CN115083447A

CN115083447A - Heat sink device

Info

Publication number: CN115083447A
Application number: CN202110272071.7A
Authority: CN
Inventors: 王水源; 陈家震
Original assignee: Inventec Pudong Technology Corp; Inventec Corp
Current assignee: Inventec Pudong Technology Corp; Inventec Corp
Priority date: 2021-03-12
Filing date: 2021-03-12
Publication date: 2022-09-20

Abstract

The invention provides a heat dissipation device, which comprises a substrate, a connector, an expansion unit, a heat dissipation sheet and a fixing piece. The substrate has a first through hole. The connector is arranged on the substrate, wherein the connector is provided with a slot and two first hook bodies, and the two first hook bodies are arranged on two corresponding sides of the connector. The expansion unit is inserted into the slot and is positioned between the first through hole and the connector. The radiating fin is arranged on the expansion unit and is provided with two second hook bodies and second through holes, wherein the two second hook bodies are arranged on two corresponding sides of the radiating fin, and the two first hook bodies are respectively clamped with the two second hook bodies. The fixing piece penetrates through the first through hole and the second through hole, and the fixing piece and the connector fix the radiating fin on the expansion unit together. The invention can replace the conventional fixing method of the heat sink and the connector, improve the assembly efficiency, save the cost and further increase the product competitiveness.

Description

Heat sink device

Technical Field

The present invention relates to a heat dissipation device, and more particularly, to a heat dissipation device for an expansion unit (e.g., a solid state disk).

Background

The expansion unit is used for providing more expansion functions for the computer, such as an image display adapter, a solid state disk and the like. Because the heat dissipation requirement of the expansion unit is getting bigger and bigger, the conventional heat sink is fixed on the expansion unit by means of adhesion, which is not in accordance with the requirement. For example, the stability of the mounting is insufficient or not convenient enough, and the bonding force is insufficient to reduce the heat dissipation efficiency.

Therefore, how to provide a heat dissipation device that improves stability and coupling force and simultaneously achieves installation convenience to be conveniently and stably coupled to an expansion unit is a problem to be solved in the industry.

Disclosure of Invention

In view of the above, an objective of the present invention is to provide a heat dissipation device, which includes a substrate, a connector, an expansion unit, a heat sink and a fixing element. The substrate has a first through hole. The connector is arranged on the substrate, wherein the connector is provided with a slot and two first hook bodies, and the two first hook bodies are arranged on two corresponding sides of the connector. The expansion unit is inserted into the slot and is positioned between the first through hole and the connector. The radiating fin is arranged on the expansion unit and is provided with two second hook bodies and second through holes, wherein the two second hook bodies are arranged on two corresponding sides of the radiating fin, and the two first hook bodies are respectively clamped with the two second hook bodies. The fixing piece penetrates through the first through hole and the second through hole, and the fixing piece and the connector fix the radiating fin on the expansion unit together.

In one or more embodiments of the present invention, the heat dissipation device further includes a heat conduction member, wherein the heat conduction member is disposed between the expansion unit and the heat dissipation plate.

In one or more embodiments of the present invention, the heat-conducting member is a heat-conducting sheet or a heat-conducting tape.

In one or more embodiments of the present invention, two of the second hooks are disposed at the front end of the heat sink, and the second through hole is disposed at the rear end of the heat sink.

In one or more embodiments of the present invention, the first hook body is L-shaped, the second hook body is L-shaped, and the first hook body and the second hook body are abutted against each other in a vertical direction.

In one or more embodiments of the present invention, the first hook body has an arc-shaped convex portion, and the second hook body has an arc-shaped concave portion, wherein the arc-shaped convex portion abuts against the arc-shaped concave portion.

In one or more embodiments of the present invention, the connector further includes a sidewall, the sidewall connects one of the first hook bodies, and the sidewall is used to limit the one of the first hook bodies in a horizontal direction.

In one or more embodiments of the present invention, the connector further includes two side walls, and the two side walls and the two first hook bodies are respectively connected to two opposite sides of the connector, so as to form two accommodating spaces for accommodating the two second hook bodies.

In one or more embodiments of the present invention, the two second hooks are spaced apart by a distance substantially equal to the width of the connector.

In one or more embodiments of the invention, the material of the heat sink comprises copper, aluminum, or alloys thereof.

In some embodiments of the present invention, a heat sink is provided having a special design that can be easily secured to a connector to facilitate assembly of the heat sink to and cooling of the expansion unit. Therefore, the heat sink and the connector of the present invention can replace the conventional fixing method (such as screw locking), thereby not only improving the assembly efficiency, but also saving a lot of cost (the cost of the locking member), and further increasing the product competitiveness.

The foregoing is merely illustrative of the problems, solutions to problems, and other aspects of the present invention, and the specific details thereof are set forth in the following description and the related drawings.

Drawings

To the accomplishment of the foregoing and related ends, the principles briefly described above are explained in detail with reference to the embodiments, which are illustrated in the accompanying drawings. The drawings are only for purposes of illustrating the invention and are not to be construed as limiting the scope of the invention. The principles of the present invention will be clearly explained with reference to the accompanying drawings, in which:

FIG. 1 is an exploded perspective view of a heat dissipation device according to some embodiments of the present invention;

FIG. 2 is a perspective view of a connector according to some embodiments of the present invention;

FIG. 3 is a perspective view of a heat sink in accordance with some embodiments of the present invention;

FIG. 4 is a schematic side view of a heat sink according to some embodiments of the present invention;

FIG. 5 is a schematic side view of a heat sink according to some embodiments of the present invention; and

fig. 6 is a perspective view of a connector according to some embodiments of the invention.

Description of the symbols

100 heat sink

110 substrate

111 first via hole

120,120a connector

121 first hook

121a arc convex part

123 slot

125 side wall

127 accommodating space

130 expansion unit

140 heat sink

141 second hook

141a arc-shaped concave part

143 second through hole

150 fastener

160 heat conducting member

B back end

Distance of separation D

F front end

Left side of L1, L2

R1, R2 right side

Width W

In the X horizontal direction

Y vertical direction

Detailed Description

In the following description, for purposes of explanation, numerous implementation details are set forth in order to provide a thorough understanding of the various embodiments of the present invention. It should be understood, however, that these implementation details should not be taken to limit the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.

Referring to fig. 1, fig. 1 is an exploded perspective view of a heat dissipation device 100 according to some embodiments of the present invention. The heat dissipation device 100 includes a substrate 110, a connector 120, an expansion unit 130, a heat sink 140 and a fixing member 150, wherein when the expansion unit 130 is inserted into the connector 120, the connector 120 can limit the expansion unit 130 in a horizontal direction X and a vertical direction Y, the heat sink 140 is detachably fixed to the connector 120, and the heat sink 140 is configured to cool heat generated by the operation of the expansion unit 130. The assembly of the heat dissipation device 100 and the related details thereof will be described in the following paragraphs, which will not be repeated herein.

Referring to fig. 1 to fig. 3, fig. 2 is a perspective view of the connector 120. Fig. 3 is a perspective view of the heat sink 140. In some embodiments of the present invention, the substrate 110 has a first through hole 111. The connector 120 is disposed on the substrate 110, wherein the connector 120 has two first hook bodies 121 and a slot 123, and the two first hook bodies 121 are disposed on two corresponding sides of the connector 120 (e.g., a left side L1 and a right side R1 of the connector 120). When the expansion unit 130 is inserted into the slot 123, the expansion unit 130 is located between the first through hole 111 and the connector 120. Next, the heat sink 140 is disposed on the expansion unit 130 and has two second hooks 141 and second through holes 143, wherein the two second hooks 141 are disposed on two corresponding sides of the heat sink 140 (e.g., a left side L2 and a right side R2 of the heat sink 140), and the two first hooks 121 are respectively configured to engage the two second hooks 141. In addition, the fixing element 150 passes through the first through hole 111 and the second through hole 143, and the fixing element 150 and the connector 120 together fix the heat sink 140 on the expansion unit 130, but the invention is not limited thereto.

Specifically, the substrate 110 may be a Printed Circuit Board (PCB), such as a single-sided printed circuit board (single-layer PCB) or a multi-layer PCB, but the invention is not limited thereto. The expansion unit 130 may integrate functions of a Solid State Disk (SSD) or a wireless communication module. The wireless communication module may be, for example, Wi-Fi, bluetooth, satellite navigation, Near Field Communication (NFC). In addition, the connector 120 may be a plug-in connector, and when the expansion unit 130 is inserted into the slot 123 of the connector 120, the expansion unit 130 is electrically connected to the conductive trace structure of the substrate 110, but the invention is not limited thereto.

In addition, the expansion unit 130 is exemplified by an m.2 interface (interface) PCI-E in the embodiment, since high-speed read-write heating is a common problem of the solid state disk of the m.2 interface, especially the performance of the solid state disk is increasingly improved, and the heat dissipation requirement is higher. The heat sink 100 provided by the invention can improve the problem of heat generation. The precursor of m.2 interface is Next Generation Form Factor (NGFF), which is a specification of a computer internal extended function card and related linker, but the invention is not limited thereto, and may also be mini PCI-E (mini Peripheral Component Interconnect, Peripheral Component Interconnect standard), or msita (mini Serial Advanced Technology Attachment, Serial Advanced Technology Attachment). In one or more embodiments of the present invention, the heat sink 140 is made of a material with good thermal conductivity, wherein the heat sink 140 may include copper, aluminum or an alloy thereof, and the heat sink 140 may be integrally formed, but the present invention is not limited thereto.

In some embodiments of the present invention, the first through hole 111 and the second through hole 143 have smooth inner walls, and the fixing member 150 is a snap assembly for fixing the first through hole 111 and the second through hole 143 aligned in the vertical direction Y. In other embodiments, the first through hole 111 and the second through hole 143 are screw holes for screw locking, the first through hole 111 and the second through hole 143 have inner threaded walls, and the fastener 150 is a screw assembly for fastening the first through hole 111 and the second through hole 143 aligned in the vertical direction Y, but the invention is not limited thereto.

In some embodiments of the present invention, the heat dissipation device 100 further includes a heat conducting member 160, wherein the heat conducting member 160 is disposed between the expansion unit 130 and the heat sink 140, so as to improve the efficiency of the heat sink 140 cooling the expansion unit 130. Specifically, the heat conductive member 160 may be a heat conductive sheet or a heat conductive tape. The heat-conducting sheet may be, for example, a heat-conducting silicone sheet, which may be tightly filled between the expansion unit 130 and the heat sink 140, so as to squeeze out air, and since the air is a poor heat conductor and may seriously hinder heat from being transferred between the expansion unit 130 and the heat sink 140, the heat-conducting silicone sheet may effectively improve the cooling effect of the heat sink 140. In addition, the heat dissipation tape may be a heat dissipation double-sided tape, which may have an adhesive effect besides improving the temperature cooling effect of the heat dissipation fins 140, so that the heat dissipation double-sided tape may further provide the assembly convenience of the heat dissipation device 100, and the heat dissipation double-sided tape may further firmly fix the expansion unit 130 and the heat dissipation fins 140, but the invention is not limited thereto. Specifically, the heat conducting member 160 may be attached and fixed to the expansion unit 130 or the heat sink 140, and then the expansion unit 130 and the heat sink 140 are assembled to the connector 120, but the invention is not limited thereto.

In one or more embodiments of the present invention, the two second hooks 141 are disposed at the front end F of the heat sink 140 and located at the left side L2 and the right side R2 of the heat sink 140, respectively, and the second through holes 143 are disposed at the rear end B of the heat sink 140. In addition, the two second hooks 141 are respectively engaged with the two first hooks 121 of the connector 120 located in front of the expansion unit 130, and the first hooks 121 and the second hooks 141 are respectively facing in opposite directions (for example, the first hooks 121 face rearward, and the second hooks 141 face forward). In addition, the first through hole 111 and the second through hole 143 are aligned up and down along the vertical direction Y, the first through hole 111 is located behind the expansion unit 130, and the fixing member 150 passes through the first through hole 111 and the second through hole 143 to be fixed behind the expansion unit 130. Thus, the connector 120 and the fixing member 150 fix the heat sink 140 on the expansion unit 130 in the front-rear direction. In one or more embodiments of the present invention, the distance D between the two second hooks 141 is substantially the same as the width W of the connector 120, so as to limit the heat sink 140 in the horizontal direction X, and therefore, the heat sink 140 has a stable structure and is not easily shaken by an external force in the horizontal direction X and is not easily separated.

Referring to fig. 1 to 5, fig. 4 and 5 are schematic side views of the heat dissipation device 100. In fig. 4, the heat sink 140 may be fixed to the expansion unit 130, for example. In fig. 5, only the front end F of the heat sink 140 is engaged with the connector 120, so that the heat sink 140 is inclined to the expansion unit 130 and can rotate relative to the connector 120. In one or more embodiments of the present invention, the first hook 121 is L-shaped, the second hook 141 is also L-shaped, and the first hook 121 and the second hook 141 can be engaged with each other and can abut against each other in the vertical direction Y.

Specifically, the first hook 121 has an arc-shaped protrusion 121a (e.g., a semicircular protrusion structure), and the second hook 141 has an arc-shaped recess 141a (e.g., a semicircular groove structure), wherein the arc-shaped protrusion 121a abuts against the arc-shaped recess 141a, when the fixing member 150 is unfastened and separated from the first through hole 111 and the second through hole 143 (as shown in fig. 5), the fixing member 150 no longer fixes the expansion unit 130 and the heat sink 140, and the arc-shaped recesses 141a of the two second hooks 141 respectively abut against the arc-shaped protrusions 121a of the two first hooks 121, so that the heat sink 140 can rotate relative to the connector 120 and move toward or away from the connector 120, thereby it is known that the heat sink 140 can be assembled on the expansion unit 130 quite simply, but the invention is not limited thereto.

Referring to fig. 1, 3 to 6, fig. 6 is a perspective view of a connector 120a, wherein the connector 120a in fig. 6 can be used to replace the connector 120 in other drawings, the connector 120 is substantially the same as the connector 120a, and a main difference is that the connector 120a further includes a sidewall 125, the sidewall 125 is connected to one of the first hook bodies 121, the sidewall 125 can be used to limit at least one of the first hook bodies 121 in the horizontal direction X, and the first hook body 121 is limited by the second hook body 141 in the vertical direction Y. Specifically, the sidewall 125 and the first hook 121 are disposed on one of the left side L1 and the right side R1 of the connector, so as to form an accommodating space 127 for the second hook 141 to be inserted into, but the invention is not limited thereto. In other embodiments of the present invention, the connector 120a has two sidewalls 125, the two sidewalls 125 are respectively connected to the two first hook bodies 121, and then two receiving spaces 127 for receiving the two second hook bodies 141 are respectively formed on the left side L1 and the right side R1 of the connector 120a, the two receiving spaces 127 can be used for limiting the two first hook bodies 121 in the horizontal direction X and the vertical direction Y, thereby increasing the structural stability and the strength of the heat dissipation device 100.

While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. Many modifications may be made to the embodiments of the present application in light of the present disclosure without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments.

Claims

1. A heat dissipating device, comprising:

a substrate having a first through hole;

the connector is arranged on the substrate and provided with a slot and two first hook bodies, and the two first hook bodies are arranged on two corresponding sides of the connector;

the expansion unit is inserted into the slot and is positioned between the first through hole and the connector;

the radiating fin is arranged on the expansion unit and is provided with two second hook bodies and second through holes, wherein the two second hook bodies are arranged on two corresponding sides of the radiating fin, and the two first hook bodies are respectively clamped with the two second hook bodies; and

and the fixing piece penetrates through the first through hole and the second through hole, and the fixing piece and the connector jointly fix the radiating fin on the expansion unit.

2. The heat dissipating device of claim 1, further comprising a heat conducting member, wherein the heat conducting member is disposed between the expansion unit and the heat sink.

3. The heat dissipating device of claim 2, wherein the heat conducting member is a heat conducting sheet or a heat conducting tape.

4. The heat dissipating device of claim 1, wherein the two second hooks are disposed at the front end of the heat sink, and the second through holes are disposed at the rear end of the heat sink.

5. The heat dissipating device of claim 1, wherein the two first hooks are L-shaped, the two second hooks are L-shaped, and the two first hooks and the two second hooks respectively abut against each other in a vertical direction.

6. The heat dissipating device of claim 5, wherein the two first hook bodies each have an arc-shaped convex portion and the two second hook bodies each have an arc-shaped concave portion, wherein the arc-shaped convex portions abut the arc-shaped concave portions.

7. The heat dissipating device of claim 5, wherein the connector further comprises a sidewall connecting one of the two first hooks, and the sidewall is configured to limit one of the two second hooks in a horizontal direction.

8. The heat dissipating device of claim 5, wherein the connector further comprises two side walls, and the two side walls and the two first hooks are respectively connected to two opposite sides of the connector, thereby forming two receiving spaces for receiving the two second hooks.

9. The heat dissipating device of claim 1, wherein the two second hooks are spaced apart by a distance substantially equal to a width of the connector.

10. The heat dissipation device of claim 1, wherein the material of the heat sink comprises copper, aluminum, or alloys thereof.