US20120043058A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20120043058A1 US20120043058A1 US12/894,166 US89416610A US2012043058A1 US 20120043058 A1 US20120043058 A1 US 20120043058A1 US 89416610 A US89416610 A US 89416610A US 2012043058 A1 US2012043058 A1 US 2012043058A1
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- dissipation device
- air outlet
- fin assembly
- impeller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure relates to heat dissipation devices, and particularly to a heat dissipation device for dissipating heat generated from an electronic component.
- an electronic device such as a computer or a server is much thinner and smaller than before. Yet the device is able to hold many more electronic components than before.
- the electronic components generate a large amount of heat during operation.
- a heat sink assembly is installed on a printed circuit board for cooling a major heat-generating electronic component mounted on the printed circuit board.
- the heat sink assembly includes a heat pipe 30 thermally contacting the electronic component, a fin assembly 40 thermally connecting the heat pipe 30 , and a centrifugal fan 50 located at a side of the fin assembly 40 .
- the fin assembly 40 includes a plurality of fins stacked together.
- the centrifugal fan 50 has an air inlet and an air outlet. The centrifugal fan 50 draws cool air through the air inlet. The cool air under the action of an impeller in the centrifugal fan 50 is blown through and out of the air outlet towards the fins, and turns into hot air at the fins. The hot air then flows out of the fin assembly 40 .
- the heat pipe 30 is attached to the fin assembly 40 by inserting and soldering an end of the heat pipe 30 inside the fin assembly 40 . Therefore when the air flows through the fins of the fin assembly 40 , the heat pipe 30 in the fin assembly 40 blocks some of the air from flowing out of the fin assembly 40 .
- FIG. 4 shows another conventional heat sink assembly, which is similar to the above-described heat sink assembly.
- the heat pipe 30 is attached to the fin assembly 40 by soldering an end of the heat pipe 30 on a top face of the fin assembly 40 .
- this solution increases the thickness of the entire heat sink assembly and correspondingly the thickness of the electronic device.
- FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the disclosure.
- FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
- FIGS. 3-4 are isometric views of two heat sinks in accordance with related art.
- the heat dissipation device is adapted for cooling an electronic device (not shown) mounted on a printed circuit board (not shown), and includes a heat sink 10 and a centrifugal fan 20 .
- the centrifugal fan 20 includes a fan frame 22 , and an impeller 24 mounted in the fan frame 22 .
- the fan frame 22 includes a base 26 , and a cover plate 28 covering the base 26 .
- a first air inlet 280 is defined in a central portion of the cover plate 28 .
- a plurality of through holes 282 is defined in a periphery of the cover plate 28 .
- the base 26 includes a base plate 260 , and a side wall 262 extending vertically upwardly from an outer edge of the base plate 260 .
- the base plate 260 includes a fixing seat 2602 near a center thereof.
- Three second air inlets 2600 are defined in the base plate 260 around the fixing seat 2602 , corresponding to the first air inlet 280 of the cover plate 28 .
- the impeller 24 is fixed on the fixing seat 2602 of the base plate 260 .
- An air outlet 202 is defined in the side wall 262 of the base 26 , and includes a first portion 2021 and a second portion 2022 . An angle between the first portion 2021 and the second portion 2022 is an obtuse angle.
- the air outlet 202 is perpendicular to the first air inlet 280 and the second air inlet 2600 .
- a plurality of protruding posts 2620 protrude from a top face of the side wall 262 , corresponding to the through holes 282 of the cover plate 28 .
- the protruding posts 2620 extend through the through holes 282 of the cover plate 28 to fasten the cover plate 28 on the side wall 262 . Thereby, the cover plate 28 and the base 26 cooperatively form a space (not labeled) where the impeller 24 is received.
- the heat sink 10 includes a heat spreader 12 , a heat pipe 14 , and a fin assembly 16 .
- the heat pipe 14 is flat, and includes an evaporating section 142 attached to the heat spreader 12 and a condensing section 144 attached to the fin assembly 16 .
- the evaporating section 142 has a flat top face and a flat bottom face. The top and bottom faces of the evaporating section 142 are parallel to each other. The bottom face of the evaporating section 142 thermally contacts a top face of the heat spreader 12 .
- the condensing section 144 has an inner side face and an outer side face. The inner side face and the outer side face of the condensing section 144 are parallel to each other. The inner and outer side faces of the condensing section 144 are perpendicular to the top and bottom faces of the evaporating section 14 .
- the heat spreader 12 is made of metal such as aluminum, copper or an alloy thereof. A bottom of the heat spreader 12 thermally contacts the electronic device to absorb heat from the electronic device. Two fastening elements 122 are disposed at two lateral sides of the top face of the heat spreader 12 , for fastening the heat spreader 12 on the printed circuit board on which the electronic device is mounted.
- the fin assembly 16 includes a plurality of spaced, parallel fins 162 .
- Two opposite flanges 164 are bent and formed at two opposite lateral sides (i.e., inner and outer sides) of each fin 162 .
- the fins 162 are stacked together one above another along a direction parallel to a central axis of the centrifugal fan 20 .
- a plurality of horizontal airflow channels (not labeled) are formed between adjacent fins 162 of the fin assembly 16 .
- the flanges 164 of adjacent fins 162 abut against each other and form first and second side faces 165 , 166 at the outer and inner sides of the fin assembly 16 .
- the first and second side faces 165 , 166 are respectively parallel to the central axis of the centrifugal fan 20 .
- a portion at an end of each fin 162 which is located adjacent to the impeller 24 is cut away to thereby form an arc-shaped cutout 168 , making a length of the second side face 166 smaller than that of the first side face 165 .
- the fin assembly 16 is disposed at the air outlet 202 .
- the first side face 165 of the fin assembly 16 is in alignment with the second portion 2022 of the air outlet 202
- the second side face 166 of the fin assembly 16 is disposed in the first portion 2021 of the air outlet 202 and abuts against the side wall 262 of the base 26
- the cutout 168 of the fin assembly 16 is disposed near the impeller 24 of the centrifugal fan 20 .
- the inner side face of the condensing section 144 of the heat pipe 14 is attached to and thermally contacts the first side face 165 of the fin assembly 16 via a heat conductive material 13 .
- the heat conductive material 13 is a thermal tape.
- the heat spreader 12 absorbs heat generated from the electronic device, and the heat pipe 14 transfers heat in the heat spreader 12 to the fin assembly 16 .
- the centrifugal fan 20 draws air through the first air inlet 280 and the second air inlets 2600 into the space formed by the cover plate 28 and the base 26 .
- the air under the action of the impeller 24 is blown from the first portion 2021 of the air outlet 202 and out of the fin assembly 16 . Since the condensing section 144 of the heat pipe 14 is attached on the first side face 165 of the fin assembly 16 , the heat pipe 14 does not block the air flowing through the fin assembly 16 , and yet the thickness of the entire heat dissipation device is kept to a minimum.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An exemplary heat dissipation device includes a centrifugal fan comprising an air outlet, a fin assembly arranged at the air outlet, and a heat pipe comprising an evaporating section and a condensing section. The fin assembly comprises fins. The fins are stacked together with one above another along a central axis of the centrifugal fan. Each of the fins has at least a flange bent at a lateral side thereof. The flanges of the fins abut against each other and form a side face parallel to the central axis of the centrifugal fan. The condensing section is attached to and thermally contacts the side face of the fin assembly.
Description
- 1. Technical Field
- The disclosure relates to heat dissipation devices, and particularly to a heat dissipation device for dissipating heat generated from an electronic component.
- 2. Description of Related Art
- Nowadays, with the development of electronics technology, an electronic device such as a computer or a server is much thinner and smaller than before. Yet the device is able to hold many more electronic components than before. The electronic components generate a large amount of heat during operation. Usually a heat sink assembly is installed on a printed circuit board for cooling a major heat-generating electronic component mounted on the printed circuit board.
- Referring to
FIG. 3 , a conventional heat sink assembly is shown. The heat sink assembly includes aheat pipe 30 thermally contacting the electronic component, afin assembly 40 thermally connecting theheat pipe 30, and acentrifugal fan 50 located at a side of thefin assembly 40. Thefin assembly 40 includes a plurality of fins stacked together. Thecentrifugal fan 50 has an air inlet and an air outlet. Thecentrifugal fan 50 draws cool air through the air inlet. The cool air under the action of an impeller in thecentrifugal fan 50 is blown through and out of the air outlet towards the fins, and turns into hot air at the fins. The hot air then flows out of thefin assembly 40. However, theheat pipe 30 is attached to thefin assembly 40 by inserting and soldering an end of theheat pipe 30 inside thefin assembly 40. Therefore when the air flows through the fins of thefin assembly 40, theheat pipe 30 in thefin assembly 40 blocks some of the air from flowing out of thefin assembly 40. -
FIG. 4 shows another conventional heat sink assembly, which is similar to the above-described heat sink assembly. In this other heat sink assembly, theheat pipe 30 is attached to thefin assembly 40 by soldering an end of theheat pipe 30 on a top face of thefin assembly 40. However, this solution increases the thickness of the entire heat sink assembly and correspondingly the thickness of the electronic device. - What is needed, therefore, is a heat dissipation device which can overcome the limitations described.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the views.
-
FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the disclosure. -
FIG. 2 is an exploded view of the heat dissipation device ofFIG. 1 . -
FIGS. 3-4 are isometric views of two heat sinks in accordance with related art. - Referring to
FIG. 1 , a heat dissipation device in accordance with an embodiment of the present disclosure is shown. The heat dissipation device is adapted for cooling an electronic device (not shown) mounted on a printed circuit board (not shown), and includes aheat sink 10 and acentrifugal fan 20. - Also referring to
FIG. 2 , thecentrifugal fan 20 includes afan frame 22, and animpeller 24 mounted in thefan frame 22. Thefan frame 22 includes abase 26, and acover plate 28 covering thebase 26. Afirst air inlet 280 is defined in a central portion of thecover plate 28. A plurality of throughholes 282 is defined in a periphery of thecover plate 28. Thebase 26 includes abase plate 260, and aside wall 262 extending vertically upwardly from an outer edge of thebase plate 260. Thebase plate 260 includes afixing seat 2602 near a center thereof. Threesecond air inlets 2600 are defined in thebase plate 260 around thefixing seat 2602, corresponding to thefirst air inlet 280 of thecover plate 28. Theimpeller 24 is fixed on thefixing seat 2602 of thebase plate 260. Anair outlet 202 is defined in theside wall 262 of thebase 26, and includes afirst portion 2021 and asecond portion 2022. An angle between thefirst portion 2021 and thesecond portion 2022 is an obtuse angle. Theair outlet 202 is perpendicular to thefirst air inlet 280 and thesecond air inlet 2600. A plurality of protrudingposts 2620 protrude from a top face of theside wall 262, corresponding to the throughholes 282 of thecover plate 28. Theprotruding posts 2620 extend through the throughholes 282 of thecover plate 28 to fasten thecover plate 28 on theside wall 262. Thereby, thecover plate 28 and thebase 26 cooperatively form a space (not labeled) where theimpeller 24 is received. - The
heat sink 10 includes aheat spreader 12, aheat pipe 14, and afin assembly 16. Theheat pipe 14 is flat, and includes anevaporating section 142 attached to theheat spreader 12 and acondensing section 144 attached to thefin assembly 16. The evaporatingsection 142 has a flat top face and a flat bottom face. The top and bottom faces of the evaporatingsection 142 are parallel to each other. The bottom face of the evaporatingsection 142 thermally contacts a top face of theheat spreader 12. Thecondensing section 144 has an inner side face and an outer side face. The inner side face and the outer side face of thecondensing section 144 are parallel to each other. The inner and outer side faces of thecondensing section 144 are perpendicular to the top and bottom faces of the evaporatingsection 14. - The
heat spreader 12 is made of metal such as aluminum, copper or an alloy thereof. A bottom of the heat spreader 12 thermally contacts the electronic device to absorb heat from the electronic device. Twofastening elements 122 are disposed at two lateral sides of the top face of theheat spreader 12, for fastening theheat spreader 12 on the printed circuit board on which the electronic device is mounted. - The
fin assembly 16 includes a plurality of spaced,parallel fins 162. Twoopposite flanges 164 are bent and formed at two opposite lateral sides (i.e., inner and outer sides) of eachfin 162. Thefins 162 are stacked together one above another along a direction parallel to a central axis of thecentrifugal fan 20. A plurality of horizontal airflow channels (not labeled) are formed betweenadjacent fins 162 of thefin assembly 16. Theflanges 164 ofadjacent fins 162 abut against each other and form first and second side faces 165, 166 at the outer and inner sides of thefin assembly 16. The first and second side faces 165, 166 are respectively parallel to the central axis of thecentrifugal fan 20. A portion at an end of eachfin 162 which is located adjacent to theimpeller 24 is cut away to thereby form an arc-shaped cutout 168, making a length of thesecond side face 166 smaller than that of thefirst side face 165. - In assembly, the
fin assembly 16 is disposed at theair outlet 202. Thefirst side face 165 of thefin assembly 16 is in alignment with thesecond portion 2022 of theair outlet 202, thesecond side face 166 of thefin assembly 16 is disposed in thefirst portion 2021 of theair outlet 202 and abuts against theside wall 262 of thebase 26, and thecutout 168 of thefin assembly 16 is disposed near theimpeller 24 of thecentrifugal fan 20. The inner side face of thecondensing section 144 of theheat pipe 14 is attached to and thermally contacts thefirst side face 165 of thefin assembly 16 via a heatconductive material 13. In the illustrated embodiment, the heatconductive material 13 is a thermal tape. - During operation of the heat dissipation device, the
heat spreader 12 absorbs heat generated from the electronic device, and theheat pipe 14 transfers heat in theheat spreader 12 to thefin assembly 16. Thecentrifugal fan 20 draws air through thefirst air inlet 280 and thesecond air inlets 2600 into the space formed by thecover plate 28 and thebase 26. The air under the action of theimpeller 24 is blown from thefirst portion 2021 of theair outlet 202 and out of thefin assembly 16. Since thecondensing section 144 of theheat pipe 14 is attached on thefirst side face 165 of thefin assembly 16, theheat pipe 14 does not block the air flowing through thefin assembly 16, and yet the thickness of the entire heat dissipation device is kept to a minimum. - It is believed that the embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
Claims (20)
1. A heat dissipation device comprising:
a centrifugal fan comprising an air outlet at a lateral side thereof;
a fin assembly arranged at the air outlet, the fin assembly comprising a plurality of fins, the fins being stacked together one above another along a direction substantially parallel to a central axis of the centrifugal fan, each of the fins having at least a flange bent at a lateral side thereof, the flanges of the fins abutting each other and forming a side face substantially parallel to the central axis of the centrifugal fan; and
a heat pipe comprising an evaporating section and a condensing section, the condensing section being attached to and thermally contacting the side face of the fin assembly.
2. The heat dissipation device of claim 1 , wherein the centrifugal fan comprises a fan frame and an impeller mounted in the fan frame, the fan frame comprising a base plate, a side wall extending from an outer edge of the base plate and a cover plate connecting the side wall, the air outlet being defined in the side wall of the base, an air inlet is defined in the cover plate corresponding to the impeller.
3. The heat dissipation device of claim 1 , wherein the evaporating section and the condensing section each are flat, the evaporating section comprising a flat bottom face adapted for absorbing heat generated from a heat source, the condensing section comprising a flat side face perpendicular to the bottom face of the evaporating section, the flat side face of the condensing section thermally contacting the side face of the fin assembly.
4. The heat dissipation device of claim 3 , wherein the centrifugal fan comprises a fan frame and an impeller mounted in the fan frame, the fan frame comprising a base plate, a side wall extending from an outer edge of the base plate and a cover plate connecting the side wall, the air outlet being defined in the side wall of the base, an air inlet is defined in the cover plate corresponding to the impeller.
5. The heat dissipation device of claim 3 , further comprising a heat spreader, the bottom face of the evaporating section thermally contacting a top face of the heat spreader, a bottom face of the heat spreader being adapted for thermally contacting the heat source.
6. The heat dissipation device of claim 5 , wherein the centrifugal fan comprises a fan frame and an impeller mounted in the fan frame, the fan frame comprising a base plate, a side wall extending from an outer edge of the base plate and a cover plate connecting the side wall, the air outlet being defined in the side wall of the base, an air inlet is defined in the cover plate corresponding to the impeller.
7. The heat dissipation device of claim 6 , wherein the base plate comprises a fixing seat at a center thereof, and the impeller is fixed on the fixing seat.
8. The heat dissipation device of claim 7 , wherein a plurality of air inlets are defined in the base plate around the fixing seat, corresponding to the air inlet of the cover plate.
9. The heat dissipation device of claim 8 , wherein the air outlet is perpendicular to the air inlet of the cover plate and the air inlets of the base plate.
10. The heat dissipation device of claim 6 , wherein each fin forms an arc-shaped cutout at an end, the arc-shaped cutout is disposed near the impeller of the centrifugal fan.
11. The heat dissipation device of claim 6 , wherein the air outlet comprises a first portion and a second portion, an angle between the first portion and the second portion is an obtuse angle, the side face of the fin assembly being disposed in alignment with the second portion of the air outlet, air under an action of the impeller being blown to the fin assembly from the first portion of the air outlet.
12. The heat dissipation device of claim 1 , wherein the condensing section is flat and has a flat side face, and the flat side face of the condensing section is attached to and thermally contacts the side face of the fin assembly.
13. A heat dissipation device comprising:
a centrifugal fan comprising an air outlet at a lateral side thereof;
a fin assembly arranged at the air outlet, the fin assembly comprising a plurality of fins, the fins being stacked together one above another along a direction substantially parallel to a central axis of the centrifugal fan, each of the fins having at least a flange bent at a lateral side thereof, the flanges of the fins abutting each other and forming a side face parallel to the central axis of the centrifugal fan;
a heat pipe comprising a flat evaporating section and a flat condensing section, the evaporating section comprising a flat bottom face, the condensing section comprising a flat side face thermally contacting the side face of the fin assembly; and
a heat spreader, the bottom face of the evaporating section thermally contacting a top face of the heat spreader, a bottom face of the heat spreader being adapted for thermally contacting a heat source.
14. The heat dissipation device of claim 13 , wherein the side face of the condensing section is vertical to the bottom face of the evaporating section.
15. The heat dissipation device of claim 14 , wherein the centrifugal fan comprises a fan frame and an impeller mounted in the fan frame, the fan frame comprising a base plate, a side wall extending from an outer edge of the base plate and a cover plate connecting the side wall, the air outlet being defined in the side wall of the base, an air inlet is defined in the cover plate corresponding to the impeller.
16. The heat dissipation device of claim 15 , wherein the base plate comprises a fixing seat at a center thereof, and the impeller is fixed on the fixing seat.
17. The heat dissipation device of claim 16 , wherein a plurality of air inlets are defined in the base plate around the fixing seat, corresponding to the air inlet of the cover plate.
18. The heat dissipation device of claim 17 , wherein the air outlet is perpendicular to the air inlet of the cover plate and the air inlets of the base plate.
19. The heat dissipation device of claim 15 , wherein each fin forms an arc-shaped cutout at an end, the arc-shaped cutout is disposed near the impeller of the centrifugal fan.
20. The heat dissipation device of claim 15 , wherein the air outlet comprises a first portion and a second portion, an angle between the first portion and the second portion is an obtuse angle, the side face of the fin assembly being disposed in alignment with the second portion of the air outlet, air under an action of the impeller being blown to the fin assembly from the first portion of the air outlet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102588912A CN102378550A (en) | 2010-08-20 | 2010-08-20 | Radiating device |
| CN201010258891.2 | 2010-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20120043058A1 true US20120043058A1 (en) | 2012-02-23 |
Family
ID=45593146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/894,166 Abandoned US20120043058A1 (en) | 2010-08-20 | 2010-09-30 | Heat dissipation device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20120043058A1 (en) |
| CN (1) | CN102378550A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD718061S1 (en) * | 2014-02-12 | 2014-11-25 | Asia Vital Components Co., Ltd. | Heat pipe |
| US20180374777A1 (en) * | 2017-06-22 | 2018-12-27 | Acer Incorporated | Heat dissipation module |
| CN109219309A (en) * | 2017-07-03 | 2019-01-15 | 宏碁股份有限公司 | Heat radiation module |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107525171A (en) * | 2016-06-21 | 2017-12-29 | 丁文凯 | Semiconductor air conditioner is fanned |
| CN107454805B (en) * | 2017-08-28 | 2023-10-27 | 歌尔科技有限公司 | VR product heat radiation structure |
| CN110035640A (en) * | 2019-05-07 | 2019-07-19 | 东软医疗系统股份有限公司 | A kind of equipment cooling device |
| CN110389642A (en) * | 2019-08-27 | 2019-10-29 | 广东虹勤通讯技术有限公司 | Cooling fan and cooling device for electronic equipment and electronic equipment |
| CN113031273B (en) * | 2021-03-16 | 2023-01-20 | 歌尔股份有限公司 | Head-mounted display device and heat dissipation mechanism thereof |
| CN114850811A (en) * | 2022-03-15 | 2022-08-05 | 昆山品岱电子有限公司 | Method for processing radiator |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7265974B2 (en) * | 2004-09-16 | 2007-09-04 | Industrial Design Laboratories Inc. | Multi-heatsink integrated cooling device |
| US20070267172A1 (en) * | 2006-05-16 | 2007-11-22 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
| US20070272395A1 (en) * | 2006-05-25 | 2007-11-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US20080011454A1 (en) * | 2006-07-12 | 2008-01-17 | Ching-Bai Hwang | Heat dissipation apparatus |
| US20080105410A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
| US20080156460A1 (en) * | 2006-12-27 | 2008-07-03 | Foxconn Technology Co., Ltd. | Thermal module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7447027B2 (en) * | 2005-12-19 | 2008-11-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Hybrid heat dissipation device |
| CN101620368B (en) * | 2008-07-04 | 2011-12-28 | 富准精密工业(深圳)有限公司 | Projector with cooling system |
-
2010
- 2010-08-20 CN CN2010102588912A patent/CN102378550A/en active Pending
- 2010-09-30 US US12/894,166 patent/US20120043058A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7265974B2 (en) * | 2004-09-16 | 2007-09-04 | Industrial Design Laboratories Inc. | Multi-heatsink integrated cooling device |
| US20070267172A1 (en) * | 2006-05-16 | 2007-11-22 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
| US20070272395A1 (en) * | 2006-05-25 | 2007-11-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US20080011454A1 (en) * | 2006-07-12 | 2008-01-17 | Ching-Bai Hwang | Heat dissipation apparatus |
| US20080105410A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation apparatus |
| US20080156460A1 (en) * | 2006-12-27 | 2008-07-03 | Foxconn Technology Co., Ltd. | Thermal module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD718061S1 (en) * | 2014-02-12 | 2014-11-25 | Asia Vital Components Co., Ltd. | Heat pipe |
| US20180374777A1 (en) * | 2017-06-22 | 2018-12-27 | Acer Incorporated | Heat dissipation module |
| US10529649B2 (en) * | 2017-06-22 | 2020-01-07 | Acer Incorporated | Heat dissipation module |
| CN109219309A (en) * | 2017-07-03 | 2019-01-15 | 宏碁股份有限公司 | Heat radiation module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102378550A (en) | 2012-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20120043058A1 (en) | Heat dissipation device | |
| US7640968B2 (en) | Heat dissipation device with a heat pipe | |
| US8514574B2 (en) | Heat dissipating apparatus | |
| US7891411B2 (en) | Heat dissipation device having a fan for dissipating heat generated by at least two electronic components | |
| US7967059B2 (en) | Heat dissipation device | |
| US7613001B1 (en) | Heat dissipation device with heat pipe | |
| US8267159B2 (en) | Thermal module | |
| US7916469B2 (en) | Heat dissipation device | |
| US8804336B2 (en) | Heat disspating apparatus and electronic device | |
| US8355253B2 (en) | Electronic apparatus with heat dissipation device | |
| US20080007914A1 (en) | Heat dissipation device | |
| US8270166B2 (en) | Heat dissipation device for electronic apparatus | |
| US8120917B2 (en) | Heat dissipation device | |
| US8081458B2 (en) | Heat dissipation apparatus for electronic device | |
| US7855889B2 (en) | Resilient fastener and thermal module incorporating the same | |
| US20110261533A1 (en) | Compact heat dissipation device | |
| US20090059525A1 (en) | Heat dissipation device for computer add-on cards | |
| US20130083483A1 (en) | Heat dissipation device and electronic device using same | |
| US7663882B2 (en) | Heat dissipating assembly having a fan duct | |
| US20080128118A1 (en) | Heat dissipation device with a heat pipe | |
| US20100155023A1 (en) | Heat dissipation apparatus having heat pipes inserted therein | |
| US8562291B2 (en) | Heat dissipation device and centrifugal fan thereof | |
| US20130206367A1 (en) | Heat dissipating module | |
| JP2011091384A (en) | Heat dissipation device with heat pipeheat pipe heat radiator | |
| US20090236077A1 (en) | Heat dissipation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HWANG, CHING-BAI;XIA, BEN-FAN;REEL/FRAME:025065/0116 Effective date: 20100820 Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HWANG, CHING-BAI;XIA, BEN-FAN;REEL/FRAME:025065/0116 Effective date: 20100820 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |