the like is contained in the sucked air, the substrate is not adversely affected.
The heat conducted to the chassis 14 is not only the internal fins 12b and the external fins 12a, but also the bottom surface of the ventilation path 4, the intake fan installation part B1, the air reservoir part B2, and the air discharge part B3. The heat is also radiated from each part.
Thus, the heat generated in the heat-generating electronic component 1 is efficiently radiated by the heat-dissipating region B, so that the temperature of the heat-generating electronic component 1 can be prevented from rising excessively. The wireless communication device 10 can be operated stably.

In addition, the place where the air intake port in which the slit 11 is formed is not limited to the top surface of the housing 12, but may be the side surface, the bottom surface, the back surface, or the front surface of the housing 12.
The place where the exhaust port 15 is disposed is not limited to the rear surface of the housing 12, but may be the side surface, the bottom surface, the top surface, or the front surface of the housing 12.
In addition, the intake port in which the slit 11 is formed may be disposed on the same surface as the exhaust port, or may be disposed on a different surface.
Furthermore, the shape of the housing is not limited to a rectangular parallelepiped, but may be a polyhedron or a housing having a curved surface.

In Example 1 of the present invention, an axial fan was used as the intake fan, the intake port was opened on the top surface of the housing, and the exhaust port was opened on the back surface of the housing.
Further, since the air inlet does not protrude from the housing, the appearance is excellent.

The present invention is not limited to a wireless communication device, and can be used for various applications using a heat dissipation device using an intake fan and a heat dissipation fin.

1 is a perspective view of an external appearance of an embodiment of a heat dissipation device for an electronic device according to the present invention. It is a perspective view inside the heat radiating device of the electronic apparatus. It is a perspective view inside the heat radiating device of the electronic apparatus. It is the XX sectional view taken on the line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Wireless communication apparatus, electronic device 11 Slit, inlet 12 Case 13 Cover 14 Chassis, conduction means 15 Exhaust 1 Exothermic electronic component 3 Intake fan 4 Ventilation path 5 Substrate 6 Partition member A Substrate arrangement area B Heat dissipation area B1 Intake fan installation part B2 Air reservoir part B3 Air exhaust part B4 Ventilation part B5 Opening part

Claims (3)

In a heat dissipation device for an electronic device configured to dissipate heat generated by electronic components disposed in the chassis by passing the gas sucked by the intake fan through a ventilation path formed in the chassis,
The ventilation path is covered with a cover,
An air reservoir is provided at a position facing the blowout side of the intake fan of the chassis,
The air reservoir has a bottom surface and a side surface erected with respect to the bottom surface,
An opening is provided in a part of the side surface,
The gas sucked by the intake fan in a direction perpendicular to the flat surface portion of the cover is blown to the bottom surface of the air reservoir, and passes along the cover from an opening provided in a part of the side surface. By flowing into the ventilation path, the flow direction is forcibly changed from a direction perpendicular to the cover to a direction along the cover and passes through the ventilation path. Heat dissipation device for electronic equipment. 2. The electron according to claim 1 , wherein a partition member that separates and divides a heat dissipating region including the air reservoir and the ventilation path and a substrate disposition region where the substrate is disposed is formed in the chassis. Equipment heat dissipation device. In the chassis, an air discharge part is formed between the opening and the ventilation path,
3. The heat dissipation device for an electronic device according to claim 1 , wherein a cross-sectional area of the ventilation path is smaller than a cross-sectional area of the air discharge portion .

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