CN109275309A - Radiating module and motherboard component comprising it - Google Patents
Radiating module and motherboard component comprising it Download PDFInfo
- Publication number
- CN109275309A CN109275309A CN201710586562.2A CN201710586562A CN109275309A CN 109275309 A CN109275309 A CN 109275309A CN 201710586562 A CN201710586562 A CN 201710586562A CN 109275309 A CN109275309 A CN 109275309A
- Authority
- CN
- China
- Prior art keywords
- mask
- expansion board
- cooling fin
- electric connector
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
Abstract
A kind of radiating module and the motherboard component comprising it, the motherboard component include a circuit board, an expansion board and a radiating module.Circuit board includes a substrate and an electric connector, and electric connector is set to substrate.Expansion board is connected to electric connector.Radiating module includes a cooling fin, a mask and a fan.Cooling fin thermally contacts expansion board.Mask is stacked at cooling fin, and a heat dissipation chamber is collectively formed in mask and cooling fin.Mask has a corresponding first through hole and one second through-hole.Fan is set to mask, and fan is located in heat dissipation cavity room.The present invention can heat radiation module to the heat dissipation of expansion board, and then maintain the working efficiency of expansion board, and extend the service life of expansion board.
Description
Technical field
The present invention is about a kind of radiating module and includes its motherboard component, especially a kind of heat dissipation that can stop waste heat
Module and motherboard component comprising it.
Background technique
With the technology continuous evolution of electronic field, the efficiency of electronic device is also constantly promoted.Wherein, M.2 connector is advised
Model system is the interface standard of new generation developed in recent years, uses more flexible specification, allows a greater variety of Module specifications
Connection, and can arrange in pairs or groups with the interface of higher order.For example, it is applicable to serial ATA (Serial Advanced
Technology Attachment, SATA) and mini peripheral interconnection standard (Mini Peripheral Component
Interconnect Express, MiniPCIe) etc. channels.Therefore, there can be more preferably convenience and higher in use
Efficiency.In addition, the technology with Related product is more and more mature, price is also more and more human-oriented, therefore is advised using M.2 connector
The expanding device of model is more and more universal and popular in recent years.
In general, the enhancing efficiency of electronic component, generated heat just will increase.These heats will continue to accumulate
It is increased in the temperature for leading to element on electronic component itself.If the temperature of electronic component can not effectively be allowed to decline, may lead
It causes element fault and damage and reduces its service life.Therefore, high-effect at these and be also easy to produce the electronic component of a large amount of thermal energy
On, it will usually the radiator of setting such as cooling fin is to radiate to it.However, radiator gives out electronic element radiating
Waste heat will also tend to the electronic component to arround and have an impact.For example, radiator meeting when radiating to display adapter
Waste heat is bled around, so that the expanding devices such as neighbouring M.2 solid state hard disk are influenced by this waste heat and reduce dissipating for itself
Thermal efficiency, and then the working efficiency of expanding device is influenced, and will increase the probability of expanding device damage.Therefore, how one is provided
Kind of radiator, can effectively stop the waste heat of periphery electronic component, and can exclude the heat of expanding device itself, then for
Research staff one of should solve the problems, such as.
Summary of the invention
The invention reside in provide a kind of radiating module and comprising its motherboard component, use solution and expand in the prior art
The problem of device is influenced by periphery electronic component waste heat and reduces the heat dissipation and working efficiency of itself.
Motherboard component disclosed in one embodiment of the invention includes a circuit board, an expansion board and a radiating mould
Block.Circuit board includes a substrate and an electric connector, and electric connector is set to substrate.Expansion board is connected to electric connector.
Radiating module includes a cooling fin, a mask and a fan.Cooling fin thermally contacts expansion board.Mask is stacked at cooling fin, and
A heat dissipation chamber is collectively formed with cooling fin in shielding.Shielding has a corresponding first through hole and one second through-hole.Fan setting
In mask, and fan is located in heat dissipation cavity room.
Motherboard component of the present invention, wherein the circuit board further includes a stud and a screw, stud setting
A distance is kept in the substrate and with the electric connector, the mask, the cooling fin and the expansion board, which all have, corresponds to the spiral shell
One aperture of column, the screw wear the aperture and are locked in the stud.
Motherboard component of the present invention, wherein the mask have far from the electric connector a first side and
Close to a second side of the electric connector, which is located at the first side, which is located at the second side.
Motherboard component of the present invention, wherein the mask has the first side far from the electric connector, this
One through-hole and second through-hole are all located at the first side.
Motherboard component of the present invention, wherein the mask have far from the electric connector a first side and
Close to a second side of the electric connector, the fan be less than with the first side at a distance from the fan and the second side away from
From.
Motherboard component of the present invention, wherein the cooling fin includes a plate body and multiple projective structures, the protrusion
Structure is located at side of the plate body far from the expansion board.
Motherboard component of the present invention, wherein the radiating module further includes a thermal paste, which is located at the expansion
It fills between card and the cooling fin.
Motherboard component of the present invention, wherein the expansion board is the expanding device for being applicable in M.2 connector specification.
Motherboard component of the present invention, wherein the expansion board is to be applicable in mini peripheral interconnection standard channel
One expanding device.Radiating module disclosed in another embodiment of the present invention, suitable for being set to an expansion board.Expansion board is connected to
One electric connector of one circuit board.Radiating module includes a cooling fin, a mask and a fan.Cooling fin expands to thermally contact
Fill card.Mask is stacked at cooling fin, and a heat dissipation chamber is collectively formed in mask and cooling fin.Mask has corresponding one first to lead to
Hole and one second through-hole.Fan is set to mask, and fan is located in heat dissipation cavity room.
Beneficial effects of the present invention:
The radiating module according to above-described embodiment and the motherboard component comprising it, by setting mask in expansion
On card, facilitate the waste heat for stopping periphery electronic component；In addition, through-hole is opened up on mask position appropriate, to avoid periphery
The diffusion path of electronic component waste heat, and cooperate the setting of fan, the cross-ventilation of heat dissipation chamber and exterior space can be reinforced.By
This, can heat radiation module to the heat dissipation of expansion board, and then maintain the working efficiency of expansion board, and extend making for expansion board
Use the service life.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the motherboard component according to the first embodiment of the present invention.
Fig. 2 is the decomposition diagram of the motherboard component of Fig. 1.
Fig. 3 is the lateral sectional view of the motherboard component of Fig. 1.
Fig. 4 is the lateral sectional view of the motherboard component according to the second embodiment of the present invention.
Wherein, appended drawing reference:
1,1a motherboard component
10 circuit boards
110 substrates
130 electric connectors
131 joint faces
133 slots
150 studs
170 screws
30 expansion boards
31 semicircle apertures
50 radiating modules
510 cooling fins
511 plate bodys
513 projective structures
515 first apertures
530 thermal pastes
550,550a mask
551,551a heat dissipation chamber
552 extension boards
553,553a first side
555,555a second side
556a third through-hole
557,557a first through hole
558, the second through-hole of 558a
559 second apertures
560 gaskets
570,570a fan
D1 first distance
D2 second distance
Specific embodiment
The following embodiment viewpoint that present invention be described in more detail, but it is non-anyways to limit scope of the invention.
It please refers to Fig.1 to Fig.3.Fig. 1 is the stereoscopic schematic diagram of the motherboard component according to first embodiment of the invention.
Fig. 2 is the decomposition diagram of the motherboard component of Fig. 1.Fig. 3 is the lateral sectional view of the motherboard component of Fig. 1.
The motherboard component 1 of the present embodiment includes a circuit board 10, an expansion board 30 and a radiating module 50.
Circuit board 10 includes a substrate 110, an electric connector 130, a stud 150 and a screw 170.Electric connector
130 and stud 150 be all set to substrate 110, and electric connector 130 and stud 150 keep a distance.In this present embodiment, expand
Stud 150 can be locked in by screw 170 by filling card 30 and radiating module 50.
Electric connector 130 have a joint face 131 and a slot 133, direction of the joint face 131 towards stud 150, and
Slot 133 is opened on joint face 131.
Expansion board 30 is inserted in the slot 133 of electric connector 130, and expansion board 30 has far from one end of electric connector 130
There is half circular opening 31.Screw 170 can wear semicircle aperture 31 and be locked in stud 150, and then expansion board 30 is fixed.
In this present embodiment, electric connector 130 is by taking M.2 socket connector as an example, and expansion board 30 is to be applicable in M.2 connector
Specification and mini peripheral interconnection standard (Mini Peripheral Component Interconnect Express,
MiniPCIe) for the M.2 Ssd apparatus in channel, but invention is not limited thereto.In other embodiments, electric connector
It may be, for example, mSATA (mini Serial advanced technology attachment) standard connector；Expansion board can
For example, it is applicable in serial ATA (Serial Advanced Technology Attachment, SATA) or universal serial bus
M.2 the expanding device or mSATA expanding device in the channel (Universal Serial Bus, USB).
Radiating module 50 includes a cooling fin 510, a thermal paste 530, a mask 550 and a fan 570.
Cooling fin 510 is set on expansion board 30, and thermal paste 530 is between expansion board 30 and cooling fin 510.Into one
For step, cooling fin 510 thermally contacts expansion board 30 by thermal paste 530.Cooling fin 510 includes a plate body 511 and multiple
Projective structure 513, the projective structure 513 are located at side of the plate body 511 far from expansion board 30.It as a result, can by projective structure 513
The contact area for increasing cooling fin 510 and air makes the air of flowing that can take away more heats on cooling fin 510 simultaneously, with
Reach preferable heat radiation function.In addition, cooling fin 510 has more one first aperture 515 corresponding to stud 150, screw 170 can
It wears the first aperture 515 and is locked in stud 150, with fixing cooling fins 510.
In this present embodiment, radiating module 50 includes thermal paste 530, but invention is not limited thereto.In other embodiments
In, radiating module can not include thermal paste, and cooling fin is made directly to contact expansion board.In addition, being to radiate in this present embodiment
For piece 510 includes multiple projective structures 513, but invention is not limited thereto.In other embodiments, cooling fin can not include
Projective structure.
Mask 550 is stacked at cooling fin 510, and a heat dissipation chamber 551 is collectively formed in mask 550 and cooling fin 510.Mask
550 have the first side 553 far from electric connector 130 and the second side 555 close to electric connector 130, and hide
Cover 550 has multiple first through hole 557 and one second through-hole 558.These first through hole 557 of mask 550 are located at the first side
Face 553, and the second through-hole 558 is located at second side 555.The chamber 551 that radiates passes through these first through hole 557 and the second through-hole
558 connection exterior spaces, so that 550 inner air and outer air of mask can circulate mutually.In general, the electronic component on 30 periphery of expansion board
The left and right sides of expansion board 30 is arranged in (not being painted), therefore first through hole 557 and the second through-hole 558 are provided with mask respectively
On 550 side of front and back two (that is, first side 553 and second side 555), the waste heat to avoid periphery electronic component is straight
It connects and flows to through-hole and enter heat dissipation chamber 551；Mask 550 can effectively stop the waste heat of periphery electronic component as a result, and can pass through
First through hole 557 and the second through-hole 558 in first side 553 and second side 555 reach the function of ventilation and heat.In addition,
Mask 550 further includes an extension board 552 and one second aperture 559.Extension board 552 is adjacent to first side 553 and along first
The normal of side 553 extends to the direction far from electric connector 130.Second aperture 559 is opened in extension board 552 corresponding to stud
150 position, screw 170 can wear the second aperture 559 and be locked in stud 150, with stationary shroud 550.
In this present embodiment, the material of mask 550 is by taking plastics as an example, but invention is not limited thereto.In other implementations
In example, mask can be made of the material of other low heat conductivities.
Fan 570 is set to mask 550 and is located in heat dissipation chamber 551, and the 1 of fan 570 and first side 553 the
One distance D1 is less than a second distance D2 of fan 570 and second side 555.In addition, can between fan 570 and mask 550
Multiple pads 560 are provided with, so as to keep a spacing between fan 570 and mask 550, enter fan 570 for air circulation.
As shown in figure 3, in this present embodiment, the joint face 131 of electric connector 130 shelters from the second through-hole of part 558, so that second is logical
The area that hole 558 can allow air-flow to pass through is less than the area that first through hole 557 can allow air-flow to pass through.Therefore, by the neighbouring screening of fan 570
It is arranged at the first side 553 of cover 550, air can be made to be increased by the flow that first through hole 557 enters heat dissipation chamber 551, to reach
To more preferably heat dissipation effect.
It in this present embodiment, is so that fan 570 is set to mask 550 at first side 553 as an example, but the present invention is not
As limit.In other embodiments, visual actual demand and adjust the position that fan is set in mask.
In addition, in this present embodiment, air is to enter heat dissipation chamber 551 from the first side 553 of mask 550, and by the
Two side faces 555 flow out, and form an air flow path, but invention is not limited thereto.In other embodiments, air can be in mask
Same side disengaging.
Referring to Fig. 4, being the lateral sectional view of the motherboard component according to second embodiment of the invention.The present embodiment
Motherboard component 1a it is similar to the motherboard component 1 of first embodiment, difference be the fan 570a of the present embodiment close to
The first side 553a of mask 550a is arranged, and first through hole 557a and the second through-hole 558a are all located at the first side of mask 550a
Face 553a.Wherein, first through hole 557a and the second through-hole 558a is respectively air inlet and venthole.In addition, mask 550a has more
There is a third through-hole 556a, and third through-hole 556a is located at the second side 555a of mask 550a.In this way, when fan 570a is operated
When, air enters heat dissipation chamber 551a from first through hole 557a and is flowed out by the second through-hole 558a and form an air flow path；This
Outside, air also can pass in and out mask 550a via third through-hole 556a and form another air flow path, thus can disperse to arrange by waste heat
Mask 550a out, in response to radiating requirements needed for different machines.
In this present embodiment, be by mask 550a in second side 555a have third through-hole 556a for, but the present invention
It is not limited.In other embodiments, the second side of mask can not have through-hole, and only in first side have through-hole with
For air circulation.
According to the radiating module of above-described embodiment and comprising its motherboard component, by setting mask on expansion board,
Facilitate the waste heat for stopping periphery electronic component；Further, since the electronic component on expansion board periphery is generally located on expansion board
The left and right sides, therefore through-hole is provided on the side of front and back two of mask, to avoid the diffusion path of periphery electronic component waste heat,
And cooperate the setting of fan, the cross-ventilation of heat dissipation chamber and exterior space can be reinforced；Furthermore pass through the protrusion knot on cooling fin
Structure can increase the contact area of cooling fin and air, make the air of flowing that can take away more heats on cooling fin simultaneously.By
This, can heat radiation module to the heat dissipation of expansion board, and then maintain the working efficiency of expansion board, and extend making for expansion board
Use the service life.
In addition, can be by same spiral shell by the feature and expansion board that are set to fan on mask, cooling fin and mask
Silk is locked in the feature on stud, can promote the convenience of expansion board dismounting.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
Various corresponding changes and modifications, but these corresponding changes and modifications can be made according to the present invention by knowing those skilled in the art
It all should belong to the protection scope of the claims in the present invention.
Claims (10)
1. a kind of motherboard component, which is characterized in that the motherboard component includes:
One circuit board, includes a substrate and an electric connector, which is set to the substrate；
One expansion board is connected to the electric connector；And
One radiating module includes:
One cooling fin thermally contacts the expansion board；
One mask is stacked at the cooling fin, and a heat dissipation chamber is collectively formed in the mask and the cooling fin, and the mask has correspondence
A first through hole and one second through-hole；And
One fan is set to the mask, and the fan is located in the heat dissipation cavity room.
2. motherboard component as described in claim 1, which is characterized in that the circuit board further includes a stud and a screw,
The stud is set to the substrate and keeps a distance with the electric connector, and the mask, the cooling fin and the expansion board all have phase
Corresponding to an aperture of the stud, which wears the aperture and is locked in the stud.
3. motherboard component as described in claim 1, which is characterized in that the mask has one first far from the electric connector
One second side of side and the close electric connector, the first through hole are located at the first side, which is located at should
Second side.
4. motherboard component as described in claim 1, which is characterized in that the mask has one first far from the electric connector
Side, the first through hole and second through-hole are all located at the first side.
5. motherboard component as described in claim 1, which is characterized in that the mask has one first far from the electric connector
Side and close to the electric connector a second side, the fan with the first side at a distance from be less than the fan with this second
The distance of side.
6. motherboard component as described in claim 1, which is characterized in that the cooling fin includes that a plate body and multiple protrusions are tied
Structure, the projective structure are located at side of the plate body far from the expansion board.
7. motherboard component as described in claim 1, which is characterized in that the radiating module further includes a thermal paste, the heat dissipation
Glue is located between the expansion board and the cooling fin.
8. motherboard component as described in claim 1, which is characterized in that the expansion board is to be applicable in the one of M.2 connector specification
Expanding device.
9. motherboard component as described in claim 1, which is characterized in that the expansion board is to be applicable in mini peripheral interconnection mark
One expanding device in quasi- channel.
10. a kind of radiating module, suitable for being set to an expansion board, which is connected to an electric connector of a circuit board,
It is characterized in that, which includes:
One cooling fin, to thermally contact the expansion board；
One mask is stacked at the cooling fin, and a heat dissipation chamber is collectively formed in the mask and the cooling fin, and the mask has correspondence
A first through hole and one second through-hole；And
One fan is set to the mask, and the fan is located in the heat dissipation cavity room.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710586562.2A CN109275309B (en) | 2017-07-18 | 2017-07-18 | Heat dissipation module and host board assembly comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710586562.2A CN109275309B (en) | 2017-07-18 | 2017-07-18 | Heat dissipation module and host board assembly comprising same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109275309A true CN109275309A (en) | 2019-01-25 |
| CN109275309B CN109275309B (en) | 2020-09-08 |
Family
ID=65152815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710586562.2A Active CN109275309B (en) | 2017-07-18 | 2017-07-18 | Heat dissipation module and host board assembly comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109275309B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275309B (en) * | 2017-07-18 | 2020-09-08 | 技嘉科技股份有限公司 | Heat dissipation module and host board assembly comprising same |
| CN115083447A (en) * | 2021-03-12 | 2022-09-20 | 英业达科技有限公司 | Heat sink device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11186769A (en) * | 1997-10-02 | 1999-07-09 | Samsung Electron Co Ltd | Heat radiator and computer system |
| CN2792115Y (en) * | 2005-05-06 | 2006-06-28 | 纽福克斯光电科技（上海）有限公司 | Super-miniature superthin converter |
| CN1897804A (en) * | 2005-07-15 | 2007-01-17 | 撼讯科技股份有限公司 | Auxiliary radiator |
| CN201387577Y (en) * | 2009-03-25 | 2010-01-20 | 馨意科技股份有限公司 | Heat-dissipating device of notebook computer |
| CN102200807A (en) * | 2010-03-25 | 2011-09-28 | 鸿富锦精密工业（深圳）有限公司 | Expansion card heat insulation shield |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275309B (en) * | 2017-07-18 | 2020-09-08 | 技嘉科技股份有限公司 | Heat dissipation module and host board assembly comprising same |
-
2017
- 2017-07-18 CN CN201710586562.2A patent/CN109275309B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11186769A (en) * | 1997-10-02 | 1999-07-09 | Samsung Electron Co Ltd | Heat radiator and computer system |
| CN2792115Y (en) * | 2005-05-06 | 2006-06-28 | 纽福克斯光电科技（上海）有限公司 | Super-miniature superthin converter |
| CN1897804A (en) * | 2005-07-15 | 2007-01-17 | 撼讯科技股份有限公司 | Auxiliary radiator |
| CN201387577Y (en) * | 2009-03-25 | 2010-01-20 | 馨意科技股份有限公司 | Heat-dissipating device of notebook computer |
| CN102200807A (en) * | 2010-03-25 | 2011-09-28 | 鸿富锦精密工业（深圳）有限公司 | Expansion card heat insulation shield |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275309B (en) * | 2017-07-18 | 2020-09-08 | 技嘉科技股份有限公司 | Heat dissipation module and host board assembly comprising same |
| CN115083447A (en) * | 2021-03-12 | 2022-09-20 | 英业达科技有限公司 | Heat sink device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109275309B (en) | 2020-09-08 |
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Address after: Taiwan Xindian District, New Taipei City Chinese Po Road No. 6 Applicant after: GIGA-BYTE TECHNOLOGY Co.,Ltd. Address before: Chinese Taiwan Taipei City store Bao Jiang Road No. 6 Applicant before: GIGA-BYTE TECHNOLOGY Co.,Ltd. |
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