CN117727700A - Chip packaging structure - Google Patents
Chip packaging structure Download PDFInfo
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- CN117727700A CN117727700A CN202410172220.6A CN202410172220A CN117727700A CN 117727700 A CN117727700 A CN 117727700A CN 202410172220 A CN202410172220 A CN 202410172220A CN 117727700 A CN117727700 A CN 117727700A
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- Prior art keywords
- chip
- groove
- side wall
- protective shell
- heat
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- 238000004806 packaging method and process Methods 0.000 title abstract description 28
- 230000001681 protective effect Effects 0.000 claims abstract description 67
- 229920001971 elastomer Polymers 0.000 claims abstract description 10
- 239000000806 elastomer Substances 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 33
- 230000017525 heat dissipation Effects 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 20
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 230000008602 contraction Effects 0.000 claims description 5
- 238000001125 extrusion Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 11
- 239000000725 suspension Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Abstract
The disclosure relates to a chip packaging structure, wherein a bottom shell is fixed on a chip bearing surface and circumferentially surrounds a chip, a first groove which is opened in the top surface of the bottom shell is arranged in the bottom shell, and the first groove circumferentially surrounds the chip; the bottom shell comprises a second groove which is opened on the outer side surface of the bottom shell; when the side wall part of the protective shell is embedded into the first groove, the side wall part and the bearing surface enclose to form a cavity body for sealing the chip; the side wall of the protective shell comprises a clamping groove; the clamping part comprises a handle and a horizontal part which penetrates through the bottom surface of the second groove along the horizontal direction and extends into the cavity, and the handle is fixedly connected with the inner surface of the second groove through an elastomer; the horizontal part is used for being clamped with the clamping groove when the clamping groove is positioned in the first groove; the heat collecting plate is located the top surface of chip, and the top surface of heat collecting plate is fixed to be provided with a plurality of heat conduction poles that the interval was arranged, and the heat conduction pole extends and runs through the top surface of protecting crust along the direction of perpendicular base plate, can dispel the heat and be convenient for installation and dismantlement betterly.
Description
Technical Field
The present invention relates to the field of semiconductor packaging technology, and in particular, to a chip packaging structure.
Background
With the increasing development of semiconductor technology, the integration density and power consumption of semiconductor devices are higher and higher, so that the heat dissipation of chips is more difficult, and new challenges are brought to the safety and reliability of chip operation.
The conventional chip packaging structure generally fixes the chip inside the packaging shell, so as to ensure that contaminants such as external dust enter the chip packaging structure to pollute the chip, the chip packaging structure is generally sealed and fixed, and the chip packaging structure is difficult to disassemble to clean, maintain or repair the chip inside the chip packaging structure, so that the reliability and the service life of the chip packaging structure are reduced.
Disclosure of Invention
Based on this, it is necessary to provide a chip packaging structure, can be better with the chip heat conduction to chip packaging structure's outside to be convenient for install and dismantle, the convenience of customers cleans, maintains or maintains the chip, when improving chip operational reliability, extension chip's life.
To solve the above technical problems and other related problems, according to some embodiments, an aspect of the disclosure provides a chip packaging structure, including a substrate, a bottom shell, a protective shell, a clamping portion, and a heat collecting plate, where a bearing surface of the substrate is provided with contacts disposed corresponding to pins of a chip, and the contacts are electrically connected with the corresponding pins; the bottom shell is fixed on the bearing surface and circumferentially surrounds the chip, a first groove which is opened in the top surface of the bottom shell is arranged in the bottom shell, and the first groove circumferentially surrounds the chip; the bottom shell comprises a second groove which is opened on the outer side surface of the bottom shell; when the side wall part of the protective shell is embedded into the first groove, the side wall part and the bearing surface enclose to form a cavity body for sealing the chip; the side wall of the protective shell comprises a clamping groove; the clamping part comprises a handle and a horizontal part penetrating through the bottom surface of the second groove along the horizontal direction and extending into the cavity, the handle is at least partially positioned at the periphery of the bottom shell and fixedly connected with the outer end surface of the horizontal part, and the handle is fixedly connected with the inner surface of the second groove through an elastomer; the horizontal part is used for being clamped with the clamping groove when the clamping groove is positioned in the first groove; the heat collecting plate is positioned on the top surface of the chip, a plurality of heat conducting rods which are distributed at intervals are fixedly arranged on the top surface of the heat collecting plate, and the heat conducting rods extend along the direction perpendicular to the substrate and penetrate through the top surface of the protective shell.
In the chip packaging structure of the embodiment, the conductive contacts corresponding to the pins of the chip are arranged on the bearing surface of the substrate, so that the pins of the chip and the contacts on the bearing surface of the substrate are fixedly connected one to one, and the electrical communication between the chip and the substrate is realized; the bottom shell is fixed on the substrate bearing surface and circumferentially surrounds the chip, a first groove which is opened in the top surface of the bottom shell and a second groove which is opened on the outer side surface of the bottom shell are arranged in the bottom shell, and the first groove circumferentially surrounds the chip, so that when the side wall part of the protective shell is embedded in the first groove, the protective shell and the substrate bearing surface are surrounded to form a cavity body for sealing the chip; the clamping part comprises a handle and a horizontal part penetrating through the bottom surface of the second groove along the horizontal direction and extending into the cavity, the handle is at least partially positioned at the periphery of the bottom shell and fixedly connected with the outer end surface of the horizontal part, and the handle is fixedly connected with the inner surface of the second groove through an elastomer; when the elastic body is stretched by the horizontal part and leaves the clamping groove of the side wall of the protective shell, the side wall part of the protective shell is embedded into the first groove, and when the horizontal part is rebounded by the elastic body, the elastic body is pulled back and partially embedded into the clamping groove of the side wall of the protective shell, so that the clamping connection between the clamping part and the protective shell is realized; through setting up the heat-collecting plate and being located the top surface of chip, the fixed heat-conducting rod that is provided with a plurality of intervals of top surface of heat-collecting plate, the heat-conducting rod extends and runs through the top surface of protecting crust along the direction of perpendicular base plate, the heat-collecting plate direct contact of being convenient for compresses tightly the chip to in time with the chip generate heat the outside of conducting to chip packaging structure via the heat-conducting rod. If the chip packaging structure needs to be disassembled, the elastic body can be stretched through the handle, the horizontal part is taken away from the clamping groove of the side wall of the protective shell, so that a user can directly take the protective shell together with the heat-collecting plate and the heat-conducting rod away from the bottom shell, the user can clean, maintain or repair the chip conveniently, after the cleaning, maintenance or repair operation is finished, the elastic body is stretched through the handle, the side wall part of the protective shell is embedded into the first groove, the handle is released, the elastic body is used for rebounding and pulling back the horizontal part, the horizontal part is clamped into the clamping groove of the side wall of the protective shell, the assembly of the protective shell and the bottom shell on the substrate is realized, and therefore, the working reliability of the chip is improved, and the service life of the chip is prolonged.
In some embodiments, the chip package structure further includes a heat-conducting buffer layer fixed to the bottom surface of the heat-collecting plate and located between the heat-collecting plate and the top surface of the chip.
In some embodiments, the thermally conductive buffer layer comprises a thermally conductive silicone sheet secured to the bottom surface of the heat collecting plate and positioned between the heat collecting plate and the top surface of the chip.
In some embodiments, an area of the handle facing away from the chip surface in the horizontal direction is greater than an opening area of the second recess.
In some embodiments, the elastic body comprises a spring, one end of the spring is fixedly connected with the surface of the handle, which is close to the chip in the horizontal direction, and the other end of the spring is fixedly connected with the bottom surface of the second groove.
In some embodiments, the chip package structure further comprises at least one elastic pressing device suspended on an inner side wall of the protective shell; the elastic pressing device comprises a pressing elastic sheet, a sliding block and an extrusion column, and a first end of the pressing elastic sheet is fixed on the inner side wall of the protective shell; the slider is configured to: the surface deviating from the chip is fixedly connected with the second end of the compression spring plate, and one end close to the inner side wall of the protective shell is in sliding connection with the inner side wall of the protective shell; the extrusion column is configured to: the surface deviating from the chip is fixedly connected with the surface, close to the chip, of the sliding block, and the surface, close to the chip, is used for being pressed on the top surface of the chip.
In some embodiments, a third groove which is opened on the inner side wall of the protective shell is arranged in the side wall of the protective shell, and a sliding rod which extends along the height direction of the vertical base plate and penetrates through the sliding block is arranged in the third groove; two ends of the sliding rod, which are opposite in the height direction, are fixed on the inner side wall of the third groove; the sliding block is used for sliding in the third groove along the guiding of the sliding rod.
In some embodiments, the chip package structure further includes at least one suspension spring and/or at least one buffer spring, a first end of the suspension spring is fixed to an inner sidewall of the protective shell and a second end of the suspension spring is fixed to a top surface of the heat collecting plate; the buffer spring piece is positioned between the substrate and the chip, two ends of the buffer spring piece, which are opposite along the extending direction of the buffer spring piece, are both fixed on the top surface of the substrate, and the middle part of the buffer spring piece presses the chip.
In some embodiments, the chip packaging structure further includes at least one heat dissipation window formed on a side wall of the protective shell, and a first metal sheet and a second metal sheet disposed corresponding to the heat dissipation window and located in the cavity; the first metal sheet covers the heat dissipation window, and the second metal sheet is positioned on the surface of the first metal sheet, which is away from the heat dissipation window; at least one end of the first metal sheet and at least one end of the second metal sheet are fixed on the inner side wall of the protective shell; the difference value of the thermal expansion coefficient and the cold contraction coefficient of the first metal sheet and the second metal sheet is larger than or equal to a preset threshold value.
In some embodiments, the chip packaging structure further comprises a clamping piece and a splice plate, wherein the clamping piece is fixed on the outer side wall of the protective shell, and a sliding rail is arranged on the clamping piece; the side wall of the splice plate is provided with a clamping groove which is used for being clamped with the sliding rail and fixing the splice plate on the outer side wall of the protective shell; the surface of the side wall of the splice plate, which faces away from the protective shell, is provided with at least one heat dissipation plate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other embodiments of the drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic longitudinal section view of a chip package structure along a length direction according to an embodiment of the present disclosure; wherein the length direction is parallel to the ox direction; the width direction is parallel to the oy direction; the height direction is parallel to the oz direction;
FIG. 2 is an enlarged schematic view of a partial structure within a circle A shown in FIG. 1;
FIG. 3 is an enlarged partial schematic view of a longitudinal section of a chip package structure along a longitudinal direction according to an embodiment of the present disclosure; wherein the length direction is parallel to the ox direction;
fig. 4 is a schematic perspective view of a chip package structure according to an embodiment of the present disclosure;
FIG. 5 is a schematic longitudinal cross-sectional view of the structure shown in FIG. 4 in the widthwise direction; wherein the length direction is parallel to the ox direction; the width direction is parallel to the oy direction; the height direction is parallel to the oz direction;
FIG. 6 is an enlarged schematic view of a partial structure within a circle B shown in FIG. 5;
fig. 7 is an enlarged schematic view of a part of a splice plate and a slide rail of a chip package structure according to an embodiment of the present disclosure.
Reference numerals illustrate:
1. a substrate; 201. a first metal sheet; 202. a second metal sheet; 211. a handle; 212. an elastomer; 2111. a horizontal portion; 301. a first groove; 302. a second groove; 20. a heat dissipation window; 213. a slide bar; 214. a protective shell; 2141. a clamping groove; 2142. a third groove; 215. a buffer spring plate; 216. an extrusion column; 217. compressing the spring plate; 218. a bottom case; 219. a slide block; 221. a heat dissipation plate; 222. a heat conduction rod; 223. a thermally conductive silicone sheet; 224. a heat collecting plate; 225. a hanging spring plate; 226. splice plates; 2261. a clamping groove; 227. a slide rail; 3. a chip; 4. pins; 5. and a contact.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Where the terms "comprising," "having," and "including" are used herein, another component may also be added unless explicitly defined as such, e.g., "consisting of … …," etc. Unless mentioned to the contrary, singular terms may include plural and are not to be construed as being one in number.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
Spatially relative terms, such as "under", "below", "beneath", "under", "above", "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. Furthermore, the device may also include an additional orientation (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
Embodiments of the invention are described herein with reference to schematic illustrations that are idealized embodiments (and intermediate structures) of the invention, such that variations of the illustrated shapes due to, for example, manufacturing techniques and/or tolerances are to be expected. Thus, embodiments of the present invention should not be limited to the particular shapes of the regions illustrated herein, but rather include deviations in shapes that result, for example, from manufacturing techniques.
The horizontal direction in the embodiment of the present application is a direction parallel to the top surface of the substrate, and the direction perpendicular to the substrate is parallel to the height direction of the chip.
The silicon optical chip is an integrated optical path integrating silicon optical materials and devices together through standard semiconductor technology, and mainly comprises a modulator, a detector, a passive waveguide device and the like. The silicon light is a silicon-based photoelectron large-scale integration technology taking photons and electrons as information carriers, can greatly improve the performance of an integrated chip, is a basic support technology of emerging industries such as big data, artificial intelligence, future mobile communication and the like, and can be widely applied to industries such as big data centers, 5G, internet of things and the like. However, the attenuation rate of the silicon optical chip is high, so that the stability of signal transmission directly affects the performance and the working reliability of the silicon optical chip.
Referring to fig. 1-2, according to some embodiments, a chip package structure is provided, which includes a substrate 1, a bottom shell 218, a protective shell 214, a clamping portion (not shown) and a heat collecting plate 224, wherein a bearing surface of the substrate 1 is provided with a contact 5 corresponding to a pin 4 of a chip 3, and the contact 5 is electrically connected with the corresponding pin 4; the bottom shell 218 is fixed on the bearing surface and circumferentially surrounds the chip 3, a first groove 301 which is opened in the top surface of the bottom shell 218 is arranged in the bottom shell 218, and the first groove 301 circumferentially surrounds the chip 3; the bottom case 218 includes a second groove 302 opened at an outer side surface of the bottom case 218; when the side wall part of the protective shell 214 is embedded into the first groove 301, the side wall part and the bearing surface enclose a cavity for sealing the chip 3; the side wall of the protective housing 214 includes a clamping groove 2141; the clamping part comprises a handle 211 and a horizontal part 2111 penetrating through the bottom surface of the second groove 302 along the horizontal direction and extending into the cavity, wherein the handle 211 is at least partially positioned at the periphery of the bottom shell 218 and fixedly connected with the outer end surface of the horizontal part 2111, and the handle 211 is fixedly connected with the inner surface of the second groove 302 through an elastomer 212; the horizontal portion 2111 is configured to be engaged with the clamping groove 2141 when the clamping groove 2141 is located in the first groove 301; the heat collecting plate 224 is located on the top surface of the chip 3, and a plurality of heat conducting rods 222 arranged at intervals are fixedly arranged on the top surface of the heat collecting plate 224, and the heat conducting rods 222 extend along the direction perpendicular to the substrate 1 and penetrate through the top surface of the protective shell 214.
With continued reference to fig. 1-2, by providing the carrier surface of the substrate 1 with conductive contacts 5 corresponding to the pins 4 of the chip 3, the pins 4 of the chip 3 are conveniently and fixedly connected with the contacts 5 on the carrier surface of the substrate 1 in one-to-one manner, so as to realize electrical communication between the chip 3 and the substrate 1; by arranging the bottom shell 218 fixed on the bearing surface of the substrate 1 and circumferentially surrounding the chip 3, a first groove 301 opening in the top surface of the bottom shell 218 and a second groove 302 opening in the outer side surface of the bottom shell 218 are arranged in the bottom shell 218, and the first groove 301 circumferentially surrounds the chip 3, so that when the side wall part of the protective shell 214 is embedded into the first groove 301, the protective shell 214 and the bearing surface of the substrate 1 are surrounded to form a cavity body for sealing the chip 3; the clamping part comprises a handle 211 and a horizontal part 2111 penetrating through the bottom surface of the second groove 302 along the horizontal direction and extending into the cavity, wherein the handle 211 is at least partially positioned at the periphery of the bottom shell 218 and fixedly connected with the outer end surface of the horizontal part 2111, and the handle 211 is fixedly connected with the inner surface of the second groove 302 through an elastomer 212; thus, when the horizontal part 2111 stretches the elastic body 212 and leaves the clamping groove 2141 on the side wall of the protecting shell 214, the side wall part of the protecting shell 214 is embedded into the first groove 301, and when the horizontal part 2111 is rebounded by the elastic body 212, the side wall part is pulled back and is partially embedded into the clamping groove 2141 on the side wall of the protecting shell 214, so that the clamping connection between the clamping part and the protecting shell 214 is realized; through setting up the heat-collecting plate 224 and being located the top surface of chip 3, the fixed heat-conducting rod 222 that is provided with a plurality of intervals of top surface of heat-collecting plate 224, heat-conducting rod 222 extends and runs through the top surface of protecting crust 214 along the direction of perpendicular base plate 1, and the direct contact of the heat-collecting plate 224 of being convenient for compresses tightly chip 3 to in time with chip 3 generate heat and conduct the outside to chip packaging structure via heat-conducting rod 222. If the chip packaging structure needs to be disassembled, the elastic body 212 can be stretched by the handle 211 and the horizontal portion 2111 is carried away from the clamping groove 2141 on the side wall of the protecting shell 214, so that a user can directly carry the protecting shell 214, the heat-collecting plate 224 and the heat-conducting rod 222 away from the bottom shell 218, and the user can clean, maintain or repair the chip 3 conveniently.
In some embodiments, the chip packaging structure further includes a heat-conducting buffer layer (not shown), where the heat-conducting buffer layer is fixed on the bottom surface of the heat-collecting plate and located between the heat-collecting plate and the top surface of the chip, and the heat-conducting buffer layer can transfer heat dissipation of the chip to outside of the protective shell through the heat-collecting plate and the heat-conducting rod, and has an elastic buffer effect, so that the influence of excessive pressure of the heat-collecting plate on the chip on the stability of the chip operation is avoided; and the heat-collecting plate can press the chip through the heat-conducting buffer layer, so that the chip is fixed on the top surface of the substrate, the problem that the pins and the contacts of the chip are separated due to shaking of the chip packaging structure is avoided, and the working reliability of the chip packaging structure is improved.
In some embodiments, the heat conducting rod can be connected with the protective shell in a sealing way through the sealant, so that the chip is prevented from being influenced by external dust or toxic gas and other pollutants, and the service life of the chip is shortened.
With continued reference to fig. 1-2, in some embodiments, the thermally conductive buffer layer includes a thermally conductive silicone sheet 223, the thermally conductive silicone sheet 223 being fixed to the bottom surface of the heat collecting plate 224 and being located between the heat collecting plate 224 and the top surface of the chip 3. The heat-conducting silica gel sheet 223 can transfer the heat dissipation of the chip to the outside of the protective shell 214 through the heat-collecting plate 224 and the heat-conducting rod 222, has an elastic buffering function, and prevents the heat-collecting plate 224 from excessively pressing the chip 3 to influence the working stability of the chip 3; and the heat collecting plate 224 can compress tightly the chip 3 through the heat conducting silica gel piece 223, so that the chip 3 is fixed on the top surface of the substrate 1, and the problem that the pins 4 and the contacts 5 of the chip 3 are separated due to shaking of the chip packaging structure is avoided, thereby improving the working reliability of the chip packaging structure.
With continued reference to fig. 1-2, in some embodiments, the area of the handle 211 facing away from the surface of the chip 3 in the horizontal direction is larger than the opening area of the second groove 302, so that the handle 211 is prevented from being partially or completely pressed into the second groove 302, which results in over-compressing the elastomer 212 and reducing the service life of the elastomer 212.
Note that the number of the clamping portions in the embodiment of the present application may be plural. For example, four corners of the rectangular bottom shell are respectively distributed.
With continued reference to fig. 1-2, in some embodiments, the elastic body 212 includes a spring, one end of which is fixedly connected to the surface of the handle 211 adjacent to the chip 3 in the horizontal direction, and the other end of which is fixedly connected to the bottom surface of the second recess 302. The horizontal portion 2111 can be assisted by spring tension and rebound to move away from or engage the catch 2141 of the side wall of the guard 214 to assist in mounting or dismounting the guard 214 from the bottom shell 218.
In some embodiments, referring to fig. 3, the chip package structure further includes at least one elastic pressing device (not shown) suspended from an inner sidewall of the protective housing 214; the elastic pressing device comprises a pressing elastic sheet 217, a sliding block 219 and a pressing column 216, wherein a first end of the pressing elastic sheet 217 is fixed on the inner side wall of the protective shell 214; the slider 219 is configured to: the surface deviating from the chip 3 is fixedly connected with the second end of the pressing elastic sheet 217, and one end close to the inner side wall of the protective shell 214 is in sliding connection with the inner side wall of the protective shell 214; the extrusion column 216 is configured to: the surface facing away from the chip 3 is fixedly connected with the surface of the slider 219, which is close to the chip 3, and the surface, which is close to the chip 3, is used for being pressed against the top surface of the chip 3. The pressing spring piece 217 presses the sliding block 219 and the pressing column 216 downwards, so that the pressing column 216 is ensured to press the chip 3; the pressing spring piece 217 has a certain elastic buffering function, and the phenomenon that the working reliability of the chip 3 is affected due to the fact that the pressure of the pressing column 216 on the chip 3 is too high is avoided.
Note that the number of the elastic pressing devices in the embodiment of the present application may be plural. For example, the number of the protective shells can be four, and the protective shells are distributed on two inner side walls of the rectangular parallelepiped protective shell, which are opposite in the ox direction.
In some embodiments, please continue to refer to fig. 1-3, a third groove 2142 is provided in the sidewall of the protection shell 214, which is open to the inner sidewall of the protection shell 214, and a sliding rod 213 extending along the height direction (such as oz direction) of the vertical substrate 1 and penetrating through the sliding block 219 is included in the third groove 2142; both ends of the sliding rod 213 opposite to each other in the height direction are fixed to the inner sidewall of the third groove 2142; the slider 219 is adapted to slide within the third groove 2142 along the guide of the slide bar 213.
In some embodiments, please continue to refer to fig. 3, the chip package structure further includes at least one buffer spring 215, the buffer spring 215 is located between the substrate 1 and the chip 3, two opposite ends of the buffer spring 215 along the extending direction are both fixed on the top surface of the substrate 1 and the middle portion of the buffer spring presses the chip 3, so as to avoid damaging the chip 3 due to excessive pressure applied to the chip 3.
In some embodiments, referring to fig. 4-6, the chip package structure further includes at least one suspension spring 225, wherein a first end of the suspension spring 225 is fixed to an inner sidewall of the protective housing 214 and a second end of the suspension spring is fixed to a top surface of the heat collecting plate 224. The hanging spring piece 225 can hang the heat collecting plate 224 on the side wall of the protecting shell 214, and compress the heat collecting plate 224 on the top surface of the chip 3, and meanwhile, the elastic buffering effect can be achieved, and the influence of the excessive pressure of the heat collecting plate 224 on the chip 3 on the service life of the chip 3 is avoided.
Note that the number of suspension springs in the embodiment of the present application may be plural. For example, the number of the protection shells can be four, and the protection shells are distributed on two opposite inner side walls of the rectangular parallelepiped protection shell along the oy direction.
In some embodiments, please continue to refer to fig. 5-6, the chip package structure further includes at least one heat dissipation window 20 formed on a sidewall of the protective housing 214, and a first metal sheet 201 and a second metal sheet 202 disposed corresponding to the heat dissipation window 20 and located in the cavity; the first metal sheet 201 covers the heat dissipation window 20, and the second metal sheet 202 is located on the surface of the first metal sheet 201 facing away from the heat dissipation window 20; at least one end of the first metal sheet 201 and the second metal sheet 202 is fixed on the inner side wall of the protective shell 214; wherein, the difference value of the thermal expansion coefficient and the cold contraction coefficient of the first metal sheet 201 and the second metal sheet 202 is greater than or equal to a preset threshold value.
Note that the number of heat dissipation windows in the embodiment of the present application may be plural. For example, the number of the protection shells can be four, and the protection shells are arranged on two side walls of the rectangular protection shell, which are opposite in the oy direction.
In some embodiments, please continue to refer to fig. 5-6, the first metal sheet 201 may be provided as an aluminum plate, the second metal sheet 202 may be provided as a copper plate, and the aluminum plate and the copper plate may have different coefficients of thermal expansion and contraction, so that when the heat dissipation of the chip causes the aluminum plate and the copper plate to be heated and bent, a heat dissipation gap is generated between the aluminum plate and the copper plate, and the heat dissipation gap is located in the heat dissipation window 20.
In some embodiments, the material of the first metal sheet or the second metal sheet may be one or more selected from aluminum, copper, magnesium, iron, tungsten, etc., so as to ensure that the difference between the thermal expansion coefficient and the cold contraction coefficient of the first metal sheet and the second metal sheet is greater than or equal to a preset threshold value, and the specific material is not specifically limited in this application.
In some embodiments, please continue to refer to fig. 5 and 7, the chip package structure further includes a clip (not shown) and a splice plate 226, the clip is fixed on the outer sidewall of the protective housing 214, and a sliding rail 227 is disposed on the clip; the side wall of the splice plate 226 is provided with a clamping groove 2261, and the clamping groove 2261 is used for clamping with the sliding rail 227 and fixing the splice plate 226 on the outer side wall of the protective shell 214; the surface of the splice plate 226 facing away from the side wall of the protective housing 214 is provided with at least one heat dissipating plate 221. The heat dissipation plate 221 can accelerate the heat dissipation speed of the protecting shell 214 outwards, so as to avoid the influence of the temperature rise caused by the heat dissipation accumulation of the chip 3 on the working stability of the chip 3.
In some embodiments, please continue to refer to fig. 5 and 7, the clamping groove 2261 may be a T-shaped clamping groove, so that the splice plate 226 fixed with a plurality of heat dissipation plates 221 arranged at intervals is clamped on the sliding rail 227 via the T-shaped clamping groove, and the splice plate 226 is also convenient to be detached from the sliding rail 227.
In some embodiments, the chip in the chip packaging structure is a silicon optical chip, and in the embodiment of the application, the heat conduction buffer layer is fixed on the bottom surface of the heat collecting plate and is positioned between the heat collecting plate and the top surface of the chip, and the elastic pressing device, the buffer elastic sheet and the suspension elastic sheet are arranged to act together, so that the silicon optical chip is ensured to be firmly connected with the contact on the bearing surface of the substrate, the energy conversion efficiency of the silicon optical chip is improved, and the phenomenon of cold joint or open circuit between the silicon optical chip and the contact caused by shaking of the chip packaging structure can be avoided; and the influence on the service life of the silicon optical chip caused by overlarge pressure on the silicon optical chip can be avoided.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. A chip package structure, comprising:
the substrate is provided with a contact corresponding to a pin of the chip on a bearing surface, and the contact is electrically connected with the corresponding pin;
the bottom shell is fixed on the bearing surface and circumferentially surrounds the chip, a first groove which is opened in the top surface of the bottom shell is arranged in the bottom shell, and the first groove circumferentially surrounds the chip; the bottom shell comprises a second groove which is opened on the outer side surface of the bottom shell;
the side wall part of the protective shell is enclosed with the bearing surface to form a cavity body for sealing the chip when being embedded into the first groove; the side wall of the protective shell comprises a clamping groove;
the clamping part comprises a handle and a horizontal part penetrating through the bottom surface of the second groove along the horizontal direction and extending into the cavity, the handle is at least partially positioned at the periphery of the bottom shell and fixedly connected with the outer end surface of the horizontal part, and the handle is fixedly connected with the inner surface of the second groove through an elastomer; the horizontal part is used for being clamped with the clamping groove when the clamping groove is positioned in the first groove;
the heat collecting plate is positioned on the top surface of the chip, a plurality of heat conducting rods which are distributed at intervals are fixedly arranged on the top surface of the heat collecting plate, and the heat conducting rods extend along the direction perpendicular to the substrate and penetrate through the top surface of the protective shell.
2. The chip package structure according to claim 1, further comprising:
the heat conduction buffer layer is fixed on the bottom surface of the heat collecting plate and is positioned between the heat collecting plate and the top surface of the chip.
3. The chip package structure of claim 2, wherein the thermally conductive buffer layer comprises:
and the heat conduction silica gel sheet is fixed on the bottom surface of the heat collection plate and is positioned between the heat collection plate and the top surface of the chip.
4. A chip package structure according to any one of claims 1 to 3, wherein an area of the handle facing away from the chip surface in a horizontal direction is larger than an opening area of the second recess.
5. A chip package structure according to any one of claims 1 to 3, wherein the elastomer comprises:
and one end of the spring is fixedly connected with the surface of the handle, which is close to the chip along the horizontal direction, and the other end of the spring is fixedly connected with the bottom surface of the second groove.
6. The chip package structure of any one of claims 1-3, further comprising at least one elastic pressing device suspended from an inner sidewall of the protective case; the elastic pressing device includes:
the first end of the compression spring piece is fixed on the inner side wall of the protective shell;
a slider configured to: the surface deviating from the chip is fixedly connected with the second end of the compression spring plate, and one end close to the inner side wall of the protective shell is in sliding connection with the inner side wall of the protective shell;
an extrusion column configured to: the surface deviating from the chip is fixedly connected with the surface, close to the chip, of the sliding block, and the surface, close to the chip, is used for being pressed on the top surface of the chip.
7. The chip package structure according to claim 6, wherein a third groove which is opened in the inner side wall of the protective shell is arranged in the side wall of the protective shell, and a sliding rod which extends along the height direction perpendicular to the substrate and penetrates through the sliding block is arranged in the third groove;
two ends of the sliding rod, which are opposite in the height direction, are fixed on the inner side wall of the third groove;
the sliding block is used for sliding in the third groove along the guiding of the sliding rod.
8. The chip package structure according to any one of claims 1 to 3, further comprising at least one of:
a hanging spring plate, the first end of which is fixed on the inner side wall of the protective shell and the second end of which is fixed on the top surface of the heat collecting plate; and/or
The buffer elastic sheet is positioned between the substrate and the chip, and two ends of the buffer elastic sheet, which are opposite along the extending direction of the buffer elastic sheet, are both fixed on the top surface of the substrate, and the middle part of the buffer elastic sheet extrudes the chip.
9. The chip package structure according to any one of claims 1 to 3, further comprising at least one heat dissipation window formed on a side wall of the protective case, and a first metal sheet and a second metal sheet disposed corresponding to the heat dissipation window and located in the cavity;
the first metal sheet covers the heat dissipation window, and the second metal sheet is positioned on the surface of the first metal sheet, which is away from the heat dissipation window; at least one end of the first metal sheet and one end of the second metal sheet are fixed on the inner side wall of the protective shell;
the difference value of the thermal expansion coefficient and the cold contraction coefficient of the first metal sheet and the second metal sheet is larger than or equal to a preset threshold value.
10. The chip package structure according to any one of claims 1 to 3, further comprising:
the clamping piece is fixed on the outer side wall of the protective shell and is provided with a sliding rail;
the side wall of the splice plate is provided with a clamping groove which is used for being clamped with the sliding rail and fixing the splice plate on the outer side wall of the protective shell; at least one heat dissipation plate is arranged on the surface of the side wall, facing away from the protective shell, of the splice plate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410172220.6A CN117727700B (en) | 2024-02-07 | 2024-02-07 | Chip packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410172220.6A CN117727700B (en) | 2024-02-07 | 2024-02-07 | Chip packaging structure |
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| CN117727700B CN117727700B (en) | 2024-05-03 |
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| WO2023272637A1 (en) * | 2021-06-30 | 2023-01-05 | 华为技术有限公司 | Packaging heat dissipating cover, chip packaging structure, and electronic device |
| WO2023071671A1 (en) * | 2021-10-26 | 2023-05-04 | 北京比特大陆科技有限公司 | Chip module and circuit board |
| CN116247013A (en) * | 2022-12-16 | 2023-06-09 | 超聚变数字技术有限公司 | Chip packaging module and electronic equipment |
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| CN109346442A (en) * | 2018-10-10 | 2019-02-15 | 唐燕 | It is a kind of be easy to radiate chip-packaging structure and its packaging method |
| CN213340337U (en) * | 2020-05-18 | 2021-06-01 | 马鞍山芯海科技有限公司 | Chip packaging structure |
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| CN117727700B (en) | 2024-05-03 |
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