CN219437446U - Circuit board assembly - Google Patents
Circuit board assembly Download PDFInfo
- Publication number
- CN219437446U CN219437446U CN202320335960.8U CN202320335960U CN219437446U CN 219437446 U CN219437446 U CN 219437446U CN 202320335960 U CN202320335960 U CN 202320335960U CN 219437446 U CN219437446 U CN 219437446U
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- heat
- circuit board
- board assembly
- heat dissipation
- piece
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Abstract
The application discloses a circuit board assembly, which comprises a circuit board, a heat dissipation mounting piece and a heat diffusion piece, wherein the heat dissipation mounting piece is provided with a functional socket, a functional plug of the circuit board is in plug-in connection with the functional socket, and the heat diffusion piece is clamped between the circuit board and the heat dissipation mounting piece; the heat diffusion piece comprises a heat conduction part and a heat pipe diffusion part, the first end of the heat pipe diffusion part and the circuit board are in contact fit with the heat conduction part, the heat dissipation installation piece is provided with an installation groove, at least one part of the heat pipe diffusion part is embedded in the installation groove, and the outer wall of the heat pipe diffusion part is in contact fit with the inner wall of the installation groove. The circuit board assembly has good heat dissipation performance and relatively small overall volume.
Description
Technical Field
The application relates to the technical field of electronic products, in particular to a circuit board assembly.
Background
Along with the continuous progress of technology, the function of the circuit board is continuously enhanced, but the heat generated by the circuit board is increased, and the heat accumulation can have adverse effects on the normal operation of the circuit board, so that how to ensure that the circuit board has good heat dissipation performance is a serious problem.
At present, heat dissipation devices such as fans are generally arranged around the circuit board to provide a heat dissipation effect for the circuit board in an air cooling manner, however, the volume of the devices such as fans is relatively large, and the devices need to occupy a large installation space, so that the components formed by the circuit board are not beneficial to the development of thinning.
Disclosure of Invention
The application discloses a circuit board assembly, it has good heat dispersion, and holistic volume is less relatively.
In order to solve the problems, the application adopts the following technical scheme:
the application discloses a circuit board assembly, which comprises a circuit board, a heat dissipation mounting piece and a heat diffusion piece, wherein the heat dissipation mounting piece is provided with a functional socket, a functional plug of the circuit board is in plug-in connection with the functional socket, and the heat diffusion piece is clamped between the circuit board and the heat dissipation mounting piece;
the heat diffusion piece comprises a heat conduction part and a heat pipe diffusion part, the first end of the heat pipe diffusion part and the circuit board are in contact fit with the heat conduction part, the heat dissipation installation piece is provided with an installation groove, at least one part of the heat pipe diffusion part is embedded in the installation groove, and the outer wall of the heat pipe diffusion part is in contact fit with the inner wall of the installation groove.
The technical scheme that this application adopted can reach following beneficial effect:
the embodiment of the application discloses circuit board assembly, its heat dissipation installed part is equipped with the function socket to make its circuit board's function plug can form assembly relation with heat dissipation installed part through the mode with function socket grafting complex, and then restrict the position of the heat diffusion spare of clamp between locating circuit board and the heat dissipation installed part, form stable cooperation relation between each part in the assurance circuit board assembly.
Meanwhile, the first end of the heat pipe diffusion part in the heat diffusion piece is in contact fit with the heat conduction part, and the heat conduction part is also in contact fit with the circuit board, so that heat generated by the circuit board can be transferred to the heat pipe diffusion part through the heat conduction part, at least one part of the heat pipe diffusion part is embedded in the mounting groove, the outer wall of the heat pipe diffusion part is in contact fit with the inner wall of the mounting groove, the heat transferred to the heat pipe diffusion part can be transferred to the heat dissipation mounting piece in a contact transfer mode, the heat dissipation mounting piece is utilized to dissipate the heat outside the circuit board assembly, and the temperature of the circuit board is always relatively low.
In the circuit board assembly disclosed in the embodiment of the application, the heat conducting part of the heat diffusion piece and the overall shape of the heat pipe diffusion part are relatively flattened, and at least a part of the heat pipe diffusion part can be embedded into the mounting groove of the heat dissipation mounting piece, so that the arrangement of the heat diffusion piece can not increase the volume of the whole circuit board assembly too much, and the overall volume is relatively smaller while the circuit board assembly is guaranteed to have good heat dissipation capability.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
FIGS. 1 and 2 are exploded schematic views of a circuit board assembly disclosed in an embodiment of the present application;
FIG. 3 is a schematic view of another circuit board assembly according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram of another structure of a circuit board assembly according to an embodiment of the present disclosure.
Reference numerals illustrate:
100-circuit board, 200-heat dissipation mount, 300-heat spreader, 310-heat conductor, 320-heat pipe spreader, 410-back support, 420-spring, 430-lock, 510-power outlet, 520-data outlet.
Detailed Description
For the purposes, technical solutions and advantages of the present application, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The following describes in detail the technical solutions disclosed in the embodiments of the present application with reference to the accompanying drawings.
As shown in fig. 1-4, embodiments of the present application disclose a circuit board assembly that includes a circuit board 100, a heat dissipation mount 200, and a heat spreader 300.
The circuit board 100 is a device for providing functions of data processing, data transmission, etc. in the circuit board assembly, and parameters such as specification and shape can be flexibly selected according to actual requirements. In addition, the number of the circuit boards 100 may be one or more, and in the case that the number of the circuit boards 100 is plural, the heat spreader 300 may be provided for only one of the circuit boards 100 that generates relatively serious heat, and of course, in the case that there is a corresponding requirement, the heat spreader 300 may be provided for each circuit board 100.
The heat sink mount 200 is a device of the circuit board assembly that is the mounting base, and both the circuit board 100 and the heat spreader 300 may be directly or indirectly mounted on the heat sink mount 200.
The heat dissipation mounting piece 200 may be provided with a functional socket, where the functional socket may specifically include a power socket 510, a data socket 520, and the like, so that the circuit board 100 may be mounted on the heat dissipation mounting piece 200 in a manner that the circuit board 100 can be connected with the functional socket through its corresponding functional plug in a plugging manner, and the circuit board 100 and the heat dissipation mounting piece 200 form a relatively fixed relationship; on the basis, in the process of being used, the circuit board assembly can realize the purpose of plug and play by enabling the functional socket to be mutually plugged with a plug on corresponding equipment.
While for the heat spreader 300, it may be mounted to the heat sink mount 200 by means of a snap fit, adhesive or welding, etc., in one embodiment of the present application, the heat sink mount 200 is optionally provided with mounting slots to provide mounting for the heat spreader 300. Meanwhile, the heat dissipation mounting member 200 also has a heat dissipation function, and therefore, the heat dissipation mounting member 200 may be formed of a hard material having a relatively high heat dissipation performance such as a metal. Specifically, the heat dissipation mounting member 200 is formed of metallic aluminum, so that the heat dissipation mounting member 200 combines relatively low cost with good heat dissipation performance.
The heat spreader 300 is a device for spreading heat in the circuit board assembly, and is sandwiched between the circuit board 100 and the heat sink mounting 200, and the motherboard and the heat sink mounting 200 can form a relatively fixed relationship, and the heat spreader 300 can be limited between the motherboard and the heat sink mounting 200 by using the mounting grooves provided on the heat sink mounting 200, so that the heat spreader 300 can also form a relatively stable assembly relationship with the motherboard and the heat sink mounting 200 as a whole.
As shown in fig. 2, in order to ensure that the circuit board 100 in the circuit board assembly has good heat dissipation capability, the heat spreader 300 includes a heat conducting portion 310 and a heat pipe diffusing portion 320, wherein the heat pipe diffusing portion 320 includes a heat pipe having good heat dissipation capability, so that the heat transferred to the heat pipe diffusing portion 320 can be more rapidly and uniformly diffused to any position of the whole heat pipe diffusing portion 320. The first end of the heat pipe diffusion portion 320 and the circuit board 100 are in contact engagement with the heat conduction portion 310, so that heat of the circuit board 100 is transferred to the heat pipe diffusion portion 320 by the heat conduction portion 310. Specifically, the heat conducting portion 310 may be formed of metal copper having relatively high heat conducting performance and structural reliability, and at the same time, by making the surfaces of the circuit board 100, the heat conducting portion 310 and the heat pipe diffusing portion 320 each include a plane, and making the circuit board 100 be bonded to one plane of the heat conducting portion 310, and making the plane of one end surface of the heat pipe diffusing portion 320 be bonded to the other plane of the heat conducting portion 310, heat of the circuit board 100 can be transferred to the heat pipe diffusing portion 320 through the heat conducting portion 310, so that the heat can be diffused by the heat pipe diffusing portion 320.
Meanwhile, at least a part of the heat pipe diffusion part 320 is embedded in the mounting groove, and the outer wall of the heat pipe diffusion part 320 is in contact fit with the inner wall of the mounting groove, so that heat on the heat pipe diffusion part 320 can be transferred to the heat radiation mounting piece 200 in a contact transfer mode, and further the heat is radiated out of the circuit board assembly through the heat radiation mounting piece 200, thereby ensuring that heat generated by the circuit board 100 can be radiated out, and the temperature of the environment where the circuit board 100 is positioned is always relatively low. Specifically, the shape and size of the installation groove may be correspondingly designed according to the shape and size of the heat pipe diffusion part 320, so as to ensure that at least a portion of the heat pipe diffusion part 320 may be embedded in the installation groove, and that the portion of the heat pipe diffusion part 320 embedded in the installation groove is in contact fit with the inner wall of the installation groove. More specifically, the entire heat pipe diffuser 320 may be embedded within the mounting groove, which may further enhance the heat transfer efficiency and heat transfer effect between the heat pipe diffuser 320 and the heat sink mount 200.
The embodiment of the application discloses a circuit board assembly, its heat dissipation installed part 200 is equipped with the function socket to make its function plug of circuit board 100 can form the assembly relation with heat dissipation installed part 200 through the mode of pegging graft the cooperation with the function socket, and then restrict the position of the heat diffusion piece 300 that presss from both sides between circuit board 100 and heat dissipation installed part 200, guarantee to form stable cooperation relation between each part in the circuit board assembly.
Meanwhile, the first end of the heat pipe diffusion part 320 in the heat diffusion member 300 is in contact fit with the heat conduction part 310, and the heat conduction part 310 is also in contact fit with the circuit board 100, so that heat generated by the circuit board 100 can be transferred to the heat pipe diffusion part 320 through the heat conduction part 310, at least a part of the heat pipe diffusion part 320 is embedded in the mounting groove, the outer wall of the heat pipe diffusion part 320 is in contact fit with the inner wall of the mounting groove, the heat transferred to the heat pipe diffusion part 320 is ensured to be transferred to the heat dissipation mounting member 200 in a contact transfer manner, and the heat is dissipated to the outside of the circuit board assembly by the heat dissipation mounting member 200, so that the temperature of the circuit board 100 is ensured to be relatively low all the time.
In the circuit board assembly disclosed in the embodiments of the present application, the overall shape of the heat conducting portion 310 and the heat pipe diffusing portion 320 of the heat diffusing member 300 is flattened, and at least a portion of the heat pipe diffusing portion 320 may also be embedded in the mounting groove of the heat dissipating mounting member 200, so that the volume of the whole circuit board assembly is not excessively increased by the arrangement of the heat diffusing member 300, thereby ensuring that the circuit board assembly has good heat dissipating capability, and the overall volume is still relatively small.
As described above, the heat conductive part 310 may ensure that heat can be transferred between the heat conductive part 310 and the heat pipe diffusing part 320 by contacting with one end of the heat pipe diffusing part 320, and in order to improve heat transfer efficiency and heat transfer effect between the heat conductive part 310 and the heat pipe diffusing part 320, the first end of the heat pipe diffusing part 320 may be welded to the heat conductive part 310, which may also ensure a stable assembly relationship between the heat conductive part 310 and other components in the circuit board assembly. In addition, the contact matching reliability between the first end of the heat pipe diffusion part 320 and the heat conduction part 310 can be further improved by filling solder such as solder paste in the welding seam between the heat conduction part 310 and the first end of the heat pipe diffusion part 320, so that the heat transfer effect and the heat transfer efficiency between the heat conduction part 310 and the heat pipe diffusion part 320 can be improved.
As described above, at least a portion of the heat pipe diffuser 320 may be embedded in the mounting groove of the heat sink mount 200, and the position of the heat pipe diffuser 320 is restricted by the clamping action between the motherboard and the heat sink mount 200. In another embodiment of the present application, in order to improve the reliability of the assembly relationship between the heat pipe diffusion portion 320 and the heat dissipation mounting member 200, optionally, the second end of the heat pipe diffusion portion 320 is welded to the heat dissipation mounting member 200, and by filling solder such as solder paste in the welding seam between the two, a good contact-fit relationship between the two can be ensured, so as to further improve the heat transfer efficiency and the heat transfer effect between the heat pipe diffusion portion 320 and the heat dissipation mounting member 200.
In the above embodiment, the heat conducting portion 310 is in contact with the circuit board 100, so that heat generated by the circuit board 100 can be transferred to the heat conducting portion 310, in order to improve the heat transfer effect and efficiency between the heat conducting portion 310 and the circuit board 100, in this embodiment, optionally, a heat conducting interface material layer is disposed between the heat conducting portion 310 and the circuit board 100, and the heat conducting interface material layer is a layered structure formed by the heat conducting interface material, and may be formed on the surface of the heat conducting portion 310 and/or the circuit board 100 by coating, and in the process of attaching the heat conducting portion 310 to the circuit board 100, opposite sides of the heat conducting interface material layer are respectively formed into a relatively tight contact relationship with the heat conducting portion 310 and the circuit board 100, so that the heat transfer effect and efficiency between the heat conducting portion 310 and the circuit board 100 are better. Specifically, the thickness of the heat conductive interface material layer does not need to be relatively thick, and the gap between the heat conductive portion 310 and the circuit board 100 caused by factors such as the structural body and the processing precision can be compensated.
In order to further develop the circuit board assembly to be light and thin, optionally, the heat dissipation mounting member 200 is provided with an avoidance hole toward the region of the heat conducting portion 310, and a portion of the heat conducting portion 310 extends into the avoidance hole along the thickness direction of the circuit board 100, which can further reduce the thickness of the region of the circuit board assembly where the heat conducting portion 310 is located, so as to improve the structural compactness of the circuit board assembly, and enable the circuit board assembly to be further developed to be light and thin.
Specifically, the shape of the avoidance hole may correspond to the shape of the heat conducting portion 310, so that the heat conducting portion 310 is ensured to be able to extend into the avoidance hole in the case that the size of the avoidance hole is relatively small as a whole. In other words, the shape of the avoidance hole may be a shape of a projection of the heat conducting portion 310 on a plane perpendicular to the thickness direction of the circuit board 100, and the avoidance hole and the heat conducting portion 310 are correspondingly disposed in the thickness direction of the circuit board 100, so that it is ensured that the heat conducting portion 310 can extend into the avoidance hole along the thickness direction of the circuit board 100.
Based on the above technical solution, in order to ensure that the heat conducting portion 310 can still form a stable assembly relationship with the heat dissipation mounting piece 200, the heat conducting portion 310 and the heat pipe diffusion piece can be relatively fixed, so that the limited position state of the heat pipe diffusion piece is utilized to provide a limiting effect for the heat conducting portion 310. Alternatively, the heat conductive interface material layer may be formed by using a heat conductive adhesive, so that the heat transfer efficiency and the heat transfer effect between the heat conductive portion 310 and the circuit board 100 are improved while the heat conductive portion 310 and the circuit board 100 are adhered and fixed.
In another embodiment of the present application, the circuit board assembly may further include an elastic pressing member, and the elastic pressing member is mounted on the heat dissipation mounting member 200, and the elastic pressing member presses the heat conducting portion 310 against the circuit board 100, so that the bonding relationship between the heat conducting portion 310 and the circuit board 100 is more reliable and tighter. Specifically, the elastic pressing member may have a structure such as a hard metal sheet, and one end of the elastic pressing member is fixed on the heat dissipation mounting member 200, and the other end of the elastic pressing member abuts against a surface of the heat conducting portion 310 facing away from the circuit board 100, so as to apply an extrusion force to the heat conducting portion 310 to move the heat conducting portion 310 in a direction approaching to the circuit board 100.
In another embodiment of the present application, the elastic pressing member includes a back support 410, an elastic member 420 and a locking member 430, wherein at least a portion of the back support 410 is located on a side of the circuit board 100 facing away from the heat conducting portion 310, the elastic member 420 is located on a side of the heat conducting portion 310 facing away from the circuit board 100, and the elastic member 420 is connected to the back support 410 through the locking member 430 to press the heat conducting portion 310 against the circuit board 100.
Specifically, the locking member 430 may be a threaded connection member, and the back support 410 may be provided with a through hole or a threaded hole, and the locking member 430 passes through the locking member 430 and is connected with the back support 410, so that the magnitude of the extrusion force applied by the elastic member 420 to the heat conducting portion 310 is adjusted by using the adjustable connection relationship between the locking member 430 and the back support 410, and a reliable assembly relationship between the elastic pressing member and the heat dissipation mounting member 200 is ensured.
More specifically, the elastic member 420 is a spring, in which case, locking members 430 may be disposed at opposite ends of the spring, so as to ensure that the spring can apply a relatively uniform elastic pressing force to different positions of the heat conducting portion 310. Further, the number of the elastic members 420 may be plural, and the opposite ends of any elastic member 420 are provided with locking members 430. Under the condition that the plurality of elastic pieces 420 are all reeds, the plurality of elastic pieces 420 can be uniformly and alternately distributed along the direction perpendicular to the length of the reeds, so that under the condition that the plurality of elastic pieces 420 exert extrusion action on the heat conducting part 310, the reliable and compact attaching contact relationship between any position on the heat conducting part 310 and the corresponding position on the circuit board 100 is ensured. Accordingly, in the embodiment of the present application, a heat-conducting interface material layer may also be disposed between the heat-conducting portion 310 and the circuit board 100, so as to maximize the heat-conducting efficiency between the heat-conducting portion 310 and the circuit board 100.
As described above, the heat dissipation device 200 is a mounting base for other devices such as the circuit board 100 and the heat spreader 300 in the circuit board assembly, and as shown in fig. 1 and 2, alternatively, the heat dissipation device 200 is an open structure, which may reduce the weight and cost of the entire circuit board assembly. In another embodiment of the present application, as shown in fig. 3 and 4, the heat dissipation mounting member 200 is a package housing, and the package housing has a receiving cavity, and the circuit board 100 and the heat spreader 300 are both located in the receiving cavity. That is, in the embodiment of the present application, the heat dissipation mounting member 200 is of a closed structure, which can improve the protection capability of the heat dissipation mounting member 200 to the circuit board 100 and the heat spreader 300, and can make the overall reliability of the circuit board assembly relatively higher, and in addition, the relative heat dissipation area of the heat dissipation mounting member 200 is larger, so that the heat dissipation performance of the circuit board 100 can be improved to some extent.
In the embodiments described above, the differences between the embodiments are mainly described, and as long as there is no contradiction between the different optimization features between the embodiments, the different optimization features may be combined to form a better embodiment, and in consideration of brevity of line text, the description is omitted here.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and changes may be made to the present application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. which are within the spirit and principles of the present application are intended to be included within the scope of the claims of the present application.
Claims (10)
1. The circuit board assembly is characterized by comprising a circuit board, a heat dissipation mounting piece and a heat diffusion piece, wherein the heat dissipation mounting piece is provided with a functional socket, a functional plug of the circuit board is in plug-in connection with the functional socket, and the heat diffusion piece is clamped between the circuit board and the heat dissipation mounting piece;
the heat diffusion piece comprises a heat conduction part and a heat pipe diffusion part, the first end of the heat pipe diffusion part and the circuit board are in contact fit with the heat conduction part, the heat dissipation installation piece is provided with an installation groove, at least one part of the heat pipe diffusion part is embedded in the installation groove, and the outer wall of the heat pipe diffusion part is in contact fit with the inner wall of the installation groove.
2. The circuit board assembly of claim 1, wherein the first end of the heat pipe diffuser is welded to the thermally conductive portion.
3. The circuit board assembly of claim 1, wherein the second end of the heat pipe diffuser is solder-connected to the heat sink mount.
4. The circuit board assembly of claim 1, wherein a layer of thermally conductive interface material is disposed between the thermally conductive portion and the circuit board.
5. The circuit board assembly according to claim 1, wherein the heat dissipation mounting member is provided with a relief hole toward a region of the heat conduction portion, and a portion of the heat conduction portion extends into the relief hole in a thickness direction of the circuit board.
6. The circuit board assembly of claim 5, further comprising an elastic press-holder mounted to the heat dissipation mounting member, and the elastic press-holder presses the heat conducting portion against the circuit board.
7. The circuit board assembly of claim 6, wherein the elastic pressing member comprises a back support, an elastic member and a locking member, at least a portion of the back support is located on a side of the circuit board facing away from the heat conducting portion, the elastic member is located on a side of the heat conducting portion facing away from the circuit board, and the elastic member is connected with the back support through the locking member so as to press the heat conducting portion to the circuit board.
8. The circuit board assembly of claim 7, wherein the number of elastic members is plural, and the locking members are provided at opposite ends of any one of the elastic members.
9. The circuit board assembly of claim 1, wherein the heat dissipation mount is a package housing having a receiving cavity, the circuit board and the heat spreader being both located within the receiving cavity.
10. The circuit board assembly of claim 1, wherein the heat sink mounting is formed of a material comprising metallic aluminum and the thermally conductive portion is formed of a material comprising metallic copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320335960.8U CN219437446U (en) | 2023-02-16 | 2023-02-16 | Circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320335960.8U CN219437446U (en) | 2023-02-16 | 2023-02-16 | Circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219437446U true CN219437446U (en) | 2023-07-28 |
Family
ID=87344804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320335960.8U Active CN219437446U (en) | 2023-02-16 | 2023-02-16 | Circuit board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219437446U (en) |
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2023
- 2023-02-16 CN CN202320335960.8U patent/CN219437446U/en active Active
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