TWM444548U - Electronic device - Google Patents

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device having a heat sink.

In recent years, electronic devices have become thinner and thinner, and the computing speed of electronic devices has become faster and faster. Therefore, when an electronic device is used, the temperature of the electronic component in the electronic device rises sharply. In general, it is necessary to provide a heat sink to remove the heat generated and reduce the temperature of the electronic components.

Referring to FIG. 1 , a perspective view of a conventional electronic device 11 is illustrated. The heat sink 112 is mounted on the circuit board 111 in the electronic device 11 to dissipate the heat of the circuit board 111 into the environment. In general, it is often believed that the heat sink fins can increase the heat dissipation area and thus increase the heat dissipation efficiency. Therefore, the conventional heat sink 112 employs a plurality of heat sink fins 112a.

In view of the above problems, the present invention provides an electronic device that dissipates heat by another heat dissipating member.

According to an embodiment of the present invention, an electronic device includes a circuit board, at least one electronic component, and at least one heat sink. The electronic components are mounted on the circuit board. The heat sink comprises a mounting wall and at least one side wall. The attached wall is attached to the electronic component and has opposite ends. At least one side wall is attached to the end of the attachment wall. The side wall and the attachment wall form a tubular member having an air inlet opening and an air outlet opening. The inlet opening faces the base and the wind The opening is relative to the inlet opening.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the spirit and principles of the present invention, and to provide further explanation of the scope of the present patent application.

The detailed features and advantages of the present invention are described in detail in the following detailed description of the embodiments of the present invention. Any related art and related art can easily understand the related purposes and advantages of the present invention. The following examples are intended to describe the present invention in further detail, but do not limit the scope of the present invention in any way.

Referring to FIG. 2A, a perspective view of an electronic device 20 according to an embodiment of the present invention is illustrated. The electronic device 20 has a base 201. The electronic device 20 is, for example, a display or a television. Referring to FIG. 2B, a partial exploded view of the electronic device 20 in FIG. 2A is illustrated. The electronic device 20 includes a circuit board 21, an electronic component 22, and a heat sink 23, but is not limited thereto. In other embodiments, the electronic device 20 can also include a plurality of electronic components 22 and a plurality of heat sinks 23 . The electronic component 22 is mounted on the circuit board and electrically connected to the circuit board 21. The electronic component is a chip such as a CPU. The heat sink 23 is attached to the electronic component 22 to dissipate the heat generated by the electronic component 22. The heat sink 23 includes an attachment wall 231 and at least one side wall. In the present embodiment, the attachment wall 231 is rectangular. However, this embodiment is not intended to define the shape of the attachment wall. In other embodiments, the shape of the attachment wall can also be circular or other shape. Attached to the wall 231 attached The electronic component 22 has opposite end portions 231a. In this embodiment, the heat sink 23 includes three rectangular side walls 232 and 232'. However, this embodiment is not intended to limit the number of side walls. The side walls 232' are respectively connected to the end portions 231a of the attachment walls 231. The side walls 232 and 232' and the attachment wall 231 form a tubular member having an air inlet opening 233 and an air outlet opening 234. The air inlet opening 233 and the air outlet opening 234 are disposed opposite to each other. The electronic device 20 further includes a housing 24 that covers the circuit board 21, the electronic component 22, and the heat sink 23. The outer casing 24 has an air inlet hole 241 and an air outlet hole 242. The air inlet hole 241 is close to the base 201, and the air outlet hole 242 is away from the base 201.

Referring to FIG. 3, a cross-sectional view of the electronic device 20 taken along line 3-3 in FIG. 2A is shown. The inlet opening 233 faces the base 201, and the outlet opening 234 is opposite to the inlet opening 233. The thickness T of the heat sink 23 is, for example, equal to or smaller than 10 mm. The heat sink 23 is made of, for example, aluminum or copper.

When the electronic device 20 is used, the electronic device 20 can stand on a table top, for example, by the susceptor 201. Therefore, part of the heat of the electronic component 22 can be conducted to the air in the heat sink 23 via the attaching wall 231. Since the density of the hot air is less than the density of the cold air, when natural convection occurs, the hot air moves in the opposite direction of the gravity direction M. Therefore, the hot air in the heat sink 23 is removed from the air outlet opening 234 due to natural convection, and the cold air near the air inlet opening 233 is sucked into the heat sink 23 to lower the temperature of the electronic component 22.

Referring to FIG. 4A, a cross-sectional view of the electronic device 20 taken along line 4A-4A in FIG. 2A is shown. In the present embodiment, the tubular members formed by the side walls 232 and 232' and the attachment wall 231 are rectangular tubes. However, this embodiment is not intended to define a tubular member The shape. In other embodiments, the heat sink can also have a variety of different shapes. Taking FIG. 4B as an example, a cross-sectional view of an electronic device 20b according to another embodiment of the present invention is shown. Different from the shape of the tubular member of Fig. 4A, the shape of the tubular member of the heat dissipating member 23b formed by the side walls 232a and 232b and the attaching wall 231 is a trapezoidal tube. The side wall 232a away from the attachment wall 231 is parallel to the attachment wall 231. The width W1 of the side wall 232a is smaller than the width W2 of the attachment wall 231.

Referring to FIG. 4C, a cross-sectional view of an electronic device 20c according to another embodiment of the present invention is illustrated, and another shape of the heat sink is disclosed. In this embodiment, although the shape of the tubular member of the heat dissipating member 23c formed by the side walls 232c and 232d and the attaching wall 231 is also a trapezoidal tube, and the side wall 232c away from the attaching wall 231 is parallel to the attaching wall 231, The width W3 of the side wall 232c is greater than the width W4 of the attachment wall 231.

Referring to FIG. 4D, a cross-sectional view of an electronic device 20d according to another embodiment of the present invention is illustrated, and a heat dissipating member having a different shape is disclosed. In the embodiment, the heat sink 23d includes a curved sidewall 232e. Therefore, the tubular member of the heat dissipating member 23d formed by the side wall 232e and the attaching wall 231 is a chord.

Referring to FIG. 5A, a partial exploded view of an electronic device according to another embodiment of the present invention is illustrated. In the present embodiment, the heat sink 23e includes three rectangular side walls 235 and 236. Each side wall 236 is adjacent to the attachment wall 231 and has a through hole 236a so that cold air near the through hole 236a can be sucked into the heat sink 23e, and the heat sink 23e can be used to lower the temperature of the electronic component 22.

Referring to FIG. 5B, a partial exploded view of an electronic device according to another embodiment of the present invention is illustrated. In this embodiment, the heat sink 23f includes three rectangular side walls 237 And 238. The side wall 237 away from the attachment wall 231 has a plurality of elongated through holes 237a. The through hole 237a extends in a direction perpendicular to the direction L, and the direction L extends from the inlet opening 233 to the outlet opening 234. The through holes 237a are parallel to each other and close to the inlet opening 233. Therefore, cold air close to the through hole 237a can also be sucked into the heat sink 23f to lower the temperature of the electronic component 22.

Referring to FIG. 5C, a partial exploded view of an electronic device according to another embodiment of the present invention is illustrated. The heat sink 23g is similar to the heat sink 23f. However, the through hole 237a' of the heat sink 23g is adjacent to the air outlet opening 234. Therefore, part of the hot air in the heat radiating member 23g can be removed from the through hole 237a'.

Referring to FIG. 5D, a partial exploded view of an electronic device according to another embodiment of the present invention is illustrated. In the present embodiment, the heat sink 23h includes three rectangular side walls 232 and 232'. The heat sink 23h further includes a partition wall 239. The partition wall 239 is located between the attachment wall 231 and a portion of the side wall 232 remote from the attachment wall 231. Therefore, part of the heat of the electronic component 22 can be conducted to the sidewall 232 via the partition wall 239 away from the attachment wall 231 and escape from the sidewall 232.

Experimental data is provided herein to compare the heat dissipation efficiency of the conventional heat sink 112a and the heat sinks 23, 23e, 23f, 23g, 23h of the present invention. In this experiment, the size of each of the heat dissipating members 112a, 23, 23e, 23f, 23g, 23h was 37.5 mm × 37.5 mm × 10.0 mm, and the size of the electronic component was 27.0 mm × 27.0 mm. The circuit board 21, the electronic component 22, and the heat sinks 112a, 23, 23e, 23f, 23g, and 23h are housed in a thin outer casing. The experimental results are shown in Table 1 below.

In Table 1, column A shows the situation when no heat sink is used. Column D shows the case where the heat sink 112a in Fig. 1 is used. Column I shows the use of the heat sink 23 in Figure 2B. Column E shows the case where the heat sink 23e in Fig. 5A is used. Column F shows the case where the heat sink 23f in Fig. 5B is used. Column G shows the case where the heat sink 23g in Fig. 5C is used. Column H shows the case where the heat sink 23h in Fig. 5D is used. Ta represents the ambient temperature. In this experiment, Ta was 25 °C. Tc denotes the temperature of the portion of the heat sink away from the electronic component 22, that is, the outer surface of the heat sink 112a, 23, 23e, 23f, 23g, 23h. Tj is the temperature of the electronic component 22 calculated from the thermal conductivity of the heat sinks 112a, 23, 23e, 23f, 23g, 23h. The flow rate represents the amount of air flowing through the inlet opening per second. The areas of the air inlet openings of the heat dissipating members 112a, 23, 23e, 23f, 23g, and 23h are all the same.

In Table 1, the temperature Tc of the heat sinks 23, 23e, 23f, 23g, 23h is less than 60 ° C, and the temperature Tc of the heat sink 112a is greater than 60 ° C. By the heat sinks 23, 23e, The temperature Tj calculated by 23f, 23g, and 23h is less than 80 ° C, and the temperature Tj calculated by the heat sink 112a is greater than 80 ° C. The flow rate of the heat sink 23 is much larger than that of the conventional heat sink 112a. Therefore, it can be seen that the heat dissipation efficiency of the heat sinks 23, 23e, 23f, 23g, and 23h of the present invention is far superior to that of the conventional heat sink 112a. In columns I, E, F, G, and H, the lowest temperature Tc appears in column E, and the lowest temperature Tj appears in column H.

Please refer to Figures 6A and 6B. Fig. 6A is a perspective view of an electronic device 20' according to another embodiment of the present invention. Fig. 6B is a rear view of the electronic device 20' in Fig. 6A. In the present embodiment, the outer casing 24' further includes a plurality of deflecting plates 243. The deflecting plate 243 is disposed between the inlet opening 233 and the base 201. The deflecting plate 243 is configured in a tapered shape. The narrow end of the cone is close to the inlet opening 233, and the wide end of the cone is remote from the inlet opening 233. Therefore, cold air can be guided into the wind opening 233 by the deflection plate 243 passing through the taper.

Please refer to Figures 7A and 7B. 7A is a perspective view of an electronic device 20" according to another embodiment of the present invention. FIG. 7B is a cross-sectional view of the electronic device 20" taken along line 7B-7B of FIG. 7A. In this embodiment, the outer casing 24" further has an air inlet hole 244 and an air outlet hole 245. The air inlet hole 244 is closer to the air inlet opening 233. The air outlet hole 245 is closer to the air outlet opening 234. The air inlet hole 244 is smaller than the air inlet opening 244. The opening 233 is closer to the base 201. The air outlet 245 is further away from the base 201 than the air outlet 234. The outer casing 24" further has flow guiding surfaces 246a and 246b. One of the flow guiding surfaces 246a and 246b is located between the air inlet hole 244 and the air inlet opening 233. The other of the flow guiding surfaces 246a and 246b is located at the outlet 245 and the outlet is open. Between ports 234. The flow guiding surfaces 246a and 246b are configured to communicate the environment outside the housing 24" with the interior of the heat sink 23. When the size of the electronic device 20" is so large that the air inlet hole 241 and the air outlet hole 242 are away from the heat sink 23, The air inlet 244 and the air outlet 245 can help the heat sink 23 to dissipate heat generated by the electronic component 22.

According to the disclosure of the present invention, since the tubular member is formed from the end of one end of the attaching wall to the opposite end of the attaching wall and the attaching wall, the heat dissipating member in the embodiment of the present invention has a more conventional The heat sink in the electronic device has higher heat dissipation efficiency. In addition, since the geometry of the heat sink in the embodiment of the present invention is less complicated, the manufacturing cost of the heat sink in the embodiment of the present invention can be reduced.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the present invention. The changes and refinements of the present invention are within the scope of the patent protection of the present invention without departing from the spirit and scope of the present invention. Please refer to the attached patent application for the scope of protection defined by this new model.

11‧‧‧Electronic devices

111‧‧‧Circuit board

112‧‧‧Solder parts

112a‧‧‧heat fins

20, 20b, 20c, 20d, 20', 20" ‧ ‧ electronic devices

201‧‧‧Base

21‧‧‧ boards

22‧‧‧Electronic components

23, 23b, 23c, 23d, 23e, 23f, 23g, 23h‧‧‧ heat sink

231‧‧‧ Attached to the wall

231a‧‧‧End

232, 232', 232a, 232b, 232c, 232d, 232e, 235, 236, 237, 238‧‧‧ side walls

233‧‧‧Inlet opening

234‧‧‧Outlet opening

236a, 237a, 237a’‧‧‧through holes

239‧‧‧ partition wall

24, 24', 24" ‧ ‧ shell

241, 244‧‧‧ inlet holes

242, 245‧‧ vent holes

243‧‧‧ skewed board

246a, 246b‧‧‧ diversion surface

L‧‧‧ direction

M‧‧‧Gravity direction

T‧‧‧ thickness

W1, W2, W3, W4‧‧‧ width

FIG. 1 is a perspective view of a conventional electronic device.

2A is a perspective view of an electronic device according to an embodiment of the present invention.

FIG. 2B is an exploded view of the circuit board, the electronic component, and the heat sink in FIG. 2A.

Fig. 3 is a cross-sectional view showing the electronic device taken along line 3-3 in Fig. 2A.

Fig. 4A is a cross-sectional view showing the electronic device taken along line 4A-4A in Fig. 2A.

4B is a cross-sectional view of an electronic device in accordance with another embodiment of the present invention.

4C is a cross-sectional view of an electronic device in accordance with another embodiment of the present invention.

4D is a cross-sectional view of an electronic device in accordance with another embodiment of the present invention.

FIG. 5A is an exploded view showing a combination of a circuit board, an electronic component, and a heat sink according to another embodiment of the present invention.

FIG. 5B is an exploded view showing a combination of a circuit board, an electronic component, and a heat sink according to another embodiment of the present invention.

FIG. 5C is an exploded view showing a combination of a circuit board, an electronic component, and a heat sink according to another embodiment of the present invention.

FIG. 5D is an exploded view showing a combination of a circuit board, an electronic component, and a heat sink according to another embodiment of the present invention.

FIG. 6A is a perspective view of an electronic device according to another embodiment of the present invention.

FIG. 6B is a rear view of the electronic device in FIG. 6A.

FIG. 7A is a perspective view of an electronic device according to another embodiment of the present invention.

Fig. 7B is a cross-sectional view showing the electronic device taken along line 7B-7B in Fig. 7A.

20‧‧‧Electronic devices

201‧‧‧Base

21‧‧‧ boards

23‧‧‧ Heat sink

24‧‧‧ Shell

241‧‧‧Into the air hole

242‧‧‧Air outlet

Claims (10)

An electronic device includes a pedestal, the electronic device includes: a circuit board; at least one electronic component is mounted on the circuit board; and at least one heat dissipating component comprises: a affixing wall Attached to the electronic component, the attachment wall has opposite ends; and at least one side wall is connected to the end portions of the attachment wall, the side wall and the attachment wall are formed to have an air inlet opening And a tubular member of an air outlet opening, the air inlet opening is toward the base, and the air outlet opening is opposite to the air inlet opening. The electronic device of claim 1, wherein the thickness of the heat sink is equal to or less than 10 mm. The electronic device of claim 1, wherein the tubular member formed by the sidewalls and the attachment wall is a rectangular tube, a trapezoidal tube or a chord. The electronic device of claim 1, wherein the heat dissipating member comprises a plurality of side walls, and each of the side walls adjacent to the attaching wall has a through hole. The electronic device of claim 1, wherein a portion of the side wall away from the attachment wall has a plurality of through holes. The electronic device of claim 1, wherein the electronic device further comprises a casing covering the circuit board, the electronic component, and the heat sink. The shell has an air inlet hole and an air outlet hole, the air inlet hole is close to the base, and the air outlet hole is away from the base. The electronic device of claim 1, wherein the electronic device further comprises a casing covering the circuit board, the electronic component and the heat dissipating component, the casing having an air inlet hole and an air outlet hole The air inlet hole is close to the air inlet opening, the air outlet hole is close to the air outlet opening, the air inlet hole is closer to the base than the air inlet opening, and the air outlet hole is larger than the air outlet hole The wind opening is further away from the base. The electronic device of claim 7, wherein the outer casing further has a plurality of flow guiding surfaces, wherein one of the flow guiding surfaces is located between the air inlet hole and the air inlet opening, A flow guiding surface is located between the air outlet hole and the air outlet opening, and the flow guiding surfaces are configured to communicate the outer portion of the outer casing with the inner portion of the tubular member. The electronic device of claim 1, wherein the electronic device further comprises a casing having a plurality of deflecting plates, the deflecting plates being disposed between the inlet opening and the base The deflecting plates are configured to have a tapered shape, and the narrow end of the tapered portion is adjacent to the inlet opening, and the wide end of the tapered portion is away from the inlet opening. The electronic device of claim 1, wherein the heat sink further comprises a partition wall between the attachment wall and a portion of the side wall away from the attachment wall.