WO2020148898A1

WO2020148898A1 - Electronic apparatus

Info

Publication number: WO2020148898A1
Application number: PCT/JP2019/001508
Authority: WO
Inventors: 富強韓
Original assignee: 三菱電機株式会社
Priority date: 2019-01-18
Filing date: 2019-01-18
Publication date: 2020-07-23

Abstract

This electronic apparatus comprises: a housing (10) in which a substrate (14, 15) with an electronic component (14a to 14k, 15a to 15p) mounted thereon is accommodated; a fan (17) provided in an exhaust hole (11g) of the housing (10); a heatsink (18) accommodated in the housing (10) in thermal contact with the electronic component (15a to 15e); a first ventilating path (41) which is defined and formed by an inner surface of the housing (10) and an outer surface of the heatsink (18), and through which air drawn in through an intake hole (11f) of the housing (10) due to driving of the fan (17) is discharged out of the exhaust hole (11g); and a second ventilating path (42) through which air drawn in through an intake hole (18d) of the heatsink (18) due to driving of the fan (17) is discharged via the heatsink (18) and out of the exhaust hole (11g). A fin (18a) of the heatsink (18) is disposed extending toward the electronic component (15a to 15e) in thermal contact with the heatsink (18).

Description

Electronics

The present invention relates to an electronic device having a heat dissipation structure.

Demands for higher functionality and smaller size of electronic devices have been increasing in recent years, and along with this, heat dissipation from electronic components has become one of the important issues. Conventional heat dissipation techniques include forced cooling in which heat inside the product is forcibly drawn out by a fan or the like, and radiation from the product housing. An electronic device provided with a heat dissipation structure is disclosed in Patent Document 1, for example.

JP-A-2002-271073

The electronic device disclosed in Patent Document 1 transmits heat generated from a heat-generating component to a fin arranged inside a duct via a heat pipe, and the heat transmitted to the fin is driven by a fan. It is released to the outside of the housing.

However, in the above conventional electronic device, a dead space is formed around the duct, and the heat accumulated in the dead space cannot be efficiently released to the outside of the housing. Further, in the above-described conventional electronic device, the heat transfer distance between the heat-generating component and the fin becomes long, and heat cannot be efficiently radiated from the heat-generating component.

The present invention has been made to solve the above problems, and provides an electronic device capable of performing heat dissipation from the inside of a housing and heat dissipation from a heat-generating component using one fan. The purpose is to

An electronic device according to the present invention includes a housing that houses a substrate on which a heat-generating component is mounted, a fan that is provided in a housing-side exhaust hole that opens in the housing, and a housing that is housed in the housing and that is thermally connected to the heat-generating component. A first ventilation that discharges air sucked from a housing-side intake hole that is defined by an inner surface of the housing and an outer surface of the heatsink that is in contact with And a second ventilation path for discharging the air sucked from the heat sink side intake hole of the heat sink by the drive of the fan from the housing side exhaust hole via the heat sink, and the fins of the heat sink are provided with respect to the heat sink. It is characterized in that it is arranged so as to extend toward a heat generating component that is in thermal contact.

According to the present invention, it is possible to perform heat dissipation from the inside of the housing and heat dissipation from the heat-generating components using one fan.

FIG. 3 is an external view of the electronic device according to the first embodiment. FIG. 1A is a front perspective view of the electronic device according to the first embodiment. FIG. 1B is a rear perspective view of the electronic device according to the first embodiment. FIG. 2 is a sectional view taken along the line AA of FIG. 1B. FIG. 2 is a sectional view taken along the line BB of FIG. 1B. FIG. 3 is an exploded perspective view of the electronic device according to the first embodiment. It is an appearance perspective view of a heat sink.

Hereinafter, in order to explain the present invention in more detail, modes for carrying out the present invention will be described with reference to the accompanying drawings.

Embodiment 1.
The electronic device according to the first embodiment will be described with reference to FIGS. 1 to 5. FIG. 1A is a front perspective view of the electronic device according to the first embodiment. FIG. 1B is a rear perspective view of the electronic device according to the first embodiment. FIG. 2 is a sectional view taken along the line AA of FIG. 1B. FIG. 3 is a sectional view taken along the line BB of FIG. 1B. FIG. 4 is an exploded perspective view of the electronic device according to the first embodiment. FIG. 5 is an external perspective view of the heat sink. The two-dot chain line arrow in FIG. 2 and the solid line arrow in FIG. 5 indicate the air flow direction.

The electronic device according to the first embodiment includes a housing 10,

substrates

14 and 15, a support plate 16, a fan 17, and a heat sink 18.

The housing 10 houses the board 14 on which various electronic components 14a to 14k are mounted and the board 15 on which various electronic components 15a to 15p are mounted. The housing 10 includes a bottom plate member 11, a top plate 12, and a front plate 13. The bottom plate member 11, the top plate 12, and the front plate 13 are sheet metal members formed by sheet metal processing and are made of metal.

The bottom plate member 11 has a bottom plate portion 11a, a left wall portion 11b, a right wall portion 11c, a rear wall portion 11d, a heat sink mounting port 11e, a plurality of intake holes 11f, and a plurality of exhaust holes 11g.

The left wall portion 11b and the right wall portion 11c are provided at both left and right ends of the bottom plate portion 11a. The rear wall portion 11d is provided at the rear end of the bottom plate portion 11a so as to connect the left wall portion 11b and the right wall portion 11c. As a result, the bottom plate member 11 has a box shape in which the upper portion and the front portion are opened.

The heat sink mounting port 11e is open to the bottom plate portion 11a. The intake hole 11f constitutes a housing-side intake hole, and is open to the left wall portion 11b. The exhaust hole 11g constitutes a casing-side exhaust hole, and is opened in the right wall portion 11c. The fan 17 is attached to the inner surface of the right wall portion 11c so as to face the exhaust hole 11g. The fan 17 shown in FIG. 4 is arranged outside the right side portion 17c in order to make the overall appearance of the fan 17 easy to understand.

The top plate 12 is joined to the bottom plate member 11 so as to close the upper opening of the bottom plate member 11. The front plate 13 is joined to the bottom plate member 11 and the top plate 12 so as to close the front opening of the bottom plate member 11.

The board 14 is arranged above the board 15. The support plate 16 is arranged between the substrate 14 and the substrate 15 in the vertical direction. The substrate 14 is supported by a support plate 16, and the support plate 16 is fixed to the top plate 12 via a mounting member (not shown). The substrate 15 is fixed to the bottom plate member 11. The support plate 16 is a sheet metal member formed by sheet metal processing, and is made of metal. The support plate 16 is made of a material having a high thermal conductivity, and is made of, for example, aluminum or copper.

The electronic components 14a to 14k mounted on the board 14 are heat-generating components that generate heat during operation. The electronic components 14a to 14g are mounted on the lower surface of the substrate 14, and the electronic components 14h to 14k are mounted on the upper surface of the substrate 14.

Among these, among the electronic components 14a to 14k, the

electronic components

14a and 14b having the highest heat generation temperature are in contact with the upper surface of the support plate 16 via the heat

radiation sheet members

31 and 32. The heat

dissipation sheet members

31 and 32 are made of, for example, an elastic material such as rubber. The heat

dissipation sheet members

31 and 32 are in close contact with the surfaces of the

electronic components

14a and 14b and the upper surface of the support plate 16 without any gap.

The electronic components 14c to 14g are, for example, buttons or the like, and a part of them protrudes forward from an opening provided in the front plate 13.

The electronic components 15a to 15p mounted on the board 15 are heat-generating components that generate heat during operation. The electronic components 15a to 15l are mounted on the lower surface of the substrate 15, and the electronic components 15m to 15p are mounted on the upper surface of the substrate 15.

Among these, among the electronic components 15a to 15p, the

electronic components

15a and 15b having the highest heat generation temperature are in contact with the upper surface of the heat sink 18, which will be described later, via the two heat radiating sheet members 33. Further, among the electronic components 15a to 15p, the

electronic components

15c and 15d having the highest heat generation temperature are in contact with the upper surface of the heat sink 18 via the two heat radiation sheet members 34. Further, among the electronic components 15a to 15p, the electronic component 15e having the highest heat generation temperature is in contact with the upper surface of the heat sink 18 via the heat dissipation sheet member 35.

The heat radiation sheet members 33 to 35 are made of an elastic material such as rubber. The heat-dissipating sheet member 33 that is superposed is in close contact with the surfaces of the

electronic components

15a and 15b and the upper surface of the heat sink 18 without any gap. The heat-dissipating sheet member 34 that has been superposed is in close contact with the respective surfaces of the

electronic components

15c and 15d and the upper surface of the heat sink 18 without a gap. The heat radiation sheet member 35 is in close contact with the surface of the electronic component 15e and the upper surface of the heat sink 18 without any gap.

The electronic components 15f to 15l are, for example, buttons and the like, and a part of them protrudes forward from an opening provided in the front plate 13.

The heat sink 18 is attached to the heat sink attachment port 11e while being housed in the housing 10. As described above, in the electronic device, by attaching the heat sink 18 to the housing 10, the first ventilation path 41 defined by the inner surface of the housing 10 and the outer surface of the heat sink 18 and the second air passage passing through the inside of the heat sink 18 are formed. And a ventilation path 42. The inner surface of the housing 10 is a surface formed by the upper surface of the bottom plate member 11, the lower surface of the top plate 12, and the inner surface of the front plate 13.

Therefore, the substrate 14, the electronic components 14a to 14k mounted on the substrate 14, the substrate 15, the electronic components 15a to 15p mounted on the substrate 15, and the support plate 16 are arranged in the first ventilation path 41. ing. When the fan 17 is driven, the first ventilation path 41 discharges the air sucked from the intake hole 11f of the housing 10 from the exhaust hole 11g of the housing 10. The intake direction F1 of the intake hole 11f and the exhaust direction F3 of the exhaust hole 11g are parallel to each other.

As a result, in the electronic device, the air is passed through the first ventilation passage 41 by driving the fan 17, so that the electronic components 14a to 14k that generate heat and the substrate to which the heat generated from the electronic components 14a to 14k are transmitted. 14 and the support plate 16, the electronic components 15a to 15p that generate heat, and the substrate 15 to which the heat generated from the electronic components 15a to 15p is transferred can be cooled. That is, the electronic device can radiate heat from the inside of the housing 10 by including the first ventilation path 41.

Here, the first ventilation passage 41 and the second ventilation passage 42 have different intake holes and common exhaust holes, but the details of the second ventilation passage 42 will be described later. To do.

The heat sink 18 forming the second ventilation passage 42 has a plurality of fins 18a, a bottom plate portion 18b, a top plate portion 18c, an intake hole 18d, and an exhaust hole 18e. The heat sink 18 is in thermal contact with the electronic components 15a to 15e mounted on the substrate 15. Specifically, the top surface of the top plate portion 18c is in contact with the electronic components 15a to 15e via the heat radiation sheet members 33 to 35.

The plurality of fins 18a are arranged so as to extend toward the substrate 15 and the electronic components 15a to 15e. The plurality of fins 18a are arranged at regular intervals in the direction orthogonal to the exhaust direction F3 of the exhaust hole 11g. As a result, air passages are formed between the adjacent fins 18a, and these air passages are provided so as to be parallel to the exhaust direction F3 of the exhaust holes 11g.

The lower ends of the fins 18a are connected by the bottom plate portion 18b. The upper ends and the left ends of the fins 18a are connected by a top plate portion 18c. As a result, the right end side of the fin 18a of the heat sink 18 is open and forms an exhaust hole 18e. The exhaust hole 18e constitutes a heat sink side exhaust hole and faces the exhaust hole 11g of the fan 17 and the bottom plate member 11.

The air intake hole 18d constitutes a heat sink side air intake hole and is open to the bottom plate portion 18b. The intake hole 18d communicates with the exhaust hole 18e through all ventilation passages in the heat sink 18. Further, the air intake hole 18d is opened toward the top plate portion 18c which is in thermal contact with the electronic components 15a to 15e. The intake direction F2 of the intake hole 18d and the exhaust direction F3 of the exhaust hole 11g are orthogonal to each other. Further, the opening position of the intake hole 18d is set according to the installation positions of the electronic components 15a to 15e. Specifically, the opening position of the intake hole 18d is set to a position where the air taken in from the intake hole 18d flows toward the electronic components 15a to 15e.

As described above, in the electronic device, by attaching the heat sink 18 to the heat sink attachment port 11e of the bottom plate member 11, the bottom plate member is inserted from the intake hole 18d of the heat sink 18 through the ventilation passage between the fins 18a and the exhaust hole 18e. The second ventilation passage 42 extending to the exhaust hole 11g of 11 is provided. When the fan 17 is driven, the second ventilation passage 42 discharges the air sucked from the intake hole 18d of the heat sink 18 from the exhaust hole 11g of the housing 10.

With this, the electronic device can cool the heat-generated electronic components 15a to 15e by driving the fan 17 to pass the air into the second ventilation passage 42. That is, the electronic device is provided with the second ventilation passage 42, so that the electronic components 15a to 15e can radiate heat. Therefore, the electronic components 15a to 15e receive heat radiation by the air passing through the first ventilation passage 41 and heat radiation by the air passing through the second ventilation passage 42.

Specifically, the plurality of fins 18a has a temperature gradient such that the temperature gradually increases from the lower end distant from the electronic components 15a to 15e toward the upper end located on the electronic component 15a to 15e side. And the temperature at the top is highest. Therefore, since the plurality of fins 18a are arranged so as to extend toward the electronic components 15a to 15e, the air sucked from the intake holes 18d passes more to the upper end side than to the lower end side of the fin 18a. Thereby, the electronic device can easily radiate heat from the electronic components 15a to 15e.

In addition, since the intake direction F2 of the intake hole 18d and the exhaust direction F3 of the exhaust hole 11g are orthogonal to each other, the air sucked from the intake hole 18d is in thermal contact with the electronic components 15a to 15e. After colliding with the portion 18c, the fin 18a passes through the upper end side. Furthermore, since the opening position of the intake hole 18d is set according to the installation position of the electronic components 15a to 15e, the air sucked from the intake hole 18d flows into the electronic components 15a to 15e in a concentrated manner. Thereby, the electronic device can efficiently dissipate heat from the electronic components 15a to 15e.

As described above, the electronic device according to the first embodiment is provided in the housing 10 that houses the

boards

14 and 15 on which the electronic components 14a to 14k and 15a to 15p are mounted, and the exhaust hole 11g that opens in the housing 10. The fan 17 and the heat sink 18 housed in the housing 10 and in thermal contact with the electronic components 15a to 15e are partitioned by the inner surface of the housing 10 and the outer surface of the heat sink 18, and are driven by the fan 17. The air sucked from the intake hole 11f opening in the housing 10 is exhausted from the exhaust hole 11g, and the air sucked from the intake hole 18d of the heat sink 18 by driving the fan 17 is supplied to the heat sink 18g. And a second ventilation path 42 that discharges the air from the exhaust hole 11g through the. The fins 18a of the heat sink 18 are arranged so as to extend toward the electronic components 15a to 15e that are in thermal contact with the heat sink (18). Accordingly, the electronic device can perform heat dissipation from the inside of the housing 10 and heat dissipation from the electronic components 15a to 15e by using the single fan 17.

In the electronic device according to the first embodiment, the intake direction F2 of the intake hole 18d and the exhaust direction F3 of the exhaust hole 11g are orthogonal to each other. As a result, the electronic device causes the air sucked into the second ventilation passage 42 from the intake hole 18d to collide with the top plate portion 18c that is in thermal contact with the electronic components 15a to 15e, and the upper ends of the plurality of fins 18a. You can pass by.

In the electronic device according to the first embodiment, the opening position of the intake hole 18d is set according to the installation positions of the electronic components 15a to 15e. As a result, the electronic device can intensively flow the air sucked into the second ventilation passage 42 from the intake hole 18d of the heat sink 18 toward the electronic components 15a to 15e.

Note that, in the present invention, it is possible to modify any constituent element of the embodiment or omit any constituent element of the embodiment within the scope of the invention.

The electronic device according to the present invention includes the first ventilation passage and the second ventilation passage, and the fins of the heat sink are arranged so as to extend toward the heat-generating component. It is possible to radiate heat from the heat-generating component, and it is suitable for use in an electronic device or the like having a heat radiating structure.

10 housing, 11 bottom plate member, 11a bottom plate part, 11b left wall part, 11c right wall part, 11d rear wall part, 11e heat sink mounting port, 11f intake hole, 11g exhaust hole, 12 top plate, 13 front plate, 14, 15 boards, 14a to 14k, 15a to 15p electronic parts, 16 support plates, 17 fans, 18 heat sinks, 18a fins, 18b bottom plate parts, 18c top plate parts, 18d intake holes, 18e exhaust holes, 31 to 35 heat dissipation sheet members , 41 first ventilation passage, 42 second ventilation passage, F1, F2 intake direction, F3 exhaust direction.

Claims

A housing for accommodating a board on which heat-generating components are mounted,
A fan provided in a casing-side exhaust hole opening to the casing,
A heat sink housed in the housing and in thermal contact with the heat generating component;
A first ventilation path that is formed by being partitioned by the inner surface of the housing and the outer surface of the heat sink and that is sucked from the housing-side intake hole opened to the housing by driving the fan and is discharged from the housing-side exhaust hole. When,
A second ventilation path for discharging the air sucked from the heat sink side intake hole of the heat sink by the drive of the fan through the housing side exhaust hole via the heat sink;
The fin of the heat sink is arranged so as to extend toward the heat generating component that is in thermal contact with the heat sink.
The electronic device according to claim 1, wherein an intake direction of the heat sink side intake hole and an exhaust direction of the housing side exhaust hole are orthogonal to each other.
The electronic device according to claim 1, wherein an opening position of the heat sink side intake hole is set according to an installation position of the heat generating component.