CN116247013A

CN116247013A - Chip packaging module and electronic equipment

Info

Publication number: CN116247013A
Application number: CN202211637075.1A
Authority: CN
Inventors: 冉懋良; 何宏波
Original assignee: XFusion Digital Technologies Co Ltd
Current assignee: Henan Kunlun Technology Co ltd
Priority date: 2022-12-16
Filing date: 2022-12-16
Publication date: 2023-06-09

Abstract

The embodiment of the application provides a chip packaging module and electronic equipment. The chip package device includes a package circuit board, a thermally conductive housing, and a chip. The heat conduction shell and the chip are arranged on the packaging circuit board, an installation space is formed between the heat conduction shell and the packaging circuit board, and the chip is positioned in the installation space. The radiator is located the heat conduction shell and deviates from the one end of encapsulation circuit board, and first recess has been seted up towards one side of encapsulation circuit board to the radiator, and in the first recess was located to the one end that the heat conduction shell deviates from encapsulation circuit board, the surface of the part in the first recess was located to the heat conduction shell was used for carrying out the heat exchange with the cell wall of first recess to make the chip carry out the heat exchange through heat conduction shell and radiator. Therefore, the heat exchange surface between the radiator and the heat conduction shell is large, the heat exchange efficiency is high, the heat dissipation efficiency of the chip for dissipating heat through the heat conduction shell and the radiator is high, and the chip is not easy to overheat.

Description

Chip packaging module and electronic equipment

Technical Field

The present disclosure relates to electronic devices, and particularly to a chip package module and an electronic device.

Background

As the power consumption of the chip increases, the heat dissipation effect of the chip affects the performance of the chip.

The chip packaging module is arranged in the electronic equipment, in the related technology, the chip packaging module can comprise a chip packaging device and a radiator, the chip packaging device can comprise a chip, a packaging circuit board and a heat conducting shell, the chip and the heat conducting shell are arranged on one side of the packaging circuit board, an installation space is formed between the heat conducting shell and the packaging circuit board, the chip is located in the installation space, the radiator is attached to one side, away from the packaging circuit board, of the heat conducting shell, and the chip can conduct heat exchange with the radiator through the heat conducting shell so that the chip dissipates heat.

However, in the related art, the heat dissipation efficiency of the chip is low, and the risk of the chip overheating is high.

Disclosure of Invention

The embodiment of the application provides a chip packaging module and electronic equipment, through seting up the recess on the radiator of chip packaging module to locate the tip of the heat conduction shell of chip packaging module in the recess of radiator, can make the heat transfer surface between radiator and the heat conduction shell great, heat exchange efficiency is higher, and the chip carries out radiating heat exchange efficiency higher through heat conduction shell and radiator, and the chip is difficult overheated.

An embodiment of the present application provides a chip package module, including a chip package device and a heat spreader. The chip package device includes a package circuit board, a thermally conductive housing, and a chip. The heat conduction shell and the chip are arranged on the packaging circuit board, an installation space is reserved between the heat conduction shell and the packaging circuit board, and the chip is positioned in the installation space. The radiator is located the heat conduction shell and deviates from the one end of encapsulation circuit board, and first recess has been seted up towards one side of encapsulation circuit board to the radiator, and in the first recess was located to the one end that the heat conduction shell deviates from encapsulation circuit board, the surface of the part in the first recess was located to the heat conduction shell was used for carrying out the heat exchange with the cell wall of first recess to make the chip carry out the heat exchange through heat conduction shell and radiator.

The chip packaging module that this embodiment provided, each side cell wall of the first recess of radiator and the surface that the heat conduction shell is located each side in the first recess all can be the heat transfer face, that is to say, except that the heat conduction shell deviates from the one side surface of encapsulation circuit board and the tank bottom of the first recess of relative radiator be the heat transfer face between heat conduction shell and the radiator, the surface that the heat conduction shell is located the other sides of part and the cell wall of the other sides of first recess also can be the heat transfer face. The heat exchange can be carried out through the surface of each side cell wall of first recess and each side of the part that the heat conduction shell is located in first recess between radiator and the heat conduction shell, and the area of the heat transfer face between radiator and the heat conduction shell is great, and the heat exchange efficiency between radiator and the heat conduction shell is higher, can make the heat dissipation efficiency of chip between heat conduction shell and the encapsulation circuit board higher through the radiator, does benefit to the overheated risk of chip emergence between reduction heat conduction shell and the encapsulation circuit board. In addition, after the heat dissipation efficiency of the chip between the heat conduction shell and the packaging circuit board is improved, the chip with higher power is arranged between the heat conduction shell and the packaging circuit board, and the performance of the electronic equipment is improved.

In one possible implementation manner, at least one heat conducting protrusion is arranged on one of the surface of the heat conducting shell, which is away from one side of the packaging circuit board, and the bottom of the first groove, a second groove corresponding to the heat conducting protrusion one to one is arranged on the other of the surface of the heat conducting shell, which is away from one side of the packaging circuit board, and the bottom of the first groove, the heat conducting protrusion is arranged in the corresponding second groove, and the outer surface of the heat conducting protrusion is used for carrying out heat exchange with the groove wall of the second groove where the heat conducting protrusion is located.

In one possible embodiment, a plurality of heat-conducting projections are provided at a distance from one another on one of the surface of the heat-conducting housing facing away from the side of the circuit board and the bottom of the first recess.

In one possible implementation, the at least one thermally conductive protrusion is a cube-like structure.

In one possible implementation, the heat-conducting protrusion is disposed at a bottom of the first groove, and the second groove is disposed at a surface of the heat-conducting housing facing away from the side of the package circuit board.

In one possible implementation, the chip package module further includes a substrate and a fixing frame, wherein a side of the package circuit board away from the heat conductive housing is disposed on the substrate, and the fixing frame is disposed on a side of the substrate where the package circuit board is disposed. The heat conduction shell comprises a shell part and a boss part, wherein the shell part is arranged on the packaging circuit board, a mounting space is reserved between the shell part and the packaging circuit board, the boss part is arranged on one side of the shell part, which is away from the packaging circuit board, of the boss part, one end of the boss part, which is away from the packaging circuit board, is arranged in the first groove, and the outer surface of the boss part, which is arranged in the first groove, is used for carrying out heat exchange with the groove wall of the first groove, so that the chip carries out heat exchange with the radiator through the shell part and the boss part. The fixed frame is located the edge of cover shell portion, and boss portion wears to establish in the entrance to a cave of fixed frame, and the one end that boss portion deviates from encapsulation circuit board is located outside the fixed frame, and fixed frame is used for restricting cover shell portion and encapsulation circuit board and removes, and boss portion is located outside the fixed frame at least partially locate in the first recess.

In one possible implementation, the heat sink is fastened to the base plate by means of a fastening element, and the side of the heat sink facing the base plate is used for pressing the fixing frame against the base plate.

In one possible implementation, the second groove formed in the heat conducting housing is formed in a surface of the boss portion on a side away from the package circuit board, and a bottom of the at least one second groove is located in the cover portion.

In one possible implementation, the projected outer edge of the boss portion in the package circuit board thickness direction coincides with the projected outer edge portion of the cover case portion in the package circuit board thickness direction.

A second aspect of the embodiments of the present application provides an electronic device, including a housing and a chip packaging module in any of the foregoing embodiments, where a chip packaging device of the chip packaging module is disposed in the housing.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic cross-sectional view of a chip package device and a circuit board of a chip package module according to an embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of a further chip package module according to an embodiment of the disclosure;

fig. 4 is a schematic structural diagram of a heat spreader of another chip package module according to an embodiment of the disclosure;

fig. 5 is a schematic structural diagram of a heat spreader of yet another chip package device according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of a chip package device and a substrate after assembly according to another embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of still another chip packaging device according to an embodiment of the present disclosure after being assembled with a substrate and a fixing frame;

fig. 8 is a schematic structural diagram of another chip package module provided in the embodiment of the present application before the heat spreader is assembled.

Reference numerals illustrate:

100. a housing;

200. a chip packaging module;

210. packaging the device by a chip;

220. a substrate; 221. a circuit board; 222. a bracket; 223. a limit frame;

230. a heat sink; 231. a heat conduction protrusion; 232. a first groove; 233. a mounting ear; 234. a mounting hole;

240. a fixed frame;

300. a thermally conductive housing;

310. a cover part;

320. a boss portion; 321. a second groove;

330. an installation space;

400. a chip;

500. a first heat conductive medium;

600. and packaging the circuit board.

Detailed Description

The terminology used in the description of the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application, as will be described in detail with reference to the accompanying drawings.

The electronic device provided in the embodiments of the present application may include, but is not limited to, a server, a switch, a memory, a mobile phone, a tablet computer, a television, a notebook computer, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a handheld computer, a robot, a touch television, an intercom, a netbook, a POS, a personal digital assistant (personal digital assistant, PDA), a wearable device, a virtual reality device, and the like.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

As shown in fig. 1, in the embodiment of the present application, the electronic device includes a housing 100 and a chip package module 200, and at least a portion of the chip package module 200 is disposed in the housing 100.

It is understood that the portion of the chip package module 200 located in the housing 100 may be mounted on the inner wall of the housing 100 by fastening, clamping, bonding, etc.

It is understood that the chip package module 200 may be entirely located within the housing 100. The chip package module 200 may also be partially located inside the housing 100 and partially located outside the housing 100.

In this embodiment, the chip package module 200 includes a chip package device 210 and a substrate 220, where the chip package device 210 and the substrate 220 can be disposed in the housing 100, the substrate 220 can be mounted on an inner wall of the housing 100, the chip package device 210 is disposed on the substrate 220, and the chip package device 210 can be electrically connected with the substrate 220.

It is understood that the substrate 220 may be a motherboard of an electronic device or an interposer of an electronic device.

It can be understood that, when the substrate 220 is a motherboard of an electronic device, the substrate 220 may be mounted on the inner wall of the housing 100 by means of fastening, clamping, bonding, etc., so that the chip package module 200 is mounted on the inner wall of the housing 100. When the substrate 220 is an interposer of an electronic device, the substrate 220 may be mounted on a motherboard of the electronic device, and the motherboard is mounted on an inner wall of the housing 100, so that the chip package module 200 is mounted on the inner wall of the housing 100 through the motherboard of the electronic device.

It is understood that the chip package device 210 may be disposed on the substrate 220 by an electrical connection structure such as a Ball Grid Array (BGA) or a Land Grid Array (LGA) to electrically connect the chip package device 210 with the substrate 220.

Fig. 2 is a schematic diagram of an electrical connection structure of a chip package device according to an embodiment of the present application mounted on a circuit board.

As shown in fig. 2, in an embodiment of the present application, the chip package device 210 includes a package circuit board 600, a thermally conductive housing 300, and a chip 400. The heat conducting shell 300 and the chip 400 are arranged on the packaging circuit board 600, an installation space 330 is formed between the heat conducting shell 300 and the packaging circuit board 600, the chip 400 is positioned in the installation space 330, the heat conducting shell 300 is used for conducting heat exchange with the chip 400 in the installation space 330 formed by the heat conducting shell 300, one side, away from the heat conducting shell 300, of the packaging circuit board 600 is arranged on the substrate 220, the packaging circuit board 600 is electrically connected with the substrate 220, and the chip 400 is electrically connected with the packaging circuit board 600, so that the chip 400 can be electrically connected with the substrate 220 through the packaging circuit board 600.

It is understood that the package circuit board 600 may be disposed on the substrate 220 through an electrical connection structure such as a solder ball array or a grid array, so that the package circuit board 600 is electrically connected to the substrate 220, and the chip 400 may be disposed on the package circuit board 600 through an electrical connection structure such as a solder ball array or a grid array, so that the chip 400 is electrically connected to the package circuit board 600.

It is understood that the heat conductive housing 300 and the chip 400 are both disposed on a side of the package circuit board 600 facing away from the substrate 220, the mounting space 330 may be formed by the side of the package circuit board 600 facing away from the substrate 220 and the inner wall of the heat conductive housing 300, and the mounting space 330 may be a sealed space.

It is understood that the chip package device 210 may be a central processing unit (central processing unit, CPU) package device, a graphics processing unit (graphics processing unit, GPU) package device, or the like. When the chip package device 210 is a central processing unit (central processing unit, CPU) package device, the chip 400 of the chip package device 210 is a central processing unit. When the chip package device 210 is a graphics processor (graphics processing unit, GPU) package device, the chip 400 of the chip package device 210 is a graphics processor.

It is understood that the substrate 220 may include a circuit board 221, and the packaged circuit board 600 of the chip package device 210 may be mounted on the circuit board 221 and electrically connected to the circuit board 221 of the substrate 220 through an electrical connection structure such as a solder ball array or a grid array.

In embodiments of the present application, the thermally conductive housing 300 may include an electrically conductive layer (not shown), at which time the thermally conductive housing 300 may also be used to reduce electromagnetic interference from outside the thermally conductive housing 300 experienced by the chip 400 within the mounting space 330 formed thereby.

It is understood that the thermally conductive housing 300 may be integrally formed of a thermally conductive, electrically conductive material, that is, the thermally conductive housing 300 may be integrally formed as an electrically conductive layer. The heat conductive housing 300 may also be made partially of a heat conductive, electrically conductive material and partially of an insulating, electrically conductive material, that is, the heat conductive housing 300 may include an insulating layer (not shown) in addition to the electrically conductive layer, the electrically conductive layer being made of a heat conductive, electrically conductive material and the insulating layer being made of an insulating, thermally conductive material.

In some examples of the present application, the heat conductive housing 300 may be a metal housing, and the heat conductive housing 300 may be made of a metal material with good heat and electrical conductivity, such as copper, aluminum, and the like.

In the embodiment of the present application, in order to improve the heat conduction efficiency between the chip 400 and the heat conduction housing 300, a first heat conduction medium 500 may be disposed between the chip 400 and the heat conduction housing 300, the chip 400 and the heat conduction housing 300 are connected through the first heat conduction medium 500, and the chip 400 exchanges heat with the heat conduction housing 300 through the first heat conduction medium 500.

In this way, the influence of the gap between the chip 400 and the heat conducting shell 300 on the heat conducting efficiency can be reduced, the heat conducting efficiency between the chip 400 and the heat conducting shell 300 is higher, and the heat dissipation performance of the chip 400 is improved.

It is understood that the side of the first heat conductive medium 500 facing the package circuit board 600 may be bonded to the side of the chip 400 facing away from the package circuit board 600, and the side of the first heat conductive medium 500 facing away from the package circuit board 600 may be bonded to the inner wall of the heat conductive housing 300.

It is understood that the first heat conductive medium 500 may be formed of a thermal interface material (Thermal Interface Material, TIM).

It is understood that the first heat-conducting medium 500 is an elastic medium and can play a role in buffering. In this way, collision is not likely to occur between the chip 400 and the heat conductive housing 300, and in addition, the risk of the heat conduction efficiency between the chip 400 and the heat conductive housing 300 being lowered due to the change in the interval between the chip 400 and the heat conductive housing 300 can be reduced.

Fig. 3 is a schematic cross-sectional view of still another chip package module according to an embodiment of the disclosure.

As shown in fig. 3, in an embodiment of the present application, the substrate 220 may further include a bracket 222, the bracket 222 being mounted on the circuit board 221, and the chip package device 210 being mounted on the bracket 222 such that the chip package device 210 may be mounted on the circuit board 221 through the bracket 222. The bracket 222 has connection holes (not shown) which are through holes, and the chip package device 210 may be connected to the circuit board 221 of the substrate 220 through an electrical connection structure such as a solder ball array or a grid array penetrating the connection holes, so that the chip package device 210 is electrically connected to the circuit board 221 of the substrate 220. Specifically, the bracket 222 may be fastened to the circuit board 221 by fastening structures such as fasteners, snap structures, etc., and the whole of the package circuit board 600 and the heat conductive housing 300 may be mounted to the bracket 222 by fastening structures such as fasteners, snap structures, etc., and the package circuit board 600 may be connected to the circuit board 221 of the substrate 220 by an electrical connection structure such as a solder ball array or a grid array penetrating through the connection hole, so that the package circuit board 600 is electrically connected to the circuit board 221 of the substrate 220.

It is understood that the connection holes may have various shapes such as square holes, round holes, etc., and the shape of the connection holes may be determined according to the electrical connection structure of the circuit board 221 electrically connecting the package circuit board 600 and the substrate 220.

As shown in fig. 1 and 3, to improve the heat dissipation performance of the chip 400, the chip package module 200 further includes a heat spreader 230, where the heat spreader 230 is disposed at an end of the chip package device 210 facing away from the substrate 220. Specifically, the heat sink 230 is disposed at an end of the heat conductive housing 300 away from the package circuit board 600, and the heat sink 230 is configured to exchange heat with the heat conductive housing 300, so that the chip 400 can exchange heat with the heat sink 230 through the heat conductive housing 300, and the chip 400 can dissipate heat through the heat sink 230.

It is understood that the heat sink 230 may include, but is not limited to, a fin heat sink, or the like.

It is understood that the heat spreader 230 may be entirely located within the housing 100, and in this case, the chip package module 200 may be entirely located within the housing 100. The heat spreader 230 may also be partially located inside the housing 100 and partially located outside the housing 100, such that a portion of the chip package module 200 is located outside the housing 100.

It will be appreciated that the electronic device may also include a cooling module (not shown) for exchanging heat with the heat sink 230 to remove heat from the heat sink 230. The cooling module may be an air cooling module, a liquid cooling module, etc. For example, the cooling module may be a liquid cooling module, the cooling module may include a liquid cooling plate, and the radiator 230 may contact with the liquid cooling plate, so that the radiator 230 exchanges heat with the liquid cooling plate, so that the liquid cooling plate may take away heat on the radiator 230.

Of course, when the portion of the heat sink 230 is located outside the housing 100, the portion of the heat sink 230 located outside the housing 100 may exchange heat with the environment outside the housing 100, and the heat sink 230 may dissipate heat by natural cooling.

In the related art, one side of radiator towards the base plate is the plane, one side of radiator towards the base plate pastes the surface of establishing in heat conduction shell one side that deviates from encapsulation circuit board, only heat conduction shell deviates from the one side surface of encapsulation circuit board and the part of the relative radiator one side surface towards the base plate between radiator and the heat conduction shell is the heat transfer face, the area of the heat transfer face between radiator and the heat conduction shell is less, the heat exchange efficiency between radiator and the heat conduction shell is lower, it is lower to make the chip carry out radiating efficiency through heat conduction shell and radiator, the risk that the chip between heat conduction shell and the encapsulation circuit board appears overheated is great.

Fig. 4 is a schematic structural diagram of a heat spreader of another chip package module according to an embodiment of the present application.

As shown in fig. 4, and referring to fig. 3, in this embodiment, a first groove 232 is formed on a side of the heat sink 230 facing the package circuit board 600, one end of the heat conducting housing 300 facing away from the package circuit board 600 is disposed in the first groove 232, and an outer surface of a portion of the heat conducting housing 300 disposed in the first groove 232 is used for performing heat exchange with a groove wall of the first groove 232, so that the chip 400 performs heat exchange with the heat sink 230 through the heat conducting housing 300.

Thus, each side groove wall of the first groove 232 of the heat sink 230 and each side surface of the heat conductive housing 300 located in the first groove 232 may be heat exchanging surfaces, that is, in addition to a side surface of the heat conductive housing 300 facing away from the package circuit board 600 and a groove bottom of the first groove 232 of the opposite heat sink 230 between the heat conductive housing 300 and the heat sink 230, a surface of the remaining side of the heat conductive housing 300 located in the first groove 232 and a groove wall of the remaining side of the first groove 232 may be heat exchanging surfaces. The heat exchange between the heat sink 230 and the heat conductive housing 300 can be performed through the groove walls of the sides of the first groove 232 and the surfaces of the sides of the part of the heat conductive housing 300 located in the first groove 232, the heat exchange surface between the heat sink 230 and the heat conductive housing 300 has a larger area, the heat exchange efficiency between the heat sink 230 and the heat conductive housing 300 is higher, the heat dissipation efficiency of the chip 400 between the heat conductive housing 300 and the package circuit board 600 through the heat sink 230 is higher, and the risk of overheating of the chip 400 between the heat conductive housing 300 and the package circuit board 600 is reduced. In addition, after the heat dissipation efficiency of the chip 400 between the heat conductive housing 300 and the package circuit board 600 is improved, the chip 400 with higher power is advantageously arranged between the heat conductive housing 300 and the package circuit board 600, which is advantageous for improving the performance of the electronic device.

It is understood that the bottom of the groove is the wall of the groove on the side opposite the mouth of the groove.

It is understood that thermally conductive housing 300 may include, but is not limited to, a columnar structure, a block-like structure, a mesa-like structure, and the like. The shape of the groove cavity of the first groove 232 corresponds to the shape of the end of the heat conductive housing 300 facing away from the package circuit board 600, so that the end of the heat conductive housing 300 facing away from the package circuit board 600 can be accommodated in the first groove 232, and the outer surface of the portion of the heat conductive housing 300 located in the first groove 232 can exchange heat with the groove wall of the first groove 232. For example, when one end of the heat conductive housing 300 facing away from the package circuit board 600 is in a prismatic table structure, the cavity of the first groove 232 is in a corresponding prismatic table structure; when the end of the heat conductive housing 300 facing away from the package circuit board 600 has a cylindrical structure, the cavity of the first groove 232 has a corresponding cylindrical structure.

In some embodiments of the present application, the outer surface of the portion of the thermally conductive housing 300 located within the first recess 232 may be in contact with each side wall of the first recess 232 such that the outer surface of the portion of the thermally conductive housing 300 located within the first recess 232 is in heat exchange with each side wall of the first recess 232.

In some embodiments of the present application, a second heat-conducting medium (not shown) is disposed between the portion of the heat-conducting housing 300 located in the first groove 232 and the wall of the first groove 232, and the portion of the heat-conducting housing 300 located in the first groove 232 is connected to the wall of the first groove 232 through the second heat-conducting medium, so that the outer surface of the portion of the heat-conducting housing 300 located in the first groove 232 exchanges heat with the side walls of the first groove 232.

It is understood that the second heat conductive medium may fill the gap between the portion of the heat conductive housing 300 located in the first groove 232 and the wall of the first groove 232, and the second heat conductive medium is respectively attached to the portion of the heat conductive housing 300 located in the first groove 232 and the wall of the first groove 232.

In this way, by providing the second heat transfer medium between the portion of the heat transfer housing 300 located in the first groove 232 and the groove wall of the first groove 232, the influence of the gap between the portion of the heat transfer housing 300 located in the first groove 232 and the groove wall of the first groove 232 on the heat transfer efficiency can be reduced.

It is understood that the second thermally conductive medium may be formed of a thermal interface material (Thermal Interface Material, TIM).

It will be appreciated that the second heat conducting medium is an elastic medium and may perform a certain buffering function, so that the risk of reducing the heat conducting efficiency between the heat conducting housing 300 and the heat sink 230 due to the change of the interval between the portion of the heat conducting housing 300 located in the first groove 232 and the groove wall of the first groove 232 can be reduced.

In the embodiment of the present application, a mounting ear 233 may be disposed on the heat sink 230, and a mounting hole 234 may be formed on the mounting ear 233, and the heat sink 230 may be fastened to the substrate 220 by a fastener (not shown) penetrating through the mounting ear 233. Specifically, a plurality of mounting ears 233 may be disposed at the edge of the heat sink 230, and fasteners penetrating the mounting ears 233 are fastened to the bracket 222 of the base plate 220, so that the heat sink 230 is fastened to the bracket 222 of the base plate 220.

In this way, the heat sink 230 is assembled more conveniently. In addition, the heat spreader 230 may also function to limit movement of the chip package device 210 after the heat spreader 230 is assembled to the substrate 220.

It will be appreciated that the bracket 222 may be provided with a threaded hole (not shown) corresponding to the mounting hole 234, the fastener penetrating through the mounting hole 234 may be a bolt, and the bolt penetrating through the mounting hole 234 may be screwed with the corresponding threaded hole. Specifically, the bracket 222 may be provided with a connection post (not shown), and the end surface of the connection post facing away from the circuit board 221 may be provided with a threaded hole for threaded connection with a bolt penetrating into the mounting hole 234.

Fig. 5 is a schematic structural diagram of a heat spreader of another chip package device according to an embodiment of the present application.

As shown in fig. 5 and referring to fig. 2-4, in this embodiment, at least one heat conducting protrusion 231 is disposed on one of a surface of the heat conducting housing 300 facing away from one side of the package circuit board 600 and a bottom of the first groove 232, a second groove 321 corresponding to the heat conducting protrusion 231 one to one is disposed on the other of the surface of the heat conducting housing 300 facing away from one side of the package circuit board 600 and the bottom of the first groove 232, the heat conducting protrusion 231 is disposed in the corresponding second groove 321, and an outer surface of the heat conducting protrusion 231 is used for performing heat exchange with a groove wall of the second groove 321 where the heat conducting protrusion 231 is located.

In this way, the outer surface of the heat conducting protrusion 231 and the groove wall of the second groove 321 may be the heat dissipating surface between the heat sink 230 and the heat conducting housing 300, which is beneficial to further increasing the area of the heat exchanging surface between the heat conducting housing 300 and the heat sink 230, so as to improve the heat exchanging efficiency between the heat conducting housing 300 and the heat sink 230, and further improving the heat dissipating efficiency of the chip 400 between the heat conducting housing 300 and the package circuit board 600 through the heat sink 230.

It is understood that the heat conducting protrusion 231 may be disposed on a surface of the heat conducting housing 300 facing away from the package circuit board 600, and the second groove 321 may be disposed at a bottom of the first groove 232. Alternatively, the heat conductive protrusion 231 may be disposed at a bottom of the first groove 232, and the second groove 321 may be disposed on a surface of the heat conductive housing 300 facing away from the package circuit board 600.

It is understood that the heat conductive protrusions 231 may include, but are not limited to, columnar structures, mesa structures, cone structures, hemispherical structures, and the like. For example, the heat conductive protrusion 231 may have a cylindrical structure, a prismatic table structure, a truncated cone structure, or the like. The shape of the groove cavity of the second groove 321 corresponds to the shape of the heat conductive protrusion 231 received therein, so that the groove wall of the second groove 321 can exchange heat with the outer surface of the heat conductive protrusion 231 received therein. For example, when the heat conductive protrusion 231 has a cylindrical structure, a groove cavity of the second groove 321 accommodating the heat conductive protrusion 231 having a cylindrical structure has a cylindrical structure; when the heat conduction protrusion 231 has a pyramid-shaped structure, the groove cavity of the second groove 321 for accommodating the heat conduction protrusion 231 has a pyramid-shaped structure.

It is understood that the groove wall of the second groove 321 may be in contact with the outer surface of the heat conductive protrusion 231 accommodated therein for heat exchange. A second heat-conducting medium may be disposed between the groove wall of the second groove 321 and the heat-conducting protrusion 231 accommodated therein, so that the groove wall of the second groove 321 and the heat-conducting protrusion 231 accommodated therein are connected by the second heat-conducting medium therebetween, and heat exchange is performed between the groove wall of the second groove 321 and the heat-conducting protrusion 231 accommodated therein by the second heat-conducting medium therebetween.

It is understood that the number of the heat conductive protrusions 231 may be one or more, and the number of the second grooves 321 may be the same as the number of the heat conductive protrusions 231. That is, when the heat conductive protrusions 231 are one, the second groove 321 is opened with one. When the number of the heat conductive protrusions 231 is 2, 3, 4, or more, the second grooves 321 are correspondingly opened 2, 3, 4, or more.

It is understood that when the number of the heat conductive protrusions 231 is plural, all the heat conductive protrusions 231 may have the same shape, or one or more of the heat conductive protrusions 231 may have a shape different from that of the other heat conductive protrusions 231.

In the embodiment of the present application, a surface of the heat conductive housing 300 facing away from the side of the package circuit board 600 and a groove bottom of the first groove 232 are provided with a plurality of heat conductive protrusions 231 spaced apart from each other.

In this way, the area of the heat exchanging surface between the heat conducting housing 300 and the heat sink 230 is further increased, so as to improve the heat exchanging efficiency between the heat conducting housing 300 and the heat sink 230, and further improve the heat dissipating efficiency of the chip 400 between the heat conducting housing 300 and the package circuit board 600 through the heat sink 230.

In some embodiments of the present application, when a plurality of heat conducting protrusions 231 spaced from each other are disposed on one of the surface of the side of the heat conducting housing 300 facing away from the package circuit board 600 and the bottom of the first groove 232, all the heat conducting protrusions 231 may be distributed in an array, for example, may be distributed in a matrix, or may be distributed in a multi-layer annular array. In this way, the heat exchange between the heat conductive housing 300 and the heat sink 230 is balanced throughout.

In some embodiments of the present application, the plurality of heat conductive protrusions 231 provided on one of the surface of the side of the heat conductive housing 300 facing away from the package circuit board 600 and the bottom of the first recess 232 are equally spaced. In this way, heat exchange between the heat conductive housing 300 and the heat sink 230 can be balanced throughout.

In the present embodiment, the at least one heat conductive protrusion 231 is of a cube-like structure.

In this way, the heat exchanging surface of the heat conducting boss 231 having a cubic structure can be made large. In addition, it is advantageous to arrange more heat conductive protrusions 231 on one plane.

It is understood that when a plurality of heat conductive protrusions 231 are provided, all the heat conductive protrusions 231 may have a cubic structure, or one or more of the heat conductive protrusions 231 may have a cubic structure.

In the embodiment of the present application, one of the surface of the heat conductive housing 300 facing away from the side of the package circuit board 600 and the bottom of the first recess 232 is provided with a plurality of heat conductive protrusions 231 spaced apart from each other and identical.

In this way, the heat conduction of each heat conduction protrusion 231 in the second groove 321 is balanced, and it is easy to form a plurality of identical heat conduction protrusions 231.

In the present embodiment, when a plurality of heat conductive protrusions 231 are provided, all the heat conductive protrusions 231 are of a cube-like structure.

In the embodiment of the application, the heat conducting protrusion 231 is disposed at the bottom of the first groove 232, and the second groove 321 is disposed on the surface of the heat conducting housing 300 facing away from the side of the package circuit board 600.

In this way, the path of heat transfer on the heat conducting housing 300 is shorter, which is beneficial to transferring the heat to the heat sink 230 faster, and improving the heat conducting efficiency between the chip 400 and the heat sink 230, so that the heat dissipation efficiency of the chip 400 between the heat conducting housing 300 and the package circuit board 600 through the heat sink 230 is higher.

Fig. 6 is a schematic structural diagram of a chip package device and a substrate after assembly according to an embodiment of the present application.

As shown in fig. 6, a limit frame 223 is disposed on one side of the substrate 220 for mounting the chip package device 210, the chip package device 210 is mounted in the limit frame 223, and the limit frame 223 is used for limiting the movement of the chip package device 210 on the surface of the substrate 220 so as to position the chip package device 210. Specifically, a limiting frame 223 is disposed on a side of the bracket 222 away from the circuit board 221, a portion of the bracket 222 located in the limiting frame 223 is provided with a connection hole for penetrating through an electrical connection structure such as a solder ball array or a grid array, the limiting frame 223 is disposed at an edge of the package circuit board 600, the limiting frame 223 is used for limiting movement of the package circuit board 600 on the surface of the substrate 220, and one end of the heat conductive housing 300 away from the substrate 220 is located outside the limiting frame 223. In this way, the chip package device 210 is easily and accurately mounted to a predetermined position on the substrate 220, so that the chip package device 210 is easily and electrically connected to the substrate 220. In addition, the risk of shifting the fully assembled chip package device 210 may also be reduced.

Fig. 7 is a schematic structural diagram of a chip package device provided in an embodiment of the present application after being assembled with a substrate and a fixing frame, and fig. 8 is a schematic structural diagram of a chip package module provided in an embodiment of the present application before a radiator is assembled.

As shown in fig. 7 and 8, and referring to fig. 3, in the embodiment of the present application, the chip package module 200 further includes a fixing frame 240, where the fixing frame 240 is disposed on a side of the substrate 220 where the package circuit board 600 is disposed. The heat conductive housing 300 includes a housing portion 310 and a boss portion 320, the housing portion 310 is disposed on the package circuit board 600, an installation space 330 is provided between the housing portion 310 and the package circuit board 600, the boss portion 320 is disposed on a side of the housing portion 310 facing away from the package circuit board 600, one end of the boss portion 320 facing away from the package circuit board 600 is disposed in the first groove 232, and an outer surface of a portion of the boss portion 320 disposed in the first groove 232 is used for heat exchange with a groove wall of the first groove 232, so that the chip 400 performs heat exchange with the heat sink 230 through the housing portion 310 and the boss portion 320. The fixing frame 240 is located at the edge of the cover shell portion 310, the boss portion 320 is penetrated in the hole of the fixing frame 240, one end of the boss portion 320, which is away from the package circuit board 600, is located outside the fixing frame 240, the fixing frame 240 is used for limiting the cover shell portion 310 and the package circuit board 600 to move, and at least part of the boss portion 320 located outside the fixing frame 240 is located in the first groove 232.

Thus, by providing the fixing frame 240 and the boss portion 320, the chip package device 210 is conveniently fixed on the substrate 220, and the chip package device 210 is not easily displaced after being assembled on the substrate 220. Further, the heat exchange efficiency between the heat conductive housing 300 having the boss portion 320 and the heat sink 230 is high.

It is understood that the housing portion 310 may include, but is not limited to, a columnar structure, a block structure, a mesa structure, and the like. The boss portion 320 may include, but is not limited to, a columnar structure, a block structure, a mesa structure, and the like.

It is understood that the mounting space 330 may be formed by the inner wall of the housing part 310 and the side of the package circuit board 600 facing away from the substrate 220.

It is understood that when the substrate 220 includes the bracket 222, the fixing frame 240 is disposed on the bracket 222.

It will be appreciated that the fixing frame 240 may be used to abut against the cover portion 310 to limit the cover portion 310 and the packaged circuit board 600 from moving along the surface of the substrate 220, in particular, the fixing frame 240 may abut against the surface of the cover portion 310 on the side facing away from the substrate 220, the fixing frame 240 may also abut against the side wall of the cover portion 310 adjacent to the side facing away from the substrate 220, and the chip package device 210 may be fixed on the substrate 220 by the fixing frame 240.

It will be appreciated that the fixed frame 240 may also be used to interfere with the sidewall of the boss portion 320 for interfacing with the housing portion 310.

It can be appreciated that at least one heat conducting protrusion 231 is provided on one of the surface of the heat conducting housing 300 facing away from the package circuit board 600 and the bottom of the first groove 232, and in the example in which the second groove 321 corresponding to the heat conducting protrusion 231 one to one is provided on the other of the surface of the heat conducting housing 300 facing away from the package circuit board 600 and the bottom of the first groove 232, at least one heat conducting protrusion 231 is provided on one of the surface of the boss portion 320 facing away from the package circuit board 600 and the bottom of the first groove 232, and the second groove 321 corresponding to the heat conducting protrusion 231 one to one is provided on the other of the surface of the boss portion 320 facing away from the package circuit board 600 and the bottom of the first groove 232.

It will be appreciated that in the embodiment where the chip 400 is connected to the heat conductive housing 300 through the first heat conductive medium 500, the inner wall of the side of the chip 400 facing away from the package circuit board 600 of the cover part 310 is connected to the side of the first heat conductive medium 500, and the side of the first heat conductive medium 500 facing away from the package circuit board 600 may be attached to the inner wall of the side of the cover part 310 facing away from the package circuit board 600, and the chip 400 and the cover part 310 exchange heat through the first heat conductive medium 500.

It is understood that the housing portion 310 and the boss portion 320 may be of a unitary structure.

In the embodiment of the present application, when the heat sink 230 is fastened to the substrate 220 by the fastener, a side of the heat sink 230 facing the substrate 220 is used to press the fixing frame 240 against the substrate 220.

In this way, the fixing frame 240 is conveniently fixed to the substrate 220 by the heat sink 230 which is completed to be assembled.

It will be appreciated that the side of the heat sink 230 facing the circuit board 221 may compress the fixing frame 240 against the side of the housing portion 310 facing away from the circuit board 221, and compress the housing portion 310 against the bracket 222 via the fixing frame 240, such that the bracket 222 of the substrate 220 may compress the fixing frame 240 with the heat sink 230 via the housing portion 310. The side of the heat sink 230 facing the circuit board 221 may also press the fixing frame 240 against the side of the bracket 222 facing away from the circuit board 221. The side of the heat sink 230 facing the circuit board 221 may further compress the fixing frame 240 at the side of the limiting frame 223 facing away from the circuit board 221.

It is understood that the fixing frame 240 may not press the cover portion 310, and the cover portion 310 may be pressed against the bracket 222 of the substrate 220 by the heat sink 230.

In this embodiment, the second groove 321 formed in the heat conductive housing 300 is formed on a surface of the boss 320 facing away from the side of the package circuit board 600, and a bottom of the at least one second groove 321 is located on the cover portion 310.

In this way, the heat exchange surface between the groove wall of the second groove 321 and the heat conduction protrusion 231 is larger, the heat exchange efficiency is higher, and the efficiency of heat dissipation of the chip 400 between the cover case portion 310 and the package circuit board 600 through the heat sink 230 is higher.

It is understood that the groove bottom of the second groove 321 may be located at the junction surface of the cover portion 310 and the boss portion 320, where the depth of the second groove 321 may be equal to the thickness of the boss portion 320 where the second groove 321 is formed. The bottom of the second groove 321 may be located in the cover portion 310 and spaced from the boss portion 320, where the depth of the second groove 321 may be greater than the thickness of the boss portion 320 where the second groove 321 is formed.

It is understood that the bottoms of all the second grooves 321 may be located at the housing portion 310, or the bottoms of one or more of the second grooves 321 may be located at the housing portion 310.

In the embodiment of the present application, the projected outer edge of the boss portion 320 in the thickness direction of the package circuit board 600 coincides with the projected outer edge portion of the cover case portion 310 in the thickness direction of the package circuit board 600.

In this way, the boss 320 has a larger size, and the heat exchange area between the boss 320 and the first groove 232 is larger, which is beneficial to improving the heat exchange efficiency between the heat conductive housing 300 and the heat sink 230.

In the description of the embodiments of the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly coupled, indirectly coupled through intermediaries, in communication with each other, or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.

The terms first, second, third, fourth and the like in the description and in the claims of embodiments of the application and in the above-described figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto; although embodiments of the present application have been described in detail with reference to the foregoing embodiments, it will be appreciated by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. The chip packaging module is characterized by comprising a chip packaging device and a radiator;

the chip packaging device comprises a packaging circuit board, a heat conduction shell and a chip;

the heat conducting shell and the chip are arranged on the packaging circuit board, an installation space is formed between the heat conducting shell and the packaging circuit board, and the chip is positioned in the installation space;

the heat radiator is arranged at one end of the heat conducting shell, which is away from the packaging circuit board, a first groove is formed in one side of the heat radiator, which faces towards the packaging circuit board, one end of the heat conducting shell, which is away from the packaging circuit board, is arranged in the first groove, and the outer surface of the part, which is arranged in the first groove, of the heat conducting shell is used for carrying out heat exchange with the groove wall of the first groove, so that the chip passes through the heat conducting shell and the heat radiator.

2. The chip packaging module according to claim 1, wherein at least one heat conducting protrusion is arranged on one of a surface of the heat conducting shell, which is away from one side of the packaging circuit board, and a groove bottom of the first groove, a second groove corresponding to the heat conducting protrusion one to one is arranged on the other of the surface of the heat conducting shell, which is away from one side of the packaging circuit board, and the groove bottom of the first groove, the heat conducting protrusion is arranged in the corresponding second groove, and an outer surface of the heat conducting protrusion is used for heat exchange with a groove wall of the second groove where the heat conducting protrusion is located.

3. The chip package module of claim 2, wherein one of a surface of the thermally conductive housing facing away from the package circuit board and a bottom of the first recess is provided with a plurality of thermally conductive protrusions spaced apart from each other.

4. A chip package module according to claim 2 or 3, wherein at least one of the thermally conductive bumps is of a cube-like structure.

5. The chip package module according to any one of claims 2 to 4, wherein the heat conducting protrusion is disposed at a bottom of the first groove, and the second groove is disposed on a surface of the heat conducting housing facing away from a side of the package circuit board.

6. The chip packaging module according to any one of claims 1 to 5, further comprising a substrate and a fixing frame, wherein a side of the packaging circuit board facing away from the heat conductive housing is disposed on the substrate, and the fixing frame is disposed on a side of the substrate on which the packaging circuit board is disposed;

the heat conduction shell comprises a shell part and a boss part, the shell part is arranged on the packaging circuit board, the mounting space is formed between the shell part and the packaging circuit board, the boss part is positioned on one side of the shell part, which is away from the packaging circuit board, the boss part is arranged in the first groove at one end, which is away from the packaging circuit board, of the boss part, and the outer surface of the part, which is arranged in the first groove, is used for carrying out heat exchange with the groove wall of the first groove, so that the chip carries out heat exchange with the radiator through the shell part and the boss part;

the fixed frame is located the edge of housing portion, boss portion wears to establish in the entrance to a cave of fixed frame, boss portion deviates from the one end of encapsulation circuit board is located outside the fixed frame, fixed frame is used for the restriction housing portion with encapsulation circuit board removes, boss portion is located at least part outside the fixed frame is located in the first recess.

7. The chip package module of claim 6, wherein the heat sink is fastened to the substrate by a fastener, and a side of the heat sink facing the substrate is used to compress the fixing frame against the substrate.

8. The chip packaging module according to claim 6 or 7, wherein a second groove formed in the heat conducting housing is formed in a surface of one side of the boss portion, which is away from the packaging circuit board, and a bottom of at least one second groove is located in the housing portion.

9. The chip packaging module according to any one of claims 6 to 8, wherein an outer edge of the projection of the boss portion in the package circuit board thickness direction coincides with an outer edge portion of the projection of the cover case portion in the package circuit board thickness direction.

10. An electronic device comprising a housing and the chip package module of any one of claims 1-9, wherein a chip package device of the chip package module is disposed within the housing.