CN110416383A - A kind of T8 LED daylight lamp encapsulating structure - Google Patents
A kind of T8 LED daylight lamp encapsulating structure Download PDFInfo
- Publication number
- CN110416383A CN110416383A CN201910542577.8A CN201910542577A CN110416383A CN 110416383 A CN110416383 A CN 110416383A CN 201910542577 A CN201910542577 A CN 201910542577A CN 110416383 A CN110416383 A CN 110416383A
- Authority
- CN
- China
- Prior art keywords
- package cap
- cup dolly
- daylight lamp
- t8led
- cone tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The invention discloses a kind of T8 LED daylight lamp encapsulating structures, including cup dolly and package cap, package cap is provided at the top of cup dolly, the top of cup dolly offers cone tank, and package cap and cone tank match setting, round light-transmitting plate is embedded in the middle part of package cap top, the bottom end of package cap is provided with sealing mechanism, and the two sides of cone tank successively offer card slot and fluting from top to bottom.Substrate and LED chip can be encapsulated in cup dolly by the present invention by package cap, press down on package cap, pass through sealing mechanism, with the downward push of package cap, the air-tightness between package cap and cup dolly is enhanced, fixture block and connecting rod are passed through, fitted bolt, package cap after pressing can be fixed, by this kind of connection type, not only mounting means is simple, and without positioning gluing, practicability is improved.
Description
Technical field
The present invention relates to a kind of encapsulating structure, specially a kind of T8LED daylight lamp encapsulation structure.
Background technique
T8 LED daylight lamp is using CREE and AOD ultra-bright LED white light as illuminating source, and shell is acrylic/outside
Cover can make of PC pipe, and high temperature resistant is up to 135 degree.Traditional fluorescent tube is also known as fluorescent lamp, and respectively there is a filament at lamp both ends, in fluorescent tube
Filled with micro argon and thin mercury vapour, fluorescent powder is coated on tube inner wall, when gaseous conduction between two filaments issues
Ultraviolet light makes fluorescent powder issue visible light.
Currently, T8 LED daylight lamp is when being packaged, influenced in order to avoid air and liquid enter in LED encapsulation structure
To the use of LED chip, therefore to guarantee its leakproofness, existing packaging process is excessively cumbersome and troublesome, and positions when encapsulation
Also very inconvenient applicability is lower for gluing.
Summary of the invention
In order to solve the above technical problem, the present invention provides a kind of T8LED daylight lamp encapsulation structures.
The present invention is realized with following technical solution: a kind of T8LED daylight lamp encapsulation structure, including cup dolly and envelope
Top cover is filled, package cap is provided at the top of the cup dolly, the top of the cup dolly offers cone tank, and encapsulates
Top cover and cone tank match setting, and round light-transmitting plate is embedded in the middle part of the package cap top, the package cap
Bottom end is provided with sealing mechanism, and the two sides of the cone tank successively offer card slot and fluting, the package cap from top to bottom
Two sides be fixed with fixture block, and fixture block is located in card slot, and the bottom end of the fixture block is fixed with connecting rod, and connecting rod with
The interspersed connection of fluting, two sides of the cup dolly and position for being right against fluting opens up fluted, the groove internal screw thread
It is connected with bolt, and bolt passes through groove and is threadedly coupled with connecting rod, is embedded in the middle part of the cup dolly inner lower edge
Substrate, the top of the substrate are fixed with LED chip, and the two sides of the LED chip are respectively arranged with cathode tube and anode tube,
And cathode tube and anode tube with the bottom end on the inside of cup dolly is interspersed is fixedly connected, the LED chip passes through two conducting wires point
It is not electrically connected with cathode tube and anode tube.
As a preferred technical solution of the present invention, the sealing mechanism includes annular fixing member, and round light-transmitting plate
It is right against the inside of annular fixing member.
As a preferred technical solution of the present invention, rubber layer, and rubber are fixed on the outside of the annular fixing member
Match setting on the inside of glue-line and cup dolly.
As a preferred technical solution of the present invention, side wall inside the cup dolly and it is located under sealing mechanism
Side is fixed with annular anode reflector.
As a preferred technical solution of the present invention, the inside of the package cap and it is located at below round light-transmitting plate
Position is embedded with fluorescence coating.
As a preferred technical solution of the present invention, cooling fin is embedded in the middle part of the cup dolly bottom end, and dissipate
Backing is in contact with the bottom end of substrate.
The beneficial effects of the present invention are: this kind of LED encapsulation structure can be sealed substrate and LED chip by package cap
In cup dolly, by round light-transmitting plate, cooperate cathode tube and anode tube, LED chip work can be made to shine outward,
Package cap is pressed down on, package cap and cup dolly are enhanced with the downward push of package cap by sealing mechanism
Between air-tightness, by fixture block and connecting rod, fitted bolt can be fixed the package cap after pressing, by this
Kind connection type, not only mounting means is simple, but also without positioning gluing, improves practicability.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings:
Fig. 1 is schematic structural view of the invention；
Fig. 2 is this practical new profile structural schematic diagram；
Fig. 3 is partial structural diagram of the present invention.
In figure: 1, cup dolly；2, package cap；3, cone tank；4, round light-transmitting plate；5, sealing mechanism；501, annular
Fixing piece；502, rubber layer；6, card slot；7, it slots；8, fixture block；9, connecting rod；10, groove；11, bolt；12, substrate；13,
LED chip；14, cathode tube；15, anode tube；16, annular anode reflector；17, fluorescence coating；18, cooling fin.
Specific embodiment
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, it should be understood that preferred reality described herein
Apply example only for the purpose of illustrating and explaining the present invention and is not intended to limit the present invention.
Embodiment: as shown in Figure 1, Figure 2 and Figure 3, a kind of T8LED daylight lamp encapsulation structure of the present invention, including cup dolly 1
With package cap 2, the top of cup dolly 1 is provided with package cap 2, and the top of cup dolly 1 offers cone tank 3, and seals
Dress top cover 2 and cone tank 3 match setting, and round light-transmitting plate 4, the bottom of package cap 2 are embedded in the middle part of 2 top of package cap
End is provided with sealing mechanism 5, and the two sides of cone tank 3 successively offer card slot 6 and fluting 7, the two sides of package cap 2 from top to bottom
It is fixed with fixture block 8, and fixture block 8 is located in card slot 6, the bottom end of fixture block 8 is fixed with connecting rod 9, and connecting rod 9 and fluting
7 interspersed connections, two sides of the cup dolly 1 and position for being right against fluting 7 opens up fluted 10,10 internal screw thread of groove is connected with
Bolt 11, and bolt 11 passes through groove 10 and is threadedly coupled with connecting rod 9, is embedded with base in the middle part of 1 inner lower edge of cup dolly
Plate 12, the top of substrate 12 are fixed with LED chip 13, and the two sides of LED chip 13 are respectively arranged with cathode tube 14 and anode tube
15, and cathode tube 14 and anode tube 15 with the bottom end of the inside of cup dolly 1 is interspersed is fixedly connected, LED chip 13 passes through two
Conducting wire is electrically connected with cathode tube 14 and anode tube 15 respectively.
Wherein, sealing mechanism 5 includes annular fixing member 501, and round light-transmitting plate 4 is right against the interior of annular fixing member 501
Portion；The outside of annular fixing member 501 is fixed with rubber layer 502, and the inside of rubber layer 502 and cup dolly 1 matches and sets
It sets, presses down on package cap 2, under the action of cone tank 3, with moving down for package cap 2, so that rubber layer 502 is downward
It is mobile, cone tank 3 is squeezed, and then enhance the air-tightness between package cap 2 and cup dolly 1, passes through annular fixing member
501, rubber layer 502 is limited, drives fixture block 8 to move down in card slot 6 while package cap 2 moves down, so that
Connecting rod 9 moves down in fluting 7, turns bolt 11 so that bolt 11 is threadedly coupled with connecting rod 9, and then can be to pressing after
Package cap 2 be fixed, by this kind of connection type, not only mounting means is simple, but also without positioning gluing, improves
Practicability.
Wherein, the side wall inside cup dolly 1 and be located at sealing mechanism 5 lower section be fixed with annular anode reflector 16；Envelope
It fills the inside of top cover 2 and the position being located at below round light-transmitting plate 4 is embedded with fluorescence coating 17, pass through annular anode reflector 16 and fluorescence
Layer 17, can be improved the illumination effect of LED chip 13, improves practicability.
Wherein, it is embedded with cooling fin 18 in the middle part of 1 bottom end of cup dolly, and cooling fin 18 connects with the bottom end of substrate 12
Touching, by cooling fin 18, the heat derives generated when LED chip 13 can be worked improve making for LED chip 13 to the external world
Use the service life.
When work, by package cap 2, substrate 12 and LED chip 13 can be encapsulated in cup dolly 1, pass through circle
Shape light-transmitting plate 4 cooperates cathode tube 14 and anode tube 15, and LED chip 13 can be made to work outward and shone, encapsulation top is pressed down on
Lid 2, with moving down for package cap 2, so that rubber layer 502 moves down, squeezes cone tank 3 under the action of cone tank 3
Pressure, and then enhances the air-tightness between package cap 2 and cup dolly 1, by annular fixing member 501, to rubber layer 502 into
Row limit, drives fixture block 8 to move down in card slot 6 while package cap 2 moves down, so that under connecting rod 9 is in fluting 7
It moves, turns bolt 11, so that bolt 11 is threadedly coupled with connecting rod 9, and then the package cap 2 after pressing can be consolidated
Fixed, by this kind of connection type, not only mounting means is simple, but also without positioning gluing, improves practicability.
In the description of the present invention, it should be noted that the orientation of the instructions such as term "vertical", "upper", "lower", "horizontal"
Or positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, and
It is not that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore
It is not considered as limiting the invention.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be indirect by intermediary
It is connected, can be the connection inside two elements.For the ordinary skill in the art, it can manage as the case may be
Solve the concrete meaning of above-mentioned term in the present invention.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (6)
1. a kind of T8LED daylight lamp encapsulation structure, including cup dolly (1) and package cap (2), which is characterized in that the circle
It is provided at the top of shape pedestal (1) package cap (2), the top of the cup dolly (1) offers cone tank (3), and encapsulates
Top cover (2) and cone tank (3) match setting, are embedded with round light-transmitting plate (4), institute in the middle part of package cap (2) top
The bottom end for stating package cap (2) is provided with sealing mechanism (5), and the two sides of the cone tank (3) successively offer card from top to bottom
Slot (6) and fluting (7), the two sides of the package cap (2) are fixed with fixture block (8), and fixture block (8) is located in card slot (6),
The bottom end of the fixture block (8) is fixed with connecting rod (9), and connecting rod (9) and the interspersed connection of fluting (7), the cup dolly
(1) the two sides and position for being right against fluting (7) opens up fluted (10), groove (10) internal screw thread is connected with bolt
(11), and bolt (11) passes through groove (10) and is threadedly coupled with connecting rod (9), in cup dolly (1) inner lower edge
Portion is embedded with substrate (12), and the top of the substrate (12) is fixed with LED chip (13), the two sides of the LED chip (13)
It is respectively arranged with cathode tube (14) and anode tube (15), and cathode tube (14) and anode tube (15) are and on the inside of cup dolly (1)
Bottom end it is interspersed be fixedly connected, the LED chip (13) is electric with cathode tube (14) and anode tube (15) respectively by two conducting wires
Property connection.
2. a kind of T8LED daylight lamp encapsulation structure according to claim 1, which is characterized in that sealing mechanism (5) packet
It includes annular fixing member (501), and round light-transmitting plate (4) is right against the inside of annular fixing member (501).
3. a kind of T8LED daylight lamp encapsulation structure according to claim 2, which is characterized in that the annular fixing member
(501) it is fixed on the outside of rubber layer (502), and the setting that matches on the inside of rubber layer (502) and cup dolly (1).
4. a kind of T8LED daylight lamp encapsulation structure according to claim 1, which is characterized in that in the cup dolly (1)
The side wall in portion and be located at sealing mechanism (5) below be fixed with annular anode reflector (16).
5. a kind of T8LED daylight lamp encapsulation structure according to claim 1, which is characterized in that the package cap (2)
Position that is internal and being located at below round light-transmitting plate (4) is embedded with fluorescence coating (17).
6. a kind of T8LED daylight lamp encapsulation structure according to claim 1, which is characterized in that cup dolly (1) bottom
It is embedded in the middle part of end cooling fin (18), and cooling fin (18) is in contact with the bottom end of substrate (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910542577.8A CN110416383A (en) | 2019-06-21 | 2019-06-21 | A kind of T8 LED daylight lamp encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910542577.8A CN110416383A (en) | 2019-06-21 | 2019-06-21 | A kind of T8 LED daylight lamp encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110416383A true CN110416383A (en) | 2019-11-05 |
Family
ID=68359526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910542577.8A Pending CN110416383A (en) | 2019-06-21 | 2019-06-21 | A kind of T8 LED daylight lamp encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110416383A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133808A (en) * | 2020-08-05 | 2020-12-25 | 清华大学无锡应用技术研究院 | Vertical packaging structure of full-color gallium nitride-based chip |
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| CN208189625U (en) * | 2018-04-26 | 2018-12-04 | 成都东旭智能科技有限公司 | A kind of package substrate of LED light source |
| CN208336266U (en) * | 2018-07-12 | 2019-01-04 | 深圳市绿明光电有限公司 | A kind of paster type light emitting type |
| CN208418619U (en) * | 2018-07-12 | 2019-01-22 | 上海兴为视觉科技股份有限公司 | A kind of LED filament encapsulating structure that colour rendering is high |
| CN109346442A (en) * | 2018-10-10 | 2019-02-15 | 唐燕 | It is a kind of be easy to radiate chip-packaging structure and its packaging method |
| CN208862024U (en) * | 2018-09-20 | 2019-05-14 | 福州万超网络科技有限公司 | A kind of anti-vulcanization LED encapsulation structure |
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2019
- 2019-06-21 CN CN201910542577.8A patent/CN110416383A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208189625U (en) * | 2018-04-26 | 2018-12-04 | 成都东旭智能科技有限公司 | A kind of package substrate of LED light source |
| CN208336266U (en) * | 2018-07-12 | 2019-01-04 | 深圳市绿明光电有限公司 | A kind of paster type light emitting type |
| CN208418619U (en) * | 2018-07-12 | 2019-01-22 | 上海兴为视觉科技股份有限公司 | A kind of LED filament encapsulating structure that colour rendering is high |
| CN108766939A (en) * | 2018-08-15 | 2018-11-06 | 江苏盐芯微电子有限公司 | A kind of chip packaging device and packaging method |
| CN208862024U (en) * | 2018-09-20 | 2019-05-14 | 福州万超网络科技有限公司 | A kind of anti-vulcanization LED encapsulation structure |
| CN109346442A (en) * | 2018-10-10 | 2019-02-15 | 唐燕 | It is a kind of be easy to radiate chip-packaging structure and its packaging method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133808A (en) * | 2020-08-05 | 2020-12-25 | 清华大学无锡应用技术研究院 | Vertical packaging structure of full-color gallium nitride-based chip |
| CN112133808B (en) * | 2020-08-05 | 2022-03-11 | 清华大学无锡应用技术研究院 | Vertical packaging structure of full-color gallium nitride-based chip |
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| PB01 | Publication | ||
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Application publication date: 20191105 |