CN109346442A - It is a kind of be easy to radiate chip-packaging structure and its packaging method - Google Patents
It is a kind of be easy to radiate chip-packaging structure and its packaging method Download PDFInfo
- Publication number
- CN109346442A CN109346442A CN201811180271.4A CN201811180271A CN109346442A CN 109346442 A CN109346442 A CN 109346442A CN 201811180271 A CN201811180271 A CN 201811180271A CN 109346442 A CN109346442 A CN 109346442A
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- heat
- fixedly connected
- conducting
- chip
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Abstract
The present invention relates to a kind of chip-packaging structure for being easy to radiate and its packaging methods, including substrate.Substrate center is fixedly connected with encapsulating table, and substrate two sides offer slot, inserted with pin in slot, pin one end two sides are flexibly connected movable block, movable block one end is fixedly connected with spring, inserted with chip body in the top groove of encapsulating table, package shelf is provided with above chip body, two side bottom of package shelf offers card slot, two lateral roof of substrate is fixedly connected with fixture block, package shelf bottom is fixedly connected with heat-conducting plate, heat-conducting plate bottom is fixedly connected with absorber plate, heat-conducting block is fixedly connected on absorber plate, heat-conducting block two sides are fixedly connected with heat conductive rod, if heat-conducting plate side wall is fixedly connected with dry plate cooling fin, two sides are provided with Air Filter at the top of package shelf, several heat-radiating rods are fixedly connected at the top of heat-conducting block, heat-radiating rod top is fixedly connected with heat sink, package shelf two sides side wall offers several heat release holes, chip body two sides are electrically connected Conducting wire.
Description
Technical field
The present invention relates to electronic component technology field, specially a kind of chip-packaging structure for being easy to radiate and its encapsulation side
Method.
Background technique
Chip, also known as microcircuit, microchip, integrated circuit, refer to the silicon wafer for including integrated circuit, volume very little, usually
It is computer or a part of other electronic equipments.The carrier and integrated circuit that chip generally refers to integrated circuit are by setting
Meter, manufacture, encapsulation, test after as a result, and integrated circuit is most important part in electronic equipment, carry operation and storage
Function, the application range of integrated circuit covers military project, civilian almost all of electronic equipment.Encapsulation is integrated circuit
Assembly is the process of chip final products, and briefly, the integrated circuit die that exactly manufacturer is produced is placed on one piece and rises
On the substrate acted on to carrying, pin is extracted, then fixation is packaged into as an entirety.
When chip operation, often generate a large amount of thermal energy, if thermal energy can not in time loss and be constantly deposited in chip
If interior, the temperature of chip will constantly rise, and for a long time, chip is just likely to occur due to overheat and efficiency is caused to decline
Subtract or reduced service life, serious person even cause permanent damage.Existing chip-packaging structure design is unreasonable, does not have
Reserve sufficiently large heat-dissipating space so that the inner air of encapsulating structure does not circulate, so as to cause heat caused by chip without
Method is timely spread out.
Summary of the invention
Present invention solves the technical problem that being to overcome the chip-packaging structure of the prior art to design unreasonable, heat-dissipating space
Small, inner air does not circulate, can not in time radiating and cooling defect, provide it is a kind of be easy to radiate chip-packaging structure and its envelope
Dress method.A kind of chip-packaging structure for being easy to radiate and its packaging method have design, and rationally heat-dissipating space is big, favorably
It is spread in time in heat, heat dissipation and the features such as good cooling effect.
To achieve the above object, the invention provides the following technical scheme: it is a kind of be easy to radiate chip-packaging structure, including
Substrate, the center of the substrate is fixedly connected with encapsulating table, and the two sides of the substrate offer slot, the slot interpolation
Entering has pin, and one end two sides of the pin are connected with movable block, and one end of the movable block is fixedly connected with spring, institute
The other end for stating spring is fixedly connected on pin, and fluted, and the top of the encapsulating table is opened up at the top of the encapsulating table
Inserted with chip body in groove, it is provided with package shelf above the chip body, two side bottoms of the package shelf are opened
Equipped with card slot, two lateral roofs of the substrate are fixedly connected to fixture block, and the fixture block is inserted into card slot, the package shelf
Bottom is fixedly connected with two pieces of heat-conducting plates, and the bottom of the heat-conducting plate is fixedly connected with absorber plate, the bottom of the absorber plate with
The top surface of chip body is in contact, and heat-conducting block is fixedly connected on the absorber plate, and the two sides of the heat-conducting block are solid
Surely several heat conductive rods are connected with, the other end of the heat conductive rod is fixedly connected on heat-conducting plate, and the side wall of the heat-conducting plate is solid
If being connected with dry plate cooling fin surely, the top two sides of the package shelf are provided with Air Filter, and the Air Filter is located at cooling fin
Surface is fixedly connected with several heat-radiating rods at the top of the heat-conducting block, and the every heat-radiating rod runs through the top of package shelf
Portion's outer wall and the top for extending to package shelf, and the top of the heat-radiating rod is fixedly connected with heat sink, the two of the package shelf
Side side wall offers several heat release holes, and the two sides of the chip body are electrically connected with conducting wire, the other end of the conducting wire
It is electrically connected on pin.
Preferably, the center of the fixture block and card slot is located on the same line, and width is less than the groove width of card slot, and institute
The outer wall for stating fixture block is provided with several hemispherical rubber blocks.
Preferably, the cooling fin is waveform copper sheet structure, and quantity is no less than eight, and dissipates described in every adjacent two panels
The distance between backing is equal.
Preferably, the absorber plate be copper-aluminum composite board structure, and the bottom of the absorber plate uniformly smear one layer it is thermally conductive
Silicone grease.
Preferably, the heat sink is copper sheet structure, and several heat dissipation convex blocks, institute are provided at the top of the heat sink
Stating heat dissipation convex block is rectangle copper billet structure.
Preferably, the packaging method of a kind of chip-packaging structure for being easy to radiate, comprising the following steps:
S1, chip body to be packaged is inserted into the groove at the top of encapsulating table, it is then uniform to the bottom of absorber plate
Smear one layer of heat-conducting silicone grease；
S2, after having smeared heat-conducting silicone grease, the fixture block of two lateral roof of substrate is aligned and is inserted into two side bottom of package shelf
In card slot, so that package shelf is mounted and fixed on substrate, and make the bottom of absorber plate and the top surface of chip body
It is in contact；
S3, it inserts pins into the slot of substrate side wall, when insertion, extruding of the movable block of pin two sides by slot
And tighten, and after pin is fully inserted into, under the elastic reaction of spring, movable block can pop up and return to original position, from
And play the role of detent using movable block, to prevent pin to be detached from from substrate；
S4, the both ends of conducting wire are electrically connected on pin and chip body, and are welded with spot-welding gun, thus
Complete the encapsulation work of entire chip.
Compared with prior art, the beneficial effects of the present invention are:
1, reasonable in design, heat-dissipating space is big, is conducive to the air circulation inside package shelf, so that chip body is produced
Raw heat can be diffused into the outside of package shelf in time.
2, the gap between absorber plate and chip body can be filled by heat-conducting silicone grease, so that the heat of chip body
It can more rapid and better be transmitted on absorber plate, can be spread in time using certifiable heat, and make heat dissipation more
Uniformly, the contact area of heat sink and air can be expanded using heat dissipation convex block, to further speed up radiating rate.
3, by the way that the air circulation inside package shelf can be further speeded up, dust-proof effect can not only be played using Air Filter
Fruit avoids dust from falling on cooling fin and influence its heat dissipation effect, while can also accelerate internal air circulation, so that cooling fin
On heat can quickly be diffused into the outside of package shelf.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is enlarged drawing at the A of Fig. 1.
Figure label: 1 substrate, 2 encapsulating tables, 3 slots, 4 pins, 5 movable blocks, 6 springs, 7 chip bodies, 8 package shelfs, 9
Card slot, 10 fixture blocks, 11 heat-conducting plates, 12 absorber plates, 13 heat-conducting blocks, 14 heat conductive rods, 15 cooling fins, 16 Air Filters, 17 heat-radiating rods, 18
Heat sink, 19 heat release holes, 20 conducting wires, 21 heat dissipation convex blocks.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The present invention provides a kind of technical solution referring to FIG. 1-2: a kind of chip-packaging structure for being easy to radiate, including base
Plate 1, the center of substrate 1 is fixedly connected with encapsulating table 2, and the two sides of substrate 1 offer slot 3, and slot 3 is interior inserted with pin
4, one end two sides of pin 4 are connected with movable block 5, and one end of movable block 5 is fixedly connected with spring 6, the other end of spring 6
Be fixedly connected on pin 4, the top of encapsulating table 2 open up it is fluted, and encapsulating table 2 top groove in inserted with chip body
7, the top of chip body 7 is provided with package shelf 8, and two side bottoms of package shelf 8 offer card slot 9, two lateral roofs of substrate 1
It is fixedly connected to fixture block 10, fixture block 10 is inserted into card slot 9, and fixture block 10 and the center of card slot 9 are located on the same line,
Width is less than the groove width of card slot 9, and the outer wall of fixture block 10 is provided with several hemispherical rubber blocks, and rubber block has elasticity, by
To flexible deformation can occur when squeezing, when fixture block 10 is inserted into card slot 9, flexible deformation occurs because being squeezed for rubber block,
Therefore it can increase the frictional force between 9 cell wall of fixture block 10 and card slot, to play the role of fixed fixture block 10 and card slot 9, encapsulate
The bottom of frame 8 is fixedly connected with two pieces of heat-conducting plates 11, and heat-conducting plate 11 is aluminium sheet material, and the bottom of heat-conducting plate 11 is fixedly connected with
Absorber plate 12, absorber plate 12 is copper-aluminum composite board structure, and one layer of heat-conducting silicone grease, absorber plate are uniformly smeared in the bottom of absorber plate 12
12 bottom is in contact with the top surface of chip body 7, can be filled between absorber plate 12 and chip body 7 using heat-conducting silicone grease
Gap it is fixed on absorber plate 12 to connect so that the heat of chip body 7 can be more rapid and better transmitted on absorber plate 12
It is connected to heat-conducting block 13, heat-conducting block 13 is albronze material, and the two sides of heat-conducting block 13 are fixedly connected to several heat conductive rods
14, heat conductive rod 14 is aluminium bar material, and the other end of heat conductive rod 14 is fixedly connected on heat-conducting plate 11, and the side wall of heat-conducting plate 11 is solid
If being connected with dry plate cooling fin 15 surely, cooling fin 15 is waveform copper sheet structure, and quantity is no less than eight, and per adjacent two panels
The distance between cooling fin 15 is equal, it is ensured that heat can be spread in time, and it is more uniform to radiate, encapsulation
The top two sides of frame 8 are provided with Air Filter 16, and Air Filter 16 is located at the surface of cooling fin 15, and Air Filter can not only play anti-
The effect of dirt avoids dust from falling on cooling fin 15 and influence its heat dissipation effect, while can also accelerate internal air circulation, makes
The outside that the heat on cooling fin 15 can quickly be diffused into package shelf is obtained, the top of heat-conducting block 13 is fixedly connected with several
Heat-radiating rod 17, heat-radiating rod 17 are aluminium bar material, and every heat-radiating rod 17 through the top exterior walls of package shelf 8 and extends to package shelf
8 top, and the top of heat-radiating rod 17 is fixedly connected with heat sink 18, heat sink 18 are copper sheet structure, and the top of heat sink 18
Portion is provided with several heat dissipation convex blocks 21, and heat dissipation convex block 21 is rectangle copper billet structure, can expand heat sink using heat dissipation convex block 21
18 with the contact area of air, further speeded up radiating rate, the two sides side wall of package shelf 8 offers several heat release holes
19, the air circulation inside package shelf can be further speeded up, the two sides of chip body 7 are electrically connected with conducting wire 20, conducting wire 20
The other end is electrically connected on pin 4.
A kind of packaging method for the chip-packaging structure for being easy to radiate, comprising the following steps:
S1, chip body 7 to be packaged is inserted into the groove at 2 top of encapsulating table, then to the bottom of absorber plate 12
Uniformly smear one layer of heat-conducting silicone grease；
S2, after having smeared heat-conducting silicone grease, the fixture block 10 of 1 liang of lateral roof of substrate is aligned and is inserted into 8 two sides bottom of package shelf
In the card slot 9 in portion, so that package shelf 8 is mounted and fixed on substrate 1, and make bottom and the chip body 7 of absorber plate 12
Top surface be in contact；
S3, pin 4 is inserted into the slot 3 of 1 side wall of substrate, when insertion, the movable block 5 of 4 two sides of pin is by slot 3
Extruding and tighten, and after pin 4 is fully inserted into, under the elastic reaction of spring 6, movable block 5 can be popped up and be returned to
Original position, so as to play the role of detent using movable block 5, to prevent pin 4 to be detached from from substrate 1；
S4, the both ends of conducting wire 20 are electrically connected on pin 4 and chip body 7, and are welded with spot-welding gun,
To complete the encapsulation work of entire chip.
Compared with prior art, the beneficial effects of the present invention are:
1, reasonable in design, heat-dissipating space is big, is conducive to the air circulation inside package shelf, so that chip body is produced
Raw heat can be diffused into the outside of package shelf in time.
2, the gap between absorber plate and chip body can be filled by heat-conducting silicone grease, so that the heat of chip body
It can more rapid and better be transmitted on absorber plate, can be spread in time using certifiable heat, and make heat dissipation more
Uniformly, the contact area of heat sink and air can be expanded using heat dissipation convex block, to further speed up radiating rate.
3, by the way that the air circulation inside package shelf can be further speeded up, dust-proof effect can not only be played using Air Filter
Fruit avoids dust from falling on cooling fin and influence its heat dissipation effect, while can also accelerate internal air circulation, so that cooling fin
On heat can quickly be diffused into the outside of package shelf.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (6)
1. a kind of chip-packaging structure for being easy to radiate, including substrate (1), it is characterised in that: the center of the substrate (1) is fixed
It is connected with encapsulating table (2), and the two sides of the substrate (1) offer slot (3), inserted with pin in the slot (3)
(4), one end two sides of the pin (4) are connected with movable block (5), and one end of the movable block (5) is fixedly connected with bullet
The other end of spring (6), the spring (6) is fixedly connected on pin (4), opened up at the top of the encapsulating table (2) it is fluted, and
Inserted with chip body (7) in the top groove of the encapsulating table (2), package shelf is provided with above the chip body (7)
(8), two side bottoms of the package shelf (8) offer card slot (9), and two lateral roofs of the substrate (1) are fixedly connected to
Fixture block (10), the fixture block (10) are inserted into card slot (9), and the bottom of the package shelf (8) is fixedly connected with two pieces of heat-conducting plates
(11), the bottom of the heat-conducting plate (11) is fixedly connected with absorber plate (12), the bottom of the absorber plate (12) and chip body
(7) top surface is in contact, and heat-conducting block (13) are fixedly connected on the absorber plate (12), and the two of the heat-conducting block (13)
Side is fixedly connected to several heat conductive rods (14), and the other end of the heat conductive rod (14) is fixedly connected on heat-conducting plate (11),
The heat-conducting plate (11) if side wall be fixedly connected with dry plate cooling fin (15), the top two sides of the package shelf (8) are provided with
Air Filter (16), the Air Filter (16) are located at the surface of cooling fin (15), are fixedly connected at the top of the heat-conducting block (13)
There are several heat-radiating rods (17), the every heat-radiating rod (17) runs through the top exterior walls of package shelf (8) and extends to package shelf
(8) top, and the top of the heat-radiating rod (17) is fixedly connected with heat sink (18), the two sides side wall of the package shelf (8)
Several heat release holes (19) are offered, the two sides of the chip body (7) are electrically connected with conducting wire (20), the conducting wire (20)
The other end be electrically connected on pin (4).
2. it is according to claim 1 it is a kind of be easy to radiate chip-packaging structure, it is characterised in that: the fixture block (10) with
The center of card slot (9) is located on the same line, and width is less than the groove width of card slot (9), and the outer wall of the fixture block (10) is set
It is equipped with several hemispherical rubber blocks.
3. a kind of chip-packaging structure for being easy to radiate according to claim 1, it is characterised in that: the cooling fin (15)
For waveform copper sheet structure, quantity is no less than eight, and the distance between cooling fin (15) described in every adjacent two panels is equal.
4. a kind of chip-packaging structure for being easy to radiate according to claim 1, it is characterised in that: the absorber plate (12)
One layer of heat-conducting silicone grease is uniformly smeared for the bottom of copper-aluminum composite board structure, and the absorber plate (12).
5. a kind of chip-packaging structure for being easy to radiate according to claim 1, it is characterised in that: the heat sink (18)
For copper sheet structure, and several heat dissipations convex block (21) are provided at the top of the heat sink (18), the heat dissipation convex block (21) is
Rectangle copper billet structure.
6. a kind of packaging method of chip-packaging structure for being easy to radiate according to claim 1, which is characterized in that including
Following steps:
S1, chip body (7) to be packaged is inserted into the groove at the top of encapsulating table (2), then to the bottom of absorber plate (12)
Uniformly smear one layer of heat-conducting silicone grease in portion；
S2, after having smeared heat-conducting silicone grease, the fixture block (10) of (1) two lateral roof of substrate is aligned and is inserted into package shelf (8) two sides
In the card slot (9) of bottom, so that package shelf (8) is mounted and fixed on substrate (1), and make the bottom of absorber plate (12) with
The top surface of chip body (7) is in contact；
S3, pin (4) is inserted into the slot (3) of substrate (1) side wall, when insertion, the movable block (5) of pin (4) two sides by
To slot (3) extruding and tighten, and after pin (4) is fully inserted into, under the elastic reaction of spring (6), movable block (5) meeting
Original position is popped up and returns to, so as to play the role of detent using movable block (5), to prevent pin (4) from substrate (1)
It is detached from；
S4, the both ends of conducting wire (20) are electrically connected on pin (4) and chip body (7), and are welded with spot-welding gun
It connects, to complete the encapsulation work of entire chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811180271.4A CN109346442B (en) | 2018-10-10 | 2018-10-10 | Chip packaging structure easy to dissipate heat and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811180271.4A CN109346442B (en) | 2018-10-10 | 2018-10-10 | Chip packaging structure easy to dissipate heat and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109346442A true CN109346442A (en) | 2019-02-15 |
| CN109346442B CN109346442B (en) | 2020-05-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811180271.4A Active CN109346442B (en) | 2018-10-10 | 2018-10-10 | Chip packaging structure easy to dissipate heat and packaging method thereof |
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| CN110265380A (en) * | 2019-06-27 | 2019-09-20 | 罗瑞琪 | A kind of peripheral apparatus ic chip package structure |
| CN110416383A (en) * | 2019-06-21 | 2019-11-05 | 徐洪亮 | A kind of T8 LED daylight lamp encapsulating structure |
| CN110812975A (en) * | 2019-11-27 | 2020-02-21 | 东台市华源复合材料有限公司 | High-efficient filter fiber board of high temperature smog |
| CN111302295A (en) * | 2020-02-19 | 2020-06-19 | 三桥惠(佛山)新材料有限公司 | Packaging structure for MEMS sensor chip |
| CN111341741A (en) * | 2020-03-17 | 2020-06-26 | 中国科学院微电子研究所 | Power device packaging structure and packaging method for improving heat dissipation capability |
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| CN110416383A (en) * | 2019-06-21 | 2019-11-05 | 徐洪亮 | A kind of T8 LED daylight lamp encapsulating structure |
| CN110265380A (en) * | 2019-06-27 | 2019-09-20 | 罗瑞琪 | A kind of peripheral apparatus ic chip package structure |
| CN110812975A (en) * | 2019-11-27 | 2020-02-21 | 东台市华源复合材料有限公司 | High-efficient filter fiber board of high temperature smog |
| CN111302295A (en) * | 2020-02-19 | 2020-06-19 | 三桥惠(佛山)新材料有限公司 | Packaging structure for MEMS sensor chip |
| CN111341741A (en) * | 2020-03-17 | 2020-06-26 | 中国科学院微电子研究所 | Power device packaging structure and packaging method for improving heat dissipation capability |
| CN113539989B (en) * | 2020-04-13 | 2023-07-21 | 烽火通信科技股份有限公司 | Multi-chip heat dissipation packaging structure and packaging method |
| CN113539989A (en) * | 2020-04-13 | 2021-10-22 | 烽火通信科技股份有限公司 | Multi-chip heat dissipation packaging structure and packaging method |
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