CN102378550A - Radiating device - Google Patents

Radiating device Download PDF

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Publication number
CN102378550A
CN102378550A CN2010102588912A CN201010258891A CN102378550A CN 102378550 A CN102378550 A CN 102378550A CN 2010102588912 A CN2010102588912 A CN 2010102588912A CN 201010258891 A CN201010258891 A CN 201010258891A CN 102378550 A CN102378550 A CN 102378550A
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Prior art keywords
heat
heat dissipation
fin
fan
air outlet
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CN2010102588912A
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Chinese (zh)
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黄清白
夏本凡
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Furui Precise Component Kunshan Co Ltd
Hon Hai Precision Industry Co Ltd
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Furui Precise Component Kunshan Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2010102588912A priority Critical patent/CN102378550A/en
Priority to US12/894,166 priority patent/US20120043058A1/en
Publication of CN102378550A publication Critical patent/CN102378550A/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置，包括一离心式风扇、一热管及与热管的一端导热连接的一鳍片组，所述离心式风扇包括一出风口，该鳍片组设于该出风口处，该鳍片组包括若干散热鳍片，每一散热鳍片边缘弯折延伸形成至少一折边，所述散热鳍片沿离心风扇的中心轴线的方向相互叠置，各散热鳍片的折边相互抵靠而形成一与风扇的中心轴线方向相互平行的一侧面，该热管与该鳍片组的侧面导热接触。本发明的散热装置中，由于热管的一端与鳍片组的侧面导热接触，风扇产生的气流在沿着散热鳍片流动的过程中不会受到热管的干涉而受到阻扰，从而保持散热装置较高的散热效率；另外，由于热管的一端与鳍片组的侧面导热接触，不会在上下方向上额外占用空间，可以减小该散热装置的厚度。

Figure 201010258891

A heat dissipation device, comprising a centrifugal fan, a heat pipe and a fin group connected to one end of the heat pipe in heat conduction, the centrifugal fan includes an air outlet, the fin group is arranged at the air outlet, the fin The set includes several heat dissipation fins, each heat dissipation fin edge is bent and extended to form at least one folding edge, and the heat dissipation fins are stacked on each other along the direction of the central axis of the centrifugal fan, and the folding edges of each heat dissipation fin are against each other A side surface parallel to the direction of the central axis of the fan is formed, and the heat pipe is in thermal contact with the side surface of the fin set. In the heat dissipation device of the present invention, since one end of the heat pipe is in heat conduction contact with the side of the fin group, the airflow generated by the fan will not be interfered by the heat pipe during the flow along the heat dissipation fins, thereby keeping the heat dissipation device relatively stable. High heat dissipation efficiency; in addition, since one end of the heat pipe is in thermal contact with the side of the fin group, no additional space is occupied in the up and down direction, and the thickness of the heat dissipation device can be reduced.

Figure 201010258891

Description

散热装置heat sink

技术领域 technical field

本发明涉及一种散热装置，尤其涉及一种对电子元件进行散热的散热装置。The invention relates to a cooling device, in particular to a cooling device for cooling electronic components.

背景技术 Background technique

随着中央处理器(CPU)等电子元件功率的不断提高，散热问题越来越受到人们的重视，在笔记本电脑中更是如此。With the continuous improvement of the power of electronic components such as central processing unit (CPU), the problem of heat dissipation is more and more paid attention to by people, especially in notebook computers.

通常业界在电路板上安装散热装置，用以对设置在电路板上的发热电子元件散热。如图1所示，散热装置通常包括一与电子元件导热接触的热管30、与热管30导热连接的一鳍片组40及一位于该鳍片组40一侧的风扇50。该鳍片组40由若干相互间隔、平行的散热片叠设而成。该风扇50具有一进风口及一出风口，风扇50通过其进风口从其周围吸入冷空气，吸入的冷空气通过其出风口吹向并冷却散热片。然而，该散热装置中，热管30与鳍片组40的结合方式为将热管30的一端穿入焊接鳍片组40中，气流流经散热片时，热管30与鳍片组40结合的位置会阻碍气流流出鳍片组40，从而会扰乱气流的流动方向，大大影响了散热装置的散热效率。Generally, the industry installs a heat sink on the circuit board to dissipate heat from the heat-generating electronic components disposed on the circuit board. As shown in FIG. 1 , the heat dissipation device generally includes a heat pipe 30 in thermal contact with the electronic components, a fin set 40 connected to the heat pipe 30 in heat conduction, and a fan 50 located on one side of the fin set 40 . The fin set 40 is formed by stacking a plurality of mutually spaced and parallel heat sinks. The fan 50 has an air inlet and an air outlet. The fan 50 sucks in cool air from its surroundings through the air inlet, and the sucked cold air is blown to and cools the heat sink through the air outlet. However, in this cooling device, the heat pipe 30 is combined with the fin set 40 in such a way that one end of the heat pipe 30 is inserted into the welded fin set 40, and when the airflow flows through the heat sink, the joint position of the heat pipe 30 and the fin set 40 will be changed. Obstructing the air flow out of the fin set 40 disturbs the flow direction of the air flow and greatly affects the heat dissipation efficiency of the heat dissipation device.

图2所示为现有技术中的另一种散热装置，该散热装置中热管30的一端焊接在鳍片组40的上表面，该种结合方式虽然可以减小热管30扰乱出风口气流的流动方向，然而会大大增加散热装置的厚度，从而会在上下方向上额外占用电脑主机原已十分有限的空间。FIG. 2 shows another heat sink in the prior art. In this heat sink, one end of the heat pipe 30 is welded on the upper surface of the fin set 40. Although this combination can reduce the flow of the heat pipe 30 disturbing the airflow at the air outlet However, the thickness of the cooling device will be greatly increased, thereby additionally occupying the already very limited space of the computer host in the up and down direction.

发明内容 Contents of the invention

有鉴于此，有必要提供一种散热效率较高、且节省空间的散热装置。In view of this, it is necessary to provide a heat dissipation device with high heat dissipation efficiency and space saving.

一种散热装置，包括一离心式风扇、一热管及与热管的一端导热连接的一鳍片组，所述离心式风扇包括一出风口，该鳍片组设于该出风口处，该鳍片组包括若干散热鳍片，每一散热鳍片边缘弯折延伸形成至少一折边，所述散热鳍片沿离心风扇的中心轴线的方向相互叠置，各散热鳍片的折边相互抵靠而形成一与风扇的中心轴线方向相互平行的一侧面，该热管与该鳍片组的侧面导热接触。A heat dissipation device, comprising a centrifugal fan, a heat pipe and a fin group connected to one end of the heat pipe in heat conduction, the centrifugal fan includes an air outlet, the fin group is arranged at the air outlet, the fin The set includes several heat dissipation fins, each heat dissipation fin edge is bent and extended to form at least one folding edge, and the heat dissipation fins are stacked on each other along the direction of the central axis of the centrifugal fan, and the folding edges of each heat dissipation fin are against each other A side surface parallel to the direction of the central axis of the fan is formed, and the heat pipe is in thermal contact with the side surface of the fin set.

与现有技术相比，在本发明的散热装置中，由于热管的一端与鳍片组的侧面导热接触，风扇产生的气流在沿着散热鳍片流动的过程中不会受到热管的干涉而受到阻扰，从而保持散热装置较高的散热效率；另外，由于热管的一端与鳍片组的侧面导热接触，不会在上下方向上额外占用空间，可以减小该散热装置的总厚度。Compared with the prior art, in the heat dissipation device of the present invention, since one end of the heat pipe is in thermal contact with the side of the fin group, the airflow generated by the fan will not be interfered by the heat pipe during the flow along the heat dissipation fins. In addition, because one end of the heat pipe is in thermal contact with the side of the fin set, no additional space is occupied in the up and down direction, and the total thickness of the heat sink can be reduced.

下面参照附图，结合具体的实施方式对本发明作进一步的描述。The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

附图说明 Description of drawings

图1至图2是现有技术中散热装置的示意图。1 to 2 are schematic diagrams of heat dissipation devices in the prior art.

图3是本发明一较佳实施例中散热装置的组装图。FIG. 3 is an assembly diagram of a heat sink in a preferred embodiment of the present invention.

图4是图3中散热装置的分解图。FIG. 4 is an exploded view of the heat sink in FIG. 3 .

主要元件符号说明Description of main component symbols

出风口    202Air outlet 202

第一部分  2021Part 1 2021

第二部分  2022Part Two 2022

散热器    10Radiator 10

导热介质  13Heat transfer medium 13

热管      14、30Heat pipe 14, 30

蒸发段    142Evaporation section 142

冷凝段    144Condensation section 144

鳍片组    16、40Fin set 16, 40

鳍片      162Fin 162

折边      164Hem 164

缺口        168Notch 168

第一侧面    165First side 165

第二侧面    166Second side 166

风扇        20、50Fan 20, 50

扇框        22Fan frame 22

叶轮        24impeller 24

底座        26Base 26

底板        260Bottom plate 260

固定座      2602Fixed seat 2602

侧壁        262side wall 262

凸柱        2620Convex post 2620

盖板        28Cover 28

第二进风口  2600Second air inlet 2600

第一进风口  280The first air inlet 280

通孔        282Via 282

吸热板      12Heat absorbing plate 12

固定件      122Fixing piece 122

具体实施方式 Detailed ways

请参阅图3，本发明一较佳实施例的散热装置可对安装在一主机板(图未示)上的一电子元件(图未示)进行散热。该散热装置包括一散热器10及一离心式风扇20。Please refer to FIG. 3 , a heat dissipation device according to a preferred embodiment of the present invention can dissipate heat from an electronic component (not shown) mounted on a motherboard (not shown). The cooling device includes a radiator 10 and a centrifugal fan 20 .

请同时参阅图4，所述风扇20包括一扇框22及位于扇框22内的一叶轮24。扇框22包括一底座26及罩设于该底座26上的一盖板28。一第一进风口280设于盖板28上，盖板28的周缘开设若干通孔282。该底座26包括一底板260及沿底板260外缘垂直向上延伸的一侧壁262。底板260中间设有一第二进风口2600，该第二进风口2600与第一进风口280上下相对。一固定座2602设于该第二进风口2600内，该叶轮24固定在该固定座2602上。一出风口202设于该底座26的侧壁262上，该出风口202包括一第一部分2021及一第二部分2022。所述第一部分2021和第二部分2022分别呈直线状，且第一部分2021与第二部分2022之间的夹角为钝角。该出风口202与第一进风口280及第二进风口2600相互垂直设置。底座26的侧壁262的上端面对应盖板28的通孔282处形成若干凸柱2620，用以穿过盖板28的通孔282将盖板28固定在底座26的侧壁262上，从而盖板28与底座26共同形成一容置叶轮24的腔室(未标号)。Please also refer to FIG. 4 , the fan 20 includes a fan frame 22 and an impeller 24 inside the fan frame 22 . The fan frame 22 includes a base 26 and a cover 28 covering the base 26 . A first air inlet 280 is disposed on the cover plate 28 , and a plurality of through holes 282 are defined around the cover plate 28 . The base 26 includes a bottom plate 260 and a sidewall 262 vertically extending upward along an outer edge of the bottom plate 260 . A second air inlet 2600 is disposed in the middle of the bottom plate 260 , and the second air inlet 2600 is vertically opposite to the first air inlet 280 . A fixing seat 2602 is disposed in the second air inlet 2600 , and the impeller 24 is fixed on the fixing seat 2602 . An air outlet 202 is disposed on the side wall 262 of the base 26 , and the air outlet 202 includes a first portion 2021 and a second portion 2022 . The first portion 2021 and the second portion 2022 are respectively straight, and the angle between the first portion 2021 and the second portion 2022 is an obtuse angle. The air outlet 202 is perpendicular to the first air inlet 280 and the second air inlet 2600 . The upper end surface of the side wall 262 of the base 26 corresponds to the through hole 282 of the cover plate 28 to form a plurality of protrusions 2620 for passing through the through hole 282 of the cover plate 28 to fix the cover plate 28 on the side wall 262 of the base 26. Thus, the cover plate 28 and the base 26 together form a chamber (not numbered) for accommodating the impeller 24 .

该散热器10包括一吸热板12、一热管14、及一鳍片组16。所述热管14被压成扁平状，其具有一蒸发段142与一冷凝段144。该蒸发段142具有一平面状的上表面及一平面状的下表面，该蒸发段142的上、下表面均与水平面平行，该蒸发段142的下表面与吸热板12的上表面导热接触。冷凝段144具有相互平行的一前侧面及一后侧面，该冷凝段144的前侧面及后侧面与该蒸发段142的上表面及下表面相互垂直，该冷凝段144的后侧面与鳍片组16的一侧面导热接触。The heat sink 10 includes a heat absorbing plate 12 , a heat pipe 14 , and a fin set 16 . The heat pipe 14 is pressed into a flat shape, and has an evaporating section 142 and a condensing section 144 . The evaporating section 142 has a planar upper surface and a planar lower surface, the upper and lower surfaces of the evaporating section 142 are parallel to the horizontal plane, and the lower surface of the evaporating section 142 is in thermal contact with the upper surface of the heat absorbing plate 12 . The condensation section 144 has a front side and a rear side parallel to each other. The front side and the rear side of the condensation section 144 are perpendicular to the upper surface and the lower surface of the evaporation section 142. The rear side of the condensation section 144 is connected to the fin assembly. One side of 16 is in thermal contact.

所述吸热板12由铁、铝等导热材料制成。该吸热板12的下表面与主机板上的电子元件导热接触。该吸热板12的上表面的相对两侧设有二固定件122，用来将吸热板12安装在主机板上。The heat-absorbing plate 12 is made of heat-conducting materials such as iron and aluminum. The lower surface of the heat absorbing plate 12 is in thermal contact with the electronic components on the motherboard. Two fixing parts 122 are disposed on opposite sides of the upper surface of the heat absorbing board 12 for mounting the heat absorbing board 12 on the main board.

所述鳍片组16由若干相互间隔、平行的散热鳍片162叠设而成。每一散热鳍片162前后相对两侧形成折边164，所述散热鳍片162沿风扇20中心轴线的方向上下叠置，相邻散热鳍片162的折边164相互抵靠而形成鳍片组16前后的两相对第一、第二侧面165、166。所述第一、第二侧面165、166分别与风扇20的中心轴线的方向平行。每一散热鳍片162靠近风扇20的一端被切除一部分而形成一弧形的缺口168，使得第二侧面166的长度小于第一侧面165的长度。各相邻的散热鳍片162左右两侧之间形成若干气流通道(未标号)，该等气流通道沿上、下方向排列。组装时，该鳍片组16设于风扇20的出风口202处，其中，该鳍片组16的第一侧面165与出风口202的第二部分2022对齐并顺沿该第二部分2022向远离出风口202的方向向外延伸，而第二侧面166与该出风口202的第一部分2021远离该第二部分2022的一端相互接触并向外延伸，该鳍片组16的缺口168靠近风扇20的叶轮24。热管14的冷凝段144的后侧面通过导热介质13与鳍片组16的第一侧面165导热接触，用以将热量传递给鳍片组16，利用鳍片组16的较大的散热面积将热量散发至周围空气中。The fin set 16 is formed by stacking a plurality of mutually spaced and parallel cooling fins 162 . Flanges 164 are formed on opposite sides of each heat dissipation fin 162. The heat dissipation fins 162 are stacked up and down along the direction of the central axis of the fan 20. The folded edges 164 of adjacent heat dissipation fins 162 abut against each other to form a fin group. The two opposing first and second sides 165, 166 at the front and rear of 16. The first and second side surfaces 165 , 166 are respectively parallel to the central axis of the fan 20 . One end of each cooling fin 162 close to the fan 20 is cut away to form an arc-shaped notch 168 , so that the length of the second side 166 is smaller than the length of the first side 165 . Several airflow passages (not labeled) are formed between the left and right sides of each adjacent cooling fin 162 , and the airflow passages are arranged along the up and down directions. When assembled, the fin set 16 is disposed at the air outlet 202 of the fan 20, wherein the first side 165 of the fin set 16 is aligned with the second portion 2022 of the air outlet 202 and moves away from the second portion 2022 along the direction. The direction of the air outlet 202 extends outward, and the second side 166 contacts with the end of the first part 2021 of the air outlet 202 away from the second part 2022 and extends outward. The notch 168 of the fin set 16 is close to the fan 20 impeller 24. The rear side of the condensation section 144 of the heat pipe 14 is in thermal contact with the first side 165 of the fin set 16 through the heat conduction medium 13, so as to transfer heat to the fin set 16, and utilize the larger heat dissipation area of the fin set 16 to dissipate the heat Emit into the surrounding air.

散热装置工作时，该吸热板12吸收电子元件产生的热量，热管14将吸收的热量传递给鳍片组16。风扇20同时从第一进风口280及第二进风口2600将外界空气吸入盖板28与底座26共同形成的腔室内，气流在叶轮24的作用下沿着出风口202的第一部分2021被吹向鳍片组16，并沿着鳍片162间的气流通道吹出。由于热管14的冷凝段144贴设在鳍片组16的前侧面上，气流在沿着鳍片162间的气流通道流动的过程中不会受到热管14的干涉而受到阻扰，从而保持散热装置较高的散热效率。另外，热管14的冷凝段144贴设在鳍片组16的前侧面上不会在上下方向上额外占用空间，从而可以减小该散热装置的总厚度。When the heat sink works, the heat absorbing plate 12 absorbs the heat generated by the electronic components, and the heat pipe 14 transmits the absorbed heat to the fin group 16 . The fan 20 sucks outside air from the first air inlet 280 and the second air inlet 2600 into the cavity formed by the cover plate 28 and the base 26 at the same time, and the airflow is blown to Fin set 16, and blow out along the airflow channel among the fins 162. Since the condensing section 144 of the heat pipe 14 is attached to the front side of the fin group 16, the airflow will not be interfered by the heat pipe 14 and hindered during the flow along the airflow passage between the fins 162, thereby maintaining the heat dissipation device. High cooling efficiency. In addition, the condensing section 144 of the heat pipe 14 is attached to the front side of the fin assembly 16 without occupying additional space in the vertical direction, thereby reducing the overall thickness of the heat sink.

Claims (7)

1.一种散热装置，包括一离心式风扇、一热管及与热管的一端导热连接的一鳍片组，所述离心式风扇包括一出风口，该鳍片组设于该出风口处，该鳍片组包括若干散热鳍片，每一散热鳍片边缘弯折延伸形成至少一折边，其特征在于：所述散热鳍片沿离心风扇的中心轴线的方向相互叠置，各散热鳍片的折边相互抵靠而形成一与风扇的中心轴线方向相互平行的一侧面，该热管与该鳍片组的侧面导热接触。1. A heat dissipation device, comprising a centrifugal fan, a heat pipe and a fin group connected to one end of the heat pipe through heat conduction, the centrifugal fan includes an air outlet, the fin group is arranged at the air outlet, the The fin group includes several cooling fins, and the edge of each cooling fin is bent and extended to form at least one folding edge. It is characterized in that: the cooling fins overlap each other along the direction of the central axis of the centrifugal fan, and The folded edges abut against each other to form a side surface parallel to the direction of the central axis of the fan, and the heat pipe is in thermal contact with the side surface of the fin set. 2.如权利要求1所述的散热装置，其特征在于：所述热管具有一扁平的蒸发段与一扁平的冷凝段，该蒸发段具有一平面状的下表面，该蒸发段的下表面用于吸收热源产生的热量，冷凝段具有一垂直于蒸发段的下表面的侧面，冷凝段的该侧面与鳍片组的该侧面导热接触。2. The heat dissipation device according to claim 1, wherein the heat pipe has a flat evaporating section and a flat condensing section, the evaporating section has a planar lower surface, and the lower surface of the evaporating section is used for In order to absorb the heat generated by the heat source, the condensing section has a side perpendicular to the lower surface of the evaporating section, and the side of the condensing section is in thermal contact with the side of the fin set. 3.如权利要求2所述的散热装置，其特征在于：还包括一吸热板，该吸热板的上表面与热管的蒸发段的下表面导热接触，该吸热板的下表面用于与热源导热接触。3. The heat dissipation device according to claim 2, further comprising a heat absorbing plate, the upper surface of the heat absorbing plate is in thermal contact with the lower surface of the evaporation section of the heat pipe, and the lower surface of the heat absorbing plate is used for In thermal contact with heat source. 4.如权利要求1至3任意一项所述的散热装置，其特征在于：所述离心式风扇包括一扇框及安装于扇框内的一叶轮，所述扇框包括一底板、一盖板及位于该底板与盖板之间的一侧壁，所述出风口设在该侧壁上，该盖板上对应叶轮设有一第一进风口，所述鳍片组夹置在风扇的盖板和底板之间，鳍片组的一端内凹形成一弧形缺口，该鳍片组的缺口靠近风扇的叶轮。4. The heat dissipation device according to any one of claims 1 to 3, wherein the centrifugal fan comprises a fan frame and an impeller installed in the fan frame, and the fan frame includes a bottom plate and a cover plate and a side wall located between the base plate and the cover plate, the air outlet is arranged on the side wall, the cover plate is provided with a first air inlet corresponding to the impeller, and the fin group is clamped on the cover of the fan Between the plate and the bottom plate, one end of the fin group is recessed to form an arc-shaped notch, and the notch of the fin group is close to the impeller of the fan. 5.如权利要求4所述的散热装置，其特征在于：所述底板中间设有一第二进风口，该第二进风口与第一进风口上下相对，一固定座设于该第二进风口内，该叶轮固定在该固定座上。5. The heat dissipation device according to claim 4, wherein a second air inlet is provided in the middle of the bottom plate, the second air inlet is vertically opposite to the first air inlet, and a fixing seat is arranged on the second air inlet Inside, the impeller is fixed on the fixing seat. 6.如权利要求5所述的散热装置，其特征在于：所述出风口与第一进风口及第二进风口相互垂直设置。6 . The heat dissipation device according to claim 5 , wherein the air outlet, the first air inlet and the second air inlet are perpendicular to each other. 6 . 7.如权利要求4所述的散热装置，其特征在于：所述出风口包括一第一部分及一第二部分，所述第一部分和第二部分分别呈直线状，且第一部分与第二部分之间的夹角为钝角，气流沿着出风口的第一部分吹向鳍片组，该鳍片组的侧面与出风口的第二部分对齐并顺沿该第二部分向远离出风口的方向向外延伸。7. The heat dissipation device according to claim 4, wherein the air outlet comprises a first part and a second part, the first part and the second part are linear respectively, and the first part and the second part The angle between them is an obtuse angle, the airflow blows to the fin group along the first part of the air outlet, the side of the fin group is aligned with the second part of the air outlet and moves along the second part to the direction away from the air outlet. extend outside.
CN2010102588912A 2010-08-20 2010-08-20 Radiating device Pending CN102378550A (en)

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