CN210671094U

CN210671094U - Electronic device

Info

Publication number: CN210671094U
Application number: CN201921409024.7U
Authority: CN
Inventors: 龙静
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2019-08-27
Filing date: 2019-08-27
Publication date: 2020-06-02
Anticipated expiration: 2029-08-27

Abstract

The utility model discloses an electronic equipment and mobile terminal belongs to electronic equipment thermal design technical field. The electronic device includes a circuit board, an electronic device, and a heat dissipation structure, the electronic device being located between the circuit board and the heat dissipation structure. The heat dissipation structure comprises a main body and a protruding structure, wherein the main body and the protruding structure are integrally formed, and the protruding structure is located on one side, close to the electronic device, of the main body and is in contact with the electronic device. The protruding structure and the heat dissipation structure are integrally formed, the protruding structure and the main body of the heat dissipation structure are made of the same heat conduction material, and the heat dissipation structure has high heat conduction, so that the thermal contact resistance between the electronic device and the heat dissipation structure is small. The electronic device and the heat dissipation structure are prevented from being connected through a heat conduction layer formed by glue or welding seams and the like, the contact thermal resistance between the electronic device and the heat dissipation structure is reduced, heat emitted by the electronic device can be quickly conducted to the heat dissipation structure, and the heat dissipation capacity of the electronic equipment is improved.

Description

Electronic device

Technical Field

The present disclosure relates to the field of thermal design technology for electronic devices, and more particularly, to an electronic device.

Background

With the continuous development of electronic device technologies, mobile terminals such as smart phones or tablet computers have become electronic devices commonly used by users.

A plurality of electronic devices are generally integrated on a circuit board of the mobile terminal, and as functions of the mobile terminal are upgraded, power of the electronic devices is increased, and generated heat is increased. In order to prevent the electronic device from being damaged due to overhigh temperature, a heat dissipation structure can be arranged around the electronic device, and heat generated by the electronic device can be led out through the heat dissipation structure, so that the performance of the electronic device is prevented from being reduced due to overheating. The electronic device and the heat dissipation structure are often spaced at a certain distance, and heat generated by the electronic device is conducted to the heat dissipation structure by arranging the heat conduction material between the electronic device and the heat dissipation structure, while the heat conduction material is usually connected with the heat dissipation structure in a glue sticking or welding mode, so that the heat conduction capability of the glue and the welding part is poor, the contact thermal resistance between the heat dissipation structure and the electronic device is increased, and the heat dissipation capability of the whole electronic equipment is reduced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the disclosure provides electronic equipment, which can reduce thermal contact resistance between a heat dissipation structure and an electronic device and improve heat dissipation capacity of the electronic equipment. The technical scheme is as follows:

an embodiment of the present disclosure provides an electronic device, including: the electronic device comprises a circuit board, an electronic device and a heat dissipation structure, wherein the electronic device is positioned between the circuit board and the heat dissipation structure; the heat dissipation structure comprises a main body and a protruding structure, wherein the main body and the protruding structure are integrally formed, and the protruding structure is located on one side, close to the electronic device, of the main body and is in contact with the electronic device.

Optionally, the main body has a first cavity, the first cavity is located in the main body, the first cavity has a cooling liquid therein, and an inner wall of the first cavity has a capillary structure layer.

Optionally, the protruding structure has a second cavity, the second cavity is communicated with the first cavity, and a capillary structure layer is arranged on an inner wall of the second cavity; alternatively, the raised structure is a solid structure.

Optionally, the body is plate-shaped or tubular.

Optionally, the heat dissipation structure is a copper structure.

Optionally, the electronic device further includes a heat conduction layer interposed between the protrusion structure and the electronic device.

Optionally, the heat conducting layer is a heat conducting silica gel layer.

Optionally, the electronic device further includes a middle frame, the middle frame is located between the heat dissipation structure and the electronic device, and the middle frame has a through hole for the protrusion structure to pass through.

Optionally, a gap is provided between the protruding structure and the inner wall of the through hole.

Optionally, the electronic device further includes a shielding cover located between the middle frame and the circuit board and disposed around the electronic device.

Optionally, the shielding cover includes a cylinder and a cover plate, the inner wall of the cylinder surrounds the electronic device, the cover plate is attached to one end of the electronic device close to the heat dissipation structure, and the cover plate has an opening corresponding to the protrusion structure.

The beneficial effects brought by the technical scheme provided by the embodiment of the disclosure at least comprise:

the protruding structure is arranged on one side, close to the electronic device, of the heat dissipation structure and is in contact with the electronic device, so that heat emitted by the electronic device can be directly conducted to the heat dissipation structure through the protruding structure. Because the raised structure and the heat dissipation structure are integrally formed, the raised structure and the heat dissipation structure are made of the same heat conduction material, and the heat dissipation structure has high heat conduction, so that the thermal contact resistance between the electronic device and the heat dissipation structure is small. The electronic device and the heat dissipation structure are prevented from being connected through a heat conduction layer formed by glue or welding seams and the like, the contact thermal resistance between the electronic device and the heat dissipation structure is reduced, heat emitted by the electronic device can be quickly conducted to the heat dissipation structure, and the heat dissipation capacity of the electronic equipment is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device in the related art;

fig. 2 is a schematic structural diagram of an electronic device provided in an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of another electronic device provided in the embodiments of the present disclosure;

fig. 4 is a schematic perspective structure diagram of an electronic device provided in an embodiment of the present disclosure;

fig. 5 is a structural cross-sectional view of a heat dissipation structure provided in an embodiment of the present disclosure;

fig. 6 is a schematic view of a tubular partial structure of a heat dissipation structure according to an embodiment of the present disclosure;

fig. 7 is a cross-sectional view of another heat dissipation structure provided in the embodiments of the present disclosure.

Detailed Description

To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of an electronic device in the related art. As shown in fig. 1, the electronic apparatus includes a circuit board 1 ', an electronic device 2 ', and a heat dissipation structure 3 ', and the electronic device 2 ' is attached to the circuit board 1 ' and located between the circuit board 1 ' and the heat dissipation structure 3 '. Heat is conducted between the heat dissipation structure 3 'and the electronic device 2' through a heat conduction layer 4 'made of a heat conduction material, and the heat conduction layer 4' is connected with the heat dissipation structure 3 'through a connection layer 5'. The heat conduction layer 4 ' is usually a copper layer, the connection layer 5 ' is usually a glue or a welding seam, the heat conductivity of the glue is lower than that of a copper material, and a gap exists in the welding seam, which can cause the thermal contact resistance between the electronic device 2 ' and the heat dissipation structure 3 ' to increase, and the heat generated by the electronic device 2 ' and conducted to the heat conduction layer 4 ' can not be conducted to the heat dissipation structure through the connection layer 5 ' to dissipate heat quickly, which causes the heat dissipation capability of the whole electronic equipment to be reduced.

In the disclosed embodiments, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, and the like. The electronic device of the embodiment of the present disclosure will be exemplarily described below by taking a mobile phone as an example.

Fig. 2 is a schematic structural diagram of an electronic device provided in an embodiment of the present disclosure. As shown in fig. 2, the electronic apparatus includes: circuit board 1, electronic component 2 and heat radiation structure 3, electronic component 2 is located between circuit board 1 and heat radiation structure 3. The heat dissipation structure 3 includes a main body 31 and a protrusion structure 32, the main body 31 and the protrusion structure 32 are integrally formed, and the protrusion structure 32 is located on a side of the main body 31 close to the electronic device 2 and is in contact with the electronic device 2.

In the embodiment of the disclosure, the electronic device is attached to the circuit board and is located between the circuit board and the heat dissipation structure. The protruding structure is arranged on one side, close to the electronic device, of the heat dissipation structure and is in contact with the electronic device, so that heat emitted by the electronic device can be directly conducted to the heat dissipation structure through the protruding structure. Because the raised structure and the heat dissipation structure are integrally formed, the raised structure and the heat dissipation structure are made of the same heat conduction material, and the heat dissipation structure has high heat conduction, so that the thermal contact resistance between the electronic device and the heat dissipation structure is small. The electronic device and the heat dissipation structure are prevented from being connected through a heat conduction layer formed by glue or welding seams and the like, the contact thermal resistance between the electronic device and the heat dissipation structure is reduced, heat emitted by the electronic device can be quickly conducted to the heat dissipation structure, and the heat dissipation capacity of the electronic equipment is improved.

In the embodiment of the present disclosure, the electronic device 2 may be a main heating element in the electronic apparatus, such as a CPU, a battery, a camera module, and the like.

Illustratively, in the embodiment of the present disclosure, the contact of the protruding structure 32 and the electronic device 2 may be direct contact, or may be indirect contact by disposing a heat conductive material between the protruding structure 32 and the electronic device 2.

Optionally, the heat dissipation structure 3 is a copper structure. I.e. the main body 31 and the bump structure 32 are both copper structures. Copper is used as a metal material, so that the heat dissipation device is high in corrosion resistance, small in thermal resistance, high in heat dissipation performance and low in cost, and the heat dissipation efficiency of electronic equipment can be effectively improved.

Fig. 3 is a schematic structural diagram of another electronic device provided in the embodiment of the present disclosure. As shown in fig. 3, the electronic apparatus further includes a heat conductive layer 5, and the heat conductive layer 5 is sandwiched between the protruding structure 32 and the electronic device 2. Since the main body 31 of the heat dissipation structure 3 and the bump structures 32 on the main body 31 are usually made of copper, and copper as a metal material may generate gaps on the surface thereof due to oxidation, air entering the gaps may prevent heat from being conducted on the contact surfaces of the bump structures 32 and the electronic device 2, and increase contact thermal resistance. By interposing the heat conduction layer 5 between the protruding structure 32 and the electronic device 2, the gap can be filled, the gap between the protruding structure 32 and the electronic device 2 is reduced, the contact thermal resistance is reduced, and the heat dissipation capability of the electronic device is improved.

Optionally, the heat conducting layer 5 is a heat conducting silicone layer. The heat-conducting silica gel has high heat conductivity and good electric insulation, the use temperature range is 60-280 ℃, the stability is strong, the deformation is difficult, the contact surface of the convex structure 32 and the electronic device 2 can be well and fully contacted, the contact thermal resistance is reduced, and the heat dissipation capacity of the electronic device is further improved.

Optionally, the electronic apparatus further comprises a middle frame 6, the middle frame 6 being located between the heat dissipation structure 3 and the electronic device 2, the middle frame 6 having a through hole 61 for passing the protruding structure 32. In the embodiment of the present disclosure, the middle frame 6 is a plate-shaped frame structure for mounting and arranging various electronic devices in a mobile phone case (not shown in the drawings), and may be made of an aluminum alloy or the like. The heat dissipation structure is placed on the middle frame 61, and the protruding structure 32 penetrates through the through hole 61 arranged in the middle frame 6, so that the protruding structure 32 on the heat dissipation structure 3 is fixed at the position corresponding to the electronic device 2, production and assembly are facilitated, and assembly accuracy of the electronic equipment is improved.

It should be noted that, in the embodiment of the present disclosure, only the portion of the middle frame 6 around the protruding structure 32 is shown, and the middle frame may be provided with different opening positions and thicknesses according to different electronic devices mounted on the circuit board, as long as the electronic devices can be mounted and configured, which is not limited by the present disclosure.

Optionally, there is a gap between the raised structure 32 and the inner wall of the through hole 61. The protruding structure 32 on the soaking plate 3 may generate thermal expansion to increase the volume when conducting the heat generated by the electronic device 2, and by providing a gap between the protruding structure 32 and the inner wall of the through hole 61, a space can be provided for the protruding structure 32 whose volume is increased due to the expansion, and the protruding structure 32 and the inner wall of the through hole 61 are prevented from pressing against each other and damaging the protruding structure 32 or the middle frame 6.

Fig. 4 is a schematic perspective structure diagram of an electronic device provided in an embodiment of the present disclosure. As shown in fig. 4, exemplarily, in the embodiment of the present disclosure, the electronic device 2 generating heat is a CPU, and the CPU is a square component mounted on the circuit board 1. The raised structure 32 in contact therewith is a cuboid in which the side in contact with the CPU is no larger in area than the opposite side on the CPU.

In other possible implementation manners, the electronic device 2 may also be another electronic device that is easy to generate heat in the electronic apparatus, and the protruding structures 32 may also be disposed on different positions and sides of the main body 31 corresponding to different electronic devices, as long as the protruding structures can achieve contact with the electronic devices to conduct heat, which is not limited by the disclosure.

Optionally, the electronic apparatus further comprises a shielding cover 7, the shielding cover 7 being located between the middle frame 6 and the circuit board 1 and disposed around the electronic device 2. In the embodiment of the present disclosure, because other electronic components are further attached to one side of the circuit board 1 close to the heat dissipation structure 3, radiation or electromagnetic waves emitted by the other electronic components and the electronic device 2 may interfere with each other, and by providing the shielding cover 7 surrounding the electronic device 2, the influence of external electromagnetic waves on the internal circuit of the electronic device 2 and the outward radiation of electromagnetic waves generated inside the electronic device 2 may be shielded, thereby ensuring the normal operation of the electronic device 2 and the other electronic components.

Optionally, the shielding cover 7 includes a cylinder 71 and a cover plate 72, an inner wall of the cylinder 71 is disposed around the electronic device 2, the cover plate 72 is attached to an end of the electronic device 2 close to the heat dissipation structure 3, and the cover plate 72 has an opening 721 corresponding to the protrusion structure 32. The cover plate 72 attached to one end of the electronic device 2 close to the heat dissipation structure 3 can press the electronic device 2 in a direction perpendicular to the circuit board 1, so as to achieve auxiliary fixing of the electronic device 2 on the circuit board 1. Meanwhile, the openings 721 of the cover plate 72 corresponding to the bump structures 32 define contact areas on the surface of the electronic device 2 contacting the bump structures 32. When the electronic device is assembled, the protruding structure 32 passes through the through hole 61 on the middle frame 5 and then corresponds to the contact area defined by the opening 721 on the electronic device 2, so that the electronic device 2 is attached to the protruding structure, and the assembly accuracy of the electronic device is further improved.

Fig. 5 is a structural cross-sectional view of a heat dissipation structure provided in an embodiment of the present disclosure. As shown in fig. 2 and 5, the main body 31 has a first cavity 311, the first cavity 311 is located in the main body 31, a cooling liquid for dissipating heat is provided in the first cavity 311, and a capillary structure layer 3a is provided on an inner wall of the first cavity 311. When the main body 31 is plate-shaped, the heat dissipation structure 3 is a vapor chamber. The inner wall of the first cavity 311 is provided with a bottom close to the convex structure 32, a top far away from the convex structure 32 and a side wall connecting the top and the bottom, when heat emitted by the electronic device 2 is conducted to the bottom of the inner wall of the first cavity 311 through the main body 31, heat energy is absorbed by cooling liquid in the first cavity 311, the cooling liquid is evaporated and diffused to a lower-temperature part in the first cavity 311, namely the top or the side wall of the inner wall, the gaseous cooling liquid releases heat and is condensed into liquid, the released heat is diffused to each part of the electronic equipment through the main body 31, uniform heat dissipation is realized, and overhigh temperature near the electronic device 2 is avoided. The condensed cooling liquid enters the capillary structure layer 3a on the top or the side wall, and the cooling liquid flows back to the bottom close to the electronic device 2 from the top or the side wall under the action of capillary force, so that the operation is repeated in the cavity, and the heat dissipation function is realized.

Illustratively, in the embodiment shown in FIG. 5, the raised structures 32 are solid structures.

The capillary structure layer 3a is a dense fine pore or groove structure formed on the inner wall of the cavity.

Fig. 6 is a schematic partial structure diagram of a heat dissipation structure in a tubular shape according to an embodiment of the present disclosure. As shown in fig. 2 and 6, alternatively, when the main body 31 is tubular, the heat dissipation structure 3 is a heat pipe. The heat pipe is provided with a pipe body and a capillary structure layer 3a positioned on the inner wall of the pipe body, and cooling liquid used for heat dissipation is arranged in the pipe body of the heat pipe. The heat dissipation principle is similar to that of a soaking plate, and heat conduction is realized through evaporation and condensation of cooling liquid in a tube body. The difference is that the cooling liquid absorbs heat and evaporates in the first cavity 311 near the electronic device 2, and the gaseous cooling liquid is condensed and releases heat through the tube toward the other end far from the electronic device 2, where the other end is usually near a heat dissipation port or a fan. The condensed cooling liquid flows back to one end close to the electronic device 2 from the other end far away from the electronic device 2 under the action of capillary force by the capillary structure layer 3a on the inner wall, so that the circulating heat dissipation is realized. The extending direction of the heat dissipation structure 3 as a heat pipe may be arranged according to the needs of the actual product, as long as the heat dissipation of the contacted electronic device 2 is achieved, which is not limited in the present disclosure.

Fig. 7 is a cross-sectional view of another heat dissipation structure provided in the embodiments of the present disclosure. As shown in fig. 2 and 7, the protrusion structure 32 has a second cavity 321, the second cavity 321 is communicated with the first cavity 311, and the inner wall of the second cavity 321 has a capillary structure layer 3 a. In the embodiment of the present disclosure, the inner wall of the first cavity 311 has a bottom close to the protruding structure 32, a top far away from the protruding structure 32, and a sidewall connecting the top and the bottom, the second cavity 321 is located at the bottom of the inner wall of the first cavity 311 and is communicated with the first cavity 311, after the cooling liquid in the second cavity 321 in the heat dissipation structure 3 absorbs the heat generated by the electronic device 2, the cooling liquid is evaporated into a gas state and diffused into the cavity of the first cavity 311, and when the heat is conducted to the lower temperature portion in the first cavity 311, the cooling liquid is condensed into a liquid state to release heat. The liquid coolant flows back to the bottom by the capillary structure layer 3a under the action of capillary force, and heat is dissipated by circulation of evaporation and condensation. When the main body 31 is plate-shaped, because the protrusion structure 32 contacts the electronic device 2 and is closer to the electronic device 2, the cooling liquid in the second cavity 321 can absorb the heat generated by the electronic device 2 more quickly, so that the heat dissipation is performed by circulation of evaporation and condensation in the first cavity 311 and the second cavity 321; when the main body 31 is tubular, the gas-state cooling liquid which absorbs heat and evaporates can flow to the end far away from the electronic device 2 more quickly to perform circulating heat dissipation, so that the heat dissipation capacity of the electronic equipment is further improved.

With reference to fig. 6 and 7, for example, when manufacturing the heat dissipation structure 3 with the protruding structure 32, a whole block of heat conductive material may be used for processing, the thickness of the heat conductive material is the same as the distance from the heat dissipation structure 3 to the electronic device 2, and the etching process is used to etch away the area 33 where the heat dissipation structure 3 interferes with other components mounted on the circuit board 1, so as to form the heat dissipation structure 3 with the protruding structure 32, which is required in the embodiment of the present disclosure, and the process is simple and convenient to produce.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electronic device, comprising: the electronic device comprises a circuit board (1), an electronic device (2) and a heat dissipation structure (3), wherein the electronic device (2) is positioned between the circuit board (1) and the heat dissipation structure (3); the heat dissipation structure (3) comprises a main body (31) and a protruding structure (32), the main body (31) and the protruding structure (32) are integrally formed, and the protruding structure (32) is located on one side, close to the electronic device (2), of the main body (31) and is in contact with the electronic device (2).

2. The electronic device according to claim 1, wherein the main body (31) has a first cavity (311), the first cavity (311) is located in the main body (31), the first cavity (311) has a cooling liquid therein, and the first cavity (311) has a capillary structure layer (3a) on an inner wall thereof.

3. The electronic device according to claim 2, wherein the protruding structure (32) has a second cavity (321), the second cavity (321) is communicated with the first cavity (311), and a capillary structure layer (3a) is arranged on the inner wall of the second cavity (321); alternatively, the raised structure (32) is a solid structure.

4. An electronic device according to claim 3, characterized in that the body (31) is plate-shaped or tubular.

5. The electronic device according to claim 1, wherein the heat dissipation structure (3) is a copper structure.

6. An electronic device according to any of claims 1-5, characterized in that the electronic device further comprises a heat conducting layer (5), the heat conducting layer (5) being sandwiched between the protruding structure (32) and the electronic device (2).

7. An electronic device according to claim 6, characterized in that the heat conducting layer (5) is a heat conducting silicone glue layer.

8. The electronic device according to any one of claims 1 to 5, further comprising a middle frame (6), wherein the middle frame (6) is located between the heat dissipation structure (3) and the electronic device (2), and the middle frame (6) has a through hole (61) for passing the protruding structure (32).

9. The electronic device according to claim 8, characterized in that there is a gap between the protruding structure (32) and an inner wall of the through hole (61).

10. The electronic device according to claim 8, characterized in that the electronic device further comprises a shielding cover (7), the shielding cover (7) being located between the middle frame (6) and the circuit board (1) and being arranged around the electronic device (2).

11. The electronic device according to claim 10, wherein the shielding cover (7) comprises a cylinder (71) and a cover plate (72), the cylinder (71) is disposed around the electronic device (2), the cover plate (72) is attached to an end of the electronic device (2) close to the heat dissipation structure (3), and the cover plate (72) has an opening (721) corresponding to the protrusion structure (32).